ATE442417T1 - Silikonzusammensetzung und gehärtetes silikonharz - Google Patents

Silikonzusammensetzung und gehärtetes silikonharz

Info

Publication number
ATE442417T1
ATE442417T1 AT05821206T AT05821206T ATE442417T1 AT E442417 T1 ATE442417 T1 AT E442417T1 AT 05821206 T AT05821206 T AT 05821206T AT 05821206 T AT05821206 T AT 05821206T AT E442417 T1 ATE442417 T1 AT E442417T1
Authority
AT
Austria
Prior art keywords
viscosity
silicone
silicon
average
per molecule
Prior art date
Application number
AT05821206T
Other languages
German (de)
English (en)
Inventor
Michael Smith
Bizhong Zhu
Original Assignee
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Application granted granted Critical
Publication of ATE442417T1 publication Critical patent/ATE442417T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/5403—Silicon-containing compounds containing no other elements than carbon or hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
AT05821206T 2004-11-19 2005-11-01 Silikonzusammensetzung und gehärtetes silikonharz ATE442417T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US62962004P 2004-11-19 2004-11-19
US65244205P 2005-02-11 2005-02-11
PCT/US2005/039376 WO2006055231A1 (en) 2004-11-19 2005-11-01 Silicone composition and cured silicone resin

Publications (1)

Publication Number Publication Date
ATE442417T1 true ATE442417T1 (de) 2009-09-15

Family

ID=36096236

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05821206T ATE442417T1 (de) 2004-11-19 2005-11-01 Silikonzusammensetzung und gehärtetes silikonharz

Country Status (8)

Country Link
US (1) US7687587B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP1814952B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP4870681B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR101214825B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN101044209B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) ATE442417T1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE602005016594D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO2006055231A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

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US20100273011A1 (en) * 1996-12-20 2010-10-28 Bianxiao Zhong Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates
JP5091249B2 (ja) * 2006-12-20 2012-12-05 ダウ・コーニング・コーポレイション 多層の硬化シリコーン樹脂組成物で被覆またはラミネートされたガラス基板
CN101563300B (zh) 2006-12-20 2012-09-05 陶氏康宁公司 用固化的有机硅树脂组合物涂布或层压的玻璃基底
WO2009111199A1 (en) * 2008-03-04 2009-09-11 Dow Corning Corporation Silicone composition, silicone adhesive, coated and laminated substrates
CN101959939B (zh) * 2008-03-04 2013-02-06 陶氏康宁公司 硼硅氧烷组合物，硼硅氧烷粘合剂，涂布和层压的基底
CN101531868B (zh) * 2008-03-14 2013-06-26 陶氏康宁公司 用于高固含量溶剂涂布方法的有机硅防粘涂料混合物
WO2009146254A1 (en) * 2008-05-27 2009-12-03 Dow Corning Corporation Adhesive tape and laminated glass
TW201004795A (en) * 2008-07-31 2010-02-01 Dow Corning Laminated glass
JP5793824B2 (ja) * 2009-06-02 2015-10-14 Jnc株式会社 有機ケイ素化合物、該有機ケイ素化合物を含む熱硬化性組成物、および光半導体用封止材料
CN102892812B (zh) * 2010-05-18 2017-02-08 捷恩智株式会社 液状有机硅化合物、热硬化性树脂组成物及其使用
US9012547B2 (en) 2010-11-09 2015-04-21 Dow Corning Corporation Hydrosilylation cured silicone resins plasticized by organophosphorous compounds
TWI435914B (zh) * 2010-12-31 2014-05-01 Eternal Chemical Co Ltd 可固化之有機聚矽氧烷組合物及其製法
CN103649227B (zh) 2011-05-04 2016-02-24 Lg化学株式会社 可固化组合物
JP5618903B2 (ja) * 2011-05-23 2014-11-05 信越化学工業株式会社 シルフェニレン構造及びシロキサン構造を有する重合体およびその製造方法
JP5673496B2 (ja) * 2011-11-07 2015-02-18 信越化学工業株式会社 樹脂組成物、樹脂フィルム及び半導体装置とその製造方法
KR20150037956A (ko) * 2012-08-02 2015-04-08 헨켈 차이나 컴퍼니 리미티드 폴리카르보실란 및 이를 포함하는 ｌｅｄ 캡슐화제 용의 경화성 조성물
JP2015529713A (ja) * 2012-08-02 2015-10-08 ヘンケル・チャイナ・カンパニー・リミテッドＨｅｎｋｅｌ Ｃｈｉｎａｃｏ． Ｌｔｄ． ポリカルボシランおよびヒドロシリコーンを含んでなるｌｅｄ封入剤用硬化性組成物
CN104151835B (zh) * 2014-07-04 2017-01-04 江苏矽时代材料科技有限公司 一种主链含苯撑结构的有机硅组合物及其制备方法
KR102273099B1 (ko) * 2014-12-17 2021-07-06 주식회사 케이씨씨실리콘 실리콘 엘라스토머 조성물, 이를 이용하여 제조되는 실리콘 엘라스토머 및 실리콘 페이스트
CN106467668B (zh) * 2015-08-19 2021-07-30 广东生益科技股份有限公司 一种有机硅树脂铝基覆铜板及其制备方法
JP7388865B2 (ja) * 2019-10-08 2023-11-29 信越化学工業株式会社 付加硬化型シリコーン組成物、その硬化物、及び半導体装置

Family Cites Families (17)

* Cited by examiner, † Cited by third party
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NL131800C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1965-05-17
US4087585A (en) * 1977-05-23 1978-05-02 Dow Corning Corporation Self-adhering silicone compositions and preparations thereof
US4766176A (en) * 1987-07-20 1988-08-23 Dow Corning Corporation Storage stable heat curable organosiloxane compositions containing microencapsulated platinum-containing catalysts
JPH0214244A (ja) * 1988-06-30 1990-01-18 Toray Dow Corning Silicone Co Ltd 加熱硬化性オルガノポリシロキサン組成物
JP3029680B2 (ja) * 1991-01-29 2000-04-04 東レ・ダウコーニング・シリコーン株式会社 オルガノペンタシロキサンおよびその製造方法
JPH0853622A (ja) * 1994-06-07 1996-02-27 Shin Etsu Chem Co Ltd シリコーンゲル組成物
FR2727119B1 (fr) * 1994-11-18 1997-01-03 Rhone Poulenc Chimie Polyorganosiloxanes fonctionnalises et l'un de leurs procedes de preparation
US5753751A (en) * 1996-10-24 1998-05-19 General Electric Company Process for preparing self-curable alkenyl hydride siloxane copolymers and coating composition
KR100537138B1 (ko) * 1996-12-20 2005-12-16 가부시끼가이샤 쓰리본드 올가노폴리실록산 조성물
US6310146B1 (en) * 1999-07-01 2001-10-30 Dow Corning Corporation Silsesquioxane resin with high strength and fracture toughness and method for the preparation thereof
JP2001089662A (ja) * 1999-09-22 2001-04-03 Kanegafuchi Chem Ind Co Ltd 硬化性組成物及びそれを用いた成形体の作製方法
US6509423B1 (en) * 2001-08-21 2003-01-21 Dow Corning Corporation Silicone composition and cured silicone product
US6646039B2 (en) * 2002-03-05 2003-11-11 Dow Corning Corporation Hydrosilyation cured silicone resin containing colloidal silica and a process for producing the same
US6689859B2 (en) * 2002-03-05 2004-02-10 Dow Corning Corporation High fracture toughness hydrosilyation cured silicone resin
US7019100B2 (en) * 2003-04-23 2006-03-28 Shin-Etsu Chemical Co., Ltd. Curable silicone resin composition
EP1475069B1 (en) * 2003-05-09 2010-03-31 3M Espe AG Curable silicone impression materials with high tear strength and low consistency
JP2005089671A (ja) * 2003-09-19 2005-04-07 Shin Etsu Chem Co Ltd 硬化性シリコーン樹脂組成物

Also Published As

Publication number Publication date
CN101044209B (zh) 2011-01-19
DE602005016594D1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2009-10-22
US7687587B2 (en) 2010-03-30
EP1814952B1 (en) 2009-09-09
US20070260082A1 (en) 2007-11-08
WO2006055231A1 (en) 2006-05-26
EP1814952A1 (en) 2007-08-08
KR101214825B1 (ko) 2012-12-24
KR20070085392A (ko) 2007-08-27
JP4870681B2 (ja) 2012-02-08
JP2008520802A (ja) 2008-06-19
CN101044209A (zh) 2007-09-26

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