|
US5760560A
(en)
*
|
1993-10-21 |
1998-06-02 |
Fanuc, Ltd. |
Robot apparatus
|
|
JPH07245332A
(ja)
*
|
1994-03-04 |
1995-09-19 |
Hitachi Ltd |
半導体製造装置および半導体装置の製造方法ならびに半導体装置
|
|
JP3200326B2
(ja)
*
|
1995-04-24 |
2001-08-20 |
東京応化工業株式会社 |
円板状被処理物の移載方法及び移載装置
|
|
US5898588A
(en)
*
|
1995-10-27 |
1999-04-27 |
Dainippon Screen Mfg. Co. |
Method and apparatus for controlling substrate processing apparatus
|
|
US5793050A
(en)
*
|
1996-02-16 |
1998-08-11 |
Eaton Corporation |
Ion implantation system for implanting workpieces
|
|
US5668452A
(en)
*
|
1996-05-09 |
1997-09-16 |
Vlsi Technology, Inc. |
Magnetic sensing robotics for automated semiconductor wafer processing systems
|
|
US6062798A
(en)
*
|
1996-06-13 |
2000-05-16 |
Brooks Automation, Inc. |
Multi-level substrate processing apparatus
|
|
JP3533879B2
(ja)
*
|
1996-07-15 |
2004-05-31 |
セイコーエプソン株式会社 |
部材の受け渡し装置および集積回路デバイスの検査装置
|
|
US6645355B2
(en)
|
1996-07-15 |
2003-11-11 |
Semitool, Inc. |
Semiconductor processing apparatus having lift and tilt mechanism
|
|
US6091498A
(en)
|
1996-07-15 |
2000-07-18 |
Semitool, Inc. |
Semiconductor processing apparatus having lift and tilt mechanism
|
|
USRE38622E1
(en)
|
1996-07-15 |
2004-10-12 |
Seiko Epson Corporation |
Parts handling method
|
|
KR100492267B1
(ko)
*
|
1996-09-11 |
2005-05-27 |
가부시끼가이샤 히다치 세이사꾸쇼 |
진공 처리장치 및 진공처리방법
|
|
JP3239779B2
(ja)
*
|
1996-10-29 |
2001-12-17 |
日新電機株式会社 |
基板処理装置および基板処理方法
|
|
US5943230A
(en)
*
|
1996-12-19 |
1999-08-24 |
Applied Materials, Inc. |
Computer-implemented inter-chamber synchronization in a multiple chamber substrate processing system
|
|
TW398024B
(en)
*
|
1997-09-01 |
2000-07-11 |
United Microelectronics Corp |
Method to prevent stepper fetch arm from scratching the wafer back and its control device
|
|
EP1049640A4
(de)
*
|
1997-11-28 |
2008-03-12 |
Mattson Tech Inc |
Verfahren und anlage zur handhabung von werkstücken unter vakuum mit niedriger kontamination und hohem durchsatz
|
|
US6257827B1
(en)
*
|
1997-12-01 |
2001-07-10 |
Brooks Automation Inc. |
Apparatus and method for transporting substrates
|
|
JP3196719B2
(ja)
*
|
1998-03-31 |
2001-08-06 |
日本電気株式会社 |
汚染防御用隔離ラインを有する半導体製造ライン、ウエハ搬送機構および半導体の製造方法
|
|
US20050229725A1
(en)
*
|
1999-01-17 |
2005-10-20 |
Nova Measuring Instruments Ltd. |
Buffer system for a wafer handling system
|
|
US6175418B1
(en)
*
|
1999-01-25 |
2001-01-16 |
Intergen, Inc. |
Multiple alignment mechanism in close proximity to a shared processing device
|
|
US6305677B1
(en)
*
|
1999-03-30 |
2001-10-23 |
Lam Research Corporation |
Perimeter wafer lifting
|
|
US6428262B1
(en)
*
|
1999-08-11 |
2002-08-06 |
Proteros, Llc |
Compact load lock system for ion beam processing of foups
|
|
US6429139B1
(en)
*
|
1999-12-17 |
2002-08-06 |
Eaton Corporation |
Serial wafer handling mechanism
|
|
US6906109B2
(en)
|
2000-09-01 |
2005-06-14 |
Chemical Products Corp. |
Method for controling uniformity of colloidal silica particle size
|
|
US6778258B2
(en)
*
|
2001-10-19 |
2004-08-17 |
Asml Holding N.V. |
Wafer handling system for use in lithography patterning
|
|
EP1454340B1
(de)
*
|
2001-11-29 |
2006-09-13 |
Diamond Semiconductor Group, LLC. |
Waferhandhabungsvorrichtung und verfahren dafür
|
|
US6729824B2
(en)
*
|
2001-12-14 |
2004-05-04 |
Applied Materials, Inc. |
Dual robot processing system
|
|
JP3865703B2
(ja)
*
|
2002-10-25 |
2007-01-10 |
ファナック株式会社 |
物品搬送システム及び搬送方法
|
|
US6852644B2
(en)
*
|
2002-11-25 |
2005-02-08 |
The Boc Group, Inc. |
Atmospheric robot handling equipment
|
|
SG115632A1
(en)
*
|
2003-03-11 |
2005-10-28 |
Asml Netherlands Bv |
Lithographic projection assembly, handling apparatus for handling substrates and method of handling a substrate
|
|
SG115631A1
(en)
|
2003-03-11 |
2005-10-28 |
Asml Netherlands Bv |
Lithographic projection assembly, load lock and method for transferring objects
|
|
SG115629A1
(en)
|
2003-03-11 |
2005-10-28 |
Asml Netherlands Bv |
Method and apparatus for maintaining a machine part
|
|
EP1457829A1
(de)
*
|
2003-03-11 |
2004-09-15 |
ASML Netherlands B.V. |
Lithographische Projektionsanordnung, Gerät und Verfahren zur Substrathandhabung
|
|
US6748293B1
(en)
*
|
2003-03-24 |
2004-06-08 |
Varian Semiconductor Equipment Associates, Inc. |
Methods and apparatus for high speed object handling
|
|
US7010388B2
(en)
*
|
2003-05-22 |
2006-03-07 |
Axcelis Technologies, Inc. |
Work-piece treatment system having load lock and buffer
|
|
JP2005123292A
(ja)
*
|
2003-10-15 |
2005-05-12 |
Canon Inc |
収納装置、当該収納装置を用いた露光方法
|
|
US7214027B2
(en)
*
|
2003-10-16 |
2007-05-08 |
Varian Semiconductor Equipment Associates, Inc. |
Wafer handler method and system
|
|
US7458763B2
(en)
|
2003-11-10 |
2008-12-02 |
Blueshift Technologies, Inc. |
Mid-entry load lock for semiconductor handling system
|
|
EP1684951B1
(de)
|
2003-11-10 |
2014-05-07 |
Brooks Automation, Inc. |
System zur handhabung von werkstücken in einem halbleiterhandhabungssystem auf vakuumbasis
|
|
US20070269297A1
(en)
|
2003-11-10 |
2007-11-22 |
Meulen Peter V D |
Semiconductor wafer handling and transport
|
|
US10086511B2
(en)
|
2003-11-10 |
2018-10-02 |
Brooks Automation, Inc. |
Semiconductor manufacturing systems
|
|
US7112808B2
(en)
*
|
2004-02-25 |
2006-09-26 |
Axcelis Technologies, Inc. |
Wafer 2D scan mechanism
|
|
US6987272B2
(en)
*
|
2004-03-05 |
2006-01-17 |
Axcelis Technologies, Inc. |
Work piece transfer system for an ion beam implanter
|
|
US7141809B2
(en)
*
|
2004-04-05 |
2006-11-28 |
Axcelis Technologies, Inc. |
Method for reciprocating a workpiece through an ion beam
|
|
US7267520B2
(en)
*
|
2004-04-09 |
2007-09-11 |
Axcelis Technologies, Inc. |
Wafer scanning system with reciprocating rotary motion utilizing springs and counterweights
|
|
US7246985B2
(en)
*
|
2004-04-16 |
2007-07-24 |
Axcelis Technologies, Inc. |
Work-piece processing system
|
|
US7119343B2
(en)
*
|
2004-05-06 |
2006-10-10 |
Axcelis Technologies, Inc. |
Mechanical oscillator for wafer scan with spot beam
|
|
JP2006019639A
(ja)
*
|
2004-07-05 |
2006-01-19 |
Tadamoto Tamai |
真空処理装置
|
|
WO2006016986A2
(en)
*
|
2004-07-09 |
2006-02-16 |
The Trustees Of Dartmouth College |
Electronic time-of-flight mass selector
|
|
WO2006023838A2
(en)
*
|
2004-08-19 |
2006-03-02 |
Brooks Automation, Inc. |
Reduced capacity carrier and method of use
|
|
US7720558B2
(en)
|
2004-09-04 |
2010-05-18 |
Applied Materials, Inc. |
Methods and apparatus for mapping carrier contents
|
|
US7585141B2
(en)
*
|
2005-02-01 |
2009-09-08 |
Varian Semiconductor Equipment Associates, Inc. |
Load lock system for ion beam processing
|
|
US20060258128A1
(en)
*
|
2005-03-09 |
2006-11-16 |
Peter Nunan |
Methods and apparatus for enabling multiple process steps on a single substrate
|
|
JP2009507363A
(ja)
*
|
2005-07-27 |
2009-02-19 |
シリコン・ジェネシス・コーポレーション |
制御された劈開プロセスを用いてプレート上の複数タイル部分を形成する方法および構造
|
|
JP2007242648A
(ja)
*
|
2006-03-04 |
2007-09-20 |
Masato Toshima |
基板の処理装置
|
|
US20080075563A1
(en)
*
|
2006-09-27 |
2008-03-27 |
Mclane James R |
Substrate handling system and method
|
|
JP2008153690A
(ja)
*
|
2008-02-21 |
2008-07-03 |
Hitachi Ltd |
真空処理方法及び真空処理装置
|
|
JP2011119468A
(ja)
*
|
2009-12-03 |
2011-06-16 |
Tokyo Electron Ltd |
被処理体の搬送方法および被処理体処理装置
|
|
TWI417984B
(zh)
|
2009-12-10 |
2013-12-01 |
沃博提克Lt太陽公司 |
自動排序之多方向性直線型處理裝置
|
|
CN102310999B
(zh)
*
|
2010-07-09 |
2013-07-17 |
上海凯世通半导体有限公司 |
真空传输制程设备及方法
|
|
US8459276B2
(en)
|
2011-05-24 |
2013-06-11 |
Orbotech LT Solar, LLC. |
Broken wafer recovery system
|
|
US9997384B2
(en)
*
|
2011-12-01 |
2018-06-12 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Methods for transporting wafers between wafer holders and chambers
|
|
DE102012013022A1
(de)
*
|
2012-06-29 |
2014-04-24 |
Liebherr-Verzahntechnik Gmbh |
Vorrichtung zur automatisierten Handhabung von Werkstücken
|
|
US10157763B2
(en)
|
2013-08-29 |
2018-12-18 |
Varian Semiconductor Equipment Associates, Inc. |
High throughput substrate handling endstation and sequence
|
|
CN108138304A
(zh)
*
|
2015-10-25 |
2018-06-08 |
应用材料公司 |
用于在基板上真空沉积的设备和用于在真空沉积期间掩蔽基板的方法
|
|
US11335578B2
(en)
*
|
2020-02-13 |
2022-05-17 |
Kawasaki Jukogyo Kabushiki Kaisha |
Substrate transfer apparatus and method of measuring positional deviation of substrate
|
|
CN113380680A
(zh)
*
|
2020-03-10 |
2021-09-10 |
上海临港凯世通半导体有限公司 |
硅片输运装置
|
|
CN211788912U
(zh)
*
|
2020-04-01 |
2020-10-27 |
上海临港凯世通半导体有限公司 |
离子注入机的作业平台
|
|
US12315747B2
(en)
*
|
2022-10-31 |
2025-05-27 |
Applied Materials, Inc. |
Workpiece handling architecture for high workpiece throughput
|
|
US12315748B2
(en)
|
2022-10-31 |
2025-05-27 |
Applied Materials, Inc. |
Workpiece handling architecture for high workpiece throughput
|
|
US20250210378A1
(en)
|
2023-12-20 |
2025-06-26 |
Axcelis Technologies, Inc. |
System and method for dynamic loadlock pressure control
|
|
US20250279297A1
(en)
|
2024-02-29 |
2025-09-04 |
Axcelis Technologies, Inc. |
Variable vent pressure and flow for flushing loadlock chamber
|