ATE214845T1 - Hochgeschwidigkeitsbewegung für arbeitsstücke in vakuum-behandlung - Google Patents

Hochgeschwidigkeitsbewegung für arbeitsstücke in vakuum-behandlung

Info

Publication number
ATE214845T1
ATE214845T1 AT95304550T AT95304550T ATE214845T1 AT E214845 T1 ATE214845 T1 AT E214845T1 AT 95304550 T AT95304550 T AT 95304550T AT 95304550 T AT95304550 T AT 95304550T AT E214845 T1 ATE214845 T1 AT E214845T1
Authority
AT
Austria
Prior art keywords
wafer
robots
cassette
pumpdown
wafers
Prior art date
Application number
AT95304550T
Other languages
English (en)
Inventor
Manny Sieradzki
Original Assignee
Diamond Semiconductor Group
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23026049&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE214845(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Diamond Semiconductor Group filed Critical Diamond Semiconductor Group
Application granted granted Critical
Publication of ATE214845T1 publication Critical patent/ATE214845T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Furnace Details (AREA)
AT95304550T 1994-06-30 1995-06-28 Hochgeschwidigkeitsbewegung für arbeitsstücke in vakuum-behandlung ATE214845T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/269,159 US5486080A (en) 1994-06-30 1994-06-30 High speed movement of workpieces in vacuum processing

Publications (1)

Publication Number Publication Date
ATE214845T1 true ATE214845T1 (de) 2002-04-15

Family

ID=23026049

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95304550T ATE214845T1 (de) 1994-06-30 1995-06-28 Hochgeschwidigkeitsbewegung für arbeitsstücke in vakuum-behandlung

Country Status (5)

Country Link
US (1) US5486080A (de)
EP (1) EP0690480B1 (de)
JP (1) JPH08181189A (de)
AT (1) ATE214845T1 (de)
DE (1) DE69525881T2 (de)

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US7214027B2 (en) * 2003-10-16 2007-05-08 Varian Semiconductor Equipment Associates, Inc. Wafer handler method and system
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US7458763B2 (en) 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
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US6987272B2 (en) * 2004-03-05 2006-01-17 Axcelis Technologies, Inc. Work piece transfer system for an ion beam implanter
DE602005021628D1 (de) * 2004-04-05 2010-07-15 Axcelis Tech Inc Inen ionenstrahl
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US7829843B2 (en) * 2004-07-09 2010-11-09 The Trustees Of Dartmouth College Electronic time-of-flight mass selector
JP5386082B2 (ja) * 2004-08-19 2014-01-15 ブルックス オートメーション インコーポレイテッド 低収容力のキャリア及びその使用方法
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TWI436831B (zh) 2009-12-10 2014-05-11 沃博提克Ｌｔ太陽公司 真空處理裝置之噴灑頭總成
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US11335578B2 (en) * 2020-02-13 2022-05-17 Kawasaki Jukogyo Kabushiki Kaisha Substrate transfer apparatus and method of measuring positional deviation of substrate
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Also Published As

Publication number Publication date
EP0690480A1 (de) 1996-01-03
US5486080A (en) 1996-01-23
DE69525881T2 (de) 2002-11-28
DE69525881D1 (de) 2002-04-25
JPH08181189A (ja) 1996-07-12
EP0690480B1 (de) 2002-03-20

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