AR000962A1 - Una maquina de ensamble - Google Patents

Una maquina de ensamble

Info

Publication number
AR000962A1
AR000962A1 ARP960101398A AR10139896A AR000962A1 AR 000962 A1 AR000962 A1 AR 000962A1 AR P960101398 A ARP960101398 A AR P960101398A AR 10139896 A AR10139896 A AR 10139896A AR 000962 A1 AR000962 A1 AR 000962A1
Authority
AR
Argentina
Prior art keywords
assembly machine
perform
component
operations
feeder
Prior art date
Application number
ARP960101398A
Other languages
English (en)
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AR000962A1 publication Critical patent/AR000962A1/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0857—Product-specific machine setup; Changeover of machines or assembly lines to new product type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)

Abstract

Una máquina de ensamble (10) que tiene una pluralidad de ranuras (22) cada una de las cuales mantiene un alimentador (24) conteniendo un carrete decomponente (30). La máquina de ensamble automáticamente ensambla un producto, como una plaqueta dec ircuito, desde sus componentes o partes. Cuando unaalteración ocurre la máquina de ensamble determina cual de sus componentes necesita ser agregado (104), cual necesita ser removido, y cual puede sermovido (106). La máquina de ensamble (10)lueg o instruye a un operador para primero realizar todas la operaciones de remoción, luego realizar todas lasoperaciones de mover, y por último para realizar todas las operaciones de agregar. Una combinación de exploración de unaidentificación de un componente(32) y de una identificación de alimentador (34) que verifica el componente correcto es ubicada en el carrete apropiado (30). Se verifica la ubicación delcarrete (30) entre las ranuras (22) por medio de un sensorde proximidad (2 8).
ARP960101398A 1995-02-15 1996-02-15 Una maquina de ensamble AR000962A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/388,775 US5553376A (en) 1995-02-15 1995-02-15 Method of and apparatus for changing a production setup

Publications (1)

Publication Number Publication Date
AR000962A1 true AR000962A1 (es) 1997-08-27

Family

ID=23535461

Family Applications (1)

Application Number Title Priority Date Filing Date
ARP960101398A AR000962A1 (es) 1995-02-15 1996-02-15 Una maquina de ensamble

Country Status (8)

Country Link
US (1) US5553376A (es)
CN (1) CN1081884C (es)
AR (1) AR000962A1 (es)
BR (1) BR9600723A (es)
CA (1) CA2168082C (es)
DE (1) DE19605489C2 (es)
GB (1) GB2298085B (es)
SG (1) SG64859A1 (es)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3404431B2 (ja) * 1994-07-04 2003-05-06 富士機械製造株式会社 電子部品供給カートリッジおよび電子部品供給取出装置
US5873691A (en) * 1995-05-11 1999-02-23 Fuji Machine Mfg. Co., Ltd. Electronic-component supplying system
JPH0955599A (ja) * 1995-08-12 1997-02-25 Denso Corp 電子部品装着装置
US6077022A (en) * 1997-02-18 2000-06-20 Zevatech Trading Ag Placement machine and a method to control a placement machine
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
DE59811823D1 (de) * 1997-09-05 2004-09-23 Esec Trading Sa Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat
US6027019A (en) * 1997-09-10 2000-02-22 Kou; Yuen-Foo Michael Component feeder configuration monitoring
US5925835A (en) * 1997-10-13 1999-07-20 Motorola, Inc. Method of and apparatus for testing a nozzle of a pick-and-place system
DE59711263D1 (de) 1997-10-30 2004-03-04 Esec Trading Sa Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial
TW424027B (en) * 1998-01-15 2001-03-01 Esec Sa Method of making wire connections of predetermined shaped
EP0937530A1 (de) * 1998-02-19 1999-08-25 ESEC Management SA Verfahren zum Herstellen von Drahtverbindungen an Halbleiterchips
GB9811069D0 (en) * 1998-05-23 1998-07-22 Ncr Int Inc Modular self service terminal
KR20000003363A (en) * 1998-06-27 2000-01-15 Daewoo Electronics Co Ltd Method of path building using the path of prior model
JP2000123657A (ja) 1998-10-14 2000-04-28 Yazaki Corp 自動切断圧着装置
JP4486259B2 (ja) * 1998-12-22 2010-06-23 マイデータ オートメーション アクチボラグ 部品テープ情報を部品取付機に移転する方法および手段
DE19944290C2 (de) * 1999-09-15 2002-01-31 Siemens Ag Vorrichtung zum Zuführen von elektronischen Bauteilen mit Maßnahmen gegen Fehl-bestückung
US6778878B1 (en) 2000-11-27 2004-08-17 Accu-Assembly Incorporated Monitoring electronic component holders
US6788987B2 (en) * 2001-03-07 2004-09-07 Siemens Electronic Assembly Systems, Inc. System and processes for performing quick changeovers on assembly lines
EP1253818A1 (en) * 2001-04-23 2002-10-30 TraceXpert A/S Component control in a placement machine
US6662966B2 (en) 2001-06-28 2003-12-16 Smtc Corporation Surface mount manufacturing storage system
DE50202469D1 (de) * 2001-10-05 2005-04-21 Komax Holding Ag Dierikon Verfahren und Einrichtung zur Bestückung von Steckergehäusen mit konfektionierten Kabelenden eines Kabels
US6817216B2 (en) * 2002-08-22 2004-11-16 Accu-Assembly Incorporated Electronic component placement
US6879869B2 (en) * 2003-03-28 2005-04-12 Accu-Assembly Incorporated Placement of electronic components
WO2005020656A2 (en) * 2003-08-26 2005-03-03 Matsushita Electric Industrial Co., Ltd. Component verification method
US7089074B2 (en) * 2004-11-10 2006-08-08 Universal Instruments Corporation Host feeder setup validation
NL1029247C2 (nl) * 2005-06-14 2006-12-18 Assembleon Nv Werkwijze voor het instellen van ten minste een optionele instelling van een verwerkingseigenschap van de componentplaatsingsinrichting alsmede een dergelijke componentplaatsingsinrichting en elektronische sleutel.
JP4803152B2 (ja) * 2007-10-09 2011-10-26 パナソニック株式会社 電子部品実装システムおよび電子部品実装システムにおける操作指示方法
WO2009062524A1 (de) * 2007-11-12 2009-05-22 Siemens Electronics Assembly Systems Pte. Ltd. Verfahren zum rüsten einer bestückvorrichtung
US8269973B2 (en) * 2009-05-13 2012-09-18 Accu-Assembly Incorporated Detecting component carrier tape splicing
JP5293705B2 (ja) 2010-08-30 2013-09-18 富士通株式会社 部品管理装置、段替え支援方法、段替え支援プログラム、部品管理システム及び基板ユニットの製造方法
EP2827692B1 (en) * 2012-03-13 2018-07-18 Fuji Machine Mfg. Co., Ltd. Component mounting device feeder management system
JP6176837B2 (ja) * 2013-05-28 2017-08-09 富士機械製造株式会社 部品実装機及び生産ラインのフィーダセット確認システム
JP5982649B2 (ja) * 2013-08-05 2016-08-31 パナソニックＩｐマネジメント株式会社 部品実装方法および部品実装装置
WO2015138806A1 (en) * 2014-03-12 2015-09-17 Edo Segal A system and method for constructing 3d objects
CN104289832A (zh) * 2014-08-25 2015-01-21 福州果核电子科技有限公司 一种对元器件的焊接位置进行精确指示的方法和工作台
JP7082063B2 (ja) * 2016-12-12 2022-06-07 株式会社Fuji テープフィーダ段取システム
JP6766269B2 (ja) * 2017-08-22 2020-10-07 株式会社Ｆｕｊｉ 情報処理装置、実装システム及び情報処理方法
CN109062186B (zh) * 2018-08-13 2021-03-05 武汉楚冠捷汽车科技有限公司 一种独立式ecu控制器全自动组装测试生产线
JP7070713B2 (ja) * 2018-12-28 2022-05-18 富士通株式会社 情報処理装置、段取り作業修正方法、および段取り作業修正プログラム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0620910B2 (ja) * 1987-04-20 1994-03-23 株式会社村田製作所 電子部品チツプ収納カセツト
JP2823215B2 (ja) * 1989-01-31 1998-11-11 三洋電機株式会社 電子部品供給装置
JPH03149145A (ja) * 1989-11-06 1991-06-25 Oki Electric Ind Co Ltd 部品供給システムの部品変更段取り方法
US5400497A (en) * 1990-10-29 1995-03-28 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting apparatus having memory equipped parts supply device
JPH056212A (ja) * 1991-06-27 1993-01-14 Mitsubishi Electric Corp 部品搭載機用データ作成方法
JP2647309B2 (ja) * 1992-08-12 1997-08-27 株式会社東芝 半導体装置の製造装置
US5283943A (en) * 1992-08-31 1994-02-08 Kermit Aguayo Automated assembly apparatus
JP3149145B2 (ja) * 1993-02-02 2001-03-26 カネボウ株式会社 極低温材料補強用ガラス繊維織物の製造方法
US5466117A (en) * 1993-06-10 1995-11-14 Xilinx, Inc. Device and method for programming multiple arrays of semiconductor devices

Also Published As

Publication number Publication date
GB2298085B (en) 1999-02-24
DE19605489C2 (de) 1999-07-22
US5553376A (en) 1996-09-10
MX9600616A (es) 1997-10-31
DE19605489A1 (de) 1996-09-19
CN1138818A (zh) 1996-12-25
CA2168082A1 (en) 1996-08-16
GB2298085A (en) 1996-08-21
GB9603173D0 (en) 1996-04-17
CA2168082C (en) 2000-05-02
BR9600723A (pt) 1997-12-30
SG64859A1 (en) 1999-05-25
CN1081884C (zh) 2002-03-27

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