ATE234522T1 - Lasersystem mit phasenveränderlichem material zur temperatursteuerung - Google Patents

Lasersystem mit phasenveränderlichem material zur temperatursteuerung

Info

Publication number
ATE234522T1
ATE234522T1 AT99117895T AT99117895T ATE234522T1 AT E234522 T1 ATE234522 T1 AT E234522T1 AT 99117895 T AT99117895 T AT 99117895T AT 99117895 T AT99117895 T AT 99117895T AT E234522 T1 ATE234522 T1 AT E234522T1
Authority
AT
Austria
Prior art keywords
heat
input optical
receiving
phase
energy
Prior art date
Application number
AT99117895T
Other languages
English (en)
Inventor
Geoffrey O Heberle
Original Assignee
Cutting Edge Optronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/151,851 external-priority patent/US6351478B1/en
Application filed by Cutting Edge Optronics Inc filed Critical Cutting Edge Optronics Inc
Application granted granted Critical
Publication of ATE234522T1 publication Critical patent/ATE234522T1/de

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/04Arrangements for thermal management
    • H01S3/042Arrangements for thermal management for solid state lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029Heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/025Constructional details of solid state lasers, e.g. housings or mountings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/025Constructional details of solid state lasers, e.g. housings or mountings
    • H01S3/027Constructional details of solid state lasers, e.g. housings or mountings comprising a special atmosphere inside the housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/04Arrangements for thermal management
    • H01S3/0405Conductive cooling, e.g. by heat sinks or thermo-electric elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02Constructional details
    • H01S3/04Arrangements for thermal management
    • H01S3/0407Liquid cooling, e.g. by water
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/09Processes or apparatus for excitation, e.g. pumping
    • H01S3/091Processes or apparatus for excitation, e.g. pumping using optical pumping
    • H01S3/094Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
    • H01S3/0941Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/024Arrangements for thermal management
    • H01S5/02407Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/024Arrangements for thermal management
    • H01S5/02438Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/024Arrangements for thermal management
    • H01S5/02469Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14Thermal energy storage

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Lasers (AREA)
  • Control Of Temperature (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AT99117895T 1998-09-11 1999-09-10 Lasersystem mit phasenveränderlichem material zur temperatursteuerung ATE234522T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/151,851 US6351478B1 (en) 1998-09-11 1998-09-11 Passively cooled solid-state laser
US09/270,991 US6307871B1 (en) 1998-09-11 1999-03-17 Laser system using phase change material for thermal control

Publications (1)

Publication Number Publication Date
ATE234522T1 true ATE234522T1 (de) 2003-03-15

Family

ID=26849027

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99117895T ATE234522T1 (de) 1998-09-11 1999-09-10 Lasersystem mit phasenveränderlichem material zur temperatursteuerung

Country Status (6)

Country Link
US (2) US6307871B1 (de)
EP (1) EP0987799B1 (de)
JP (1) JP2000091672A (de)
AT (1) ATE234522T1 (de)
DE (1) DE69905829T2 (de)
IL (1) IL131838A (de)

Families Citing this family (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6307871B1 (en) * 1998-09-11 2001-10-23 Cutting Edge Optronics, Inc. Laser system using phase change material for thermal control
CN1222092C (zh) * 2000-11-29 2005-10-05 三菱化学株式会社 半导体发光器件
US6397618B1 (en) * 2001-05-30 2002-06-04 International Business Machines Corporation Cooling system with auxiliary thermal buffer unit for cooling an electronics module
DE60218211T2 (de) * 2001-11-21 2007-10-18 General Atomics, San Diego Laser mit einem verteilten verstärkungsmedium
US7002800B2 (en) * 2002-01-25 2006-02-21 Lockheed Martin Corporation Integrated power and cooling architecture
US7106777B2 (en) * 2003-01-07 2006-09-12 The Boeing Company Phase-change heat exchanger
US7170919B2 (en) 2003-06-23 2007-01-30 Northrop Grumman Corporation Diode-pumped solid-state laser gain module
US7495848B2 (en) 2003-07-24 2009-02-24 Northrop Grumman Corporation Cast laser optical bench
EP1519039A1 (de) * 2003-09-23 2005-03-30 AVL List GmbH Gütegeschaltener, gepumpter Festkörperlaser
DK176137B1 (da) * 2003-10-27 2006-09-25 Danfoss Silicon Power Gmbh Flowfordelingsenhed og köleenhed med bypassflow
JP2005268445A (ja) * 2004-03-17 2005-09-29 Hamamatsu Photonics Kk 半導体レーザ装置
US7218655B2 (en) * 2004-10-08 2007-05-15 B&W Tek Property, Inc. Solid state laser insensitive to temperature changes
US20060086096A1 (en) * 2004-10-22 2006-04-27 Nanocoolers, Inc. Thermoelectric cooling and/or moderation of transient thermal load using phase change material
US7056116B2 (en) * 2004-10-26 2006-06-06 Ultradent Products, Inc. Heat sink for dental curing light comprising a plurality of different materials
US7729392B2 (en) * 2005-01-28 2010-06-01 Scientific Materials Corporation Monoblock laser with reflective substrate
US7305016B2 (en) 2005-03-10 2007-12-04 Northrop Grumman Corporation Laser diode package with an internal fluid cooling channel
US7817704B2 (en) * 2005-03-17 2010-10-19 Scientific Materials Corporation Monoblock laser with improved alignment features
US7328508B2 (en) * 2005-07-05 2008-02-12 International Business Machines Corporation Anisotropic heat spreading apparatus and method for semiconductor devices
US20070104233A1 (en) * 2005-11-09 2007-05-10 Jan Vetrovec Thermal management system for high energy laser
US20070115635A1 (en) * 2005-11-18 2007-05-24 Low Andrew G Passive cooling for fiber to the premise (FTTP) electronics
US7761181B2 (en) * 2005-11-29 2010-07-20 The Boeing Company Line replaceable systems and methods
KR100719225B1 (ko) * 2005-12-21 2007-05-17 주식회사 글로벌스탠다드테크놀로지 반도체 제조 공정용 온도조절 시스템
US7839904B1 (en) 2006-01-26 2010-11-23 Scientific Materials Corporation Monoblock laser systems and methods
US20070193278A1 (en) * 2006-02-16 2007-08-23 Polacek Denise C Cooling device and method
JP2009537998A (ja) * 2006-05-19 2009-10-29 アーゲス ゲセルシャフト フュール インダストリープラヌング ウンド ラセルテクニック エム.ベー.ハー. 可変負荷熱源またはヒートシンクの高精度制御方法、および動的熱源、特に固体レーザ用ポンプダイオードの温度制御装置
US7656915B2 (en) * 2006-07-26 2010-02-02 Northrop Grumman Space & Missions Systems Corp. Microchannel cooler for high efficiency laser diode heat extraction
US20080056314A1 (en) * 2006-08-31 2008-03-06 Northrop Grumman Corporation High-power laser-diode package system
US7518123B2 (en) * 2006-09-25 2009-04-14 Philip Morris Usa Inc. Heat capacitor for capillary aerosol generator
US7433190B2 (en) * 2006-10-06 2008-10-07 Honeywell International Inc. Liquid cooled electronic chassis having a plurality of phase change material reservoirs
US7983373B2 (en) * 2007-02-07 2011-07-19 Vintomie Networks B.V., Llc Clock distribution for 10GBase-T analog front end
US7532652B2 (en) * 2007-02-20 2009-05-12 The Boeing Company Laser thermal management systems and methods
DE102008004053A1 (de) * 2008-01-11 2009-07-23 Airbus Deutschland Gmbh Spitzenlast-Kühlung von elektronischen Bauteilen durch phasenwechselnde Materialien
US7724791B2 (en) * 2008-01-18 2010-05-25 Northrop Grumman Systems Corporation Method of manufacturing laser diode packages and arrays
US7633980B1 (en) 2008-02-29 2009-12-15 The United States Of America As Represented By The United States Department Of Energy Phase change based cooling for high burst mode heat loads with temperature regulation above the phase change temperature
US7810965B2 (en) 2008-03-02 2010-10-12 Lumenetix, Inc. Heat removal system and method for light emitting diode lighting apparatus
US9102857B2 (en) * 2008-03-02 2015-08-11 Lumenetix, Inc. Methods of selecting one or more phase change materials to match a working temperature of a light-emitting diode to be cooled
DE102008013816B4 (de) * 2008-03-12 2010-09-16 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Rückgewinnung von Energie aus einem Laserbearbeitungssystem
JP4677009B2 (ja) * 2008-05-30 2011-04-27 ヤマハ発動機株式会社 部品供給装置およびそれを備えた表面実装機
US8657487B2 (en) * 2008-06-11 2014-02-25 Utah State University Research Foundation Mini-cell, on-orbit, temperature re-calibration apparatus and method
US8542971B2 (en) * 2008-06-25 2013-09-24 Coractive High-Tech Inc. Packages for high power operation of optical fiber components
DE102008057963A1 (de) 2008-11-19 2010-05-27 Lorenzen, Dirk, Dr. Strahlungsquelle mit einer Wärmeübertragungsvorrichtung und Verfahren zum Betrieb der Strahlungsquelle
US8154728B2 (en) * 2008-12-31 2012-04-10 Spectrasensors, Inc. Analytical equipment enclosure incorporating phase changing materials
DE102009000487A1 (de) * 2009-01-29 2010-08-05 Robert Bosch Gmbh Laserzündkerze
US8345720B2 (en) 2009-07-28 2013-01-01 Northrop Grumman Systems Corp. Laser diode ceramic cooler having circuitry for control and feedback of laser diode performance
WO2011025487A1 (en) * 2009-08-27 2011-03-03 Hewlett-Packard Development Company, L.P. Heat storage by phase-change material
US8448457B2 (en) * 2009-11-23 2013-05-28 Sartorius Stedim North America Inc. Systems and methods for use in freezing, thawing, and storing biopharmaceutical materials
US8018980B2 (en) 2010-01-25 2011-09-13 Lawrence Livermore National Security, Llc Laser diode package with enhanced cooling
US8123389B2 (en) 2010-02-12 2012-02-28 Lumenetix, Inc. LED lamp assembly with thermal management system
CN101854027A (zh) * 2010-04-30 2010-10-06 西安炬光科技有限公司 一种用于半导体激光器的液体制冷器
US9590388B2 (en) 2011-01-11 2017-03-07 Northrop Grumman Systems Corp. Microchannel cooler for a single laser diode emitter based system
WO2013040530A1 (en) * 2011-09-15 2013-03-21 Schlumberger Canada Limited Target assembly including temperature activated coupler and related methods
CN102623889B (zh) * 2012-04-11 2014-12-24 西安炬光科技有限公司 应用于半导体激光器的液体制冷器的制备方法及其制冷装置
CN102620592B (zh) * 2012-04-11 2014-06-04 西安炬光科技有限公司 应用于半导体激光器的液体制冷器的制备方法及其制冷装置
EP2859391B1 (de) * 2012-04-19 2022-11-30 OE Solutions America Inc. Kühlungssystem für vorrichtungen und baugruppen
US8937976B2 (en) 2012-08-15 2015-01-20 Northrop Grumman Systems Corp. Tunable system for generating an optical pulse based on a double-pass semiconductor optical amplifier
CN103811976B (zh) * 2014-02-28 2017-02-22 苏州微木智能系统有限公司 一种脉冲式大功率激光器的散热装置及散热方法
EP2949422B1 (de) 2014-05-27 2017-05-17 Step-Tec AG Vorrichtung zur Kühlung von Maschinenbauteilen mittels PCM
US9554491B1 (en) 2014-07-01 2017-01-24 Google Inc. Cooling a data center
CN104218435B (zh) * 2014-09-19 2017-11-07 中国运载火箭技术研究院 一种基于板条式激光器的高密度热流相变储热散热系统
US20190036301A1 (en) * 2017-07-26 2019-01-31 The Boeing Company Methods and apparatus to thermally manage heat sources using eutectic thermal control
RU184534U1 (ru) * 2018-01-10 2018-10-30 Акционерное общество "Научно-исследовательский институт газоразрядных приборов "Плазма" (АО "ПЛАЗМА") Одночастотный стабилизированный газовый лазер
US10900755B1 (en) * 2018-06-26 2021-01-26 Applied Research Associates, Inc. Laser weapon system
US10685900B2 (en) * 2018-10-22 2020-06-16 Deere & Company Packaging of a semiconductor device with phase-change material for thermal performance
CN109244805A (zh) * 2018-11-02 2019-01-18 中国科学院西安光学精密机械研究所 一种高功率激光二极管泵浦源阵列的相变热控系统及方法
US10965084B1 (en) * 2019-05-07 2021-03-30 Lockheed Martin Corporation Systems and methods for planar waveguide mounting and cooling
JP7279600B2 (ja) * 2019-09-26 2023-05-23 ブラザー工業株式会社 レーザ加工装置
US20240359595A1 (en) * 2020-08-24 2024-10-31 Tae Technologies, Inc. Modular Cascaded Energy Systems with a Cooling Apparatus and with Replaceable Energy Source Capability
US11985895B2 (en) * 2021-05-17 2024-05-14 The United States Of America As Represented By The Secretary Of The Army Thermoelectrically actuated phase change thermal energy storage (TES) module
US12082374B2 (en) * 2021-10-08 2024-09-03 Simmonds Precision Products, Inc. Heatsinks comprising a phase change material
CN113851923B (zh) * 2021-10-19 2024-08-06 北京大学东莞光电研究院 激光器to封装结构
US20230400263A1 (en) * 2022-06-13 2023-12-14 Hamilton Sundstrand Corporation Cold plate thermal storage for high load short duration cooling
CN116454713B (zh) * 2023-06-19 2023-08-11 深圳市联明电源有限公司 一种具有自动调节功能的激光电源及控制方法
CN119134032B (zh) * 2024-09-02 2025-09-30 武汉锐科光纤激光技术股份有限公司 固固相变储热激光器及制备方法
CN119297707B (zh) * 2024-12-12 2025-03-28 北京卓镭激光技术有限公司 一种自冷却激光模块

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3683296A (en) 1970-10-13 1972-08-08 Texas Instruments Inc High efficiency laser cavity
GB1483849A (en) 1974-09-21 1977-08-24 Nippon Electric Co Semiconductor laser device equipped with a silicon heat sink
US4057101A (en) 1976-03-10 1977-11-08 Westinghouse Electric Corporation Heat sink
US4219072A (en) 1978-02-10 1980-08-26 Barlow Donald W Sr Phase change material heat exchanger
US4228406A (en) 1978-05-10 1980-10-14 The University Of Rochester Laser apparatus
US4233567A (en) 1978-12-13 1980-11-11 General Electric Company Face-cooled laser device having increased energy storage and output
US4393393A (en) 1979-08-13 1983-07-12 Mcdonnell Douglas Corporation Laser diode with double sided heat sink
US4315225A (en) 1979-08-24 1982-02-09 Mcdonnell Douglas Corporation Heat sink laser diode array
US4673030A (en) 1980-10-20 1987-06-16 Hughes Aircraft Company Rechargeable thermal control system
US4573067A (en) 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
US4415234A (en) 1981-04-02 1983-11-15 Eastman Kodak Company Passive cooling of mirrors
US4454602A (en) 1982-03-26 1984-06-12 Mcdonnell Douglas Corporation Conductively cooled laser diode array
US4709750A (en) 1986-04-10 1987-12-01 Internorth, Inc. Phase change heat exchanger
US4963741A (en) 1987-06-22 1990-10-16 Molectron Detector, Inc. Large area pyroelectric joulemeter
FR2616976B1 (fr) 1987-06-22 1989-10-13 Lasag Ag Laser avec systeme de refroidissement perfectionne
US4852109A (en) 1988-12-02 1989-07-25 General Electric Company Temperature control of a solid state face pumped laser slab by an active siderail
US5005640A (en) 1989-06-05 1991-04-09 Mcdonnell Douglas Corporation Isothermal multi-passage cooler
DE3925201A1 (de) 1989-07-29 1991-02-07 Messerschmitt Boelkow Blohm Optische bank zur halterung optischer, elektrischer u.a. komponenten
US5076348A (en) 1990-01-25 1991-12-31 United Technologies Corporation Solid-to-liquid phase change cooled mirror arrangement
US5105429A (en) 1990-07-06 1992-04-14 The United States Of America As Represented By The Department Of Energy Modular package for cooling a laser diode array
US5253260A (en) 1991-12-20 1993-10-12 Hughes Aircraft Company Apparatus and method for passive heat pipe cooling of solid state laser heads
US5220954A (en) 1992-10-07 1993-06-22 Shape, Inc. Phase change heat exchanger
US5520244A (en) 1992-12-16 1996-05-28 Sdl, Inc. Micropost waste heat removal system
US5315154A (en) 1993-05-14 1994-05-24 Hughes Aircraft Company Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition
US5394427A (en) 1994-04-29 1995-02-28 Cutting Edge Optronics, Inc. Housing for a slab laser pumped by a close-coupled light source
GB9505069D0 (en) * 1995-03-14 1995-05-03 Barr & Stroud Ltd Heat sink
US5834840A (en) * 1995-05-25 1998-11-10 Massachusetts Institute Of Technology Net-shape ceramic processing for electronic devices and packages
US5734672A (en) 1996-08-06 1998-03-31 Cutting Edge Optronics, Inc. Smart laser diode array assembly and operating method using same
US6307871B1 (en) * 1998-09-11 2001-10-23 Cutting Edge Optronics, Inc. Laser system using phase change material for thermal control
US6351478B1 (en) * 1998-09-11 2002-02-26 Cutting Edge Optronics, Inc. Passively cooled solid-state laser
US6397618B1 (en) * 2001-05-30 2002-06-04 International Business Machines Corporation Cooling system with auxiliary thermal buffer unit for cooling an electronics module

Also Published As

Publication number Publication date
DE69905829D1 (de) 2003-04-17
US20020018498A1 (en) 2002-02-14
EP0987799A3 (de) 2001-01-10
US6307871B1 (en) 2001-10-23
US6570895B2 (en) 2003-05-27
EP0987799B1 (de) 2003-03-12
EP0987799A2 (de) 2000-03-22
JP2000091672A (ja) 2000-03-31
IL131838A0 (en) 2001-03-19
IL131838A (en) 2002-12-01
DE69905829T2 (de) 2003-08-14

Similar Documents

Publication Publication Date Title
DE69905829D1 (de) Lasersystem mit phasenveränderlichem Material zur Temperatursteuerung
DE60239840D1 (de) Thermoelektrik mit verbessertem Wirkungsgrad unter Verwendung von thermischer Isolierung
ATE276830T1 (de) Modulare reaktionsblockanordnung mit thermoelektrischer kühlung und heizung
TW366615B (en) Excimer laser with greater spectral bandwidth and beam stability
DE59606908D1 (de) Diodenlaserbauelement mit kühlelement
ATE213365T1 (de) Laserdiodenmodul mit integraler kühlung
SE0000481L (sv) Förfarande och anordning för reglering av batteritemperatur
DK2333520T3 (da) Varmevekslende, forespurgt indretning til kemisk reaktion
TW337017B (en) Optical recording medium
SE9804146D0 (sv) Packaging
CA2250903A1 (en) Composite module for optical fiber amplifier
DK0460766T3 (da) Polymermateriale med termo-optisk virkning til en bistabil optisk indretning
EP0762678A3 (de) Laserübertragungssystem mit temperaturgeregeltem Senden
US7697805B2 (en) Fiber Bragg grating system having a thermo module for supplying or absorbing heat to or from an FBG module
DE69617938D1 (de) Diodengepumpter laser mit kristallen mit starker thermaler fokussierung
CA2048825A1 (en) Stabilized fluorescent lamp for a document scanning system
DK1205013T3 (da) Køling af faststoflaser
DE69811929D1 (de) Diodengepumpter laser unter verwendung von verstärkungsmedia mit starker thermaler fokussierung
EP1130443A3 (de) System und Verfahren zur Temperaturregelung für einen thermisch gesteuerten optischen Schalter mit konstanter Gesamtleistung
EP1258752A4 (de) Heizmodul und lichtwellenleitermodul
EP0932113A3 (de) Wellenlängenabhängiges thermisch kompensiertes optisches System
DE69723514D1 (de) Optischer Chopper für ein Wärmebildsystem und Verfahren dazu
EP0256826A3 (de) Wärmebilderzeuger
ATE435449T1 (de) Temperatursteuersystem und -verfahren
EP0395259A3 (de) Temperatursteuerungssystem für Festkörperlichtquellen

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties