ATA352977A - Verfahren zur ablagerung bei einer glimment- ladung, sowie anordnung fuer die glimmentladung zur durchfuehrung des verfahrens - Google Patents

Verfahren zur ablagerung bei einer glimment- ladung, sowie anordnung fuer die glimmentladung zur durchfuehrung des verfahrens

Info

Publication number
ATA352977A
ATA352977A AT773529A AT352977A ATA352977A AT A352977 A ATA352977 A AT A352977A AT 773529 A AT773529 A AT 773529A AT 352977 A AT352977 A AT 352977A AT A352977 A ATA352977 A AT A352977A
Authority
AT
Austria
Prior art keywords
glimum
glime
depositing
charge
procedure
Prior art date
Application number
AT773529A
Other languages
English (en)
Other versions
AT354214B (de
Inventor
Bogdan Ing Zega
Original Assignee
Battelle Memorial Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Battelle Memorial Institute filed Critical Battelle Memorial Institute
Publication of ATA352977A publication Critical patent/ATA352977A/de
Application granted granted Critical
Publication of AT354214B publication Critical patent/AT354214B/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/34Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405Magnetron sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
AT352977A 1976-05-19 1977-05-17 Verfahren zur ablagerung bei einer glimment- ladung, sowie anordnung fuer die glimmentladung zur durchfuehrung des verfahrens AT354214B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH623776A CH611938A5 (de) 1976-05-19 1976-05-19

Publications (2)

Publication Number Publication Date
ATA352977A true ATA352977A (de) 1979-05-15
AT354214B AT354214B (de) 1979-12-27

Family

ID=4306421

Family Applications (1)

Application Number Title Priority Date Filing Date
AT352977A AT354214B (de) 1976-05-19 1977-05-17 Verfahren zur ablagerung bei einer glimment- ladung, sowie anordnung fuer die glimmentladung zur durchfuehrung des verfahrens

Country Status (11)

Country Link
US (1) US4116791A (de)
JP (1) JPS608303B2 (de)
AT (1) AT354214B (de)
BE (1) BE854816A (de)
CH (1) CH611938A5 (de)
DE (1) DE2722708A1 (de)
FR (1) FR2352393A1 (de)
GB (1) GB1548061A (de)
IT (1) IT1085894B (de)
NL (1) NL7705483A (de)
SE (1) SE7705766L (de)

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JP4570233B2 (ja) * 2000-10-25 2010-10-27 株式会社アルバック 薄膜形成方法及びその形成装置
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CN100483643C (zh) * 2006-07-13 2009-04-29 中芯国际集成电路制造(上海)有限公司 一种制作低介电常数层的新方法及其应用
CN101583736A (zh) * 2007-01-19 2009-11-18 应用材料股份有限公司 浸没式等离子体室
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CN101851746A (zh) * 2009-04-03 2010-10-06 鸿富锦精密工业(深圳)有限公司 磁控式溅镀靶及磁控式溅镀系统
KR101975741B1 (ko) * 2009-11-13 2019-05-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 타깃 재료의 포장 방법 및 타깃의 장착 방법
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Also Published As

Publication number Publication date
FR2352393A1 (fr) 1977-12-16
DE2722708A1 (de) 1977-12-08
BE854816A (fr) 1977-11-18
SE7705766L (sv) 1977-11-20
CH611938A5 (de) 1979-06-29
GB1548061A (en) 1979-07-04
JPS608303B2 (ja) 1985-03-01
US4116791A (en) 1978-09-26
FR2352393B1 (de) 1983-02-11
IT1085894B (it) 1985-05-28
NL7705483A (nl) 1977-11-22
JPS5310384A (en) 1978-01-30
AT354214B (de) 1979-12-27

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