ATE210274T1 - Überwachung der dicke - Google Patents

Überwachung der dicke

Info

Publication number
ATE210274T1
ATE210274T1 AT97935672T AT97935672T ATE210274T1 AT E210274 T1 ATE210274 T1 AT E210274T1 AT 97935672 T AT97935672 T AT 97935672T AT 97935672 T AT97935672 T AT 97935672T AT E210274 T1 ATE210274 T1 AT E210274T1
Authority
AT
Austria
Prior art keywords
thickness
monitoring thickness
polarisation
illuminated
examined
Prior art date
Application number
AT97935672T
Other languages
English (en)
Inventor
Mark Burton Holbrook
William George Beckmann
Simon Eric Hicks
Christopher David Wi Wilkinson
Original Assignee
Vorgem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vorgem Ltd filed Critical Vorgem Ltd
Application granted granted Critical
Publication of ATE210274T1 publication Critical patent/ATE210274T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Drying Of Semiconductors (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
AT97935672T 1996-08-10 1997-08-11 Überwachung der dicke ATE210274T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9616853.9A GB9616853D0 (en) 1996-08-10 1996-08-10 An improved thickness monitor
PCT/GB1997/002139 WO1998007002A1 (en) 1996-08-10 1997-08-11 Improved thickness monitoring

Publications (1)

Publication Number Publication Date
ATE210274T1 true ATE210274T1 (de) 2001-12-15

Family

ID=10798334

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97935672T ATE210274T1 (de) 1996-08-10 1997-08-11 Überwachung der dicke

Country Status (8)

Country Link
US (1) US6226086B1 (de)
EP (1) EP0917642B1 (de)
JP (1) JP3816533B2 (de)
AT (1) ATE210274T1 (de)
AU (1) AU3856897A (de)
DE (1) DE69708882T2 (de)
GB (1) GB9616853D0 (de)
WO (1) WO1998007002A1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000003232A1 (en) * 1998-07-11 2000-01-20 Vorgem Limited Improved process monitor
JP4128339B2 (ja) * 2001-03-05 2008-07-30 株式会社日立製作所 試料処理装置用プロセスモニタ及び試料の製造方法
US7108584B2 (en) * 2001-09-26 2006-09-19 Fuji Photo Film Co., Ltd. Method and apparatus for manufacturing liquid drop ejecting head
JP4449293B2 (ja) * 2001-12-19 2010-04-14 株式会社ニコン 成膜装置、及び光学部材の製造方法
US6762849B1 (en) 2002-06-19 2004-07-13 Novellus Systems, Inc. Method for in-situ film thickness measurement and its use for in-situ control of deposited film thickness
US7271916B2 (en) * 2002-11-14 2007-09-18 Fitel Usa Corp Characterization of optical fiber using Fourier domain optical coherence tomography
US20080246951A1 (en) * 2007-04-09 2008-10-09 Phillip Walsh Method and system for using reflectometry below deep ultra-violet (DUV) wavelengths for measuring properties of diffracting or scattering structures on substrate work-pieces
US8564780B2 (en) * 2003-01-16 2013-10-22 Jordan Valley Semiconductors Ltd. Method and system for using reflectometry below deep ultra-violet (DUV) wavelengths for measuring properties of diffracting or scattering structures on substrate work pieces
US7126131B2 (en) * 2003-01-16 2006-10-24 Metrosol, Inc. Broad band referencing reflectometer
US20050042777A1 (en) * 2003-08-20 2005-02-24 The Boc Group Inc. Control of etch and deposition processes
US7804059B2 (en) * 2004-08-11 2010-09-28 Jordan Valley Semiconductors Ltd. Method and apparatus for accurate calibration of VUV reflectometer
US20070249071A1 (en) * 2006-04-21 2007-10-25 Lei Lian Neural Network Methods and Apparatuses for Monitoring Substrate Processing
US20080129986A1 (en) 2006-11-30 2008-06-05 Phillip Walsh Method and apparatus for optically measuring periodic structures using orthogonal azimuthal sample orientations
DE102007009901B4 (de) * 2007-02-28 2011-07-07 Globalfoundries Inc. Technik zum Strukturieren unterschiedlich verspannter Schichten, die über Transistoren ausgebildet sind, durch verbesserte Ätzsteuerungsstrategien
US20090219537A1 (en) * 2008-02-28 2009-09-03 Phillip Walsh Method and apparatus for using multiple relative reflectance measurements to determine properties of a sample using vacuum ultra violet wavelengths
US8153987B2 (en) 2009-05-22 2012-04-10 Jordan Valley Semiconductors Ltd. Automated calibration methodology for VUV metrology system
KR101306986B1 (ko) * 2010-03-09 2013-09-26 한국전자통신연구원 박막 형성 장치
US8867041B2 (en) 2011-01-18 2014-10-21 Jordan Valley Semiconductor Ltd Optical vacuum ultra-violet wavelength nanoimprint metrology
TWI441271B (zh) 2011-01-31 2014-06-11 財團法人工業技術研究院 量測矽通孔結構之系統、方法與電腦可讀取記錄媒體
US8565379B2 (en) 2011-03-14 2013-10-22 Jordan Valley Semiconductors Ltd. Combining X-ray and VUV analysis of thin film layers
RU2527670C2 (ru) * 2012-01-10 2014-09-10 Владимир Александрович Лабусов Способ измерения толщин нанометровых слоев многослойного покрытия, проводимого в процессе его напыления
BE1022682B1 (nl) * 2015-01-11 2016-07-14 Soleras Advanced Coatings Bvba Een deksel met een sensorsysteem voor een configureerbaar meetsysteem voor een configureerbaar sputtersysteem
TWI600876B (zh) 2015-11-23 2017-10-01 財團法人工業技術研究院 量測系統
US9952269B2 (en) * 2016-05-20 2018-04-24 Kerim Akel Measurement of complex dielectric constant and permeability
JP7625993B2 (ja) * 2021-07-14 2025-02-04 住友電気工業株式会社 光ファイバ、および光ファイバの製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0420113B1 (de) * 1989-09-25 1995-08-23 Mitsubishi Denki Kabushiki Kaisha Apparat und Verfahren für die Ausmessung von dünnen mehrschichtigen Lagen
GB2257507B (en) 1991-06-26 1995-03-01 Digital Equipment Corp Semiconductor wafer processing with across-wafer critical dimension monitoring using optical endpoint detection
US5333049A (en) 1991-12-06 1994-07-26 Hughes Aircraft Company Apparatus and method for interferometrically measuring the thickness of thin films using full aperture irradiation
JPH074922A (ja) 1993-06-21 1995-01-10 Jasco Corp 半導体多層薄膜膜厚測定装置およびその測定方法
JP2866559B2 (ja) 1993-09-20 1999-03-08 大日本スクリーン製造株式会社 膜厚測定方法
SE502239C2 (sv) * 1994-06-27 1995-09-18 Hassbjer Micro System Ab Sätt och anordning för tjockleksbedömning
DE69510032T2 (de) 1995-03-31 2000-01-27 International Business Machines Corp., Armonk Verfahren und Gerät zur Überwachung des Trockenätzens eines dielektrischen Films bis zu einer gegebenen Dicke

Also Published As

Publication number Publication date
JP3816533B2 (ja) 2006-08-30
WO1998007002A1 (en) 1998-02-19
EP0917642A1 (de) 1999-05-26
JP2000516712A (ja) 2000-12-12
AU3856897A (en) 1998-03-06
GB9616853D0 (en) 1996-09-25
EP0917642B1 (de) 2001-12-05
DE69708882T2 (de) 2002-08-01
US6226086B1 (en) 2001-05-01
DE69708882D1 (de) 2002-01-17

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
EEIH Change in the person of patent owner
REN Ceased due to non-payment of the annual fee