DE60117629D1 - Vorrichtung zur Erhitzung einer Flüssigkeit - Google Patents

Vorrichtung zur Erhitzung einer Flüssigkeit

Info

Publication number
DE60117629D1
DE60117629D1 DE60117629T DE60117629T DE60117629D1 DE 60117629 D1 DE60117629 D1 DE 60117629D1 DE 60117629 T DE60117629 T DE 60117629T DE 60117629 T DE60117629 T DE 60117629T DE 60117629 D1 DE60117629 D1 DE 60117629D1
Authority
DE
Germany
Prior art keywords
heating
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60117629T
Other languages
English (en)
Other versions
DE60117629T2 (de
Inventor
Eiichi Toya
Tomio Konn
Tomohiro Nagata
Sunao Seko
Takanori Saito
Kazutoshi Miura
Harunari Hasegawa
Joji Hoshi
Katsutoshi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Coorstek KK
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Toshiba Ceramics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd, Toshiba Ceramics Co Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of DE60117629D1 publication Critical patent/DE60117629D1/de
Publication of DE60117629T2 publication Critical patent/DE60117629T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/44—Heating elements having the shape of rods or tubes non-flexible heating conductor arranged within rods or tubes of insulating material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/40—Heating elements having the shape of rods or tubes
    • H05B3/42—Heating elements having the shape of rods or tubes non-flexible
    • H05B3/46—Heating elements having the shape of rods or tubes non-flexible heating conductor mounted on insulating base
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/022—Heaters specially adapted for heating gaseous material
DE60117629T 2000-03-30 2001-03-28 Vorrichtung zur Erhitzung einer Flüssigkeit Expired - Lifetime DE60117629T2 (de)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2000093245 2000-03-30
JP2000093245 2000-03-30
JP2001003250 2001-01-11
JP2001003250 2001-01-11
JP2001038424A JP3587249B2 (ja) 2000-03-30 2001-02-15 流体加熱装置
JP2001038424 2001-02-15

Publications (2)

Publication Number Publication Date
DE60117629D1 true DE60117629D1 (de) 2006-05-04
DE60117629T2 DE60117629T2 (de) 2007-01-04

Family

ID=27342878

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60117629T Expired - Lifetime DE60117629T2 (de) 2000-03-30 2001-03-28 Vorrichtung zur Erhitzung einer Flüssigkeit

Country Status (6)

Country Link
US (1) US6516143B2 (de)
EP (1) EP1139694B1 (de)
JP (1) JP3587249B2 (de)
KR (1) KR20010095084A (de)
DE (1) DE60117629T2 (de)
TW (1) TW563187B (de)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6884295B2 (en) 2000-05-29 2005-04-26 Tokyo Electron Limited Method of forming oxynitride film or the like and system for carrying out the same
DE60131698T2 (de) * 2000-05-31 2008-10-30 Tokyo Electron Ltd. Thermische Behandlungsvorrichtung und Verfahren
KR100457451B1 (ko) * 2001-12-06 2004-11-17 주성엔지니어링(주) 소스 및 반응가스 전처리 장치
KR100718593B1 (ko) * 2002-03-13 2007-05-16 와틀로 일렉트릭 매뉴팩츄어링 컴파니 핫 러너 히터장치 및 제조방법
EP1349429A3 (de) 2002-03-25 2007-10-24 Tokyo Electron Limited Heizer mit Abdichtung aus Drahtheizelementobjekt aus Kohlenstoff und Vorrichtung zum Heizen einer Flüssigkeit die denselben Heizer benützt
KR100481008B1 (ko) * 2002-06-03 2005-04-07 주성엔지니어링(주) 화학기상증착공정용 기체 가열장치 및 이를 이용한반도체소자 제조방법
DE10234043A1 (de) * 2002-07-26 2004-02-05 Forschungszentrum Karlsruhe Gmbh Mikrostrukturapparat zum Erhitzen eines Fluids
KR100560306B1 (ko) * 2003-08-02 2006-03-14 동부아남반도체 주식회사 케미컬 공급 장치의 주입 밸브 및 케미컬 공급 장치
KR100765674B1 (ko) 2003-12-10 2007-10-12 마츠시타 덴끼 산교 가부시키가이샤 열교환기 및 그것을 구비한 세정 장치
JP4007610B2 (ja) 2004-09-02 2007-11-14 財団法人電力中央研究所 腐食減肉試験装置及び腐食減肉試験方法
US7221860B2 (en) * 2005-04-22 2007-05-22 Momentive Performance Materials Inc. Vacuum insulated heater assembly
JP4743495B2 (ja) * 2005-07-08 2011-08-10 東京エレクトロン株式会社 流体加熱装置
KR100767851B1 (ko) * 2005-07-14 2007-10-18 엘지전자 주식회사 발열체의 구조
KR100730378B1 (ko) 2005-08-31 2007-06-19 (주)대하이노텍 반응가스 가열 수단
KR101134570B1 (ko) * 2005-12-07 2012-04-13 씨앤지하이테크 주식회사 반도체 제조용 유체가열장치
KR101212575B1 (ko) 2006-09-11 2012-12-14 씨앤지하이테크 주식회사 반도체 제조를 위한 유체가열용 인라인히터유닛
JP2008108703A (ja) * 2006-09-28 2008-05-08 Covalent Materials Corp 面状ヒータ及びこのヒータを備えた半導体熱処理装置
KR100955671B1 (ko) * 2006-11-06 2010-05-06 주식회사 하이닉스반도체 원자층증착 장비
JP5317462B2 (ja) * 2007-11-16 2013-10-16 助川電気工業株式会社 均熱高速昇降炉
DE102007059218A1 (de) * 2007-12-07 2009-06-10 Von Ardenne Anlagentechnik Gmbh Verfahren zur Temperaturführung in einem Diffusionsofen
CN101616512B (zh) * 2008-06-27 2015-09-30 清华大学 线热源
US20100097879A1 (en) * 2008-06-24 2010-04-22 John Krueger Apparatus and method for optimizing reaction time for curable material
JP5608333B2 (ja) * 2008-09-19 2014-10-15 株式会社日立国際電気 熱処理装置及び半導体装置の製造方法
CN101726096A (zh) * 2008-11-03 2010-06-09 崔成哲 新型热水胆及其生产方法
US7745366B2 (en) * 2008-11-04 2010-06-29 King Fahd University Of Petroleum And Minerals Microwave spent catalyst decoking method
JP2010171388A (ja) * 2008-12-25 2010-08-05 Hitachi Kokusai Electric Inc 基板処理装置及び半導体装置の製造方法及び基板処理用反応管
JP5501807B2 (ja) * 2009-03-31 2014-05-28 東京エレクトロン株式会社 処理装置
US20100282458A1 (en) * 2009-05-08 2010-11-11 Yale Ann Carbon fiber heating source and heating system using the same
CN102147147A (zh) * 2010-02-08 2011-08-10 清华大学 加热导流管
CN102147148A (zh) * 2010-02-08 2011-08-10 清华大学 流体加热器及其使用方法
WO2012071661A1 (en) * 2010-11-30 2012-06-07 Socpra Sciences Et Genie S.E.C. Epitaxial deposition apparatus, gas injectors, and chemical vapor management system associated therewith
DE102010061271A1 (de) * 2010-12-15 2012-06-21 Contitech Schlauch Gmbh Beheizbare Anschlussvorrichtung für medienführende, elektrisch beheizbare Schläuche
US8739786B2 (en) * 2012-03-26 2014-06-03 Vaporfection International, Inc. Portable hand-held vaporizer heating assembly
US20140112650A1 (en) * 2012-10-19 2014-04-24 Edwards Vacuum, Inc. Cartridge heater apparatus
DE102014102474A1 (de) 2014-02-25 2015-08-27 Sandvik Materials Technology Deutschland Gmbh Heizelement und Prozessheizer
FR3050254B1 (fr) * 2016-04-13 2018-03-30 Commissariat A L'energie Atomique Et Aux Energies Alternatives Dispositif de conversion d'un liquide en vapeur
KR101913192B1 (ko) * 2016-12-27 2018-10-31 (주)더존코리아 산소용해장치
JP6886693B2 (ja) * 2017-05-15 2021-06-16 株式会社エアレックス インキュベータ
US10495974B2 (en) * 2017-09-14 2019-12-03 Taiwan Semiconductor Manufacturing Co., Ltd. Target feeding system
CN110118435B (zh) * 2019-05-05 2021-10-29 四川奥格莱能源科技有限公司 一种壁挂炉热交换器
KR102408282B1 (ko) * 2020-08-25 2022-06-13 주식회사 토모 다공성 튜브를 이용한 액체 간접 가열 조절 장치
KR20230033984A (ko) * 2021-09-02 2023-03-09 주식회사 원익아이피에스 기판처리장치

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1369900A (en) * 1920-01-05 1921-03-01 T W Dunk Electric liquid-heater
US2775683A (en) * 1954-07-16 1956-12-25 Dole Refrigerating Co Heat exchangers for vaporizing liquid refrigerant
US3519255A (en) * 1969-03-27 1970-07-07 Hal B H Cooper Structure and method for heating gases
BE786000R (fr) * 1970-10-30 1973-01-08 Dow Chemical Co Determination de la demande en oxygene de matieres combustiblesen dispersions
DE2222849C3 (de) * 1972-05-10 1978-07-06 Schladitz-Whiskers Ag, Zug (Schweiz) Elektrische Heizvorrichtung zum raschen Erhitzen von strömenden Medien
JPS61150323A (ja) * 1984-12-25 1986-07-09 Fujitsu Ltd 半導体材料の製造方法
US4786352A (en) * 1986-09-12 1988-11-22 Benzing Technologies, Inc. Apparatus for in-situ chamber cleaning
JPS63316425A (ja) 1987-06-18 1988-12-23 Nec Corp 半導体装置の製造装置
DE3873848T2 (de) * 1987-07-16 1993-03-11 Texas Instruments Inc Behandlungsapparat und -verfahren.
JPH0220829Y2 (de) * 1987-11-26 1990-06-06
JP3129777B2 (ja) * 1990-11-16 2001-01-31 東京エレクトロン株式会社 熱処理装置及び熱処理方法
JP3260429B2 (ja) * 1992-07-30 2002-02-25 東芝セラミックス株式会社 石英ガラス質断熱材
JPH07176498A (ja) 1993-12-21 1995-07-14 Kokusai Electric Co Ltd 反応ガスの予熱装置を備えた反応炉
JP3474991B2 (ja) * 1995-11-22 2003-12-08 東京エレクトロン株式会社 酸化処理装置及び酸化処理方法
US5954094A (en) * 1997-01-13 1999-09-21 Lufran Incorporated End cap for providing a fluid-tight seal between dissimilar materials
TW452826B (en) * 1997-07-31 2001-09-01 Toshiba Ceramics Co Carbon heater
JP4185194B2 (ja) * 1997-07-31 2008-11-26 コバレントマテリアル株式会社 カーボンヒータ
JPH11329991A (ja) * 1998-05-11 1999-11-30 Sony Corp 急速加熱処理装置及びその方法
KR100334993B1 (ko) * 1998-12-01 2002-05-02 추후제출 히터

Also Published As

Publication number Publication date
EP1139694A3 (de) 2004-11-24
JP3587249B2 (ja) 2004-11-10
DE60117629T2 (de) 2007-01-04
US20020023919A1 (en) 2002-02-28
EP1139694A2 (de) 2001-10-04
KR20010095084A (ko) 2001-11-03
TW563187B (en) 2003-11-21
EP1139694B1 (de) 2006-03-08
US6516143B2 (en) 2003-02-04
JP2002277054A (ja) 2002-09-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: COVALENT MATERIALS CORP., TOKYO, JP

Owner name: TOKYO ELECTRON LTD., TOKIO/TOKYO, JP