ES2168760T3 - Modulo de diodo de laser con refrigeracion integrada. - Google Patents

Modulo de diodo de laser con refrigeracion integrada.

Info

Publication number
ES2168760T3
ES2168760T3 ES98924486T ES98924486T ES2168760T3 ES 2168760 T3 ES2168760 T3 ES 2168760T3 ES 98924486 T ES98924486 T ES 98924486T ES 98924486 T ES98924486 T ES 98924486T ES 2168760 T3 ES2168760 T3 ES 2168760T3
Authority
ES
Spain
Prior art keywords
array
fiber optic
module
laser diode
optic cable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES98924486T
Other languages
English (en)
Inventor
Daniel Joseph Ryan
Brian Lee Peterson
John Edwin Jackson
Carl John Sarro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Videojet Technologies Inc
Original Assignee
Marconi Data Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Data Systems Inc filed Critical Marconi Data Systems Inc
Application granted granted Critical
Publication of ES2168760T3 publication Critical patent/ES2168760T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4251—Sealed packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4286—Optical modules with optical power monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)

Abstract

Un módulo de láser con refrigeración integral, que comprende: (a) una primera sección de cuerpo (30) que porta una serie de diodos láser (32) y que incluye medios (60, 62, 36) para refrigerar dicha serie (32); y (b) una segunda sección de cuerpo (40) unida a la primera sección de cuerpo (30) y que porta un subconjunto de lente (16, 18) para recibir energía láser procedente de dicha serie (32) y proyectarla como un rayo a lo largo de un recorrido óptico, siendo la relación de acoplamiento entre dicha primera y segunda secciones de cuerpo (30, 40) tal que la serie de diodos láser (32) de la primera sección de cuerpo (30) se puede alinear con el subconjunto de lentes (16, 18) de la segunda sección de cuerpo (40) durante el montaje de dicho módulo de láser, estando dicho subconjunto de lentes (16, 18) dispuesto en un acoplador óptico (46) asegurado a dicha segunda sección de cuerpo (40), comprendiendo dicho subconjunto de lentes (16, 18) lentes de colimación y objetivo (16, 18) para enfocar el rayo láser a lo largo de dicho recorrido óptico siendo la relación de acoplamiento entre dicho acoplador óptico (46) y dicha segunda sección de cuerpo (40) tal que el subconjunto de lentes (16, 18) del acoplador óptico (46) se puede colocar con relación a la segunda sección de cuerpo (40) y por tanto la serie de diodos de láser (32) de la primera sección de cuerpo (30) para enfocar de manera precisa dicho rayo láser a lo largo de dicho recorrido óptico.
ES98924486T 1997-05-30 1998-05-29 Modulo de diodo de laser con refrigeracion integrada. Expired - Lifetime ES2168760T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/866,472 US6072814A (en) 1997-05-30 1997-05-30 Laser diode module with integral cooling

Publications (1)

Publication Number Publication Date
ES2168760T3 true ES2168760T3 (es) 2002-06-16

Family

ID=25347687

Family Applications (1)

Application Number Title Priority Date Filing Date
ES98924486T Expired - Lifetime ES2168760T3 (es) 1997-05-30 1998-05-29 Modulo de diodo de laser con refrigeracion integrada.

Country Status (9)

Country Link
US (1) US6072814A (es)
EP (1) EP0985254B1 (es)
JP (1) JP2002501675A (es)
AT (1) ATE213365T1 (es)
AU (1) AU7667998A (es)
CA (1) CA2291768A1 (es)
DE (1) DE69803849T2 (es)
ES (1) ES2168760T3 (es)
WO (1) WO1998054802A1 (es)

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US20070267220A1 (en) * 2006-05-16 2007-11-22 Northrop Grumman Corporation Methane extraction method and apparatus using high-energy diode lasers or diode-pumped solid state lasers
US7745898B2 (en) * 2007-12-20 2010-06-29 International Business Machines Corporation Multichip package, methods of manufacture thereof and articles comprising the same
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US8482664B2 (en) 2008-10-16 2013-07-09 Magna Electronics Inc. Compact camera and cable system for vehicular applications
CN102379119B (zh) 2009-02-06 2015-02-25 马格纳电子系统公司 用于安装在车辆上的照相机
ES2693455T3 (es) 2009-03-25 2018-12-11 Magna Electronics Inc. Montaje de cámara y lente vehicular
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US11114813B2 (en) 2015-11-25 2021-09-07 Raytheon Company Integrated pumplight homogenizer and signal injector for high-power laser system
US9865988B2 (en) * 2015-11-25 2018-01-09 Raytheon Company High-power planar waveguide (PWG) pumphead with modular components for high-power laser system
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Also Published As

Publication number Publication date
WO1998054802A1 (en) 1998-12-03
US6072814A (en) 2000-06-06
EP0985254B1 (en) 2002-02-13
DE69803849D1 (de) 2002-03-21
AU7667998A (en) 1998-12-30
ATE213365T1 (de) 2002-02-15
JP2002501675A (ja) 2002-01-15
EP0985254A1 (en) 2000-03-15
DE69803849T2 (de) 2002-06-27
CA2291768A1 (en) 1998-12-03

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