DE69102995D1 - Yag-laserbearbeitungsmaschine zur bearbeitung von dünnschichten. - Google Patents
Yag-laserbearbeitungsmaschine zur bearbeitung von dünnschichten.Info
- Publication number
- DE69102995D1 DE69102995D1 DE69102995T DE69102995T DE69102995D1 DE 69102995 D1 DE69102995 D1 DE 69102995D1 DE 69102995 T DE69102995 T DE 69102995T DE 69102995 T DE69102995 T DE 69102995T DE 69102995 D1 DE69102995 D1 DE 69102995D1
- Authority
- DE
- Germany
- Prior art keywords
- thin film
- yag laser
- laser processing
- processing machine
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2201381A JPH0489187A (ja) | 1990-07-31 | 1990-07-31 | レーザ加工機におけるレーザ光の制御方法 |
JP2414117A JPH04351280A (ja) | 1990-12-26 | 1990-12-26 | 薄膜精密加工用のyagレーザ加工機 |
JP2414118A JP2677711B2 (ja) | 1990-12-26 | 1990-12-26 | 薄膜精密加工用のyagレーザ加工機 |
PCT/JP1991/001018 WO1992002331A1 (en) | 1990-07-31 | 1991-07-30 | Yag laser working machine for precision working of thin film |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69102995D1 true DE69102995D1 (de) | 1994-08-25 |
DE69102995T2 DE69102995T2 (de) | 1994-10-27 |
Family
ID=27327936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69102995T Expired - Fee Related DE69102995T2 (de) | 1990-07-31 | 1991-07-30 | Yag-laserbearbeitungsmaschine zur bearbeitung von dünnschichten. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5227607A (de) |
EP (1) | EP0513359B1 (de) |
KR (1) | KR100235340B1 (de) |
DE (1) | DE69102995T2 (de) |
WO (1) | WO1992002331A1 (de) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3293136B2 (ja) * | 1993-06-04 | 2002-06-17 | セイコーエプソン株式会社 | レーザ加工装置及びレーザ加工方法 |
US5611946A (en) * | 1994-02-18 | 1997-03-18 | New Wave Research | Multi-wavelength laser system, probe station and laser cutter system using the same |
JP3179963B2 (ja) * | 1994-04-26 | 2001-06-25 | 松下電器産業株式会社 | レーザ加工装置とレーザ加工方法 |
JP2682475B2 (ja) * | 1994-11-17 | 1997-11-26 | 日本電気株式会社 | ビームスキャン式レーザマーキング方法および装置 |
US5932119A (en) * | 1996-01-05 | 1999-08-03 | Lazare Kaplan International, Inc. | Laser marking system |
JP3213882B2 (ja) * | 1997-03-21 | 2001-10-02 | 住友重機械工業株式会社 | レーザ加工装置及び加工方法 |
ES2142268B1 (es) * | 1998-02-19 | 2000-11-16 | Univ Vigo | Procesamiento de pizarra mediante laser. |
DE19840926B4 (de) * | 1998-09-08 | 2013-07-11 | Hell Gravure Systems Gmbh & Co. Kg | Anordnung zur Materialbearbeitung mittels Laserstrahlen und deren Verwendung |
US6324195B1 (en) * | 1999-01-13 | 2001-11-27 | Kaneka Corporation | Laser processing of a thin film |
US20090168111A9 (en) * | 1999-09-01 | 2009-07-02 | Hell Gravure Systems Gmbh | Printing form processing with fine and coarse engraving tool processing tracks |
JP3855684B2 (ja) * | 2001-06-05 | 2006-12-13 | 松下電器産業株式会社 | レーザ加工装置およびレーザ加工方法 |
US6844523B2 (en) * | 2001-09-07 | 2005-01-18 | Semiconductor Energy Laboratory Co., Ltd. | Laser apparatus, laser irradiation method, manufacturing method for a semiconductor device, semiconductor device and electronic equipment |
US7589032B2 (en) * | 2001-09-10 | 2009-09-15 | Semiconductor Energy Laboratory Co., Ltd. | Laser apparatus, laser irradiation method, semiconductor manufacturing method, semiconductor device, and electronic equipment |
US20060279793A1 (en) * | 2004-07-30 | 2006-12-14 | Hell Gravure Systems Gmbh | Printing form processing with a plurality of engraving tool tracks forming lines |
CN1954954A (zh) * | 2005-10-27 | 2007-05-02 | 鸿富锦精密工业(深圳)有限公司 | 模具加工装置 |
US8319145B2 (en) * | 2006-07-10 | 2012-11-27 | Lazare Kaplan International, Inc. | System and method for gemstone micro-inscription |
JP5620669B2 (ja) * | 2009-10-26 | 2014-11-05 | 東芝機械株式会社 | レーザダイシング方法およびレーザダイシング装置 |
JP5452247B2 (ja) * | 2010-01-21 | 2014-03-26 | 東芝機械株式会社 | レーザダイシング装置 |
JP5981094B2 (ja) | 2010-06-24 | 2016-08-31 | 東芝機械株式会社 | ダイシング方法 |
KR101235557B1 (ko) * | 2010-10-12 | 2013-02-28 | (주)룩스이엔지 | 복수의 레이저를 이용한 도광판 가공장치 |
JP5756626B2 (ja) * | 2010-12-23 | 2015-07-29 | 日本車輌製造株式会社 | レーザ加工機 |
JP5140198B1 (ja) | 2011-07-27 | 2013-02-06 | 東芝機械株式会社 | レーザダイシング方法 |
JP2014011358A (ja) | 2012-06-29 | 2014-01-20 | Toshiba Mach Co Ltd | レーザダイシング方法 |
DE102015206341A1 (de) * | 2015-04-09 | 2016-10-13 | Sirona Dental Systems Gmbh | Verfahren und ein Vermessungssystem zur optischen Vermessung eines Objekts |
TWI686256B (zh) * | 2018-04-13 | 2020-03-01 | 財團法人工業技術研究院 | 雷射清潔裝置及方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4752668A (en) * | 1986-04-28 | 1988-06-21 | Rosenfield Michael G | System for laser removal of excess material from a semiconductor wafer |
JPS62270291A (ja) * | 1986-05-20 | 1987-11-24 | Mitsubishi Electric Corp | レ−ザ加工機におけるリアルタイム制御装置 |
JPS63154280A (ja) * | 1986-12-17 | 1988-06-27 | Fuji Electric Corp Res & Dev Ltd | レ−ザ加工装置 |
US5095190A (en) * | 1987-03-03 | 1992-03-10 | Canon Kabushiki Kaisha | Exposure apparatus |
JPH0796159B2 (ja) * | 1987-09-28 | 1995-10-18 | 松下電器産業株式会社 | レーザトリミング装置 |
US4843209A (en) * | 1987-11-05 | 1989-06-27 | Dennis T. Grendahl | Method and apparatus for laser staking |
US5140128A (en) * | 1990-05-03 | 1992-08-18 | General Electric Company | Method and system for providing elements of composite objects |
FR2752380B1 (fr) * | 1996-08-14 | 1998-10-30 | Dow Corning Sa | Procede de fabrication d'un dispositif a liberation controlee |
-
1991
- 1991-07-30 WO PCT/JP1991/001018 patent/WO1992002331A1/ja active IP Right Grant
- 1991-07-30 KR KR1019920700512A patent/KR100235340B1/ko not_active IP Right Cessation
- 1991-07-30 DE DE69102995T patent/DE69102995T2/de not_active Expired - Fee Related
- 1991-07-30 EP EP91913128A patent/EP0513359B1/de not_active Expired - Lifetime
-
1992
- 1992-03-12 US US07/838,723 patent/US5227607A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO1992002331A1 (en) | 1992-02-20 |
KR100235340B1 (ko) | 1999-12-15 |
US5227607A (en) | 1993-07-13 |
DE69102995T2 (de) | 1994-10-27 |
KR920702269A (ko) | 1992-09-03 |
EP0513359B1 (de) | 1994-07-20 |
EP0513359A4 (en) | 1993-02-24 |
EP0513359A1 (de) | 1992-11-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69102995D1 (de) | Yag-laserbearbeitungsmaschine zur bearbeitung von dünnschichten. | |
DE69111314D1 (de) | Laserschneideverfahren. | |
DE3872512D1 (de) | Kantenbearbeitungsmaschine. | |
DE69117759D1 (de) | Vorrichtung zur zusammensetzung von hologrammen | |
DE69022469D1 (de) | Zitter-Bildverarbeitungsmethode. | |
DE68926014D1 (de) | Laserbearbeitungsverfahren | |
DE69005722D1 (de) | Biorientierter Film. | |
DE69008386D1 (de) | Dünnschichttransistor. | |
DE69021799D1 (de) | Druckfilm. | |
DE3676906D1 (de) | Laserbearbeitungsverfahren. | |
NO911662D0 (no) | Gjennomfoeringsbeholder for skraarigg. | |
DE3764783D1 (de) | Laserapparat. | |
DE69017503D1 (de) | Film zum Laminieren von Klichees. | |
DE69115464D1 (de) | Laserstrahlbearbeitungsverfahren | |
DE3889831D1 (de) | Laser-Apparat. | |
DE69112237D1 (de) | Laserabtastgerät. | |
FI904041A0 (fi) | Garantitillslutning foer behaollare och sprutpressverktyg foer framstaellning av tillslutningen. | |
DE59005689D1 (de) | Schälmaschine. | |
DE69013497D1 (de) | Vorrichtung zum beschichten von papierbahnen. | |
IT8020769V0 (it) | Metodo e macchina per posizionare pellicole su fogli di base. | |
DE59001100D1 (de) | Laserbearbeitungsvorrichtung. | |
DE69104019D1 (de) | Laser-Vielfachanordnungen. | |
DE69203641D1 (de) | Linsenrandschleifmaschine. | |
DE69003780D1 (de) | Laserquelle. | |
DE3575117D1 (de) | Folienschneidemaschine. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: FINE MACHINING CORP., TOKIO/TOKYO, JP JVF INC., GE |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: INNOTECH CORP., YOKOHAMA, KANAGAWA, JP |
|
8339 | Ceased/non-payment of the annual fee |