ATE251342T1 - Verfahren zum füllen eines hohraumes in einem substrat - Google Patents

Verfahren zum füllen eines hohraumes in einem substrat

Info

Publication number
ATE251342T1
ATE251342T1 AT92304633T AT92304633T ATE251342T1 AT E251342 T1 ATE251342 T1 AT E251342T1 AT 92304633 T AT92304633 T AT 92304633T AT 92304633 T AT92304633 T AT 92304633T AT E251342 T1 ATE251342 T1 AT E251342T1
Authority
AT
Austria
Prior art keywords
layer
filling
cavity
substrate
article
Prior art date
Application number
AT92304633T
Other languages
German (de)
English (en)
Inventor
Christopher David Dobson
Original Assignee
Trikon Technologies Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB919111440A external-priority patent/GB9111440D0/en
Priority claimed from GB929202745A external-priority patent/GB9202745D0/en
Application filed by Trikon Technologies Ltd filed Critical Trikon Technologies Ltd
Application granted granted Critical
Publication of ATE251342T1 publication Critical patent/ATE251342T1/de

Links

Classifications

    • H10P72/0454—
    • H10D64/011—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H10P14/40—
    • H10P72/0468—
    • H10P95/00—
    • H10P95/04—
    • H10W20/059—
    • H10W20/092—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Physical Vapour Deposition (AREA)
  • Element Separation (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
AT92304633T 1991-05-28 1992-05-21 Verfahren zum füllen eines hohraumes in einem substrat ATE251342T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB919111440A GB9111440D0 (en) 1991-05-28 1991-05-28 Forming a layer
GB929202745A GB9202745D0 (en) 1992-02-10 1992-02-10 Forming a layer

Publications (1)

Publication Number Publication Date
ATE251342T1 true ATE251342T1 (de) 2003-10-15

Family

ID=26298966

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92304633T ATE251342T1 (de) 1991-05-28 1992-05-21 Verfahren zum füllen eines hohraumes in einem substrat

Country Status (6)

Country Link
EP (1) EP0516344B1 (enExample)
JP (1) JP3105643B2 (enExample)
KR (1) KR100242602B1 (enExample)
AT (1) ATE251342T1 (enExample)
DE (1) DE69233222T2 (enExample)
TW (1) TW221521B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9414145D0 (en) * 1994-07-13 1994-08-31 Electrotech Ltd Forming a layer
US5932289A (en) * 1991-05-28 1999-08-03 Trikon Technologies Limited Method for filling substrate recesses using pressure and heat treatment
GB9402486D0 (en) * 1994-02-09 1994-03-30 Electrotech Ltd Forming a layer
KR960026249A (ko) * 1994-12-12 1996-07-22 윌리엄 이. 힐러 고압, 저온 반도체 갭 충진 프로세스
EP0793268A3 (en) * 1995-05-23 1999-03-03 Texas Instruments Incorporated Process for filling a cavity in a semiconductor device
US5857368A (en) * 1995-10-06 1999-01-12 Applied Materials, Inc. Apparatus and method for fabricating metal paths in semiconductor substrates through high pressure extrusion
GB9619461D0 (en) 1996-09-18 1996-10-30 Electrotech Ltd Method of processing a workpiece
GB2319533B (en) 1996-11-22 2001-06-06 Trikon Equip Ltd Methods of forming a barrier layer
GB2319532B (en) * 1996-11-22 2001-01-31 Trikon Equip Ltd Method and apparatus for treating a semiconductor wafer
US6218277B1 (en) 1998-01-26 2001-04-17 Texas Instruments Incorporated Method for filling a via opening or contact opening in an integrated circuit
US7322981B2 (en) 2003-08-28 2008-01-29 Jackson Roger P Polyaxial bone screw with split retainer ring
JP4357486B2 (ja) 2003-06-18 2009-11-04 ロジャー・ピー・ジャクソン スプライン捕捉連結部を備えた多軸骨ねじ
US7160300B2 (en) 2004-02-27 2007-01-09 Jackson Roger P Orthopedic implant rod reduction tool set and method
US10049927B2 (en) 2016-06-10 2018-08-14 Applied Materials, Inc. Seam-healing method upon supra-atmospheric process in diffusion promoting ambient
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
JP6947914B2 (ja) 2017-08-18 2021-10-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧高温下のアニールチャンバ
CN117936417A (zh) 2017-11-11 2024-04-26 微材料有限责任公司 用于高压处理腔室的气体输送系统
KR20200075892A (ko) 2017-11-17 2020-06-26 어플라이드 머티어리얼스, 인코포레이티드 고압 처리 시스템을 위한 컨덴서 시스템
EP3762962A4 (en) 2018-03-09 2021-12-08 Applied Materials, Inc. HIGH PRESSURE ANNEALING PROCESS FOR METAL-BASED MATERIALS
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
CN113543527B (zh) * 2021-07-09 2022-12-30 广东工业大学 载板填孔工艺的填充基材选型方法及载板填孔工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69023382T2 (de) * 1989-04-17 1996-06-20 Ibm Laminierungsverfahren zum Überdecken der Seitenwände einer Höhlung in einem Substrat sowie zur Füllung dieser Höhlung.
US5011793A (en) * 1990-06-19 1991-04-30 Nihon Shinku Gijutsu Kabushiki Kaisha Vacuum deposition using pressurized reflow process

Also Published As

Publication number Publication date
DE69233222D1 (de) 2003-11-06
JP3105643B2 (ja) 2000-11-06
DE69233222T2 (de) 2004-08-26
EP0516344B1 (en) 2003-10-01
KR920022405A (ko) 1992-12-19
KR100242602B1 (ko) 2000-02-01
TW221521B (enExample) 1994-03-01
JPH07193063A (ja) 1995-07-28
EP0516344A1 (en) 1992-12-02

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties