ATA2092000A - Vorrichtung zur fixierung von halbleitersubstraten in einer zueinander ausgerichteten sollage - Google Patents

Vorrichtung zur fixierung von halbleitersubstraten in einer zueinander ausgerichteten sollage

Info

Publication number
ATA2092000A
ATA2092000A AT2092000A AT2092000A ATA2092000A AT A2092000 A ATA2092000 A AT A2092000A AT 2092000 A AT2092000 A AT 2092000A AT 2092000 A AT2092000 A AT 2092000A AT A2092000 A ATA2092000 A AT A2092000A
Authority
AT
Austria
Prior art keywords
signaled
alignment
semiconductor substrates
fixing semiconductor
fixing
Prior art date
Application number
AT2092000A
Other languages
English (en)
Other versions
AT409681B (de
Original Assignee
Thallner Erich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thallner Erich filed Critical Thallner Erich
Priority to AT2092000A priority Critical patent/AT409681B/de
Publication of ATA2092000A publication Critical patent/ATA2092000A/de
Application granted granted Critical
Publication of AT409681B publication Critical patent/AT409681B/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
AT2092000A 2000-02-11 2000-02-11 Vorrichtung zur fixierung von halbleitersubstraten in einer zueinander ausgerichteten sollage AT409681B (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AT2092000A AT409681B (de) 2000-02-11 2000-02-11 Vorrichtung zur fixierung von halbleitersubstraten in einer zueinander ausgerichteten sollage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT2092000A AT409681B (de) 2000-02-11 2000-02-11 Vorrichtung zur fixierung von halbleitersubstraten in einer zueinander ausgerichteten sollage

Publications (2)

Publication Number Publication Date
ATA2092000A true ATA2092000A (de) 2002-02-15
AT409681B AT409681B (de) 2002-10-25

Family

ID=3669664

Family Applications (1)

Application Number Title Priority Date Filing Date
AT2092000A AT409681B (de) 2000-02-11 2000-02-11 Vorrichtung zur fixierung von halbleitersubstraten in einer zueinander ausgerichteten sollage

Country Status (1)

Country Link
AT (1) AT409681B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10139586C2 (de) * 2001-08-11 2003-11-27 Erich Thallner Plattenförmiges Justierelement
DE10230373B3 (de) * 2002-07-05 2004-03-04 Süss Microtec Lithography Gmbh Vorrichtung und Verfahren zum Bonden eines Stapels aus drei oder mehr scheibenförmigen Substraten, insbesondere eines 3-Wafer-Stacks

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2567324B1 (fr) * 1984-07-06 1986-11-28 Telemecanique Electrique Dispositif de montage, pour composant hybride a couche epaisse notamment pour module electronique
JPH046849A (ja) * 1990-04-24 1992-01-10 Kokusai Electric Co Ltd ウェーハ把持装置
JPH04177856A (ja) * 1990-11-13 1992-06-25 Hitachi Ltd 試料固定装置
JPH0555342A (ja) * 1991-08-26 1993-03-05 Hitachi Ltd ウエーハチヤツクおよびウエーハ搬送装置
AT405224B (de) * 1992-06-05 1999-06-25 Thallner Erich Vorrichtung zum ausrichten, zusammenführen und festhalten von scheibenförmigen bauteilen
IL102120A (en) * 1992-06-05 1994-08-26 Persys Technology Ltd Mask, assembly and method that enable quality control of equipment for the production of semiconductor slice chips
JPH07102371A (ja) * 1993-10-01 1995-04-18 Nissin Electric Co Ltd 被処理物の真空処理方法及び装置
US5513594A (en) * 1993-10-20 1996-05-07 Mcclanahan; Adolphus E. Clamp with wafer release for semiconductor wafer processing equipment
JPH0963531A (ja) * 1995-08-23 1997-03-07 Nippon Steel Corp イオン注入装置の被イオン注入部材固定装置
JP3282787B2 (ja) * 1996-07-29 2002-05-20 東京エレクトロン株式会社 ウエハ搬送機構
JP3492859B2 (ja) * 1996-07-31 2004-02-03 京セラ株式会社 ウエハー形状測定装置
JPH10335287A (ja) * 1997-06-05 1998-12-18 Toshiba Corp 基板処理装置
JPH11116046A (ja) * 1997-10-20 1999-04-27 Mecs Corp ウェハ搬送ロボットにおけるロボットハンド

Also Published As

Publication number Publication date
AT409681B (de) 2002-10-25

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Legal Events

Date Code Title Description
MK07 Expiry

Effective date: 20200211