ATE314730T1 - Ram speicher und das in deren herstellung verwendete platindampfabscheidungsverfahren - Google Patents
Ram speicher und das in deren herstellung verwendete platindampfabscheidungsverfahrenInfo
- Publication number
- ATE314730T1 ATE314730T1 AT97936141T AT97936141T ATE314730T1 AT E314730 T1 ATE314730 T1 AT E314730T1 AT 97936141 T AT97936141 T AT 97936141T AT 97936141 T AT97936141 T AT 97936141T AT E314730 T1 ATE314730 T1 AT E314730T1
- Authority
- AT
- Austria
- Prior art keywords
- butyl
- propyl
- methyl
- vapor deposition
- group
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C49/00—Ketones; Ketenes; Dimeric ketenes; Ketonic chelates
- C07C49/92—Ketonic chelates
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F17/00—Metallocenes
- C07F17/02—Metallocenes of metals of Groups 8, 9 or 10 of the Periodic System
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
- H01L28/65—Electrodes comprising a noble metal or a noble metal oxide, e.g. platinum (Pt), ruthenium (Ru), ruthenium dioxide (RuO2), iridium (Ir), iridium dioxide (IrO2)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/673,372 US5783716A (en) | 1996-06-28 | 1996-06-28 | Platinum source compositions for chemical vapor deposition of platinum |
PCT/US1997/012762 WO1998000432A1 (en) | 1996-06-28 | 1997-06-27 | Platinum source compositions for chemical vapor deposition of platinum |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE314730T1 true ATE314730T1 (de) | 2006-01-15 |
Family
ID=24702388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT97936141T ATE314730T1 (de) | 1996-06-28 | 1997-06-27 | Ram speicher und das in deren herstellung verwendete platindampfabscheidungsverfahren |
Country Status (6)
Country | Link |
---|---|
US (2) | US5783716A (de) |
EP (1) | EP0920435B1 (de) |
JP (1) | JP2001504159A (de) |
AT (1) | ATE314730T1 (de) |
DE (1) | DE69734985D1 (de) |
WO (1) | WO1998000432A1 (de) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3769711B2 (ja) | 1997-11-28 | 2006-04-26 | ローム株式会社 | キャパシタの製法 |
JP3321729B2 (ja) * | 1998-04-03 | 2002-09-09 | 株式会社高純度化学研究所 | トリメチル(エチルシクロペンタジエニル)白金とそ の製造方法及びそれを用いた白金含有薄膜の製造方法 |
US6284654B1 (en) * | 1998-04-16 | 2001-09-04 | Advanced Technology Materials, Inc. | Chemical vapor deposition process for fabrication of hybrid electrodes |
US6750110B1 (en) * | 1998-07-23 | 2004-06-15 | Micron Technology, Inc. | Continuous good step coverage CVD platinum metal deposition |
US6271131B1 (en) | 1998-08-26 | 2001-08-07 | Micron Technology, Inc. | Methods for forming rhodium-containing layers such as platinum-rhodium barrier layers |
US7098503B1 (en) | 1998-08-27 | 2006-08-29 | Micron Technology, Inc. | Circuitry and capacitors comprising roughened platinum layers |
US6583022B1 (en) | 1998-08-27 | 2003-06-24 | Micron Technology, Inc. | Methods of forming roughened layers of platinum and methods of forming capacitors |
US6261850B1 (en) * | 1998-09-03 | 2001-07-17 | Micron Technology, Inc. | Direct writing of low carbon conductive material |
US6323081B1 (en) * | 1998-09-03 | 2001-11-27 | Micron Technology, Inc. | Diffusion barrier layers and methods of forming same |
EP1130628A4 (de) * | 1998-10-14 | 2007-07-04 | Hitachi Ltd | Halbleitervorrichtung und herstellungsverfahren |
US6218293B1 (en) | 1998-11-13 | 2001-04-17 | Micron Technology, Inc. | Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride |
US7012292B1 (en) | 1998-11-25 | 2006-03-14 | Advanced Technology Materials, Inc | Oxidative top electrode deposition process, and microelectronic device structure |
US6204178B1 (en) * | 1998-12-29 | 2001-03-20 | Micron Technology, Inc. | Nucleation and deposition of PT films using ultraviolet irradiation |
US6352944B1 (en) | 1999-02-10 | 2002-03-05 | Micron Technology, Inc. | Method of depositing an aluminum nitride comprising layer over a semiconductor substrate |
US6984591B1 (en) * | 2000-04-20 | 2006-01-10 | International Business Machines Corporation | Precursor source mixtures |
US6503314B1 (en) * | 2000-08-28 | 2003-01-07 | Sharp Laboratories Of America, Inc. | MOCVD ferroelectric and dielectric thin films depositions using mixed solvents |
US7217615B1 (en) * | 2000-08-31 | 2007-05-15 | Micron Technology, Inc. | Capacitor fabrication methods including forming a conductive layer |
US6660631B1 (en) * | 2000-08-31 | 2003-12-09 | Micron Technology, Inc. | Devices containing platinum-iridium films and methods of preparing such films and devices |
JP3598068B2 (ja) | 2001-02-06 | 2004-12-08 | 松下電器産業株式会社 | 半導体装置の製造方法 |
GB2372404B (en) | 2001-02-16 | 2003-04-09 | Ericsson Telefon Ab L M | Telecommunications system |
US20030036242A1 (en) * | 2001-08-16 | 2003-02-20 | Haining Yang | Methods of forming metal-comprising materials and capacitor electrodes; and capacitor constructions |
US6576538B2 (en) * | 2001-08-30 | 2003-06-10 | Micron Technology, Inc. | Technique for high efficiency metalorganic chemical vapor deposition |
US6573199B2 (en) | 2001-08-30 | 2003-06-03 | Micron Technology, Inc. | Methods of treating dielectric materials with oxygen, and methods of forming capacitor constructions |
US6918960B2 (en) * | 2001-11-28 | 2005-07-19 | Micron Technology, Inc. | CVD of PtRh with good adhesion and morphology |
US7105065B2 (en) * | 2002-04-25 | 2006-09-12 | Micron Technology, Inc. | Metal layer forming methods and capacitor electrode forming methods |
US7160577B2 (en) | 2002-05-02 | 2007-01-09 | Micron Technology, Inc. | Methods for atomic-layer deposition of aluminum oxides in integrated circuits |
FR2839982B1 (fr) | 2002-05-22 | 2005-04-15 | Centre Nat Rech Scient | Composition de precurseur pour le depot de cuivre sur un support |
AU2003275973A1 (en) | 2002-06-12 | 2003-12-31 | Praxair Technology, Inc. | A method for producing organometallic compounds |
JP2004067601A (ja) * | 2002-08-07 | 2004-03-04 | Tanaka Kikinzoku Kogyo Kk | Cvd原料用の有機化合物及び該有機化合物を用いた金属又は金属化合物薄膜の製造方法 |
US7084078B2 (en) | 2002-08-29 | 2006-08-01 | Micron Technology, Inc. | Atomic layer deposited lanthanide doped TiOx dielectric films |
EP1599613B1 (de) * | 2003-03-03 | 2006-06-28 | DECHEMA Gesellschaft für Chemische Technologie und Biotechnologie e.V. | Verfahren zur beschichtung eines substrates |
US20050081907A1 (en) * | 2003-10-20 | 2005-04-21 | Lewis Larry N. | Electro-active device having metal-containing layer |
JP2005158842A (ja) * | 2003-11-21 | 2005-06-16 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
US7166732B2 (en) * | 2004-06-16 | 2007-01-23 | Advanced Technology Materials, Inc. | Copper (I) compounds useful as deposition precursors of copper thin films |
US7588988B2 (en) | 2004-08-31 | 2009-09-15 | Micron Technology, Inc. | Method of forming apparatus having oxide films formed using atomic layer deposition |
US7662729B2 (en) | 2005-04-28 | 2010-02-16 | Micron Technology, Inc. | Atomic layer deposition of a ruthenium layer to a lanthanide oxide dielectric layer |
US7572695B2 (en) | 2005-05-27 | 2009-08-11 | Micron Technology, Inc. | Hafnium titanium oxide films |
US7927948B2 (en) | 2005-07-20 | 2011-04-19 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
US7575978B2 (en) | 2005-08-04 | 2009-08-18 | Micron Technology, Inc. | Method for making conductive nanoparticle charge storage element |
US7410910B2 (en) | 2005-08-31 | 2008-08-12 | Micron Technology, Inc. | Lanthanum aluminum oxynitride dielectric films |
FR2897070B1 (fr) * | 2006-02-03 | 2008-12-19 | Commissariat Energie Atomique | Procede dli-mocvd pour la fabrication d'electrodes pour reacteurs electrochimiques, electrodes obtenues par ce procede et pile a combustible et accumulateur mettant en oeuvre de telles electrodes |
DE102006050863A1 (de) * | 2006-10-27 | 2008-04-30 | Wacker Chemie Ag | Platinkatalysator |
TW200825200A (en) * | 2006-12-05 | 2008-06-16 | Advanced Tech Materials | Metal aminotroponiminates, bis-oxazolinates and guanidinates |
US7763511B2 (en) * | 2006-12-29 | 2010-07-27 | Intel Corporation | Dielectric barrier for nanocrystals |
US7750173B2 (en) | 2007-01-18 | 2010-07-06 | Advanced Technology Materials, Inc. | Tantalum amido-complexes with chelate ligands useful for CVD and ALD of TaN and Ta205 thin films |
US8367506B2 (en) | 2007-06-04 | 2013-02-05 | Micron Technology, Inc. | High-k dielectrics with gold nano-particles |
US20090275164A1 (en) * | 2008-05-02 | 2009-11-05 | Advanced Technology Materials, Inc. | Bicyclic guanidinates and bridging diamides as cvd/ald precursors |
US9121043B2 (en) | 2010-06-15 | 2015-09-01 | Metabolic Explorer | Method for producing glycolic acid using an inducible promoter |
EP2700646B1 (de) | 2011-04-20 | 2015-10-14 | Tanaka Kikinzoku Kogyo K.K. | Verfahren zur chemischen dampfabscheidung mit hilfe einer organischen platinverbindung |
JP5156120B1 (ja) | 2011-10-14 | 2013-03-06 | 田中貴金属工業株式会社 | 有機白金化合物からなる化学蒸着用原料及び該化学蒸着用原料を用いた化学蒸着法 |
JP5960321B1 (ja) | 2015-05-12 | 2016-08-02 | 田中貴金属工業株式会社 | 有機白金化合物からなる化学蒸着用原料及び該化学蒸着用原料を用いた化学蒸着法 |
JP5952460B1 (ja) | 2015-05-12 | 2016-07-13 | 田中貴金属工業株式会社 | 有機白金化合物からなる化学蒸着用原料及び該化学蒸着用原料を用いた化学蒸着法 |
JP6407370B1 (ja) * | 2017-07-25 | 2018-10-17 | 田中貴金属工業株式会社 | 有機白金化合物からなる気相蒸着用原料及び該気相蒸着用原料を用いた気相蒸着法 |
WO2021186087A1 (de) * | 2020-03-20 | 2021-09-23 | Umicore Ag & Co. Kg | Trimethylplatin(iv)-iodid |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4510094A (en) * | 1983-12-06 | 1985-04-09 | Minnesota Mining And Manufacturing Company | Platinum complex |
GB8526613D0 (en) * | 1985-10-29 | 1985-12-04 | Shell Int Research | Aldehydes |
JPH0254704A (ja) * | 1988-08-19 | 1990-02-23 | Tanaka Kikinzoku Kogyo Kk | 貴金属粒子の製造方法 |
US4912072A (en) * | 1988-10-21 | 1990-03-27 | Gas Research Institute | Method for selective internal platinization of porous aluminosilicates |
US5130172A (en) * | 1988-10-21 | 1992-07-14 | The Regents Of The University Of California | Low temperature organometallic deposition of metals |
CA1340871C (en) * | 1988-12-28 | 2000-01-04 | Robert W. Epperly | Method for reducing emissions from or increasing the utilizable energy of fuel for powering internal combustion engines |
US5104684A (en) * | 1990-05-25 | 1992-04-14 | Massachusetts Institute Of Technology | Ion beam induced deposition of metals |
US5116637A (en) * | 1990-06-04 | 1992-05-26 | Dow Corning Corporation | Amine catalysts for the low temperature conversion of silica precursors to silica |
US5840897A (en) * | 1990-07-06 | 1998-11-24 | Advanced Technology Materials, Inc. | Metal complex source reagents for chemical vapor deposition |
US5280012A (en) * | 1990-07-06 | 1994-01-18 | Advanced Technology Materials Inc. | Method of forming a superconducting oxide layer by MOCVD |
US5276226A (en) * | 1992-10-05 | 1994-01-04 | Exxon Research & Engineering Company | Low temperature halogenation of alkanes |
US5403620A (en) * | 1992-10-13 | 1995-04-04 | Regents Of The University Of California | Catalysis in organometallic CVD of thin metal films |
US5502227A (en) * | 1993-07-27 | 1996-03-26 | Cvd, Incorporated | Liquid indium source |
ES2123823T3 (es) * | 1993-08-19 | 1999-01-16 | Shell Int Research | Procedimiento de hidroformilacion. |
WO1997005994A1 (en) * | 1995-08-04 | 1997-02-20 | Microcoating Technologies Inc | Chemical vapor deposition and powder formation using thermal spray with near supercritical and supercritical fluid solutions |
WO1997008124A1 (en) * | 1995-08-25 | 1997-03-06 | E.I. Du Pont De Nemours And Company | Hydroformylation process |
-
1996
- 1996-06-28 US US08/673,372 patent/US5783716A/en not_active Expired - Lifetime
-
1997
- 1997-06-27 AT AT97936141T patent/ATE314730T1/de not_active IP Right Cessation
- 1997-06-27 DE DE69734985T patent/DE69734985D1/de not_active Expired - Lifetime
- 1997-06-27 EP EP97936141A patent/EP0920435B1/de not_active Expired - Lifetime
- 1997-06-27 WO PCT/US1997/012762 patent/WO1998000432A1/en active IP Right Grant
- 1997-06-27 JP JP50453098A patent/JP2001504159A/ja active Pending
-
1998
- 1998-01-16 US US09/008,705 patent/US6162712A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5783716A (en) | 1998-07-21 |
EP0920435B1 (de) | 2005-12-28 |
EP0920435A1 (de) | 1999-06-09 |
US6162712A (en) | 2000-12-19 |
JP2001504159A (ja) | 2001-03-27 |
DE69734985D1 (de) | 2006-02-02 |
EP0920435A4 (de) | 2001-07-25 |
WO1998000432A1 (en) | 1998-01-08 |
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Legal Events
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RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |