DE69905829D1 - Lasersystem mit phasenveränderlichem Material zur Temperatursteuerung - Google Patents
Lasersystem mit phasenveränderlichem Material zur TemperatursteuerungInfo
- Publication number
- DE69905829D1 DE69905829D1 DE69905829T DE69905829T DE69905829D1 DE 69905829 D1 DE69905829 D1 DE 69905829D1 DE 69905829 T DE69905829 T DE 69905829T DE 69905829 T DE69905829 T DE 69905829T DE 69905829 D1 DE69905829 D1 DE 69905829D1
- Authority
- DE
- Germany
- Prior art keywords
- heat
- input optical
- receiving
- phase
- energy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
- H01S3/027—Constructional details of solid state lasers, e.g. housings or mountings comprising a special atmosphere inside the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0407—Liquid cooling, e.g. by water
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02438—Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
- Control Of Temperature (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/151,851 US6351478B1 (en) | 1998-09-11 | 1998-09-11 | Passively cooled solid-state laser |
US09/270,991 US6307871B1 (en) | 1998-09-11 | 1999-03-17 | Laser system using phase change material for thermal control |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69905829D1 true DE69905829D1 (de) | 2003-04-17 |
DE69905829T2 DE69905829T2 (de) | 2003-08-14 |
Family
ID=26849027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69905829T Expired - Lifetime DE69905829T2 (de) | 1998-09-11 | 1999-09-10 | Lasersystem mit phasenveränderlichem Material zur Temperatursteuerung |
Country Status (6)
Country | Link |
---|---|
US (2) | US6307871B1 (de) |
EP (1) | EP0987799B1 (de) |
JP (1) | JP2000091672A (de) |
AT (1) | ATE234522T1 (de) |
DE (1) | DE69905829T2 (de) |
IL (1) | IL131838A (de) |
Families Citing this family (70)
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US6307871B1 (en) * | 1998-09-11 | 2001-10-23 | Cutting Edge Optronics, Inc. | Laser system using phase change material for thermal control |
US6791181B2 (en) * | 2000-11-29 | 2004-09-14 | Mitsubishi Chemical Corporation | Semiconductor light emitting device |
US6397618B1 (en) * | 2001-05-30 | 2002-06-04 | International Business Machines Corporation | Cooling system with auxiliary thermal buffer unit for cooling an electronics module |
DE60218211T2 (de) * | 2001-11-21 | 2007-10-18 | General Atomics, San Diego | Laser mit einem verteilten verstärkungsmedium |
US7002800B2 (en) * | 2002-01-25 | 2006-02-21 | Lockheed Martin Corporation | Integrated power and cooling architecture |
US7106777B2 (en) * | 2003-01-07 | 2006-09-12 | The Boeing Company | Phase-change heat exchanger |
US7170919B2 (en) * | 2003-06-23 | 2007-01-30 | Northrop Grumman Corporation | Diode-pumped solid-state laser gain module |
US7495848B2 (en) * | 2003-07-24 | 2009-02-24 | Northrop Grumman Corporation | Cast laser optical bench |
EP1519039A1 (de) * | 2003-09-23 | 2005-03-30 | AVL List GmbH | Gütegeschaltener, gepumpter Festkörperlaser |
DK176137B1 (da) * | 2003-10-27 | 2006-09-25 | Danfoss Silicon Power Gmbh | Flowfordelingsenhed og köleenhed med bypassflow |
JP2005268445A (ja) * | 2004-03-17 | 2005-09-29 | Hamamatsu Photonics Kk | 半導体レーザ装置 |
US7218655B2 (en) * | 2004-10-08 | 2007-05-15 | B&W Tek Property, Inc. | Solid state laser insensitive to temperature changes |
US20060088271A1 (en) * | 2004-10-22 | 2006-04-27 | Nanocoolers, Inc. | Transient thermoelectric cooling of optoelectronic devices |
US7056116B2 (en) * | 2004-10-26 | 2006-06-06 | Ultradent Products, Inc. | Heat sink for dental curing light comprising a plurality of different materials |
US7729392B2 (en) * | 2005-01-28 | 2010-06-01 | Scientific Materials Corporation | Monoblock laser with reflective substrate |
US7305016B2 (en) * | 2005-03-10 | 2007-12-04 | Northrop Grumman Corporation | Laser diode package with an internal fluid cooling channel |
US7817704B2 (en) * | 2005-03-17 | 2010-10-19 | Scientific Materials Corporation | Monoblock laser with improved alignment features |
US7328508B2 (en) * | 2005-07-05 | 2008-02-12 | International Business Machines Corporation | Anisotropic heat spreading apparatus and method for semiconductor devices |
US20070104233A1 (en) * | 2005-11-09 | 2007-05-10 | Jan Vetrovec | Thermal management system for high energy laser |
US20070115635A1 (en) * | 2005-11-18 | 2007-05-24 | Low Andrew G | Passive cooling for fiber to the premise (FTTP) electronics |
US7761181B2 (en) * | 2005-11-29 | 2010-07-20 | The Boeing Company | Line replaceable systems and methods |
KR100719225B1 (ko) * | 2005-12-21 | 2007-05-17 | 주식회사 글로벌스탠다드테크놀로지 | 반도체 제조 공정용 온도조절 시스템 |
US7839904B1 (en) | 2006-01-26 | 2010-11-23 | Scientific Materials Corporation | Monoblock laser systems and methods |
WO2007098094A2 (en) * | 2006-02-16 | 2007-08-30 | Polacek Denise C | Thermoelectric cooler and reservoir for medical treatment |
DE502007005854D1 (de) * | 2006-05-19 | 2011-01-13 | Arges Ges Fuer Industrieplanung Und Lasertechnik M B H | Verfahren zur hochpräzisen regelung von lastvariabmpdioden für festkörperlaser |
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US20080056314A1 (en) * | 2006-08-31 | 2008-03-06 | Northrop Grumman Corporation | High-power laser-diode package system |
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US7532652B2 (en) * | 2007-02-20 | 2009-05-12 | The Boeing Company | Laser thermal management systems and methods |
DE102008004053A1 (de) * | 2008-01-11 | 2009-07-23 | Airbus Deutschland Gmbh | Spitzenlast-Kühlung von elektronischen Bauteilen durch phasenwechselnde Materialien |
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US5520244A (en) | 1992-12-16 | 1996-05-28 | Sdl, Inc. | Micropost waste heat removal system |
US5315154A (en) | 1993-05-14 | 1994-05-24 | Hughes Aircraft Company | Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase transition |
US5394427A (en) | 1994-04-29 | 1995-02-28 | Cutting Edge Optronics, Inc. | Housing for a slab laser pumped by a close-coupled light source |
GB9505069D0 (en) * | 1995-03-14 | 1995-05-03 | Barr & Stroud Ltd | Heat sink |
US5834840A (en) * | 1995-05-25 | 1998-11-10 | Massachusetts Institute Of Technology | Net-shape ceramic processing for electronic devices and packages |
US5734672A (en) | 1996-08-06 | 1998-03-31 | Cutting Edge Optronics, Inc. | Smart laser diode array assembly and operating method using same |
US6351478B1 (en) * | 1998-09-11 | 2002-02-26 | Cutting Edge Optronics, Inc. | Passively cooled solid-state laser |
US6307871B1 (en) * | 1998-09-11 | 2001-10-23 | Cutting Edge Optronics, Inc. | Laser system using phase change material for thermal control |
US6397618B1 (en) * | 2001-05-30 | 2002-06-04 | International Business Machines Corporation | Cooling system with auxiliary thermal buffer unit for cooling an electronics module |
-
1999
- 1999-03-17 US US09/270,991 patent/US6307871B1/en not_active Expired - Lifetime
- 1999-09-09 IL IL13183899A patent/IL131838A/en active IP Right Review Request
- 1999-09-10 AT AT99117895T patent/ATE234522T1/de not_active IP Right Cessation
- 1999-09-10 DE DE69905829T patent/DE69905829T2/de not_active Expired - Lifetime
- 1999-09-10 JP JP11257957A patent/JP2000091672A/ja active Pending
- 1999-09-10 EP EP99117895A patent/EP0987799B1/de not_active Expired - Lifetime
-
2001
- 2001-10-09 US US09/973,027 patent/US6570895B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0987799B1 (de) | 2003-03-12 |
IL131838A0 (en) | 2001-03-19 |
DE69905829T2 (de) | 2003-08-14 |
ATE234522T1 (de) | 2003-03-15 |
US6307871B1 (en) | 2001-10-23 |
EP0987799A3 (de) | 2001-01-10 |
IL131838A (en) | 2002-12-01 |
EP0987799A2 (de) | 2000-03-22 |
JP2000091672A (ja) | 2000-03-31 |
US20020018498A1 (en) | 2002-02-14 |
US6570895B2 (en) | 2003-05-27 |
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