AT413891B - Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements - Google Patents

Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements Download PDF

Info

Publication number
AT413891B
AT413891B AT0209603A AT20962003A AT413891B AT 413891 B AT413891 B AT 413891B AT 0209603 A AT0209603 A AT 0209603A AT 20962003 A AT20962003 A AT 20962003A AT 413891 B AT413891 B AT 413891B
Authority
AT
Austria
Prior art keywords
circuit board
layer
printed circuit
optoelectronic component
optoelectronic
Prior art date
Application number
AT0209603A
Other languages
German (de)
English (en)
Other versions
ATA20962003A (de
Inventor
Guenther Leising
Arno Klamminger
Gregor Langer
Volker Schmidt
Riikka Reitzer
Original Assignee
Austria Tech & System Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Austria Tech & System Tech filed Critical Austria Tech & System Tech
Priority to AT0209603A priority Critical patent/AT413891B/de
Priority to EP04802021A priority patent/EP1706770A1/de
Priority to EP10183725A priority patent/EP2309294A3/de
Priority to US10/581,849 priority patent/US20080044127A1/en
Priority to PCT/AT2004/000459 priority patent/WO2005064381A1/de
Priority to JP2006545841A priority patent/JP2007517248A/ja
Priority to CA002551654A priority patent/CA2551654A1/en
Publication of ATA20962003A publication Critical patent/ATA20962003A/de
Application granted granted Critical
Publication of AT413891B publication Critical patent/AT413891B/de
Priority to KR1020067015026A priority patent/KR101122442B1/ko

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12083—Constructional arrangements
    • G02B2006/1213—Constructional arrangements comprising photonic band-gap structures or photonic lattices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods
    • G02B2006/1219—Polymerisation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B2006/12166—Manufacturing methods
    • G02B2006/12195—Tapering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)
  • Structure Of Printed Boards (AREA)
AT0209603A 2003-12-29 2003-12-29 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements AT413891B (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
AT0209603A AT413891B (de) 2003-12-29 2003-12-29 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements
EP04802021A EP1706770A1 (de) 2003-12-29 2004-12-28 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements
EP10183725A EP2309294A3 (de) 2003-12-29 2004-12-28 Leiterplattenelement sowie Verfahren zur Herstellung eines Leiterplattenelements
US10/581,849 US20080044127A1 (en) 2003-12-29 2004-12-28 Printed Circuit Board Element Comprising at Least One Optical Waveguide, and Method for the Production of Such a Printed Circuit Board Element
PCT/AT2004/000459 WO2005064381A1 (de) 2003-12-29 2004-12-28 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements
JP2006545841A JP2007517248A (ja) 2003-12-29 2004-12-28 少なくとも一つの光導波路を含むプリント回路基板エレメント、およびそのようなプリント回路基板エレメントの製造方法
CA002551654A CA2551654A1 (en) 2003-12-29 2004-12-28 Printed circuit board element comprising at least one optical waveguide, and method for the production of such a printed circuit board element
KR1020067015026A KR101122442B1 (ko) 2003-12-29 2006-07-25 적어도 하나의 광도파로를 포함하는 인쇄 회로 기판 엘리먼트 및 이 인쇄 회로 기판 엘리먼트를 제조하기 위한 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT0209603A AT413891B (de) 2003-12-29 2003-12-29 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements

Publications (2)

Publication Number Publication Date
ATA20962003A ATA20962003A (de) 2005-10-15
AT413891B true AT413891B (de) 2006-07-15

Family

ID=34716005

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0209603A AT413891B (de) 2003-12-29 2003-12-29 Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements

Country Status (7)

Country Link
US (1) US20080044127A1 (enExample)
EP (2) EP1706770A1 (enExample)
JP (1) JP2007517248A (enExample)
KR (1) KR101122442B1 (enExample)
AT (1) AT413891B (enExample)
CA (1) CA2551654A1 (enExample)
WO (1) WO2005064381A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007007355A1 (de) * 2007-02-14 2008-08-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung optischer Verbindungen und optische Anordnung
AT505166B1 (de) * 2008-01-16 2008-11-15 Austria Tech & System Tech Verfahren und vorrichtung zum erzeugen eines licht-wellenleiters in einem leiterplattenelement
WO2012048359A1 (de) 2010-10-14 2012-04-19 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Optischer evaneszenzfeldsensor
AT12749U1 (de) * 2011-04-01 2012-10-15 Austria Tech & System Tech Leiterplattenelement mit wenigstens einer led
EP3599541A1 (en) * 2018-07-26 2020-01-29 University of Vienna Optical waveguide light emitter and touchscreen

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4304163B2 (ja) * 2005-03-09 2009-07-29 パナソニック株式会社 撮像モジュールおよびその製造方法
US8629610B2 (en) 2006-01-12 2014-01-14 Ppg Industries Ohio, Inc. Display panel
JP5317704B2 (ja) 2006-01-12 2013-10-16 ピーピージー・インダストリーズ・オハイオ・インコーポレイテッド レーザ導入された光を再指向する機能を有する表示パネル
US7474815B2 (en) * 2006-03-14 2009-01-06 International Business Machines Corporation Interconnecting (mapping) a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array
WO2007111236A1 (ja) * 2006-03-24 2007-10-04 Ibiden Co., Ltd. 光電気配線板、光通信用デバイス及び光通信用デバイスの製造方法
DE102007007269A1 (de) * 2006-04-04 2007-10-11 Man Roland Druckmaschinen Ag Applikation von elektronischen Bauelementen in Druckprodukten
AT503027B1 (de) 2006-05-08 2007-07-15 Austria Tech & System Tech Leiterplattenelement mit optoelektronischem bauelement und licht-wellenleiter
AT503585B1 (de) * 2006-05-08 2007-11-15 Austria Tech & System Tech Leiterplattenelement sowie verfahren zu dessen herstellung
CN100510812C (zh) * 2006-11-09 2009-07-08 财团法人工业技术研究院 光电基板
JP2008158440A (ja) * 2006-12-26 2008-07-10 Toshiba Corp 光電気配線板及び光電気配線装置の製造方法
WO2008078680A1 (ja) * 2006-12-26 2008-07-03 Mitsui Chemicals, Inc. 光電気混載基板およびその製造方法
AT505834B1 (de) * 2007-09-21 2009-09-15 Austria Tech & System Tech Leiterplattenelement
JPWO2009107742A1 (ja) * 2008-02-28 2011-07-07 日本電気株式会社 半導体装置
US8265432B2 (en) * 2008-03-10 2012-09-11 International Business Machines Corporation Optical transceiver module with optical windows
JP5063430B2 (ja) * 2008-03-25 2012-10-31 新光電気工業株式会社 光伝送機構を備えたモジュール基板およびその製造方法
US8390083B2 (en) 2009-09-04 2013-03-05 Analog Devices, Inc. System with recessed sensing or processing elements
AT12314U1 (de) * 2009-10-16 2012-03-15 Austria Tech & System Tech Leiterplattenelement und verfahren zur herstellung eines solchen leiterplattenelements
US7949211B1 (en) 2010-02-26 2011-05-24 Corning Incorporated Modular active board subassemblies and printed wiring boards comprising the same
TW201202769A (en) * 2010-07-07 2012-01-16 Nat Univ Tsing Hua Integrated optics for multiplexers transceiver module
US10234545B2 (en) 2010-12-01 2019-03-19 Microsoft Technology Licensing, Llc Light source module
US9064080B2 (en) 2011-01-20 2015-06-23 International Business Machines Corporation Transferring heat through an optical layer of integrated circuitry
DE102011101433A1 (de) 2011-05-10 2012-12-13 Technische Universität Dresden Integrierbares optisches Koppelelement und Verfahren zu seiner Herstellung
GB2502313A (en) * 2012-05-24 2013-11-27 Ibm Manufacturing three dimensional photonic device by two photon absorption polymerization
US9509122B1 (en) 2012-08-29 2016-11-29 Aurrion, Inc. Optical cladding layer design
US9360620B2 (en) * 2012-08-29 2016-06-07 Aurrion, Inc. Thermal management for photonic integrated circuits
US9276335B2 (en) * 2012-12-11 2016-03-01 Advanced Micro Devices, Inc. Double-sided circuit board with opposing modular card connector assemblies
EP2943830A1 (en) 2013-01-11 2015-11-18 Multiphoton Optics Gmbh Optical package and a process for its preparation
FI20135200L (fi) * 2013-03-01 2014-09-02 Tellabs Oy Sähkölaite
US9052597B2 (en) * 2013-04-04 2015-06-09 Humboldt-Universität Zu Berlin Methods and fabrication tools for fabricating optical devices
US9383531B2 (en) * 2013-04-23 2016-07-05 Hon Hai Precision Industry Co., Ltd. Light signal gathering device and optical module used thereof
US9939578B2 (en) * 2013-05-10 2018-04-10 Intel Corporation Low cost integration of optical components in planar lightwave circuits
US9847462B2 (en) 2013-10-29 2017-12-19 Point Engineering Co., Ltd. Array substrate for mounting chip and method for manufacturing the same
AT14563U1 (de) * 2014-03-31 2016-01-15 At&S Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit zumindest einer optoelektronischen Komponente
US9641254B1 (en) 2014-10-10 2017-05-02 Google Inc. Heat dissipation approach in chip on board assembly by using stacked copper microvias
CN106249361B (zh) * 2015-06-05 2019-06-28 胡迪群 嵌入式光纤模块
US9666558B2 (en) 2015-06-29 2017-05-30 Point Engineering Co., Ltd. Substrate for mounting a chip and chip package using the substrate
EP3130950A1 (de) * 2015-08-10 2017-02-15 Multiphoton Optics Gmbh Strahlumlenkelement sowie optisches bauelement mit strahlumlenkelement
US10257932B2 (en) 2016-02-16 2019-04-09 Microsoft Technology Licensing, Llc. Laser diode chip on printed circuit board
DE102016202765A1 (de) * 2016-02-23 2017-08-24 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Schaltkreisanordnung und Verfahren zum Herstellen einer Schaltkreisanordnung
US10141623B2 (en) 2016-10-17 2018-11-27 International Business Machines Corporation Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board
CN108538799B (zh) 2017-03-02 2024-02-27 弗莱克斯有限公司 互连部件和互连组件
US11611004B2 (en) 2017-04-28 2023-03-21 National Institute Of Advanced Industrial Science And Technology Opto-electronic integrated circuit and computing apparatus
US10535845B1 (en) 2017-07-14 2020-01-14 Flex Ltd. Flexible and stretchable chain battery
US10163825B1 (en) * 2017-10-26 2018-12-25 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and manufacturing method thereof
US10426029B1 (en) * 2018-01-18 2019-09-24 Flex Ltd. Micro-pad array to thread flexible attachment
US10687421B1 (en) 2018-04-04 2020-06-16 Flex Ltd. Fabric with woven wire braid
US10575381B1 (en) 2018-06-01 2020-02-25 Flex Ltd. Electroluminescent display on smart textile and interconnect methods
US11557491B2 (en) 2019-10-31 2023-01-17 Nxp B.V. Selective underfill assembly and method therefor
US20220406686A1 (en) * 2021-06-16 2022-12-22 Intel Corporation Glass-based cavity and channels for cooling of embedded dies and 3d integrated modules using package substrates with glass core
US20220404568A1 (en) * 2021-06-17 2022-12-22 Intel Corporation Package with optical waveguide in a glass core
US20230093438A1 (en) * 2021-09-21 2023-03-23 Intel Corporation Glass substrate embedded pic to pic and off-chip photonic communications
US11963291B2 (en) * 2022-04-21 2024-04-16 Nxp B.V. Efficient wave guide transition between package and PCB using solder wall
WO2024173144A1 (en) * 2023-02-16 2024-08-22 Micron Technology, Inc. Solder mask fault fiber optics sensor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4762381A (en) * 1986-01-29 1988-08-09 Sumitomo Electric Industries, Ltd. Optical element integrated optical waveguide and production of the same
US20020081056A1 (en) * 2000-10-30 2002-06-27 Kyocera Corporation Optical integrated circuit substrate and optical module
EP1219994A2 (en) * 2000-12-28 2002-07-03 Canon Kabushiki Kaisha Semiconductor device, optoelectronic board, and production methods therefor

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5749288A (en) * 1980-09-09 1982-03-23 Toshiba Corp Photo hybrid integrated circuit
US4666236A (en) * 1982-08-10 1987-05-19 Omron Tateisi Electronics Co. Optical coupling device and method of producing same
US5292620A (en) * 1988-01-15 1994-03-08 E. I. Du Pont De Nemours And Company Optical waveguide devices, elements for making the devices and methods of making the devices and elements
US5255070A (en) * 1989-07-20 1993-10-19 Pollak Fred H Method for determining interface properties of semiconductor materials by photoreflectance
DE69013165T2 (de) * 1989-12-26 1995-02-16 Allied Signal Inc Verfahren zur herstellung von optisch aktiven wellenleitern.
US5195154A (en) * 1990-04-27 1993-03-16 Ngk Insulators, Ltd. Optical surface mount technology (o-smt), optical surface mount circuit (o-smc), opto-electronic printed wiring board (oe-pwb), opto-electronic surface mount device (oe-smd), and methods of fabricating opto-electronic printed wiring board
US5367588A (en) * 1992-10-29 1994-11-22 Her Majesty The Queen In Right Of Canada, As Represented By The Minister Of Communications Method of fabricating Bragg gratings using a silica glass phase grating mask and mask used by same
JPH06337320A (ja) * 1993-05-27 1994-12-06 Agency Of Ind Science & Technol 光導波路作製法および装置
DE19746508A1 (de) * 1997-10-22 1999-04-29 Daimler Chrysler Ag Anordnung und Verfahren zur Herstellung von Wellenleiterstrukturen mit optischen Komponenten
US6343171B1 (en) * 1998-10-09 2002-01-29 Fujitsu Limited Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making
US6684007B2 (en) 1998-10-09 2004-01-27 Fujitsu Limited Optical coupling structures and the fabrication processes
US6845184B1 (en) * 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
JP2000249873A (ja) * 1999-02-25 2000-09-14 Sony Corp 電子回路一体型光伝送モジュール及びその製造方法
US6477284B1 (en) * 1999-06-14 2002-11-05 Nec Corporation Photo-electric combined substrate, optical waveguide and manufacturing process therefor
AU7885900A (en) 1999-08-27 2001-03-26 Board Of Regents, The University Of Texas System Packaging enhanced board level opto-electronic interconnects
JP4965052B2 (ja) * 2000-06-15 2012-07-04 スリーエム イノベイティブ プロパティズ カンパニー ３次元光学素子の加工方法
KR100810547B1 (ko) 2000-06-15 2008-03-18 쓰리엠 이노베이티브 프로퍼티즈 캄파니 캡슐화 광학 부재의 제작방법, 광학소자 및 이의 커플링 방법
JP2002006161A (ja) * 2000-06-19 2002-01-09 Sony Corp 光配線基板および光配線モジュール並びにそれらの製造方法
US6788847B2 (en) * 2001-04-05 2004-09-07 Luxtera, Inc. Photonic input/output port
JP4284889B2 (ja) * 2001-05-28 2009-06-24 パナソニック電工株式会社 光導波路、光配線板、電気・光混載回路基板及び光導波路の製造方法
JP2003131058A (ja) * 2001-08-09 2003-05-08 Kanegafuchi Chem Ind Co Ltd 光導波路および光導波路の作製方法。
JP3768450B2 (ja) * 2002-02-14 2006-04-19 株式会社フジクラ 光導波路部品の製造方法
JP2003315608A (ja) * 2002-04-23 2003-11-06 Matsushita Electric Works Ltd 光部品接合部の光伝送路の結合方法
TWI294262B (en) * 2002-06-28 2008-03-01 Matsushita Electric Industrial Co Ltd A light reception/emission device built-in module with optical and electrical wiring combined therein and method of making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4762381A (en) * 1986-01-29 1988-08-09 Sumitomo Electric Industries, Ltd. Optical element integrated optical waveguide and production of the same
US20020081056A1 (en) * 2000-10-30 2002-06-27 Kyocera Corporation Optical integrated circuit substrate and optical module
EP1219994A2 (en) * 2000-12-28 2002-07-03 Canon Kabushiki Kaisha Semiconductor device, optoelectronic board, and production methods therefor

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007007355A1 (de) * 2007-02-14 2008-08-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung optischer Verbindungen und optische Anordnung
DE102007007355B4 (de) * 2007-02-14 2016-01-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung optischer Verbindungen und optische Anordnung
AT505166B1 (de) * 2008-01-16 2008-11-15 Austria Tech & System Tech Verfahren und vorrichtung zum erzeugen eines licht-wellenleiters in einem leiterplattenelement
WO2012048359A1 (de) 2010-10-14 2012-04-19 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Optischer evaneszenzfeldsensor
AT12749U1 (de) * 2011-04-01 2012-10-15 Austria Tech & System Tech Leiterplattenelement mit wenigstens einer led
EP3599541A1 (en) * 2018-07-26 2020-01-29 University of Vienna Optical waveguide light emitter and touchscreen
WO2020021037A1 (en) * 2018-07-26 2020-01-30 University Of Vienna Optical waveguide light emitter and touchscreen

Also Published As

Publication number Publication date
KR20060131816A (ko) 2006-12-20
EP2309294A3 (de) 2011-08-17
EP2309294A2 (de) 2011-04-13
ATA20962003A (de) 2005-10-15
JP2007517248A (ja) 2007-06-28
CA2551654A1 (en) 2005-07-14
KR101122442B1 (ko) 2012-03-09
EP1706770A1 (de) 2006-10-04
US20080044127A1 (en) 2008-02-21
WO2005064381A1 (de) 2005-07-14

Similar Documents

Publication Publication Date Title
AT413891B (de) Leiterplattenelement mit wenigstens einem licht-wellenleiter sowie verfahren zur herstellung eines solchen leiterplattenelements
AT505834B1 (de) Leiterplattenelement
EP2016449B1 (de) Verfahren zur herstellung eines optoelektronischen bauelements
AT503585B1 (de) Leiterplattenelement sowie verfahren zu dessen herstellung
DE102004064081B4 (de) Gehäuse für einen optischen Empfänger
DE112016007062B4 (de) Halbleitergehäuse mit eingebettetem optischem Die, sowie Verfahren und elekronisches Bauelement
DE112015006339T5 (de) Optisches Übertragungsmodul, Endoskop und Verfahren zur Herstellung eines optischen Übertragungsmoduls
DE19523580A1 (de) Geformte optische Zwischenverbindung
DE19838519A1 (de) Leiterplatte und Verfahren zur Herstellung
DE69935129T2 (de) Ein verfahren zur herstellung von spiegeln in polymerwellenleitern
DE68929527T2 (de) Optische Übertragungsvorrichtung
AT14563U1 (de) Verfahren zur Herstellung einer Leiterplatte mit zumindest einer optoelektronischen Komponente
WO2011044606A1 (de) Leiterplattenelement und verfahren zur herstellung eines solchen leiterplattenelements
DE102009023071A1 (de) Mikrooptisches Koppelelement mit integrierten optischen Wellenleitern
DE102023100663A1 (de) Komponententräger mit Stapel und optisch transparentem Körper zum Leiten von Licht
DE10319900A1 (de) Optoelektronische Sende- und/oder Empfangsanordnung
DE102004016480B4 (de) Vollintegrierte hybride optisch-elektrische Leiterplatte
Houbertz et al. Optical waveguides embedded in PCBs-a real world application of 3D structures written by TPA
DE10160508A1 (de) Anordnung zur Detektion von optischen Signalen mindestens eines optischen Kanals eines planaren optischen Schaltkreises und/oder zur Einkopplung optischer Signale in mindestens einen optischen Kanal eines planaren optischen Schaltkreises
DE102006059613B4 (de) Optoelektronische Baugruppe, Verfahren zu deren Herstellung und optoelektronische Sende- und/oder Empfangsanordnung
DE10106623C2 (de) Optische Signalübertragungsvorrichtung
Baharudin et al. Optical Coupling Device by UV-Curable Resin for Optical Printed Wiring Board
DE29624438U1 (de) Optische Baugruppe zur Ankopplung eines Lichtwellenleiters

Legal Events

Date Code Title Description
MM01 Lapse because of not paying annual fees

Effective date: 20211015