ATE360598T1 - System und verfahren für vergrabene elektrische durchführungen in einem glas-silizium-mems- prozess - Google Patents

System und verfahren für vergrabene elektrische durchführungen in einem glas-silizium-mems- prozess

Info

Publication number
ATE360598T1
ATE360598T1 AT04719227T AT04719227T ATE360598T1 AT E360598 T1 ATE360598 T1 AT E360598T1 AT 04719227 T AT04719227 T AT 04719227T AT 04719227 T AT04719227 T AT 04719227T AT E360598 T1 ATE360598 T1 AT E360598T1
Authority
AT
Austria
Prior art keywords
glass
silicon
sealed cavity
recesses
burned
Prior art date
Application number
AT04719227T
Other languages
English (en)
Inventor
Robert D Horning
Jeffrey A Ridley
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Application granted granted Critical
Publication of ATE360598T1 publication Critical patent/ATE360598T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/097—Interconnects arranged on the substrate or the lid, and covered by the package seal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Micromachines (AREA)
  • Gyroscopes (AREA)
  • Glass Compositions (AREA)
  • Pressure Sensors (AREA)
AT04719227T 2003-03-10 2004-03-10 System und verfahren für vergrabene elektrische durchführungen in einem glas-silizium-mems- prozess ATE360598T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/385,181 US6888233B2 (en) 2003-03-10 2003-03-10 Systems for buried electrical feedthroughs in a glass-silicon MEMS process

Publications (1)

Publication Number Publication Date
ATE360598T1 true ATE360598T1 (de) 2007-05-15

Family

ID=32961451

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04719227T ATE360598T1 (de) 2003-03-10 2004-03-10 System und verfahren für vergrabene elektrische durchführungen in einem glas-silizium-mems- prozess

Country Status (8)

Country Link
US (2) US6888233B2 (de)
EP (1) EP1601611B1 (de)
JP (1) JP2006519707A (de)
KR (1) KR20050109551A (de)
AT (1) ATE360598T1 (de)
AU (1) AU2004220026A1 (de)
DE (1) DE602004006094T2 (de)
WO (1) WO2004080888A1 (de)

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US8288654B2 (en) * 2006-11-30 2012-10-16 Medtronic, Inc. Feedthrough assembly including a ferrule, an insulating structure and a glass
US8129622B2 (en) * 2006-11-30 2012-03-06 Medtronic, Inc. Insulator for feedthrough
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US20100177458A1 (en) * 2009-01-12 2010-07-15 Medtronic, Inc. Capacitor for filtered feedthrough with conductive pad
US8373965B2 (en) 2009-02-10 2013-02-12 Medtronic, Inc. Filtered feedthrough assembly and associated method
US9009935B2 (en) * 2009-05-06 2015-04-21 Medtronic, Inc. Methods to prevent high voltage arcing under capacitors used in filtered feedthroughs
US20110032658A1 (en) * 2009-08-07 2011-02-10 Medtronic, Inc. Capacitor assembly and associated method
US8707734B2 (en) * 2009-10-19 2014-04-29 The Regents Of The University Of Michigan Method of embedding material in a glass substrate
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DE102010029709B4 (de) 2010-06-04 2020-08-06 Robert Bosch Gmbh Mikromechanisches Bauelement und Verfahren zum Herstellen eines mikromechanischen Bauelements
US8569090B2 (en) * 2010-12-03 2013-10-29 Babak Taheri Wafer level structures and methods for fabricating and packaging MEMS
CN103460336A (zh) * 2011-03-30 2013-12-18 高萨姆·维斯瓦纳达姆 玻璃上的微器件
DE102011051441B4 (de) 2011-06-29 2018-10-25 CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH Druckwandlungsbasierter Sensor zur Bestimmung einer Messgröße in einem Medium
US8824706B2 (en) 2011-08-30 2014-09-02 Qualcomm Mems Technologies, Inc. Piezoelectric microphone fabricated on glass
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US8593816B2 (en) 2011-09-21 2013-11-26 Medtronic, Inc. Compact connector assembly for implantable medical device
US8811636B2 (en) 2011-11-29 2014-08-19 Qualcomm Mems Technologies, Inc. Microspeaker with piezoelectric, metal and dielectric membrane
CN103043604B (zh) * 2012-12-06 2015-09-02 中国电子科技集团公司第五十五研究所 硅-玻璃键合界面金属导线与悬空可动结构间电荷释放法
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Also Published As

Publication number Publication date
US6924165B2 (en) 2005-08-02
EP1601611B1 (de) 2007-04-25
US20040180464A1 (en) 2004-09-16
WO2004080888A1 (en) 2004-09-23
AU2004220026A1 (en) 2004-09-23
KR20050109551A (ko) 2005-11-21
JP2006519707A (ja) 2006-08-31
US6888233B2 (en) 2005-05-03
EP1601611A1 (de) 2005-12-07
DE602004006094D1 (de) 2007-06-06
DE602004006094T2 (de) 2008-01-10
US20040244484A1 (en) 2004-12-09

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