ATE407766T1 - Latte für laserschneidmaschinentisch - Google Patents
Latte für laserschneidmaschinentischInfo
- Publication number
- ATE407766T1 ATE407766T1 AT03815425T AT03815425T ATE407766T1 AT E407766 T1 ATE407766 T1 AT E407766T1 AT 03815425 T AT03815425 T AT 03815425T AT 03815425 T AT03815425 T AT 03815425T AT E407766 T1 ATE407766 T1 AT E407766T1
- Authority
- AT
- Austria
- Prior art keywords
- batten
- shelves
- cutting machine
- machine table
- laser cutting
- Prior art date
Links
- 238000003698 laser cutting Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0461—Welding tables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/32—Material from living organisms, e.g. skins
- B23K2103/34—Leather
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/36—Wood or similar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/40—Paper
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Lasers (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0300193A FR2849794B1 (fr) | 2003-01-09 | 2003-01-09 | Latte pour table de machine de decouple laser |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE407766T1 true ATE407766T1 (de) | 2008-09-15 |
Family
ID=32524784
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03815425T ATE407766T1 (de) | 2003-01-09 | 2003-12-29 | Latte für laserschneidmaschinentisch |
Country Status (12)
Country | Link |
---|---|
US (1) | US7759608B2 (de) |
EP (1) | EP1585615B1 (de) |
KR (1) | KR100830189B1 (de) |
CN (1) | CN100391684C (de) |
AT (1) | ATE407766T1 (de) |
AU (1) | AU2003303737C1 (de) |
CA (1) | CA2480135C (de) |
DE (1) | DE60323542D1 (de) |
ES (1) | ES2312861T3 (de) |
FR (1) | FR2849794B1 (de) |
PT (1) | PT1585615E (de) |
WO (1) | WO2004065056A1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4763254B2 (ja) * | 2004-06-16 | 2011-08-31 | コマツ産機株式会社 | 熱切断機 |
FR2897006B1 (fr) * | 2006-02-09 | 2008-05-09 | Snecma Sa | Procede de decoupe par faisceau laser |
DE202006006174U1 (de) * | 2006-04-18 | 2006-07-06 | Faber, Stefan | Schneidtisch für eine Schneidanlage |
WO2007134627A1 (de) * | 2006-05-24 | 2007-11-29 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Werkstuckauflage zur aufnahme eines insbesondere tafelförmigen werkstücks in einer bearbeitungsanlage mit auf auflageelementen anbringbaren tragelementen |
JP4961897B2 (ja) * | 2006-08-29 | 2012-06-27 | ソニー株式会社 | レーザー照射装置、レーザー照射方法、薄膜半導体装置の製造方法、及び表示装置の製造方法 |
GB2443273B (en) * | 2007-03-13 | 2008-09-17 | John Christopher Ramsden | Improvement in or relating to blade replacement to laser bed material support |
EP2082813B1 (de) * | 2008-01-22 | 2016-06-08 | Trumpf Sachsen GmbH | Maschinelle Anordnung zur Wartung und/oder Reinigung von Auflageleisten einer Werkstückauflage |
ITFI20080053A1 (it) * | 2008-03-20 | 2009-09-21 | Ot Las S R L | "dispositivo di lavorazione tramite fascio laser di un materiale in nastro con sistema di appoggio e alimentazione del materiale in corrispondenza della zona di lavoro" |
CN102152001A (zh) * | 2011-04-27 | 2011-08-17 | 苏州天弘激光股份有限公司 | 精密激光切割机 |
JP2015505733A (ja) * | 2011-11-23 | 2015-02-26 | ハイコン システムズ リミテッドHighcon Systems Ltd | カードボード操作システム及び方法 |
US9266199B2 (en) * | 2013-01-08 | 2016-02-23 | Fedtech, Inc. | Copper-tipped slats for laser cutting |
SI3140073T1 (sl) * | 2014-05-09 | 2018-10-30 | Guidolin Girotto S.R.L. | Rezalna naprava za rezanje fleksibilnega materiala s prvo rezalno enoto in drugo rezalno enoto, ki vsebuje vsaj en laserski oddajnik |
CN104759765B (zh) * | 2015-02-04 | 2017-02-01 | 大族激光科技产业集团股份有限公司 | 激光切割用治具 |
BE1023456B1 (nl) * | 2016-03-09 | 2017-03-27 | Fit Things Nv | Snijinrichting en -methode |
CN106271113B (zh) * | 2016-09-30 | 2018-01-09 | 京东方科技集团股份有限公司 | 一种基台、激光切割装置及其控制方法 |
ES2909525T3 (es) | 2018-01-15 | 2022-05-06 | Bobst Mex Sa | Dispositivo de soporte con lamas montadas en un componente básico para almacenar o transportar hojas sueltas o pilas de un material de embalaje |
US11332314B2 (en) | 2018-01-15 | 2022-05-17 | Bobst Mex Sa | Conveyor belt assembly |
DE102018000787A1 (de) * | 2018-01-31 | 2019-08-01 | Bystronic Laser Ag | Werkstückauflage für eine Werkzeugmaschine und Werkzeugmaschine |
DE102020120032B4 (de) * | 2020-07-29 | 2023-10-26 | Eissmann Automotive Deutschland Gmbh | Verfahren zum Einbringen von Öffnungen in ein auf einen Träger kaschiertes Dekormaterial |
TWI794707B (zh) * | 2020-12-23 | 2023-03-01 | 力山工業股份有限公司 | 具有導水裝置的磁磚切割機 |
KR102659797B1 (ko) | 2023-12-29 | 2024-04-23 | 주식회사 에스앤디코리아 | 반도체 제조용 저장탱크를 위한 레이저 가공 지능형 로봇 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3828159A (en) * | 1970-01-19 | 1974-08-06 | Hughes Aircraft Co | Laser cutting surface |
DE2147284C3 (de) * | 1971-09-22 | 1980-10-30 | Messer Griesheim Gmbh, 6000 Frankfurt | Vorrichtung zur Unterstützung von mit einem Laserstrahl zu schneidender Werkstücke |
SE396567C (sv) * | 1975-08-07 | 1979-12-27 | Lindkvist Konsultbyra Ab A | Anordning for bortskaffande av vid gasskerning och liknande alstrande fororeningar |
US4112797A (en) * | 1977-10-07 | 1978-09-12 | Gerber Garment Technology, Inc. | Fluid jet cutting apparatus |
KR890004531B1 (ko) * | 1981-12-14 | 1989-11-13 | 고이께 요시오 | 플라즈마 아아크 절단기에 있어서의 배연장치 |
DE3428139A1 (de) * | 1984-07-31 | 1986-02-13 | Oxytechnik Gesellschaft für Systemtechnik mbH, 6236 Eschborn | Einrichtung zum transportieren von profilen |
FR2586607B1 (fr) * | 1985-09-02 | 1989-08-25 | Lectra Systemes Sa | Support pour decoupe, par rayon laser, d'un materiau foliiforme |
US5227606A (en) * | 1992-02-26 | 1993-07-13 | U.S. Amada Ltd. | Method and apparatus for laser cutting of multiple stacked metal worksheets |
US5167903A (en) * | 1992-04-28 | 1992-12-01 | Anderson Harry E | Apparatus for supporting a work piece on a water table |
TW245669B (de) * | 1993-09-27 | 1995-04-21 | Mitsubishi Electric Machine | |
US5481083A (en) * | 1993-12-23 | 1996-01-02 | Cincinnati, Incorporated | System and method for stacking and laser cutting multiple layers of flexible material |
US5435525A (en) * | 1994-07-28 | 1995-07-25 | Roy; Peter J. | Negative pressure chamber table for gas-driven cutting apparatus |
JP3175497B2 (ja) * | 1994-10-06 | 2001-06-11 | 三菱電機株式会社 | 加工装置の被加工物支持台 |
NL1001079C2 (nl) * | 1995-08-29 | 1997-03-03 | Antonius Theodorus Cecilianus | Afzuigtafel. |
US6128546A (en) * | 1996-09-30 | 2000-10-03 | Cincinnati Incorporated | Method and apparatus for a cutting system for avoiding pre-cut features |
JPH1158062A (ja) * | 1997-08-27 | 1999-03-02 | Takasaki Bendaa Kk | レーザー切断装置 |
DE29916400U1 (de) * | 1999-09-17 | 1999-12-30 | Ebeling, Helge, Dipl.-Ing., 67595 Bechtheim | Werkstückauflagetisch für thermische Trennverfahren mit integrierter Absaugung |
US6222155B1 (en) * | 2000-06-14 | 2001-04-24 | The Esab Group, Inc. | Cutting apparatus with thermal and nonthermal cutters, and associated methods |
CN1496635A (zh) * | 2001-03-30 | 2004-05-12 | 皇家菲利浦电子有限公司 | 用于配置电气和电子装置及设备的系统 |
US6727457B1 (en) * | 2002-01-10 | 2004-04-27 | David M. Vande Berg | Apparatus for draft control and debris collection in a downdraft metal cutting table |
-
2003
- 2003-01-09 FR FR0300193A patent/FR2849794B1/fr not_active Expired - Fee Related
- 2003-12-29 ES ES03815425T patent/ES2312861T3/es not_active Expired - Lifetime
- 2003-12-29 DE DE60323542T patent/DE60323542D1/de not_active Expired - Lifetime
- 2003-12-29 KR KR1020047014602A patent/KR100830189B1/ko not_active IP Right Cessation
- 2003-12-29 AT AT03815425T patent/ATE407766T1/de not_active IP Right Cessation
- 2003-12-29 EP EP03815425A patent/EP1585615B1/de not_active Expired - Lifetime
- 2003-12-29 CA CA2480135A patent/CA2480135C/en not_active Expired - Fee Related
- 2003-12-29 AU AU2003303737A patent/AU2003303737C1/en not_active Ceased
- 2003-12-29 WO PCT/FR2003/003930 patent/WO2004065056A1/fr active IP Right Grant
- 2003-12-29 PT PT03815425T patent/PT1585615E/pt unknown
- 2003-12-29 CN CNB2003801004531A patent/CN100391684C/zh not_active Expired - Fee Related
- 2003-12-29 US US10/507,051 patent/US7759608B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2849794A1 (fr) | 2004-07-16 |
WO2004065056A1 (fr) | 2004-08-05 |
PT1585615E (pt) | 2008-12-10 |
CN1692000A (zh) | 2005-11-02 |
AU2003303737A1 (en) | 2004-08-13 |
FR2849794B1 (fr) | 2006-05-05 |
KR20050111721A (ko) | 2005-11-28 |
KR100830189B1 (ko) | 2008-05-16 |
US7759608B2 (en) | 2010-07-20 |
CA2480135A1 (en) | 2004-08-05 |
EP1585615A1 (de) | 2005-10-19 |
ES2312861T3 (es) | 2009-03-01 |
AU2003303737B2 (en) | 2009-01-22 |
CA2480135C (en) | 2012-08-21 |
CN100391684C (zh) | 2008-06-04 |
DE60323542D1 (de) | 2008-10-23 |
US20050116396A1 (en) | 2005-06-02 |
AU2003303737C1 (en) | 2009-10-08 |
EP1585615B1 (de) | 2008-09-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |