FR2528452B1 - Procede et dispositif pour la realisation de depots metalliques ou de composes metalliques, a la surface d'une piece en un materiau electriquement conducteur - Google Patents
Procede et dispositif pour la realisation de depots metalliques ou de composes metalliques, a la surface d'une piece en un materiau electriquement conducteurInfo
- Publication number
- FR2528452B1 FR2528452B1 FR8210245A FR8210245A FR2528452B1 FR 2528452 B1 FR2528452 B1 FR 2528452B1 FR 8210245 A FR8210245 A FR 8210245A FR 8210245 A FR8210245 A FR 8210245A FR 2528452 B1 FR2528452 B1 FR 2528452B1
- Authority
- FR
- France
- Prior art keywords
- workpiece
- conductive material
- electrically conductive
- metal compounds
- deposits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
- C23C14/345—Applying energy to the substrate during sputtering using substrate bias
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
- H01J37/32706—Polarising the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8210245A FR2528452B1 (fr) | 1982-06-11 | 1982-06-11 | Procede et dispositif pour la realisation de depots metalliques ou de composes metalliques, a la surface d'une piece en un materiau electriquement conducteur |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8210245A FR2528452B1 (fr) | 1982-06-11 | 1982-06-11 | Procede et dispositif pour la realisation de depots metalliques ou de composes metalliques, a la surface d'une piece en un materiau electriquement conducteur |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2528452A1 FR2528452A1 (fr) | 1983-12-16 |
FR2528452B1 true FR2528452B1 (fr) | 1985-12-20 |
Family
ID=9274919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8210245A Expired FR2528452B1 (fr) | 1982-06-11 | 1982-06-11 | Procede et dispositif pour la realisation de depots metalliques ou de composes metalliques, a la surface d'une piece en un materiau electriquement conducteur |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2528452B1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2591613B1 (fr) * | 1985-12-16 | 1988-04-01 | Stephanois Rech Mec | Couches minces de metal condense sur un substrat et contenant carbone ou azote en solution d'insertion. |
DE4140862A1 (de) * | 1991-12-11 | 1993-06-17 | Leybold Ag | Kathodenzerstaeubungsanlage |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3732158A (en) * | 1971-01-14 | 1973-05-08 | Nasa | Method and apparatus for sputtering utilizing an apertured electrode and a pulsed substrate bias |
US3749662A (en) * | 1972-04-17 | 1973-07-31 | Materials Research Corp | Heated substrate support station for sputtering systems |
US4043889A (en) * | 1976-01-02 | 1977-08-23 | Sperry Rand Corporation | Method of and apparatus for the radio frequency sputtering of a thin film |
CH611938A5 (fr) * | 1976-05-19 | 1979-06-29 | Battelle Memorial Institute |
-
1982
- 1982-06-11 FR FR8210245A patent/FR2528452B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2528452A1 (fr) | 1983-12-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CD | Change of name or company name | ||
TP | Transmission of property | ||
ST | Notification of lapse |