DE69803849D1 - Laserdiodenmodul mit integraler kühlung - Google Patents
Laserdiodenmodul mit integraler kühlungInfo
- Publication number
- DE69803849D1 DE69803849D1 DE69803849T DE69803849T DE69803849D1 DE 69803849 D1 DE69803849 D1 DE 69803849D1 DE 69803849 T DE69803849 T DE 69803849T DE 69803849 T DE69803849 T DE 69803849T DE 69803849 D1 DE69803849 D1 DE 69803849D1
- Authority
- DE
- Germany
- Prior art keywords
- array
- fiber optic
- module
- laser diode
- integral cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4286—Optical modules with optical power monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/866,472 US6072814A (en) | 1997-05-30 | 1997-05-30 | Laser diode module with integral cooling |
PCT/GB1998/001585 WO1998054802A1 (en) | 1997-05-30 | 1998-05-29 | Laser diode module with integral cooling |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69803849D1 true DE69803849D1 (de) | 2002-03-21 |
DE69803849T2 DE69803849T2 (de) | 2002-06-27 |
Family
ID=25347687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69803849T Expired - Fee Related DE69803849T2 (de) | 1997-05-30 | 1998-05-29 | Laserdiodenmodul mit integraler kühlung |
Country Status (9)
Country | Link |
---|---|
US (1) | US6072814A (de) |
EP (1) | EP0985254B1 (de) |
JP (1) | JP2002501675A (de) |
AT (1) | ATE213365T1 (de) |
AU (1) | AU7667998A (de) |
CA (1) | CA2291768A1 (de) |
DE (1) | DE69803849T2 (de) |
ES (1) | ES2168760T3 (de) |
WO (1) | WO1998054802A1 (de) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10018043A1 (de) * | 2000-04-07 | 2001-10-11 | Jenoptik Jena Gmbh | Verfahren zur Kontaktierung eines Hochleistungsdiodenlaserbarrens und eine Hochleistungsdiodenlaserbarren-Kontakt-Anordnung von elektrischen Kontakten thermisch untergeordneter Funktion |
US6697399B2 (en) | 2000-05-26 | 2004-02-24 | The Furukawa Electric Co., Ltd. | Semiconductor laser module with peltier module for regulating a temperature of a semiconductor laser chip |
US6782161B2 (en) * | 2001-02-05 | 2004-08-24 | Derma Laser Inc. | Laser diode apparatus provided with an aiming beam and injection method therefor |
US6868104B2 (en) * | 2001-09-06 | 2005-03-15 | Finisar Corporation | Compact laser package with integrated temperature control |
SE0103121D0 (sv) * | 2001-09-19 | 2001-09-19 | Optillion Ab | Cooling of optical modules |
US6538901B1 (en) * | 2002-03-05 | 2003-03-25 | Chen-Hung Hung | Optical transceiver module |
WO2004047421A2 (en) | 2002-11-14 | 2004-06-03 | Donnelly Corporation | Imaging system for vehicle |
AU2002360892A1 (en) * | 2002-12-04 | 2004-06-23 | Infineon Technologies Ag | Bidirectional emitting and receiving module |
TW547213U (en) * | 2002-12-27 | 2003-08-11 | Quarton Inc | Position adjustment apparatus for laser module |
US7186035B2 (en) * | 2004-05-12 | 2007-03-06 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Optical fibre connector |
WO2007053404A2 (en) * | 2005-10-28 | 2007-05-10 | Donnelly Corporation | Camera module for vehicle vision system |
US20070267220A1 (en) * | 2006-05-16 | 2007-11-22 | Northrop Grumman Corporation | Methane extraction method and apparatus using high-energy diode lasers or diode-pumped solid state lasers |
US7745898B2 (en) * | 2007-12-20 | 2010-06-29 | International Business Machines Corporation | Multichip package, methods of manufacture thereof and articles comprising the same |
US7822091B2 (en) * | 2008-07-14 | 2010-10-26 | Lockheed Martin Corporation | Inverted composite slab sandwich laser gain medium |
US8482664B2 (en) | 2008-10-16 | 2013-07-09 | Magna Electronics Inc. | Compact camera and cable system for vehicular applications |
CN102379119B (zh) | 2009-02-06 | 2015-02-25 | 马格纳电子系统公司 | 用于安装在车辆上的照相机 |
CN102449524B (zh) | 2009-03-25 | 2015-03-11 | 马格纳电子系统公司 | 车辆摄相机和透镜组装 |
US9380219B2 (en) | 2011-04-20 | 2016-06-28 | Magna Electronics Inc. | Angular filter for vehicle mounted cameras |
US9596387B2 (en) | 2011-08-02 | 2017-03-14 | Magna Electronics Inc. | Vehicular camera system |
US9871971B2 (en) | 2011-08-02 | 2018-01-16 | Magma Electronics Inc. | Vehicle vision system with light baffling system |
DE102012002703B3 (de) * | 2012-03-07 | 2013-07-04 | Roland Berger | Laserdiode mit innerer Luftkühlung |
EP3042228A4 (de) * | 2013-09-04 | 2017-05-03 | Bae Systems Information And Electronic Systems Integration Inc. | Direkte prallkühlung von fasern |
US9625671B2 (en) | 2013-10-23 | 2017-04-18 | Lasermax, Inc. | Laser module and system |
US9451138B2 (en) | 2013-11-07 | 2016-09-20 | Magna Electronics Inc. | Camera for vehicle vision system |
US9859680B2 (en) | 2013-12-17 | 2018-01-02 | Lasermax, Inc. | Shock resistant laser module |
US9749509B2 (en) | 2014-03-13 | 2017-08-29 | Magna Electronics Inc. | Camera with lens for vehicle vision system |
US9883612B2 (en) | 2015-06-02 | 2018-01-30 | International Business Machines Corporation | Heat sink attachment on existing heat sinks |
US10250004B2 (en) | 2015-11-05 | 2019-04-02 | Magna Electronics Inc. | Method of forming a connector for an electrical cable for electrically connecting to a camera of a vehicle |
US10351072B2 (en) | 2015-11-05 | 2019-07-16 | Magna Electronics Inc. | Vehicle camera with modular construction |
US10560613B2 (en) | 2015-11-05 | 2020-02-11 | Magna Electronics Inc. | Vehicle camera with modular construction |
US10230875B2 (en) | 2016-04-14 | 2019-03-12 | Magna Electronics Inc. | Camera for vehicle vision system |
US9865988B2 (en) * | 2015-11-25 | 2018-01-09 | Raytheon Company | High-power planar waveguide (PWG) pumphead with modular components for high-power laser system |
US11114813B2 (en) | 2015-11-25 | 2021-09-07 | Raytheon Company | Integrated pumplight homogenizer and signal injector for high-power laser system |
US10297968B2 (en) | 2015-11-25 | 2019-05-21 | Raytheon Company | High-gain single planar waveguide (PWG) amplifier laser system |
US10211590B2 (en) | 2015-11-25 | 2019-02-19 | Raytheon Company | Dual-function optical bench and cooling manifold for high-power laser system |
US10069270B2 (en) | 2016-02-11 | 2018-09-04 | Raytheon Company | Planar waveguides with enhanced support and/or cooling features for high-power laser systems |
US10142532B2 (en) | 2016-04-08 | 2018-11-27 | Magna Electronics Inc. | Camera for vehicle vision system |
US10237456B2 (en) | 2016-08-22 | 2019-03-19 | Magna Electronics Inc. | Vehicle camera assembly process |
US10511135B2 (en) | 2017-12-19 | 2019-12-17 | Raytheon Company | Laser system with mechanically-robust monolithic fused planar waveguide (PWG) structure |
US11133639B2 (en) | 2018-07-24 | 2021-09-28 | Raytheon Company | Fast axis thermal lens compensation for a planar amplifier structure |
US10901161B2 (en) | 2018-09-14 | 2021-01-26 | Toyota Motor Engineering & Manufacturing North America, Inc. | Optical power transfer devices with an embedded active cooling chip |
BR102019013939A2 (pt) | 2019-07-04 | 2021-01-12 | Petróleo Brasileiro S.A. - Petrobras | Sistema de arrefecimento de dispositivo eletrônico de fundo de poço |
Family Cites Families (21)
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US3835414A (en) * | 1972-03-24 | 1974-09-10 | Us Air Force | Gallium arsenide array |
US4306278A (en) * | 1975-09-24 | 1981-12-15 | Grumman Aerospace Corporation | Semiconductor laser array |
JPS58187961A (ja) * | 1982-04-27 | 1983-11-02 | Canon Inc | レ−ザユニツト |
JPS6015987A (ja) * | 1983-07-08 | 1985-01-26 | Hitachi Ltd | 発光素子 |
JPS6167807A (ja) * | 1984-09-12 | 1986-04-08 | Oki Electric Ind Co Ltd | 光半導体結合器の製造方法 |
US4860298A (en) * | 1988-04-12 | 1989-08-22 | Dan Botez | Phased-locked array of semiconductor lasers using closely spaced antiguides |
US4985897A (en) * | 1988-10-07 | 1991-01-15 | Trw Inc. | Semiconductor laser array having high power and high beam quality |
US4979180A (en) * | 1989-11-24 | 1990-12-18 | Muncheryan Arthur M | Modular interchangeable laser system |
US5105429A (en) * | 1990-07-06 | 1992-04-14 | The United States Of America As Represented By The Department Of Energy | Modular package for cooling a laser diode array |
US5107091A (en) * | 1990-09-14 | 1992-04-21 | Applied Solar Energy Corporation | Laser diode array mounting module |
US5105430A (en) * | 1991-04-09 | 1992-04-14 | The United States Of America As Represented By The United States Department Of Energy | Thin planar package for cooling an array of edge-emitting laser diodes |
US5263536A (en) * | 1991-07-19 | 1993-11-23 | Thermo Electron Technologies Corp. | Miniature heat exchanger |
US5212707A (en) * | 1991-12-06 | 1993-05-18 | Mcdonnell Douglas Corporation | Array of diffraction limited lasers and method of aligning same |
JP2945246B2 (ja) * | 1993-06-23 | 1999-09-06 | 株式会社日立製作所 | 光素子モジュール |
JPH07287130A (ja) * | 1994-04-19 | 1995-10-31 | Oki Electric Ind Co Ltd | 光ファイバモジュール |
US5495490A (en) * | 1995-02-28 | 1996-02-27 | Mcdonnell Douglas Corporation | Immersion method and apparatus for cooling a semiconductor laser device |
US5663980A (en) * | 1995-05-22 | 1997-09-02 | Adachi; Yoshi | Semiconductor laser device having changeable wavelength, polarization mode, and beam shape image |
JPH0961752A (ja) * | 1995-08-22 | 1997-03-07 | Sumitomo Electric Ind Ltd | 光軸調芯方法、光軸調芯装置、光学素子の検査方法、光学素子の検査装置、光学モジュ−ルの製造方法及び光学モジュ−ルの製造装置 |
US5689522A (en) * | 1995-10-02 | 1997-11-18 | The Regents Of The University Of California | High efficiency 2 micrometer laser utilizing wing-pumped Tm3+ and a laser diode array end-pumping architecture |
US5617492A (en) * | 1996-02-06 | 1997-04-01 | The Regents Of The University Of California | Fiber optic coupling of a microlens conditioned, stacked semiconductor laser diode array |
US5745514A (en) * | 1996-04-26 | 1998-04-28 | Opto Power Corporation | Laser diode structure with integrated heat sink |
-
1997
- 1997-05-30 US US08/866,472 patent/US6072814A/en not_active Expired - Fee Related
-
1998
- 1998-05-29 JP JP50039599A patent/JP2002501675A/ja not_active Ceased
- 1998-05-29 DE DE69803849T patent/DE69803849T2/de not_active Expired - Fee Related
- 1998-05-29 AT AT98924486T patent/ATE213365T1/de not_active IP Right Cessation
- 1998-05-29 EP EP98924486A patent/EP0985254B1/de not_active Expired - Lifetime
- 1998-05-29 ES ES98924486T patent/ES2168760T3/es not_active Expired - Lifetime
- 1998-05-29 WO PCT/GB1998/001585 patent/WO1998054802A1/en active IP Right Grant
- 1998-05-29 AU AU76679/98A patent/AU7667998A/en not_active Abandoned
- 1998-05-29 CA CA002291768A patent/CA2291768A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
AU7667998A (en) | 1998-12-30 |
CA2291768A1 (en) | 1998-12-03 |
DE69803849T2 (de) | 2002-06-27 |
US6072814A (en) | 2000-06-06 |
JP2002501675A (ja) | 2002-01-15 |
EP0985254B1 (de) | 2002-02-13 |
ATE213365T1 (de) | 2002-02-15 |
EP0985254A1 (de) | 2000-03-15 |
WO1998054802A1 (en) | 1998-12-03 |
ES2168760T3 (es) | 2002-06-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8339 | Ceased/non-payment of the annual fee |