BR9600723A - Processo para mudar uma mesa de peças e processo de verificação do local ou ranhura de uma pluralidade de componentes - Google Patents

Processo para mudar uma mesa de peças e processo de verificação do local ou ranhura de uma pluralidade de componentes

Info

Publication number
BR9600723A
BR9600723A BR9600723A BR9600723A BR9600723A BR 9600723 A BR9600723 A BR 9600723A BR 9600723 A BR9600723 A BR 9600723A BR 9600723 A BR9600723 A BR 9600723A BR 9600723 A BR9600723 A BR 9600723A
Authority
BR
Brazil
Prior art keywords
checking
changing
location
groove
components
Prior art date
Application number
BR9600723A
Other languages
English (en)
Inventor
Ranvir S Solanki
Eric J Gasmann
Joseph R Kane
Edward P Griffin
Andrew M Gantt
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of BR9600723A publication Critical patent/BR9600723A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0857—Product-specific machine setup; Changeover of machines or assembly lines to new product type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
BR9600723A 1995-02-15 1996-02-14 Processo para mudar uma mesa de peças e processo de verificação do local ou ranhura de uma pluralidade de componentes BR9600723A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/388,775 US5553376A (en) 1995-02-15 1995-02-15 Method of and apparatus for changing a production setup

Publications (1)

Publication Number Publication Date
BR9600723A true BR9600723A (pt) 1997-12-30

Family

ID=23535461

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9600723A BR9600723A (pt) 1995-02-15 1996-02-14 Processo para mudar uma mesa de peças e processo de verificação do local ou ranhura de uma pluralidade de componentes

Country Status (8)

Country Link
US (1) US5553376A (pt)
CN (1) CN1081884C (pt)
AR (1) AR000962A1 (pt)
BR (1) BR9600723A (pt)
CA (1) CA2168082C (pt)
DE (1) DE19605489C2 (pt)
GB (1) GB2298085B (pt)
SG (1) SG64859A1 (pt)

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JP3404431B2 (ja) * 1994-07-04 2003-05-06 富士機械製造株式会社 電子部品供給カートリッジおよび電子部品供給取出装置
US5873691A (en) * 1995-05-11 1999-02-23 Fuji Machine Mfg. Co., Ltd. Electronic-component supplying system
JPH0955599A (ja) * 1995-08-12 1997-02-25 Denso Corp 電子部品装着装置
US6157870A (en) * 1997-02-18 2000-12-05 Zevatech Trading Ag Apparatus supplying components to a placement machine with splice sensor
US6077022A (en) * 1997-02-18 2000-06-20 Zevatech Trading Ag Placement machine and a method to control a placement machine
EP0901155B1 (de) * 1997-09-05 2004-08-18 ESEC Trading SA Halbleiter-Montageeinrichtung zum Auftragen von Klebstoff auf einem Substrat
US6027019A (en) * 1997-09-10 2000-02-22 Kou; Yuen-Foo Michael Component feeder configuration monitoring
US5925835A (en) * 1997-10-13 1999-07-20 Motorola, Inc. Method of and apparatus for testing a nozzle of a pick-and-place system
EP0913857B1 (de) 1997-10-30 2004-01-28 ESEC Trading SA Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial
TW424027B (en) * 1998-01-15 2001-03-01 Esec Sa Method of making wire connections of predetermined shaped
EP0937530A1 (de) * 1998-02-19 1999-08-25 ESEC Management SA Verfahren zum Herstellen von Drahtverbindungen an Halbleiterchips
GB9811069D0 (en) * 1998-05-23 1998-07-22 Ncr Int Inc Modular self service terminal
KR20000003363A (en) * 1998-06-27 2000-01-15 Daewoo Electronics Co Ltd Method of path building using the path of prior model
JP2000123657A (ja) * 1998-10-14 2000-04-28 Yazaki Corp 自動切断圧着装置
ATE288673T1 (de) * 1998-12-22 2005-02-15 Mydata Automation Ab Verfahren zur übertragung von bauteilträgerband- informationen zu einem bauteil-bestückungsapparat und vorrichtung dafür
DE19944290C2 (de) * 1999-09-15 2002-01-31 Siemens Ag Vorrichtung zum Zuführen von elektronischen Bauteilen mit Maßnahmen gegen Fehl-bestückung
US6778878B1 (en) 2000-11-27 2004-08-17 Accu-Assembly Incorporated Monitoring electronic component holders
US6788987B2 (en) * 2001-03-07 2004-09-07 Siemens Electronic Assembly Systems, Inc. System and processes for performing quick changeovers on assembly lines
EP1253818A1 (en) 2001-04-23 2002-10-30 TraceXpert A/S Component control in a placement machine
US6662966B2 (en) 2001-06-28 2003-12-16 Smtc Corporation Surface mount manufacturing storage system
DE50211928D1 (de) * 2001-10-05 2008-04-30 Komax Holding Ag Verfahren und Einrichtung zur Bestückung von Steckergehäusen mit konfektionierten Kabelenden eines Kabels
US6817216B2 (en) * 2002-08-22 2004-11-16 Accu-Assembly Incorporated Electronic component placement
US6879869B2 (en) * 2003-03-28 2005-04-12 Accu-Assembly Incorporated Placement of electronic components
KR101074253B1 (ko) * 2003-08-26 2011-10-14 파나소닉 주식회사 부품 대조 방법 및 장치
US7089074B2 (en) * 2004-11-10 2006-08-08 Universal Instruments Corporation Host feeder setup validation
NL1029247C2 (nl) * 2005-06-14 2006-12-18 Assembleon Nv Werkwijze voor het instellen van ten minste een optionele instelling van een verwerkingseigenschap van de componentplaatsingsinrichting alsmede een dergelijke componentplaatsingsinrichting en elektronische sleutel.
JP4803152B2 (ja) * 2007-10-09 2011-10-26 パナソニック株式会社 電子部品実装システムおよび電子部品実装システムにおける操作指示方法
CN101855955B (zh) * 2007-11-12 2014-03-19 先进装配系统有限责任两合公司 用于装备装配装置的方法
US8269973B2 (en) * 2009-05-13 2012-09-18 Accu-Assembly Incorporated Detecting component carrier tape splicing
JP5293705B2 (ja) * 2010-08-30 2013-09-18 富士通株式会社 部品管理装置、段替え支援方法、段替え支援プログラム、部品管理システム及び基板ユニットの製造方法
WO2013136440A1 (ja) 2012-03-13 2013-09-19 富士機械製造株式会社 部品実装機のフィーダ管理システム
JP6176837B2 (ja) * 2013-05-28 2017-08-09 富士機械製造株式会社 部品実装機及び生産ラインのフィーダセット確認システム
JP5982649B2 (ja) * 2013-08-05 2016-08-31 パナソニックＩｐマネジメント株式会社 部品実装方法および部品実装装置
US10052858B2 (en) * 2014-03-12 2018-08-21 Edo Segal Interlocking object construction units
CN104289832A (zh) * 2014-08-25 2015-01-21 福州果核电子科技有限公司 一种对元器件的焊接位置进行精确指示的方法和工作台
EP3554205A4 (en) * 2016-12-12 2019-12-25 Fuji Corporation CONFIGURATION SYSTEM FOR TAP FEEDER
WO2019038829A1 (ja) * 2017-08-22 2019-02-28 株式会社Ｆｕｊｉ 情報処理装置、実装システム及び情報処理方法
CN109062186B (zh) * 2018-08-13 2021-03-05 武汉楚冠捷汽车科技有限公司 一种独立式ecu控制器全自动组装测试生产线
JP7070713B2 (ja) * 2018-12-28 2022-05-18 富士通株式会社 情報処理装置、段取り作業修正方法、および段取り作業修正プログラム

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JPH0620910B2 (ja) * 1987-04-20 1994-03-23 株式会社村田製作所 電子部品チツプ収納カセツト
JP2823215B2 (ja) * 1989-01-31 1998-11-11 三洋電機株式会社 電子部品供給装置
JPH03149145A (ja) * 1989-11-06 1991-06-25 Oki Electric Ind Co Ltd 部品供給システムの部品変更段取り方法
US5400497A (en) * 1990-10-29 1995-03-28 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting apparatus having memory equipped parts supply device
JPH056212A (ja) * 1991-06-27 1993-01-14 Mitsubishi Electric Corp 部品搭載機用データ作成方法
JP2647309B2 (ja) * 1992-08-12 1997-08-27 株式会社東芝 半導体装置の製造装置
US5283943A (en) * 1992-08-31 1994-02-08 Kermit Aguayo Automated assembly apparatus
JP3149145B2 (ja) * 1993-02-02 2001-03-26 カネボウ株式会社 極低温材料補強用ガラス繊維織物の製造方法
US5466117A (en) * 1993-06-10 1995-11-14 Xilinx, Inc. Device and method for programming multiple arrays of semiconductor devices

Also Published As

Publication number Publication date
US5553376A (en) 1996-09-10
CA2168082A1 (en) 1996-08-16
MX9600616A (es) 1997-10-31
CA2168082C (en) 2000-05-02
CN1138818A (zh) 1996-12-25
CN1081884C (zh) 2002-03-27
DE19605489C2 (de) 1999-07-22
DE19605489A1 (de) 1996-09-19
GB9603173D0 (en) 1996-04-17
GB2298085A (en) 1996-08-21
GB2298085B (en) 1999-02-24
SG64859A1 (en) 1999-05-25
AR000962A1 (es) 1997-08-27

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Legal Events

Date Code Title Description
FF Decision: intention to grant
FG9A Patent or certificate of addition granted
B25D Requested change of name of applicant approved

Owner name: MOTOROLA SOLUTIONS, INC. (US)

B25A Requested transfer of rights approved

Owner name: MOTOROLA MOBILITY, INC. (US)

B25G Requested change of headquarter approved

Owner name: MOTOROLA MOBILITY, INC. (US)

B25E Requested change of name of applicant rejected

Owner name: MOTOROLA MOBILITY, INC. (US)

Free format text: INDEFERIDA A ALTERACAO DE NOME SOLICITADA ATRAVES DA PETICAO NO 020130025935-RJ, DE 28/03/2013, UMA VEZ QUE NAO FOI PAGA A RESPECTIVA TAXA DE RETRIBUICAO.

B25D Requested change of name of applicant approved

Owner name: MOTOROLA MOBILITY, LLC (US)

B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]

Free format text: PATENTE EXTINTA EM 14/02/2016

B25B Requested transfer of rights rejected

Owner name: MOTOROLA MOBILITY, LLC (US)