ATE33322T1 - Filmtraeger fuer die filmtraegerband-technik integrierter schaltungen und verfahren zum herstellen der filmtraeger. - Google Patents

Filmtraeger fuer die filmtraegerband-technik integrierter schaltungen und verfahren zum herstellen der filmtraeger.

Info

Publication number
ATE33322T1
ATE33322T1 AT82303716T AT82303716T ATE33322T1 AT E33322 T1 ATE33322 T1 AT E33322T1 AT 82303716 T AT82303716 T AT 82303716T AT 82303716 T AT82303716 T AT 82303716T AT E33322 T1 ATE33322 T1 AT E33322T1
Authority
AT
Austria
Prior art keywords
film carrier
tape
bonding
integrated circuits
manufacturing
Prior art date
Application number
AT82303716T
Other languages
German (de)
English (en)
Inventor
Francis Nihal Sinnadurai
David John Small
Alexander Anthony Blain
Kenneth Cooper
Original Assignee
British Telecomm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=10523346&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE33322(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by British Telecomm filed Critical British Telecomm
Application granted granted Critical
Publication of ATE33322T1 publication Critical patent/ATE33322T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Landscapes

  • Wire Bonding (AREA)
AT82303716T 1981-07-17 1982-07-15 Filmtraeger fuer die filmtraegerband-technik integrierter schaltungen und verfahren zum herstellen der filmtraeger. ATE33322T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8122218 1981-07-17
EP82303716A EP0070691B1 (en) 1981-07-17 1982-07-15 Tape for tape-automated-bonding of integrated circuits and method of producing the tape

Publications (1)

Publication Number Publication Date
ATE33322T1 true ATE33322T1 (de) 1988-04-15

Family

ID=10523346

Family Applications (1)

Application Number Title Priority Date Filing Date
AT82303716T ATE33322T1 (de) 1981-07-17 1982-07-15 Filmtraeger fuer die filmtraegerband-technik integrierter schaltungen und verfahren zum herstellen der filmtraeger.

Country Status (5)

Country Link
EP (1) EP0070691B1 (https=)
JP (2) JPS5827355A (https=)
AT (1) ATE33322T1 (https=)
CA (1) CA1198833A (https=)
DE (1) DE3278301D1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62287093A (ja) * 1986-06-05 1987-12-12 Okuno Seiyaku Kogyo Kk 電気亜鉛−ニツケル合金めつき浴
EP0327996A3 (en) * 1988-02-09 1990-12-27 National Semiconductor Corporation Tape automated bonding of bumped tape on bumped die
DE4017863C1 (https=) * 1990-06-02 1991-07-18 Du Pont De Nemours (Deutschland) Gmbh, 4000 Duesseldorf, De
JP4497032B2 (ja) * 2005-06-16 2010-07-07 Ｔｄｋ株式会社 電子部品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5394874A (en) * 1977-01-31 1978-08-19 Matsushita Electric Ind Co Ltd Connecting method for semiconductor device
JPS5469383A (en) * 1977-11-15 1979-06-04 Toshiba Corp Production of semiconductor device
JPS5548954A (en) * 1978-10-03 1980-04-08 Toshiba Corp Manufacturing of film carrier

Also Published As

Publication number Publication date
EP0070691A1 (en) 1983-01-26
JPS5827355A (ja) 1983-02-18
JPH033940B2 (https=) 1991-01-21
JPH03123046A (ja) 1991-05-24
DE3278301D1 (en) 1988-05-05
CA1198833A (en) 1985-12-31
EP0070691B1 (en) 1988-03-30
JPH0371778B2 (https=) 1991-11-14

Similar Documents

Publication Publication Date Title
DK1353374T3 (da) Halvlederchipenhed og fremgangsmåde til fremstilling deraf
ATE59733T1 (de) Ein verfahren zum herstellen einer halbleiteranordnung mit leiter-steckerstiften.
SG73389A1 (en) Method of connecting tab tape to semiconductor chip and bump sheet and bumped tape used in the method
EP0890989A4 (en) SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
FR2579798B1 (fr) Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede
FR2704690B1 (fr) Procédé d'encapsulation de pastilles semi-conductrices, dispositif obtenu par ce procédé et application à l'interconnexion de pastilles en trois dimensions.
EP0473796A4 (en) Semiconductor device having a plurality of chips
MY130185A (en) Method & apparatus for producing integrated circuit devices.
US4704187A (en) Method of forming a lead frame
DE68908341D1 (de) Verfahren zum montieren eines elektronischen bausteins und diesen verwendende speicherkarte.
FR2720190B1 (fr) Procédé de raccordement des plages de sortie d'une puce à circuit intégré, et module multipuces ainsi obtenu.
EP0285051A3 (en) Method for bonding integrated circuit chips
ATE33322T1 (de) Filmtraeger fuer die filmtraegerband-technik integrierter schaltungen und verfahren zum herstellen der filmtraeger.
SG165145A1 (en) Film carrier tape
CA2000338A1 (en) Lead frame for a multiplicity of terminals
US5270570A (en) Lead frame for a multiplicity of terminals
US5656854A (en) Lead frame for a multiplicity of terminals
GB2244176B (en) Method and apparatus for forming a conductive pattern on an integrated circuit
ES2002935A6 (es) Un metodo para hacer un miembro conectivo microelectronico elastico
EP0171783A3 (en) Module board and module using the same and method of treating them
JPS55124248A (en) Leadless package
JPS647645A (en) Semiconductor device and manufacture thereof
JPS6486545A (en) Lead frame
JPS6424602A (en) Mounting method for chip type inductor
JPS6477953A (en) Lead frame for semiconductor device

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee