ATE459985T1 - Verfahren und struktur für einen peltier- gesteuerten phasenwechselspeicher - Google Patents

Verfahren und struktur für einen peltier- gesteuerten phasenwechselspeicher

Info

Publication number
ATE459985T1
ATE459985T1 AT06718285T AT06718285T ATE459985T1 AT E459985 T1 ATE459985 T1 AT E459985T1 AT 06718285 T AT06718285 T AT 06718285T AT 06718285 T AT06718285 T AT 06718285T AT E459985 T1 ATE459985 T1 AT E459985T1
Authority
AT
Austria
Prior art keywords
phase change
peltier
controlled phase
change storage
information bit
Prior art date
Application number
AT06718285T
Other languages
English (en)
Inventor
Lia Krusin-Elbaum
Dennis Newns
Original Assignee
Ibm
Lia Krusin-Elbaum
Newns Dennis M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm, Lia Krusin-Elbaum, Newns Dennis M filed Critical Ibm
Application granted granted Critical
Publication of ATE459985T1 publication Critical patent/ATE459985T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20—Multistable switching devices, e.g. memristors
    • H10N70/253—Multistable switching devices, e.g. memristors having three or more electrodes, e.g. transistor-like devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/821—Device geometry
    • H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/841—Electrodes
    • H10N70/8413—Electrodes adapted for resistive heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/861—Thermal details
    • H10N70/8613—Heating or cooling means other than resistive heating electrodes, e.g. heater in parallel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828—Tellurides, e.g. GeSbTe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801—Constructional details of multistable switching devices
    • H10N70/881—Switching materials
    • H10N70/884—Switching materials based on at least one element of group IIIA, IVA or VA, e.g. elemental or compound semiconductors

Landscapes

  • Semiconductor Memories (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
AT06718285T 2005-05-06 2006-01-13 Verfahren und struktur für einen peltier- gesteuerten phasenwechselspeicher ATE459985T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/123,086 US20060249724A1 (en) 2005-05-06 2005-05-06 Method and structure for Peltier-controlled phase change memory
PCT/US2006/001194 WO2006121473A1 (en) 2005-05-06 2006-01-13 Method and structure for peltier-controlled phase change memory

Publications (1)

Publication Number Publication Date
ATE459985T1 true ATE459985T1 (de) 2010-03-15

Family

ID=36600150

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06718285T ATE459985T1 (de) 2005-05-06 2006-01-13 Verfahren und struktur für einen peltier- gesteuerten phasenwechselspeicher

Country Status (8)

Country Link
US (1) US20060249724A1 (de)
EP (1) EP1878064B1 (de)
JP (1) JP2008541423A (de)
CN (1) CN101171696B (de)
AT (1) ATE459985T1 (de)
DE (1) DE602006012653D1 (de)
TW (1) TWI430486B (de)
WO (1) WO2006121473A1 (de)

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US8183551B2 (en) 2005-11-03 2012-05-22 Agale Logic, Inc. Multi-terminal phase change devices
JP4950490B2 (ja) * 2005-12-28 2012-06-13 株式会社東芝 不揮発性スイッチング素子およびその製造方法ならびに不揮発性スイッチング素子を有する集積回路
US7750333B2 (en) 2006-06-28 2010-07-06 Intel Corporation Bit-erasing architecture for seek-scan probe (SSP) memory storage
US7579616B2 (en) * 2007-04-10 2009-08-25 International Business Machines Corporation Four-terminal programmable via-containing structure and method of fabricating same
US7550313B2 (en) * 2007-07-21 2009-06-23 International Business Machines Corporation Method for delineation of phase change memory (PCM) cells separated by PCM and upper electrode regions modified to have high film resistivity
US7593278B2 (en) * 2007-08-21 2009-09-22 Seagate Technology Llc Memory element with thermoelectric pulse
JP2009123847A (ja) * 2007-11-13 2009-06-04 Gunma Univ メモリ素子、メモリセル、メモリセルアレイ及び電子機器
US8076664B2 (en) * 2007-12-20 2011-12-13 Intel Corporation Phase change memory with layered insulator
JP2012084765A (ja) * 2010-10-14 2012-04-26 Sony Corp 不揮発性メモリ素子及びその製造方法
US8487178B2 (en) 2011-01-14 2013-07-16 Ut-Battelle, Llc Alkaline earth filled nickel skutterudite antimonide thermoelectrics
JP5663422B2 (ja) * 2011-07-11 2015-02-04 株式会社日立製作所 熱電変換素子
US10818839B2 (en) 2018-03-15 2020-10-27 Samsung Electronics Co., Ltd. Apparatus for and method of fabricating semiconductor devices
US10566530B2 (en) 2018-03-15 2020-02-18 Samsung Electronics Co., Ltd. Method of fabricating semiconductor devices
US11017989B2 (en) 2018-03-16 2021-05-25 Samsung Electronics Co., Ltd. Collimator, fabrication apparatus including the same, and method of fabricating a semiconductor device using the same
JP2022144071A (ja) 2021-03-18 2022-10-03 キオクシア株式会社 抵抗変化素子及び記憶装置
CN114784183B (zh) * 2022-03-04 2025-09-26 长江先进存储产业创新中心有限责任公司 相变存储器及其控制方法和制作方法
US20240023323A1 (en) * 2022-07-15 2024-01-18 Invention And Collaboration Laboratory Pte. Ltd. Semiconductor memory structure

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US4598395A (en) * 1983-05-31 1986-07-01 Ltv Aerospace And Defense Co. Erasable optical read/write data storage system
US4924436A (en) * 1987-06-22 1990-05-08 Energy Conversion Devices, Inc. Data storage device having a phase change memory medium reversible by direct overwrite and method of direct overwrite
JPH09127812A (ja) * 1995-10-30 1997-05-16 Ricoh Co Ltd 定着装置
US6314014B1 (en) * 1999-12-16 2001-11-06 Ovonyx, Inc. Programmable resistance memory arrays with reference cells
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JP2003234514A (ja) * 2002-02-12 2003-08-22 Sharp Corp 液晶表示装置及びその製造方法
JP4091328B2 (ja) * 2002-03-29 2008-05-28 株式会社東芝 磁気記憶装置
US6707087B2 (en) * 2002-06-21 2004-03-16 Hewlett-Packard Development Company, L.P. Structure of chalcogenide memory element
DE10236439B3 (de) * 2002-08-08 2004-02-26 Infineon Technologies Ag Speicher-Anordnung, Verfahren zum Betreiben einer Speicher-Anordnung und Verfahren zum Herstellen einer Speicher-Anordnung
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Also Published As

Publication number Publication date
CN101171696B (zh) 2011-12-21
TW200713651A (en) 2007-04-01
US20060249724A1 (en) 2006-11-09
TWI430486B (zh) 2014-03-11
CN101171696A (zh) 2008-04-30
EP1878064A1 (de) 2008-01-16
DE602006012653D1 (de) 2010-04-15
WO2006121473A1 (en) 2006-11-16
JP2008541423A (ja) 2008-11-20
EP1878064B1 (de) 2010-03-03

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