ATE408154T1 - Funktionssteuerbare prüfnadel zur messung von halbleiterwafern und benutzungsverfahren - Google Patents

Funktionssteuerbare prüfnadel zur messung von halbleiterwafern und benutzungsverfahren

Info

Publication number
ATE408154T1
ATE408154T1 AT05104011T AT05104011T ATE408154T1 AT E408154 T1 ATE408154 T1 AT E408154T1 AT 05104011 T AT05104011 T AT 05104011T AT 05104011 T AT05104011 T AT 05104011T AT E408154 T1 ATE408154 T1 AT E408154T1
Authority
AT
Austria
Prior art keywords
semiconductor wafer
electrical
semiconductor wafers
test needle
controller test
Prior art date
Application number
AT05104011T
Other languages
English (en)
Inventor
Howland, Jr
Robert J Hillard
Hung Steven Chi-Shin
Original Assignee
Solid State Measurements Inc
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solid State Measurements Inc, Applied Materials Inc filed Critical Solid State Measurements Inc
Application granted granted Critical
Publication of ATE408154T1 publication Critical patent/ATE408154T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2648—Characterising semiconductor materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
AT05104011T 2004-05-14 2005-05-13 Funktionssteuerbare prüfnadel zur messung von halbleiterwafern und benutzungsverfahren ATE408154T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/845,815 US7023231B2 (en) 2004-05-14 2004-05-14 Work function controlled probe for measuring properties of a semiconductor wafer and method of use thereof

Publications (1)

Publication Number Publication Date
ATE408154T1 true ATE408154T1 (de) 2008-09-15

Family

ID=34939824

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05104011T ATE408154T1 (de) 2004-05-14 2005-05-13 Funktionssteuerbare prüfnadel zur messung von halbleiterwafern und benutzungsverfahren

Country Status (6)

Country Link
US (1) US7023231B2 (de)
EP (1) EP1596212B1 (de)
JP (1) JP2005333148A (de)
AT (1) ATE408154T1 (de)
DE (1) DE602005009603D1 (de)
TW (1) TWI391686B (de)

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US5345170A (en) * 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5729150A (en) * 1995-12-01 1998-03-17 Cascade Microtech, Inc. Low-current probe card with reduced triboelectric current generating cables
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6002263A (en) * 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
US6034533A (en) * 1997-06-10 2000-03-07 Tervo; Paul A. Low-current pogo probe card
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6578264B1 (en) * 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6838890B2 (en) * 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US6951846B2 (en) * 2002-03-07 2005-10-04 The United States Of America As Represented By The Secretary Of The Army Artemisinins with improved stability and bioavailability for therapeutic drug development and application
US6861856B2 (en) * 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7321234B2 (en) * 2003-12-18 2008-01-22 Lecroy Corporation Resistive test probe tips and applications therefor
WO2005065258A2 (en) 2003-12-24 2005-07-21 Cascade Microtech, Inc. Active wafer probe
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7282941B2 (en) * 2005-04-05 2007-10-16 Solid State Measurements, Inc. Method of measuring semiconductor wafers with an oxide enhanced probe
US20070294047A1 (en) * 2005-06-11 2007-12-20 Leonard Hayden Calibration system
US7637009B2 (en) * 2006-02-27 2009-12-29 Sv Probe Pte. Ltd. Approach for fabricating probe elements for probe card assemblies using a reusable substrate
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US20080290889A1 (en) * 2007-05-24 2008-11-27 Solid State Measurements, Inc. Method of destructive testing the dielectric layer of a semiconductor wafer or sample
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
JP5053788B2 (ja) * 2007-10-10 2012-10-17 株式会社アルバック 導電性プローブ、導電性プローブの製造方法、及び磁気特性測定方法
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
DE102012205352B4 (de) * 2012-02-24 2022-12-08 Rohde & Schwarz GmbH & Co. Kommanditgesellschaft Adapter für einen Tastkopf zur Messung eines differenziellen Signals
JP6301680B2 (ja) * 2014-02-25 2018-03-28 エイブリック株式会社 弾性プローブ
US20200233033A1 (en) * 2019-01-17 2020-07-23 Intel Corporation Test probe for wafer-level and panel-level testing

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US5378971A (en) * 1990-11-30 1995-01-03 Tokyo Electron Limited Probe and a method of manufacturing the same
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JP2900764B2 (ja) * 1993-08-30 1999-06-02 住友金属工業株式会社 半導体表面薄膜の評価方法
US5500607A (en) * 1993-12-22 1996-03-19 International Business Machines Corporation Probe-oxide-semiconductor method and apparatus for measuring oxide charge on a semiconductor wafer
JPH10185878A (ja) * 1996-12-26 1998-07-14 Mitsubishi Electric Corp 絶縁破壊測定方法
US5796121A (en) * 1997-03-25 1998-08-18 International Business Machines Corporation Thin film transistors fabricated on plastic substrates
US6139759A (en) * 1997-07-08 2000-10-31 International Business Machines Corporation Method of manufacturing silicided silicon microtips for scanning probe microscopy
JP3280327B2 (ja) * 1997-10-02 2002-05-13 インターナショナル・ビジネス・マシーンズ・コーポレーション テスト・プローブ構造体及びその製造方法
US6181144B1 (en) * 1998-02-25 2001-01-30 Micron Technology, Inc. Semiconductor probe card having resistance measuring circuitry and method fabrication
EP1256006B1 (de) * 1999-10-19 2006-07-19 Solid State Measurements, Inc. Nicht-invasive elektrische messung von halbleiterscheiben
US6741093B2 (en) * 2000-10-19 2004-05-25 Solid State Measurements, Inc. Method of determining one or more properties of a semiconductor wafer
JP2002131334A (ja) * 2000-10-24 2002-05-09 Nec Yamaguchi Ltd プローブ針、プローブカード、及びプローブカードの作製方法
CN1643741A (zh) * 2002-03-18 2005-07-20 纳米纳克斯公司 一种微型接触弹簧
US6632691B1 (en) * 2002-04-11 2003-10-14 Solid State Measurements, Inc. Apparatus and method for determining doping concentration of a semiconductor wafer
US6842029B2 (en) * 2002-04-11 2005-01-11 Solid State Measurements, Inc. Non-invasive electrical measurement of semiconductor wafers
US6894519B2 (en) * 2002-04-11 2005-05-17 Solid State Measurements, Inc. Apparatus and method for determining electrical properties of a semiconductor wafer
US6612161B1 (en) * 2002-07-23 2003-09-02 Fidelica Microsystems, Inc. Atomic force microscopy measurements of contact resistance and current-dependent stiction
US6836139B2 (en) * 2002-10-22 2004-12-28 Solid State Measurments, Inc. Method and apparatus for determining defect and impurity concentration in semiconducting material of a semiconductor wafer
US6879176B1 (en) * 2003-11-04 2005-04-12 Solid State Measurements, Inc. Conductance-voltage (GV) based method for determining leakage current in dielectrics

Also Published As

Publication number Publication date
EP1596212A1 (de) 2005-11-16
JP2005333148A (ja) 2005-12-02
US7023231B2 (en) 2006-04-04
DE602005009603D1 (de) 2008-10-23
EP1596212B1 (de) 2008-09-10
US20050253618A1 (en) 2005-11-17
TWI391686B (zh) 2013-04-01
TW200538748A (en) 2005-12-01

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