JPS6486545A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS6486545A
JPS6486545A JP24503487A JP24503487A JPS6486545A JP S6486545 A JPS6486545 A JP S6486545A JP 24503487 A JP24503487 A JP 24503487A JP 24503487 A JP24503487 A JP 24503487A JP S6486545 A JPS6486545 A JP S6486545A
Authority
JP
Japan
Prior art keywords
leads
die bonding
bonding area
lead frame
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24503487A
Other languages
Japanese (ja)
Inventor
Yasuyuki Nakamura
Toshio Kumamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP24503487A priority Critical patent/JPS6486545A/en
Publication of JPS6486545A publication Critical patent/JPS6486545A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the interference of signals among adjacent leads in a package while obtaining a lead frame having a high effect of heat dissipation by forming the leads, one sides of which are connected to a die bonding area, among all the adjacent leads for connecting circuits. CONSTITUTION:The substrate potential of a chip is applied normally to a die bonding area section 1. Accordingly, leads 4 for shield, one ends of which are connected to the die bonding area 1, are brought to the same potential as the die bonding area section 1, and have the effect of shield among adjacent leads 2 for connecting circuits, and the mutual interference of signals among the leads 2 can be prevented while the area of the die bonding area can be increased, thus acquiring a package having the high effect of heat dissipation.
JP24503487A 1987-09-28 1987-09-28 Lead frame Pending JPS6486545A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24503487A JPS6486545A (en) 1987-09-28 1987-09-28 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24503487A JPS6486545A (en) 1987-09-28 1987-09-28 Lead frame

Publications (1)

Publication Number Publication Date
JPS6486545A true JPS6486545A (en) 1989-03-31

Family

ID=17127598

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24503487A Pending JPS6486545A (en) 1987-09-28 1987-09-28 Lead frame

Country Status (1)

Country Link
JP (1) JPS6486545A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6798045B2 (en) 1998-07-28 2004-09-28 Infineon Technologies Ag Lead frame, circuit board with lead frame, and method for producing the lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6798045B2 (en) 1998-07-28 2004-09-28 Infineon Technologies Ag Lead frame, circuit board with lead frame, and method for producing the lead frame

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