ATE210274T1 - Überwachung der dicke - Google Patents

Überwachung der dicke

Info

Publication number
ATE210274T1
ATE210274T1 AT97935672T AT97935672T ATE210274T1 AT E210274 T1 ATE210274 T1 AT E210274T1 AT 97935672 T AT97935672 T AT 97935672T AT 97935672 T AT97935672 T AT 97935672T AT E210274 T1 ATE210274 T1 AT E210274T1
Authority
AT
Austria
Prior art keywords
thickness
monitoring thickness
polarisation
illuminated
examined
Prior art date
Application number
AT97935672T
Other languages
English (en)
Inventor
Mark Burton Holbrook
William George Beckmann
Simon Eric Hicks
Christopher David Wi Wilkinson
Original Assignee
Vorgem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vorgem Ltd filed Critical Vorgem Ltd
Application granted granted Critical
Publication of ATE210274T1 publication Critical patent/ATE210274T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Drying Of Semiconductors (AREA)
AT97935672T 1996-08-10 1997-08-11 Überwachung der dicke ATE210274T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9616853.9A GB9616853D0 (en) 1996-08-10 1996-08-10 An improved thickness monitor
PCT/GB1997/002139 WO1998007002A1 (en) 1996-08-10 1997-08-11 Improved thickness monitoring

Publications (1)

Publication Number Publication Date
ATE210274T1 true ATE210274T1 (de) 2001-12-15

Family

ID=10798334

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97935672T ATE210274T1 (de) 1996-08-10 1997-08-11 Überwachung der dicke

Country Status (8)

Country Link
US (1) US6226086B1 (de)
EP (1) EP0917642B1 (de)
JP (1) JP3816533B2 (de)
AT (1) ATE210274T1 (de)
AU (1) AU3856897A (de)
DE (1) DE69708882T2 (de)
GB (1) GB9616853D0 (de)
WO (1) WO1998007002A1 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU4790499A (en) 1998-07-11 2000-02-01 Surface Technology Systems Limited Improved process monitor
JP4128339B2 (ja) * 2001-03-05 2008-07-30 株式会社日立製作所 試料処理装置用プロセスモニタ及び試料の製造方法
US7108584B2 (en) * 2001-09-26 2006-09-19 Fuji Photo Film Co., Ltd. Method and apparatus for manufacturing liquid drop ejecting head
JP4449293B2 (ja) * 2001-12-19 2010-04-14 株式会社ニコン 成膜装置、及び光学部材の製造方法
US6762849B1 (en) 2002-06-19 2004-07-13 Novellus Systems, Inc. Method for in-situ film thickness measurement and its use for in-situ control of deposited film thickness
US7271916B2 (en) * 2002-11-14 2007-09-18 Fitel Usa Corp Characterization of optical fiber using Fourier domain optical coherence tomography
US8564780B2 (en) * 2003-01-16 2013-10-22 Jordan Valley Semiconductors Ltd. Method and system for using reflectometry below deep ultra-violet (DUV) wavelengths for measuring properties of diffracting or scattering structures on substrate work pieces
US7126131B2 (en) * 2003-01-16 2006-10-24 Metrosol, Inc. Broad band referencing reflectometer
US20080246951A1 (en) * 2007-04-09 2008-10-09 Phillip Walsh Method and system for using reflectometry below deep ultra-violet (DUV) wavelengths for measuring properties of diffracting or scattering structures on substrate work-pieces
US20050042777A1 (en) * 2003-08-20 2005-02-24 The Boc Group Inc. Control of etch and deposition processes
US7804059B2 (en) * 2004-08-11 2010-09-28 Jordan Valley Semiconductors Ltd. Method and apparatus for accurate calibration of VUV reflectometer
US20070249071A1 (en) * 2006-04-21 2007-10-25 Lei Lian Neural Network Methods and Apparatuses for Monitoring Substrate Processing
US20080129986A1 (en) 2006-11-30 2008-06-05 Phillip Walsh Method and apparatus for optically measuring periodic structures using orthogonal azimuthal sample orientations
DE102007009901B4 (de) * 2007-02-28 2011-07-07 Globalfoundries Inc. Technik zum Strukturieren unterschiedlich verspannter Schichten, die über Transistoren ausgebildet sind, durch verbesserte Ätzsteuerungsstrategien
US20090219537A1 (en) * 2008-02-28 2009-09-03 Phillip Walsh Method and apparatus for using multiple relative reflectance measurements to determine properties of a sample using vacuum ultra violet wavelengths
US8153987B2 (en) 2009-05-22 2012-04-10 Jordan Valley Semiconductors Ltd. Automated calibration methodology for VUV metrology system
KR101306986B1 (ko) * 2010-03-09 2013-09-26 한국전자통신연구원 박막 형성 장치
US8867041B2 (en) 2011-01-18 2014-10-21 Jordan Valley Semiconductor Ltd Optical vacuum ultra-violet wavelength nanoimprint metrology
TWI441271B (zh) 2011-01-31 2014-06-11 財團法人工業技術研究院 量測矽通孔結構之系統、方法與電腦可讀取記錄媒體
US8565379B2 (en) 2011-03-14 2013-10-22 Jordan Valley Semiconductors Ltd. Combining X-ray and VUV analysis of thin film layers
RU2527670C2 (ru) * 2012-01-10 2014-09-10 Владимир Александрович Лабусов Способ измерения толщин нанометровых слоев многослойного покрытия, проводимого в процессе его напыления
BE1022682B1 (nl) * 2015-01-11 2016-07-14 Soleras Advanced Coatings Bvba Een deksel met een sensorsysteem voor een configureerbaar meetsysteem voor een configureerbaar sputtersysteem
TWI600876B (zh) 2015-11-23 2017-10-01 財團法人工業技術研究院 量測系統
US9952269B2 (en) * 2016-05-20 2018-04-24 Kerim Akel Measurement of complex dielectric constant and permeability
JP7625993B2 (ja) * 2021-07-14 2025-02-04 住友電気工業株式会社 光ファイバ、および光ファイバの製造方法
JP2024024846A (ja) * 2022-08-10 2024-02-26 住友電気工業株式会社 光ファイバの製造方法及び光ファイバ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0650030B1 (de) * 1989-09-25 1999-05-12 Mitsubishi Denki Kabushiki Kaisha Apparat und Verfahren für die Ausmessung von dünnen mehrschichtigen Lagen
GB2257507B (en) 1991-06-26 1995-03-01 Digital Equipment Corp Semiconductor wafer processing with across-wafer critical dimension monitoring using optical endpoint detection
US5333049A (en) 1991-12-06 1994-07-26 Hughes Aircraft Company Apparatus and method for interferometrically measuring the thickness of thin films using full aperture irradiation
JPH074922A (ja) 1993-06-21 1995-01-10 Jasco Corp 半導体多層薄膜膜厚測定装置およびその測定方法
JP2866559B2 (ja) * 1993-09-20 1999-03-08 大日本スクリーン製造株式会社 膜厚測定方法
SE9402247L (sv) * 1994-06-27 1995-09-18 Hassbjer Micro System Ab Sätt och anordning för tjockleksbedömning
EP0735565B1 (de) 1995-03-31 1999-06-02 International Business Machines Corporation Verfahren und Gerät zur Überwachung des Trockenätzens eines dielektrischen Films bis zu einer gegebenen Dicke

Also Published As

Publication number Publication date
DE69708882D1 (de) 2002-01-17
JP2000516712A (ja) 2000-12-12
JP3816533B2 (ja) 2006-08-30
EP0917642B1 (de) 2001-12-05
GB9616853D0 (en) 1996-09-25
DE69708882T2 (de) 2002-08-01
US6226086B1 (en) 2001-05-01
EP0917642A1 (de) 1999-05-26
AU3856897A (en) 1998-03-06
WO1998007002A1 (en) 1998-02-19

Similar Documents

Publication Publication Date Title
ATE210274T1 (de) Überwachung der dicke
IL125964A (en) Method and apparatus for measuring the thickness of a transparent film, particularly of a photoresist film on a semiconductor substrate
SG126706A1 (en) Thin-film inspection method and device
DE69511712D1 (de) Elektro-optischer eisdetektor
HK80686A (en) Monitoring removal of thin film layers
DE69028238D1 (de) Vorrichtung zur Entdeckung eines Objekts vom photoelektrischen Reflektionstyp
EP1300691A3 (de) Überwachungsverfahren und optoelektronischer Sensor
EP1158293A3 (de) Untersuchung eines Diamanten
DE69005794D1 (de) Optische Verstärkungseinrichtung mit niedrigem Rauschen und Reflexion der Pumpleistung.
BG103823A (en) Instrument for monitoring the qualities of sheet materials
FR2650675B1 (fr) Agencement de circuit permettant la surveillance d'un ensemble de plusieurs valves, notamment d'un circuit de freinage a regularite du glissement
JPS5786743A (en) Grease measuring device
TW200507285A (en) Visible wavelength detector systems and filters therefor
DE69819717D1 (de) Abdecktuch für chirurgisches mikroskop mit einem antihalo fenster
CA2005103A1 (en) Co-variance microwave water cut monitoring means and method
SE9402247D0 (sv) Sätt och anordning för tjockleksbedömning
JPS53125865A (en) Inspection of alumite substrate
RU93018751A (ru) Акустооптическое устройство для определения частоты радиочастотного сигнала
RU2001117702A (ru) Способ измерения толщины пленок на подложке
JPS56112636A (en) Optical humidity sensor
ATE344906T1 (de) Leuchtkörper
JPS5462879A (en) Optical temperature detector
DE60230776D1 (de) Automatische schwellwertgenerierung für elektrogramm-messung
JPS6449938A (en) Optical density measuring instrument
JPS5328447A (en) Measurement of length of optical fiber and device therefor

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
EEIH Change in the person of patent owner
REN Ceased due to non-payment of the annual fee