DE60202955D1 - Wärmeleitende zusammensetzung - Google Patents

Wärmeleitende zusammensetzung

Info

Publication number
DE60202955D1
DE60202955D1 DE60202955T DE60202955T DE60202955D1 DE 60202955 D1 DE60202955 D1 DE 60202955D1 DE 60202955 T DE60202955 T DE 60202955T DE 60202955 T DE60202955 T DE 60202955T DE 60202955 D1 DE60202955 D1 DE 60202955D1
Authority
DE
Germany
Prior art keywords
weight
parts
thermoconductive
composition
thermal composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60202955T
Other languages
English (en)
Other versions
DE60202955T2 (de
Inventor
Yoshinao Yamazaki
Mitsuhiko Okada
Tomoya Tanzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of DE60202955D1 publication Critical patent/DE60202955D1/de
Application granted granted Critical
Publication of DE60202955T2 publication Critical patent/DE60202955T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
DE60202955T 2001-07-02 2002-05-31 Wärmeleitende zusammensetzung Expired - Fee Related DE60202955T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001201295A JP2003026928A (ja) 2001-07-02 2001-07-02 熱伝導性組成物
JP2001201295 2001-07-02
PCT/US2002/017343 WO2003004580A1 (en) 2001-07-02 2002-05-31 Thermoconductive composition

Publications (2)

Publication Number Publication Date
DE60202955D1 true DE60202955D1 (de) 2005-03-17
DE60202955T2 DE60202955T2 (de) 2006-03-30

Family

ID=19038288

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60202955T Expired - Fee Related DE60202955T2 (de) 2001-07-02 2002-05-31 Wärmeleitende zusammensetzung

Country Status (7)

Country Link
EP (1) EP1401987B1 (de)
JP (1) JP2003026928A (de)
KR (1) KR100893237B1 (de)
CN (1) CN100400616C (de)
AT (1) ATE288952T1 (de)
DE (1) DE60202955T2 (de)
WO (1) WO2003004580A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101125743B1 (ko) 2009-08-04 2012-03-27 두성산업 주식회사 높은 열전도 효율을 가지는 방열 패드 및 이의 제조방법
DE102010005020B4 (de) * 2010-01-19 2019-12-12 Continental Automotive Gmbh Verwendung eines Formkörpers aus einem wärmeleitenden Kompositmaterial zur Wärmeableitung
US20110262728A1 (en) * 2010-01-29 2011-10-27 Nitto Denko Corporation Thermal conductive sheet, light-emitting diode mounting substrate, and thermal conductive adhesive sheet
CN102250588B (zh) * 2011-05-18 2013-09-25 杨福河 一种高性能相变导热材料及其制备方法
JP5767044B2 (ja) * 2011-07-21 2015-08-19 ポリマテック・ジャパン株式会社 液状混合組成物及び熱伝導性成形体
CN102382473B (zh) * 2011-09-17 2012-12-05 安徽江威精密制造有限公司 新型金属化膜电容器灌封蜡
CN102382475B (zh) * 2011-09-17 2013-03-27 安徽江威精密制造有限公司 金属化膜电容器灌封蜡
JP5969783B2 (ja) * 2012-03-12 2016-08-17 日東電工株式会社 希土類永久磁石の製造方法
JP2013191610A (ja) * 2012-03-12 2013-09-26 Nitto Denko Corp 希土類永久磁石及び希土類永久磁石の製造方法
JP2013191608A (ja) * 2012-03-12 2013-09-26 Nitto Denko Corp 希土類永久磁石及び希土類永久磁石の製造方法
JP5411957B2 (ja) * 2012-03-12 2014-02-12 日東電工株式会社 希土類永久磁石及び希土類永久磁石の製造方法
KR20140134259A (ko) * 2012-03-12 2014-11-21 닛토덴코 가부시키가이샤 희토류 영구 자석 및 희토류 영구 자석의 제조 방법
US10770207B2 (en) 2012-03-12 2020-09-08 Nitto Denko Corporation Rare-earth permanent magnet and method for manufacturing rare-earth permanent magnet
JP2013191609A (ja) * 2012-03-12 2013-09-26 Nitto Denko Corp 希土類永久磁石及び希土類永久磁石の製造方法
JP6040710B2 (ja) 2012-10-31 2016-12-07 北川工業株式会社 蓄熱材組成物および蓄熱材
JP6979686B2 (ja) * 2015-05-15 2021-12-15 積水ポリマテック株式会社 熱伝導性組成物および熱伝導性ペースト
KR20210015134A (ko) * 2019-07-31 2021-02-10 엘지전자 주식회사 열반사 기능을 갖는 코팅 조성물, 코팅 유리 및 그 제조방법, 이를 이용한 조리기기
EP4267675A1 (de) 2020-12-24 2023-11-01 Dow Global Technologies LLC Material für thermische zwischenlagen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05163485A (ja) * 1991-12-13 1993-06-29 Mitsubishi Cable Ind Ltd 蓄熱材
US6197859B1 (en) * 1993-06-14 2001-03-06 The Bergquist Company Thermally conductive interface pads for electronic devices
WO1997041599A1 (en) * 1996-04-29 1997-11-06 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US6391442B1 (en) * 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
JP2001118973A (ja) * 1999-10-20 2001-04-27 Fuji Kobunshi Kogyo Kk 熱伝導性膜の形成方法

Also Published As

Publication number Publication date
EP1401987A1 (de) 2004-03-31
ATE288952T1 (de) 2005-02-15
CN100400616C (zh) 2008-07-09
WO2003004580A1 (en) 2003-01-16
CN1522290A (zh) 2004-08-18
JP2003026928A (ja) 2003-01-29
DE60202955T2 (de) 2006-03-30
EP1401987B1 (de) 2005-02-09
KR100893237B1 (ko) 2009-04-10
KR20040028800A (ko) 2004-04-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee