ATE288952T1 - Wärmeleitende zusammensetzung - Google Patents

Wärmeleitende zusammensetzung

Info

Publication number
ATE288952T1
ATE288952T1 AT02739595T AT02739595T ATE288952T1 AT E288952 T1 ATE288952 T1 AT E288952T1 AT 02739595 T AT02739595 T AT 02739595T AT 02739595 T AT02739595 T AT 02739595T AT E288952 T1 ATE288952 T1 AT E288952T1
Authority
AT
Austria
Prior art keywords
weight
parts
heat conducting
conducting composition
thermoconductive
Prior art date
Application number
AT02739595T
Other languages
English (en)
Inventor
Yoshinao Yamazaki
Mitsuhiko Okada
Tomoya Tanzawa
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Application granted granted Critical
Publication of ATE288952T1 publication Critical patent/ATE288952T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
AT02739595T 2001-07-02 2002-05-31 Wärmeleitende zusammensetzung ATE288952T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001201295A JP2003026928A (ja) 2001-07-02 2001-07-02 熱伝導性組成物
PCT/US2002/017343 WO2003004580A1 (en) 2001-07-02 2002-05-31 Thermoconductive composition

Publications (1)

Publication Number Publication Date
ATE288952T1 true ATE288952T1 (de) 2005-02-15

Family

ID=19038288

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02739595T ATE288952T1 (de) 2001-07-02 2002-05-31 Wärmeleitende zusammensetzung

Country Status (7)

Country Link
EP (1) EP1401987B1 (de)
JP (1) JP2003026928A (de)
KR (1) KR100893237B1 (de)
CN (1) CN100400616C (de)
AT (1) ATE288952T1 (de)
DE (1) DE60202955T2 (de)
WO (1) WO2003004580A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101125743B1 (ko) 2009-08-04 2012-03-27 두성산업 주식회사 높은 열전도 효율을 가지는 방열 패드 및 이의 제조방법
DE102010005020B4 (de) * 2010-01-19 2019-12-12 Continental Automotive Gmbh Verwendung eines Formkörpers aus einem wärmeleitenden Kompositmaterial zur Wärmeableitung
TW201131716A (en) * 2010-01-29 2011-09-16 Nitto Denko Corp Thermal conductive sheet, light-emitting diode mounting substrate, and thermal conductive adhesive sheet
CN102250588B (zh) * 2011-05-18 2013-09-25 杨福河 一种高性能相变导热材料及其制备方法
JP5767044B2 (ja) * 2011-07-21 2015-08-19 ポリマテック・ジャパン株式会社 液状混合組成物及び熱伝導性成形体
CN102382473B (zh) * 2011-09-17 2012-12-05 安徽江威精密制造有限公司 新型金属化膜电容器灌封蜡
CN102382475B (zh) * 2011-09-17 2013-03-27 安徽江威精密制造有限公司 金属化膜电容器灌封蜡
CN103959411A (zh) * 2012-03-12 2014-07-30 日东电工株式会社 稀土类永久磁铁及稀土类永久磁铁的制造方法
KR20140134258A (ko) 2012-03-12 2014-11-21 닛토덴코 가부시키가이샤 희토류 영구 자석 및 희토류 영구 자석의 제조 방법
JP2013191608A (ja) * 2012-03-12 2013-09-26 Nitto Denko Corp 希土類永久磁石及び希土類永久磁石の製造方法
JP2013191610A (ja) * 2012-03-12 2013-09-26 Nitto Denko Corp 希土類永久磁石及び希土類永久磁石の製造方法
JP5969783B2 (ja) * 2012-03-12 2016-08-17 日東電工株式会社 希土類永久磁石の製造方法
JP2013191609A (ja) * 2012-03-12 2013-09-26 Nitto Denko Corp 希土類永久磁石及び希土類永久磁石の製造方法
JP5411957B2 (ja) * 2012-03-12 2014-02-12 日東電工株式会社 希土類永久磁石及び希土類永久磁石の製造方法
JP6040710B2 (ja) 2012-10-31 2016-12-07 北川工業株式会社 蓄熱材組成物および蓄熱材
JP6979686B2 (ja) * 2015-05-15 2021-12-15 積水ポリマテック株式会社 熱伝導性組成物および熱伝導性ペースト
KR102692264B1 (ko) * 2019-07-31 2024-08-07 엘지전자 주식회사 열반사 기능을 갖는 코팅 조성물, 코팅 유리 및 그 제조방법, 이를 이용한 조리기기
KR102788539B1 (ko) 2020-01-23 2025-03-27 엘지전자 주식회사 글라스 코팅 조성물 및 그 코팅 유리 제조 방법과, 이를 이용한 조리기기
WO2022133850A1 (en) 2020-12-24 2022-06-30 Dow Global Technologies Llc Thermal interface material

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05163485A (ja) * 1991-12-13 1993-06-29 Mitsubishi Cable Ind Ltd 蓄熱材
US6197859B1 (en) * 1993-06-14 2001-03-06 The Bergquist Company Thermally conductive interface pads for electronic devices
JP4121152B2 (ja) 1996-04-29 2008-07-23 パーカー−ハニフイン・コーポレーシヨン 電子部品用の適合性熱境界面材料
US6391442B1 (en) * 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
JP2001118973A (ja) * 1999-10-20 2001-04-27 Fuji Kobunshi Kogyo Kk 熱伝導性膜の形成方法

Also Published As

Publication number Publication date
JP2003026928A (ja) 2003-01-29
CN1522290A (zh) 2004-08-18
DE60202955T2 (de) 2006-03-30
WO2003004580A1 (en) 2003-01-16
KR100893237B1 (ko) 2009-04-10
DE60202955D1 (de) 2005-03-17
KR20040028800A (ko) 2004-04-03
EP1401987B1 (de) 2005-02-09
EP1401987A1 (de) 2004-03-31
CN100400616C (zh) 2008-07-09

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Legal Events

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