ATE410905T1 - Mehrzonen-keramikheizsystem und verfahren zu seiner herstellung - Google Patents

Mehrzonen-keramikheizsystem und verfahren zu seiner herstellung

Info

Publication number
ATE410905T1
ATE410905T1 AT04711141T AT04711141T ATE410905T1 AT E410905 T1 ATE410905 T1 AT E410905T1 AT 04711141 T AT04711141 T AT 04711141T AT 04711141 T AT04711141 T AT 04711141T AT E410905 T1 ATE410905 T1 AT E410905T1
Authority
AT
Austria
Prior art keywords
sensor arrangement
temperature sensor
heating elements
ceramic heater
heating
Prior art date
Application number
AT04711141T
Other languages
English (en)
Inventor
Hongy Lin
Thomas Laskowski
Jason Smith
Daniel Block
Original Assignee
Watlow Electric Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Watlow Electric Mfg filed Critical Watlow Electric Mfg
Application granted granted Critical
Publication of ATE410905T1 publication Critical patent/ATE410905T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
    • H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Surface Heating Bodies (AREA)
  • Resistance Heating (AREA)
  • Tunnel Furnaces (AREA)
  • Ceramic Products (AREA)
  • Drying Of Semiconductors (AREA)
AT04711141T 2003-05-08 2004-02-13 Mehrzonen-keramikheizsystem und verfahren zu seiner herstellung ATE410905T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/431,758 US20040222210A1 (en) 2003-05-08 2003-05-08 Multi-zone ceramic heating system and method of manufacture thereof

Publications (1)

Publication Number Publication Date
ATE410905T1 true ATE410905T1 (de) 2008-10-15

Family

ID=33416519

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04711141T ATE410905T1 (de) 2003-05-08 2004-02-13 Mehrzonen-keramikheizsystem und verfahren zu seiner herstellung

Country Status (6)

Country Link
US (1) US20040222210A1 (de)
EP (1) EP1621048B1 (de)
JP (1) JP4908217B2 (de)
AT (1) ATE410905T1 (de)
DE (1) DE602004016985D1 (de)
WO (1) WO2004102076A2 (de)

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US8546732B2 (en) * 2010-11-10 2013-10-01 Lam Research Corporation Heating plate with planar heater zones for semiconductor processing
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US9224626B2 (en) * 2012-07-03 2015-12-29 Watlow Electric Manufacturing Company Composite substrate for layered heaters
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CN104131268B (zh) * 2013-05-03 2017-02-08 北京北方微电子基地设备工艺研究中心有限责任公司 分区域加热方法、装置和半导体设备
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GB2562075B (en) 2017-05-03 2022-03-16 Jemella Ltd Barrel for hair styling appliance
WO2021108176A1 (en) * 2019-11-26 2021-06-03 Tokyo Electron Limited THERMAL TREATMENTS USING A PLURALITY OF EMBEDDED RESISTANCE TEMPERATURE DETECTORS (RTDs)

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Also Published As

Publication number Publication date
EP1621048A2 (de) 2006-02-01
US20040222210A1 (en) 2004-11-11
WO2004102076A3 (en) 2005-06-16
DE602004016985D1 (de) 2008-11-20
EP1621048B1 (de) 2008-10-08
JP2007515778A (ja) 2007-06-14
JP4908217B2 (ja) 2012-04-04
EP1621048A4 (de) 2007-04-11
WO2004102076A2 (en) 2004-11-25

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Legal Events

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