DE602004016985D1 - Mehrzonen-keramikheizsystem und verfahren zu seiner herstellung - Google Patents
Mehrzonen-keramikheizsystem und verfahren zu seiner herstellungInfo
- Publication number
- DE602004016985D1 DE602004016985D1 DE602004016985T DE602004016985T DE602004016985D1 DE 602004016985 D1 DE602004016985 D1 DE 602004016985D1 DE 602004016985 T DE602004016985 T DE 602004016985T DE 602004016985 T DE602004016985 T DE 602004016985T DE 602004016985 D1 DE602004016985 D1 DE 602004016985D1
- Authority
- DE
- Germany
- Prior art keywords
- sensor arrangement
- temperature sensor
- heating elements
- ceramic heater
- heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000919 ceramic Substances 0.000 title abstract 6
- 238000010438 heat treatment Methods 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 239000011733 molybdenum Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
- Tunnel Furnaces (AREA)
- Ceramic Products (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/431,758 US20040222210A1 (en) | 2003-05-08 | 2003-05-08 | Multi-zone ceramic heating system and method of manufacture thereof |
PCT/US2004/004251 WO2004102076A2 (en) | 2003-05-08 | 2004-02-13 | Multi-zone ceramic heating system and method of manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602004016985D1 true DE602004016985D1 (de) | 2008-11-20 |
Family
ID=33416519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004016985T Expired - Lifetime DE602004016985D1 (de) | 2003-05-08 | 2004-02-13 | Mehrzonen-keramikheizsystem und verfahren zu seiner herstellung |
Country Status (6)
Country | Link |
---|---|
US (1) | US20040222210A1 (de) |
EP (1) | EP1621048B1 (de) |
JP (1) | JP4908217B2 (de) |
AT (1) | ATE410905T1 (de) |
DE (1) | DE602004016985D1 (de) |
WO (1) | WO2004102076A2 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7951616B2 (en) * | 2006-03-28 | 2011-05-31 | Lam Research Corporation | Process for wafer temperature verification in etch tools |
US8206996B2 (en) * | 2006-03-28 | 2012-06-26 | Lam Research Corporation | Etch tool process indicator method and apparatus |
US7572480B2 (en) * | 2006-10-19 | 2009-08-11 | Federal-Mogul World Wide, Inc. | Method of fabricating a multilayer ceramic heating element |
JP4879060B2 (ja) * | 2007-03-26 | 2012-02-15 | 日本碍子株式会社 | 基板加熱装置 |
US8637794B2 (en) * | 2009-10-21 | 2014-01-28 | Lam Research Corporation | Heating plate with planar heating zones for semiconductor processing |
US8791392B2 (en) | 2010-10-22 | 2014-07-29 | Lam Research Corporation | Methods of fault detection for multiplexed heater array |
US8546732B2 (en) * | 2010-11-10 | 2013-10-01 | Lam Research Corporation | Heating plate with planar heater zones for semiconductor processing |
WO2013130593A1 (en) * | 2012-02-27 | 2013-09-06 | Watlow Electric Manufacturing Company | Temperature detection and control system for layered heaters |
DE102012101717A1 (de) * | 2012-03-01 | 2013-09-05 | Aixtron Se | Verfahren und Vorrichtung zur Regelung der Oberflächentemperatur eines Suszeptors einer Substratbeschichtungseinrichtung |
US9224626B2 (en) * | 2012-07-03 | 2015-12-29 | Watlow Electric Manufacturing Company | Composite substrate for layered heaters |
DE102012111458B4 (de) * | 2012-11-27 | 2022-12-08 | Tdk Electronics Ag | Halbleitervorrichtung |
CN104131268B (zh) * | 2013-05-03 | 2017-02-08 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 分区域加热方法、装置和半导体设备 |
JP6084906B2 (ja) * | 2013-07-11 | 2017-02-22 | 日本碍子株式会社 | セラミックヒータ |
CN103874243B (zh) * | 2014-03-27 | 2016-06-01 | 福建闽航电子有限公司 | 一种带温控的陶瓷发热片 |
US20170211185A1 (en) * | 2016-01-22 | 2017-07-27 | Applied Materials, Inc. | Ceramic showerhead with embedded conductive layers |
JP6758143B2 (ja) * | 2016-09-29 | 2020-09-23 | 日本特殊陶業株式会社 | 加熱装置 |
US10679873B2 (en) * | 2016-09-30 | 2020-06-09 | Ngk Spark Plug Co., Ltd. | Ceramic heater |
US10796935B2 (en) * | 2017-03-17 | 2020-10-06 | Applied Materials, Inc. | Electronic device manufacturing systems, methods, and apparatus for heating substrates and reducing contamination in loadlocks |
GB2598522B (en) * | 2017-05-03 | 2022-09-07 | Jemella Ltd | Hair styling appliance |
US20210159102A1 (en) * | 2019-11-26 | 2021-05-27 | Tokyo Electron Limited | THERMAL TREATMENTS USING A PLURALITY OF EMBEDDED RESISTANCE TEMPERATURE DETECTORS (RTDs) |
Family Cites Families (52)
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US166854A (en) * | 1875-08-17 | Improvement in vehicle fifth-wheels | ||
US134775A (en) * | 1873-01-14 | Improvement in transplanters | ||
US2938103A (en) * | 1958-04-11 | 1960-05-24 | Electrofilm Inc | Thermostat-carrying electrical heating materials for surface application |
US3789190A (en) * | 1972-10-17 | 1974-01-29 | A J Matlen | Temperature regulation for electrical heater |
US3813520A (en) * | 1973-03-28 | 1974-05-28 | Corning Glass Works | Electric heating unit |
US4549073A (en) * | 1981-11-06 | 1985-10-22 | Oximetrix, Inc. | Current controller for resistive heating element |
JPH0719645B2 (ja) * | 1984-09-07 | 1995-03-06 | 日本電装株式会社 | 自己温度制御型発熱装置 |
JPS6183825A (ja) * | 1984-10-02 | 1986-04-28 | Babcock Hitachi Kk | バ−ナ点火装置 |
GB8514785D0 (en) * | 1985-06-11 | 1985-07-10 | Micropore International Ltd | Infra-red heaters |
US4640224A (en) * | 1985-08-05 | 1987-02-03 | Spectrum Cvd, Inc. | CVD heat source |
US4607591A (en) * | 1985-08-06 | 1986-08-26 | Spectrum Cvd, Inc. | CVD heater control circuit |
JPH0617272B2 (ja) * | 1986-02-12 | 1994-03-09 | 株式会社日本自動車部品総合研究所 | 窒化珪素−アルミナ系複合セラミツクスおよびその製造方法 |
US4778559A (en) * | 1986-10-15 | 1988-10-18 | Advantage Production Technology | Semiconductor substrate heater and reactor process and apparatus |
US4937435A (en) * | 1987-12-14 | 1990-06-26 | Thermon Manufacturing Company | Flexible electric heating pad using PTC ceramic thermistor chip heating elements |
US5001423A (en) * | 1990-01-24 | 1991-03-19 | International Business Machines Corporation | Dry interface thermal chuck temperature control system for semiconductor wafer testing |
JPH0628258B2 (ja) * | 1990-07-20 | 1994-04-13 | 日本碍子株式会社 | 半導体ウエハー加熱装置及びその製造方法 |
US5134248A (en) * | 1990-08-15 | 1992-07-28 | Advanced Temperature Devices, Inc. | Thin film flexible electrical connector |
GB9020400D0 (en) * | 1990-09-19 | 1990-10-31 | Raychem Sa Nv | Electrical heating tape |
DE69130205T2 (de) * | 1990-12-25 | 1999-03-25 | Ngk Insulators Ltd | Heizungsapparat für eine Halbleiterscheibe und Verfahren zum Herstellen desselben |
US5264681A (en) * | 1991-02-14 | 1993-11-23 | Ngk Spark Plug Co., Ltd. | Ceramic heater |
US5436172A (en) * | 1991-05-20 | 1995-07-25 | Texas Instruments Incorporated | Real-time multi-zone semiconductor wafer temperature and process uniformity control system |
DE4130337C2 (de) * | 1991-09-12 | 2002-05-02 | Ego Elektro Blanc & Fischer | Verfahren zum Betrieb einer elektrischen Heizeinheit und elektrische Heizeinheit |
FR2682253A1 (fr) * | 1991-10-07 | 1993-04-09 | Commissariat Energie Atomique | Sole chauffante destinee a assurer le chauffage d'un objet dispose a sa surface et reacteur de traitement chimique muni de ladite sole. |
US5268989A (en) * | 1992-04-16 | 1993-12-07 | Texas Instruments Incorporated | Multi zone illuminator with embeded process control sensors and light interference elimination circuit |
US5783805A (en) * | 1992-06-05 | 1998-07-21 | Katzmann; Fred L. | Electrothermal conversion elements, apparatus and methods for use in comparing, calibrating and measuring electrical signals |
JP2828575B2 (ja) * | 1993-11-12 | 1998-11-25 | 京セラ株式会社 | 窒化珪素質セラミックヒータ |
JPH08274147A (ja) * | 1995-03-30 | 1996-10-18 | Kyocera Corp | ウェハ保持装置 |
US6133557A (en) * | 1995-01-31 | 2000-10-17 | Kyocera Corporation | Wafer holding member |
US5715361A (en) * | 1995-04-13 | 1998-02-03 | Cvc Products, Inc. | Rapid thermal processing high-performance multizone illuminator for wafer backside heating |
US5830277A (en) * | 1995-05-26 | 1998-11-03 | Mattson Technology, Inc. | Thermal processing system with supplemental resistive heater and shielded optical pyrometry |
US5881208A (en) * | 1995-12-20 | 1999-03-09 | Sematech, Inc. | Heater and temperature sensor array for rapid thermal processing thermal core |
KR100280634B1 (ko) * | 1996-05-05 | 2001-02-01 | 세이이치로 미야타 | 전기 발열체 및 이를 이용한 정전 척 |
US5885353A (en) * | 1996-06-21 | 1999-03-23 | Micron Technology, Inc. | Thermal conditioning apparatus |
US6066836A (en) * | 1996-09-23 | 2000-05-23 | Applied Materials, Inc. | High temperature resistive heater for a process chamber |
KR100551980B1 (ko) * | 1997-11-03 | 2006-02-20 | 에이에스엠 아메리카, 인코포레이티드 | 저질량 지지체를 이용한 웨이퍼의 처리방법 및 장치 |
JPH11214127A (ja) * | 1998-01-21 | 1999-08-06 | Riken Corp | ヒーター装置及びその製造方法 |
US5970214A (en) * | 1998-05-14 | 1999-10-19 | Ag Associates | Heating device for semiconductor wafers |
JP2000058237A (ja) * | 1998-06-05 | 2000-02-25 | Ngk Spark Plug Co Ltd | セラミックヒ―タ及びそれを用いた酸素センサ |
JP3764278B2 (ja) * | 1998-07-13 | 2006-04-05 | 株式会社東芝 | 基板加熱装置、基板加熱方法及び基板処理方法 |
JP3892609B2 (ja) * | 1999-02-16 | 2007-03-14 | 株式会社東芝 | ホットプレートおよび半導体装置の製造方法 |
US6469283B1 (en) * | 1999-03-04 | 2002-10-22 | Applied Materials, Inc. | Method and apparatus for reducing thermal gradients within a substrate support |
US6231933B1 (en) * | 1999-03-18 | 2001-05-15 | Primaxx, Inc. | Method and apparatus for metal oxide chemical vapor deposition on a substrate surface |
US6191394B1 (en) * | 1999-05-19 | 2001-02-20 | Tokyo Electron Ltd. | Heat treating apparatus |
JP3228923B2 (ja) * | 2000-01-18 | 2001-11-12 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ |
JP4028149B2 (ja) * | 2000-02-03 | 2007-12-26 | 日本碍子株式会社 | 加熱装置 |
EP1204299A1 (de) * | 2000-04-29 | 2002-05-08 | Ibiden Co., Ltd. | Keramisches heizelement und verfahren zur regelung der temperatur des heizelement. |
EP1391919A1 (de) * | 2001-04-11 | 2004-02-25 | Ibiden Co., Ltd. | Keramisches heizelement für eine halbleiterherstellungs-/-untersuchungsvorrichtung |
CN100401852C (zh) * | 2001-04-30 | 2008-07-09 | 科林研发公司 | 用于控制工件支架表面上空间温度分布的方法与装置 |
DE10125350A1 (de) * | 2001-05-23 | 2002-11-28 | Linde Ag | Vorrichtung zur Kühlung von Bauteilen mittels Hydraulikflüssigkeit aus einem hydraulischen Kreislauf |
US6529686B2 (en) * | 2001-06-06 | 2003-03-04 | Fsi International, Inc. | Heating member for combination heating and chilling apparatus, and methods |
JP3888531B2 (ja) * | 2002-03-27 | 2007-03-07 | 日本碍子株式会社 | セラミックヒーター、セラミックヒーターの製造方法、および金属部材の埋設品 |
JP4136696B2 (ja) * | 2003-02-12 | 2008-08-20 | キヤノン株式会社 | 画像形成装置および画像形成方法 |
-
2003
- 2003-05-08 US US10/431,758 patent/US20040222210A1/en not_active Abandoned
-
2004
- 2004-02-13 AT AT04711141T patent/ATE410905T1/de not_active IP Right Cessation
- 2004-02-13 EP EP04711141A patent/EP1621048B1/de not_active Expired - Lifetime
- 2004-02-13 JP JP2006532286A patent/JP4908217B2/ja not_active Expired - Lifetime
- 2004-02-13 WO PCT/US2004/004251 patent/WO2004102076A2/en active Application Filing
- 2004-02-13 DE DE602004016985T patent/DE602004016985D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20040222210A1 (en) | 2004-11-11 |
ATE410905T1 (de) | 2008-10-15 |
EP1621048A2 (de) | 2006-02-01 |
WO2004102076A2 (en) | 2004-11-25 |
EP1621048A4 (de) | 2007-04-11 |
WO2004102076A3 (en) | 2005-06-16 |
JP4908217B2 (ja) | 2012-04-04 |
JP2007515778A (ja) | 2007-06-14 |
EP1621048B1 (de) | 2008-10-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |