ES2045056T3 - Componente optoelectronico y metodo para su fabricacion. - Google Patents

Componente optoelectronico y metodo para su fabricacion.

Info

Publication number
ES2045056T3
ES2045056T3 ES88117285T ES88117285T ES2045056T3 ES 2045056 T3 ES2045056 T3 ES 2045056T3 ES 88117285 T ES88117285 T ES 88117285T ES 88117285 T ES88117285 T ES 88117285T ES 2045056 T3 ES2045056 T3 ES 2045056T3
Authority
ES
Spain
Prior art keywords
fibre
plastic
photodiode
laser diode
carrier strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES88117285T
Other languages
English (en)
Inventor
Michael Ulmer
Gerhard Luz
Oliver Robisch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent NV
Original Assignee
Alcatel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel NV filed Critical Alcatel NV
Application granted granted Critical
Publication of ES2045056T3 publication Critical patent/ES2045056T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)
  • Telephone Function (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
  • Light Receiving Elements (AREA)
  • Inorganic Insulating Materials (AREA)
  • Organic Insulating Materials (AREA)

Abstract

SE PROPONE UN ELEMENTO (1) DE CONSTRUCCION OPTOELECTRICO. EL EXTREMO DE LA FIBRA DE UN CONDUCTOR DE LUZ SE ACOPLA EN UN FOTODIODO O LASERDIODO Y EL DISPOSITIVO EN CONJUNTO SE ROCIA CON MATERIALES SINTETICOS OPACOS. COMO BASE SE UTILIZA UNA TIRA SOPORTE PORCIONADA POR FUERA Y CONFORMADA EN BANDAS METALICAS QUE PRESENTA UNA SUPERFICIE DE MONTAJE PARA SOSTENER LA FIBRA Y OTRA SUPERFICIE DE MONTAJE MARCADA PARA FOTODIODO, LASERDIODO Y DIODO MONITOR. DENTRO DE LA ENVOLTURA DE PLASTICO SE COLOCA LA ZONA DE ACOPLAMIENTO DE FIBRAS EN MATERIAL SINTETICO TRANSPARENTE O SE CUBRE MEDIANTE UNA TAPA. UNA SECCION FINAL DE LAS BANDAS DE SOPORTE SE UTILIZA COMO PLACA CONDUCTORA DE CALOR (10) QUE JUNTAMENTE CON VARIAS BANDAS DE CUNACION (7,8,9) DE LUZ SE ENCUENTRA A LA MISMA DISTANCIA DEL CUERPO DE MATERIAL PLASTICO (6).
ES88117285T 1987-10-24 1988-10-18 Componente optoelectronico y metodo para su fabricacion. Expired - Lifetime ES2045056T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873736026 DE3736026A1 (de) 1987-10-24 1987-10-24 Optoelektrisches bauelement und verfahren zu dessen herstellung

Publications (1)

Publication Number Publication Date
ES2045056T3 true ES2045056T3 (es) 1994-01-16

Family

ID=6338994

Family Applications (1)

Application Number Title Priority Date Filing Date
ES88117285T Expired - Lifetime ES2045056T3 (es) 1987-10-24 1988-10-18 Componente optoelectronico y metodo para su fabricacion.

Country Status (5)

Country Link
EP (1) EP0313956B1 (es)
AT (1) ATE93975T1 (es)
AU (1) AU607005B2 (es)
DE (2) DE3736026A1 (es)
ES (1) ES2045056T3 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3923709A1 (de) * 1989-07-18 1991-01-31 Standard Elektrik Lorenz Ag Optoelektronische anordnung
US5101465A (en) * 1990-08-07 1992-03-31 At&T Bell Laboratories Leadframe-based optical assembly
JPH05343709A (ja) * 1992-06-08 1993-12-24 Sumitomo Electric Ind Ltd ピッグテール型光モジュールの製造方法
DE4232608C2 (de) * 1992-09-29 1994-10-06 Bosch Gmbh Robert Verfahren zum Herstellen eines Deckels für eine integriert optische Schaltung
DE4300652C1 (de) * 1993-01-13 1994-03-31 Bosch Gmbh Robert Verfahren zur Herstellung einer hybrid integrierten optischen Schaltung und Vorrichtung zur Emission von Lichtwellen
DE4323828C2 (de) * 1993-07-16 1995-12-14 Ant Nachrichtentech Anordnung zur Ankopplung mindestens eines Lichtleitfaserendes an jeweils einen optoelektronischen Sende- oder Empfängerbaustein
ES2078863B1 (es) * 1993-09-10 1996-08-01 Telefonica Nacional Espana Co Cabeza optica fotodetectora.
SE503905C2 (sv) * 1994-03-16 1996-09-30 Ericsson Telefon Ab L M Förfarande för framställning av en optokomponent samt optokomponent
SE513183C2 (sv) * 1994-03-18 2000-07-24 Ericsson Telefon Ab L M Förfarande för framställning av en optokomponent samt kapslad optokomponent
US6282352B1 (en) * 1997-04-08 2001-08-28 Hitachi, Ltd. Optical module, method for manufacturing optical module and optical communication apparatus
DE19841204A1 (de) 1998-09-09 2000-03-23 Siemens Ag Anordnung mit lichtemittierendem Leistungshalbleiterbauelement sowie Verfahren zur Herstellung derselben
ATE228664T1 (de) 1998-09-23 2002-12-15 Datasensor Spa Vorrichtung zur befestigung von mindestens einer optischen faser an einem optischen gerät

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2328973A1 (fr) * 1975-10-07 1977-05-20 Thomson Csf Dispositif pour la transmission d'informations par diode laser et emetteur comportant un tel dispositif
US4136357A (en) * 1977-10-03 1979-01-23 National Semiconductor Corporation Integrated circuit package with optical input coupler
JPS55129307A (en) * 1979-02-06 1980-10-07 Texas Instruments Inc Self matching fiberroptical package
DE2913262C2 (de) * 1979-04-03 1982-04-29 Kabelwerke Reinshagen Gmbh, 5600 Wuppertal Elektro-optische Verbindungsvorrichtung

Also Published As

Publication number Publication date
AU607005B2 (en) 1991-02-21
AU2365988A (en) 1989-04-27
DE3883700D1 (de) 1993-10-07
ATE93975T1 (de) 1993-09-15
EP0313956A2 (de) 1989-05-03
EP0313956B1 (de) 1993-09-01
EP0313956A3 (en) 1990-02-07
DE3736026A1 (de) 1989-05-03

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