JPS6486545A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS6486545A JPS6486545A JP24503487A JP24503487A JPS6486545A JP S6486545 A JPS6486545 A JP S6486545A JP 24503487 A JP24503487 A JP 24503487A JP 24503487 A JP24503487 A JP 24503487A JP S6486545 A JPS6486545 A JP S6486545A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- die bonding
- bonding area
- lead frame
- shield
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To prevent the interference of signals among adjacent leads in a package while obtaining a lead frame having a high effect of heat dissipation by forming the leads, one sides of which are connected to a die bonding area, among all the adjacent leads for connecting circuits. CONSTITUTION:The substrate potential of a chip is applied normally to a die bonding area section 1. Accordingly, leads 4 for shield, one ends of which are connected to the die bonding area 1, are brought to the same potential as the die bonding area section 1, and have the effect of shield among adjacent leads 2 for connecting circuits, and the mutual interference of signals among the leads 2 can be prevented while the area of the die bonding area can be increased, thus acquiring a package having the high effect of heat dissipation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24503487A JPS6486545A (en) | 1987-09-28 | 1987-09-28 | Lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24503487A JPS6486545A (en) | 1987-09-28 | 1987-09-28 | Lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6486545A true JPS6486545A (en) | 1989-03-31 |
Family
ID=17127598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24503487A Pending JPS6486545A (en) | 1987-09-28 | 1987-09-28 | Lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6486545A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6798045B2 (en) | 1998-07-28 | 2004-09-28 | Infineon Technologies Ag | Lead frame, circuit board with lead frame, and method for producing the lead frame |
-
1987
- 1987-09-28 JP JP24503487A patent/JPS6486545A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6798045B2 (en) | 1998-07-28 | 2004-09-28 | Infineon Technologies Ag | Lead frame, circuit board with lead frame, and method for producing the lead frame |
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