WO2025218669A1 - 一种光伏背板加工设备及方法和光伏背板制备方法及设备 - Google Patents
一种光伏背板加工设备及方法和光伏背板制备方法及设备Info
- Publication number
- WO2025218669A1 WO2025218669A1 PCT/CN2025/089087 CN2025089087W WO2025218669A1 WO 2025218669 A1 WO2025218669 A1 WO 2025218669A1 CN 2025089087 W CN2025089087 W CN 2025089087W WO 2025218669 A1 WO2025218669 A1 WO 2025218669A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- conductive layer
- adsorption
- clamping
- photovoltaic
- separated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- a conductive layer needs to be set on one side of the backsheet and an electrically isolated graphic structure needs to be engraved on the conductive layer to avoid short circuits when the photovoltaic backsheet and the solar cells come into contact. After engraving the graphic structure, some areas in the graphic structure of the conductive layer need to be peeled off.
- the complete conductive layer can be bonded to the backplane and hot-pressed, and then a graphic structure can be prepared on the conductive layer.
- the excess area in the graphic structure can be peeled off to obtain a photovoltaic backplane for connection to the solar cell.
- the conductive layer is firmly bonded to the backplane, when the redundant area in the pattern structure of the conductive layer is peeled off, the redundant area is easily broken and difficult to peel off, thereby reducing product quality and production efficiency.
- the preparation process of the conductive backplane includes: first hot pressing the complete metal conductive layer, the adhesive film, and the backplane together, then preparing a graphic structure on the metal conductive layer, and finally peeling off the redundant area in the graphic structure.
- the metal conductive layer is firmly bonded to the backplane, when the excess area in the pattern structure is peeled off, the excess area is easily broken and difficult to peel off.
- the present application provides a photovoltaic backplane processing device and method to solve the problem in the prior art that excess areas in the conductive layer are easily broken and difficult to peel off during partial peeling, thereby reducing product quality and production efficiency.
- an embodiment of the present application provides a photovoltaic backsheet processing device, comprising:
- a carrier having a transmission surface, and a peeling mechanism and a compounding mechanism arranged on the carrier;
- the transport surface of the carrier is used to transport the conductive layer so that the conductive layer passes through the stripping mechanism and the composite mechanism in sequence;
- the stripping mechanism is used to strip the area to be stripped in the conductive layer, and the composite mechanism is used to press the stripped conductive layer and the back plate provided with the adhesive layer.
- a graphic structure is formed on the surface of the conductive layer, and the area to be peeled off is included in the graphic structure; an adsorption device is provided on the transmission surface of the carrier, and the adsorption device is used to adsorb the conductive layer.
- the graphic structure includes: a plurality of regions arranged in parallel along the width direction of the conductive layer, each region including a plurality of spaced sub-regions connected end to end in sequence, the plurality of sub-regions being arranged in a zigzag manner in the region; and the sub-regions of each of the plurality of regions constitute the region to be peeled off;
- first adsorption holes arranged at intervals are provided on the vacuum adsorption carrier at positions corresponding to the outer sides of the long sides of each of the regions, and second adsorption holes arranged at intervals are provided at positions corresponding to positions between at least one group of adjacent sub-regions in each of the regions;
- the size of the second adsorption hole is smaller than that of the first adsorption hole.
- the arrangement direction of the second adsorption holes is perpendicular to the arrangement direction of the first adsorption holes, and the spacing distance between the second adsorption holes is smaller than the spacing distance between the first adsorption holes.
- a minimum distance between an edge of the second adsorption hole and an edge of the area to be peeled off is 0.1 mm to 2 mm.
- an adsorption device is provided on the transmission surface of the carrier, and the adsorption device is used to adsorb the conductive layer;
- the peeling mechanism includes: a turning device and a peeling device;
- the adsorption device moves to the flipping device, and the flipping device flips the adsorption device for the first time by rotating so that the side of the conductive layer facing away from the adsorption device faces the direction of gravity; after the adsorption device is flipped for the first time, the peeling device is located on the side of the conductive layer facing away from the adsorption device;
- the stripping device is used to contact the side of the conductive layer facing away from the adsorption device after the adsorption device is turned over for the first time, so as to separate the area to be stripped from the conductive layer;
- the peeling mechanism further includes:
- the flipping device flips the adsorption device again by rotating, so that the side of the conductive layer facing away from the adsorption device is away from the direction of gravity;
- the transport device is used to grab the back plate with the adhesive layer placed on the loading platform, and stack the side of the back plate with the adhesive layer and the side of the conductive layer facing away from the adsorption device.
- the stripping device includes: a hair dryer;
- the air outlet direction of the hair dryer faces the side of the conductive layer away from the adsorption device; the air outlet width of the hair dryer is greater than or equal to the width of the graphic structure in the conductive layer.
- the stripping device includes: a brush;
- the brush is used to contact the side of the conductive layer facing away from the adsorption device; the width of the brush is greater than or equal to the width of the graphic structure in the conductive layer.
- the stripping device includes: a roller;
- the roller is used to contact the side of the conductive layer facing away from the adsorption device; the width of the roller is greater than or equal to the width of the graphic structure in the conductive layer.
- a flexible contact layer is provided on the surface of the drum;
- the surface of the flexible contact layer is provided with flexible protrusion structures at intervals.
- the photovoltaic backsheet processing equipment further comprises: a loading and cutting device and a laser plate-making device arranged on the carrier;
- the loading and cutting device is located at the loading end of the platform, and the laser platemaking device is located between the loading and cutting device and the peeling mechanism;
- the feeding and cutting device is provided with a conductive layer coil; the feeding and cutting device is used to lead one end of the conductive layer coil to the adsorption device on the transmission surface, and cut to form the conductive layer;
- the laser plate-making device is used to perform laser engraving on the conductive layer it passes through, so as to form the graphic structure on the surface of the conductive layer.
- the adsorption device is a vacuum adsorption carrier
- the vacuum adsorption carrier is provided with adsorption holes.
- the vacuum adsorption carrier adsorbs the conductive layer, the positions of the adsorption holes do not overlap with the to-be-stripped area in the conductive layer.
- the photovoltaic backsheet processing equipment further includes: a visual inspection device and a cleaning device;
- the visual inspection device and the cleaning device are arranged at a position behind the composite mechanism in the carrier;
- the visual inspection device is used to collect and recognize images of the conductive layer and the back plate after lamination
- the cleaning device is used to remove the residue when it is identified that there is residue in the area to be stripped of the conductive layer.
- an embodiment of the present application provides a photovoltaic backsheet processing method, comprising:
- the peeled conductive layer and the back sheet provided with the adhesive layer are pressed together to obtain a photovoltaic back sheet.
- stripping the area to be stripped in the conductive layer includes:
- the stripping device is controlled to contact the side of the conductive layer provided with the pattern structure, so that the area to be stripped in the conductive layer is separated.
- the step of obtaining a conductive layer having a patterned structure on a surface includes:
- the conductive layer is laser-etched to form the pattern structure on the surface of the conductive layer.
- an adsorption device comprising:
- Vacuum adsorption carrier
- First adsorption holes are arranged at intervals along a first direction on the vacuum adsorption carrier, and second adsorption holes are arranged at intervals along a second direction on the vacuum adsorption carrier, the first direction intersects the second direction, and the first adsorption holes and the second adsorption holes have different sizes;
- the present application can first remove the area to be peeled off on the conductive layer, and finally stack the backplane provided with the adhesive layer and the peeled conductive layer and then perform hot pressing to obtain a photovoltaic backplane.
- the embodiment of the present application does not need to first hot press the backplane and the conductive layer before removing the area to be peeled off on the conductive layer. In this way, when removing the area to be peeled off, the inconvenience caused by the strong adhesion between the area to be peeled off and the backplane can be eliminated.
- the peeling is relatively simple, thereby solving the problem in the related art that when peeling off the area to be peeled off, the part of the area to be peeled off is easy to break and difficult to peel off, thereby improving product quality and production efficiency.
- the present application provides a method and device for preparing a photovoltaic backplane, aiming to at least solve the technical problem in the prior art that when peeling off the excess areas in the graphic structure, the excess areas are easily broken and difficult to peel off.
- an embodiment of the present application provides a method for preparing a photovoltaic backsheet, comprising:
- At least a conductive layer having a pattern structure on its surface is obtained, wherein the pattern structure has a portion to be separated, and at least the portion to be separated in the conductive layer is not connected to the backplane;
- the portion to be separated in the conductive layer is separated.
- blowing air onto the portion to be separated in the conductive layer comprises:
- the oscillating blowing component includes a blowing nozzle that can perform periodic reciprocating motion.
- separating the portion to be separated in the conductive layer includes:
- the portion to be separated and the portion to be retained of the conductive layer are moved relative to each other, so as to separate the portion to be separated in the conductive layer.
- the step of causing the portion to be separated and the portion to be retained of the conductive layer to move relative to each other includes:
- the portion to be separated is transported in a direction away from the portion to be retained of the conductive layer.
- the step of obtaining at least a conductive layer having a patterned structure on its surface includes:
- the method further comprises:
- the method before obtaining at least the conductive layer having a patterned structure on the surface, the method includes:
- the step of obtaining at least a conductive layer having a patterned structure on its surface comprises:
- a pattern structure is formed on the surface of the conductive layer.
- an embodiment of the present application provides a photovoltaic backsheet manufacturing device, comprising:
- an air blowing device the air blowing device being used to blow air to a portion of the pattern structure in the conductive layer that needs to be separated, wherein at least the portion of the conductive layer that needs to be separated is not connected to the backplane;
- a separation device is used to separate the part to be separated from the conductive layer.
- the blowing device includes an oscillating blowing assembly, and the oscillating blowing assembly includes a blowing nozzle that can perform periodic reciprocating motion.
- the distance between the blowing device and the conductive layer is greater than or equal to 55 mm.
- the flow rate of the air flow blown out by the blowing device is greater than or equal to 600 L/min and less than or equal to 750 L/min.
- the photovoltaic backplane preparation equipment further includes a first carrier, which is at least used to absorb the conductive layer, and the conductive layer is located under the first carrier.
- the separation device includes a clamping and separation component, and the clamping and separation component is located below the first carrier;
- the clamping and separating assembly comprises two clamping rollers which are arranged opposite to each other and rotate towards each other.
- the distance between the clamping and separating component and the conductive layer is greater than the length of the finger-shaped conductive part in the graphic structure.
- the clamping and separating assembly further includes an anti-winding mechanism
- the anti-winding mechanism includes two auxiliary rollers and two transmission belts, and a single transmission belt is wound around the auxiliary roller and the clamping roller located on the same side of the clamping and separation component along the arrangement direction of the two clamping rollers.
- the separation device includes a clamping assembly, the clamping assembly is located below the first carrier, and the clamping assembly is used to clamp the portion to be separated from the blown-away conductive layer;
- the separation device further includes a separation driving member, which is used to drive the clamping component to move; and/or the first carrier includes a transmission component, which is used to transmit and absorb the conductive layer.
- the clamping assembly includes a first clamping bar and a second clamping bar;
- the clamping assembly further includes a clamping driving member, which is used to drive the first clamping bar or the second clamping bar to move along the length direction of the first clamping bar;
- the first clamping strip and the second clamping strip are stacked, the first clamping strip is provided with a plurality of clamping grooves along the length direction of the first clamping strip, and the second clamping strip includes a plurality of clamping hooks arranged at intervals along the length direction of the first clamping strip;
- first clamping bar and the second clamping bar respectively include a plurality of first clamping jaws and a plurality of second clamping jaws arranged at intervals along the length direction of the first clamping bar, and the first clamping jaws and the second clamping jaws are arranged alternately along the length direction of the first clamping bar.
- the separation device includes a rolling brush, and the rolling brush is used to contact a side of the conductive layer facing away from the first carrier.
- the photovoltaic backsheet preparation equipment further comprises a local pressing device, wherein the local pressing device is used to locally press the portion of the conductive layer to be retained and the backsheet provided with the adhesive layer;
- the local pressing device includes an upper pressing plate and a lower pressing plate, wherein the upper pressing plate is provided with a first avoidance groove, and/or the lower pressing plate is provided with a second avoidance groove.
- the portion to be separated is not connected to the backsheet, making it easy to blow away and separate the portion to be separated.
- the portion to be separated is not easily broken, which can improve waste removal efficiency and avoid the problem of excess areas in the pattern structure being easily broken and difficult to peel off due to the strong adhesion between the metal conductive layer and the backsheet.
- the width of the portion to be separated can be reduced.
- the resistivity of the photovoltaic backsheet can be reduced, the conductivity of the photovoltaic backsheet can be improved, and the power of the photovoltaic module including the photovoltaic backsheet can be increased.
- FIG3 is a schematic diagram of a process flow of a photovoltaic backsheet manufacturing method according to an embodiment of the present application.
- FIG4 is a schematic cross-sectional view of a peeling mechanism according to an embodiment of the present application.
- FIG5 is a schematic structural diagram of a peeling device according to an embodiment of the present application.
- FIG7 is a schematic structural diagram of another stripping device according to an embodiment of the present application.
- FIG8 is a schematic structural diagram of another adsorption device carrying a conductive layer according to an embodiment of the present application.
- FIG9 is a schematic diagram of a partial structure of an adsorption device carrying a conductive layer according to an embodiment of the present application.
- FIG10 is a schematic diagram of a partial structure of an adsorption device carrying a conductive layer according to an embodiment of the present application
- FIG11 is a flowchart of a method for preparing a photovoltaic backsheet according to an embodiment of the present application.
- FIG12 is a schematic structural diagram of a conductive layer provided in an embodiment of the present application.
- FIG13 is a flowchart of another method for preparing a photovoltaic backsheet according to an embodiment of the present application.
- FIG14 is a flowchart of the steps of another method for preparing a photovoltaic backsheet provided in an embodiment of the present application.
- FIG15 is a first structural diagram of an oscillating blowing assembly and a clamping assembly in a photovoltaic backsheet manufacturing apparatus provided in an embodiment of the present application;
- FIG16 is a second structural diagram of an oscillating blowing assembly and a clamping assembly in a photovoltaic backsheet manufacturing apparatus provided in an embodiment of the present application;
- FIG17 is a third structural diagram of an oscillating blowing assembly and a clamping assembly in a photovoltaic backsheet manufacturing apparatus provided in an embodiment of the present application;
- FIG18 is a partial structural diagram of a first clamping bar and a second clamping bar in another clamping assembly in a photovoltaic backsheet manufacturing device provided in an embodiment of the present application;
- FIG19 is a schematic structural diagram of a first carrier and a conductive layer in a photovoltaic backsheet manufacturing apparatus provided in an embodiment of the present application;
- FIG20 is a schematic structural diagram of a clamping and separating component in a photovoltaic backsheet manufacturing device provided in an embodiment of the present application;
- FIG21 is a schematic structural diagram of another clamping and separating component in the photovoltaic backsheet manufacturing equipment provided in an embodiment of the present application;
- FIG22 is a schematic structural diagram of a roller brush in a photovoltaic backsheet manufacturing device according to an embodiment of the present application.
- FIG23 is a schematic structural diagram of a local pressing device in a photovoltaic backsheet manufacturing apparatus provided in an embodiment of the present application.
- FIG24 is a schematic structural diagram of an upper pressing plate in a local pressing device in a photovoltaic backsheet manufacturing apparatus provided in an embodiment of the present application;
- FIG25 is a schematic structural diagram of a lower pressing plate in a local pressing device in a photovoltaic backsheet manufacturing device provided in an embodiment of the present application;
- FIG26 is a schematic structural diagram of a second carrier and an adsorption cover provided in an embodiment of the present application.
- Figure 27 is a structural schematic diagram of the second carrier and nozzle assembly provided in an embodiment of the present application.
- the present application provides a photovoltaic backplane processing equipment, including: a carrier 10 having a transmission surface A, and a stripping mechanism 20 and a compounding mechanism 30 arranged on the carrier 10; the transmission surface A of the carrier 10 is used to transmit the conductive layer 50, so that the conductive layer 50 passes through the stripping mechanism 20 and the compounding mechanism 30 in sequence.
- an adsorption device 40 is provided on the transmission surface A of the carrier 10.
- the adsorption device 40 is used to adsorb the conductive layer 50 and move on the transmission surface A.
- FIG2 a schematic structural diagram of an adsorption device carrying a conductive layer is shown.
- a graphic structure 51 is formed on the surface of the conductive layer 50.
- the graphic structure 51 has an area to be peeled off (i.e., the area where the traced lines are located, such as the area where the black continuous curved traced lines are located in the conductive layer 50 in FIG2 ); the peeling mechanism 20 is used to peel off the area to be peeled off in the conductive layer 50, and the composite mechanism 30 is used to press the peeled conductive layer 50 and the backing plate 60 provided with an adhesive layer.
- the adhesive layer provided on the backing plate 60 can be formed by coating or other methods, or the backing plate 60 itself is provided with an adhesive layer when it is received, which is not limited here.
- the peeling mechanism 20 can stack the back panel 60 provided with an adhesive layer and the conductive layer 50 that has been peeled off to form a workpiece to be processed, and the adhesive layer is located between the back panel 60 and the conductive layer 50; then the composite mechanism 30 can press the workpiece to be processed to obtain a photovoltaic back panel.
- a conductive layer with a patterned structure is provided on the backplane so that when the backplane contacts the back-contact cell, the backplane can be conductively interconnected with the electrodes on the back of the cell through the patterned structure of the conductive layer.
- the pattern of the graphic structure 51 provided on the conductive layer 50 can be designed based on the electrode structure on the back side of the back-contact battery cell. This pattern is capable of forming an electrically isolated pattern, thereby preventing short circuits during interconnection.
- the specific design of the graphic structure is not specifically limited in this embodiment of the application. After the graphic structure 51 is depicted, any excess areas to be peeled off (the areas indicated by the black continuous curved lines in FIG2 ) need to be peeled off from the conductive layer 50 to form a graphic structure that can be used for subsequent electrical connections.
- the embodiment of the present application can use a complete set of photovoltaic backsheet processing equipment to realize the automated processing of photovoltaic backsheets.
- the carrier 10 of the photovoltaic backsheet processing equipment is used to transport components through the transmission surface A.
- the transmission direction is X.
- the peeling mechanism 20 and the compounding mechanism 30 are arranged in sequence on the carrier 10.
- the transmission surface A is placed with an adsorption device 40.
- the adsorption device 40 can adsorb the conductive layer 50 engraved with a graphic structure 51.
- the graphic structure 51 provided on the conductive layer 50 is provided on the side of the conductive layer 50 facing away from the transmission surface A.
- the conductive layer can be made of a conductive metal.
- the transmission surface A can specifically drive the adsorption device 40 to move along the transmission direction X, and pass through the stripping mechanism 20 and the composite mechanism 30 in sequence.
- the stripping mechanism 20 can strip off and remove the area to be stripped in the graphic structure 51 of the conductive layer 50.
- the stripping mechanism 20 has multiple ways to strip off and remove the area to be stripped: Method 1, the adsorption device 40 carrying the conductive layer 50 with the graphic structure 51 can be flipped 180° so that the side of the conductive layer 50 facing away from the adsorption device 40 faces the direction of gravity, and the area to be stripped is guided to detach based on gravity. Method 2, the stripping mechanism 20 can apply a force to the side of the conductive layer 50 facing away from the adsorption device 40 (such as using a roller or a brush to contact the surface to apply a force), so that the area to be stripped is detached under the force.
- Method 1 the adsorption device 40 carrying the conductive layer 50 with the graphic structure 51 can be flipped 180° so that the side of the conductive layer 50 facing away from the adsorption device 40 faces the direction of gravity, and the area to be stripped is guided to detach based on gravity.
- Method 2 the stripping mechanism 20 can apply a force to the side of the conductive layer 50 facing away from the ad
- the embodiment of the present application provides a photovoltaic backsheet processing method, including:
- Step 101 Obtain a conductive layer having a pattern structure on its surface, wherein the pattern structure has an area to be stripped.
- Step 102 peeling off the area to be peeled off in the conductive layer.
- Step 103 Pressing the peeled conductive layer and the back plate provided with the adhesive layer together.
- step 101 may specifically include:
- Sub-step 1011 drawing out a continuous conductive layer from one end of the conductive layer coil and cutting it to form the conductive layer.
- Sub-step 1012 performing laser engraving on the conductive layer to form the graphic structure on the surface of the conductive layer.
- automatic loading and cutting can be achieved by a loading and cutting device 90.
- a conductive layer coil 91 and a cutter are placed on the loading and cutting device 90.
- One end of the conductive layer coil 91 is led to the adsorption device 40 on the transmission surface A.
- the cutter can be activated to cut off a certain length of the continuous conductive layer, forming a conductive layer 50 adsorbed on the adsorption device 40 for subsequent laser engraving.
- the laser platemaking device 100 has multiple laser generators for releasing laser onto the surface of the conductive layer 50, thereby preparing a graphic structure on the surface of the conductive layer 50 by laser engraving. After laser engraving, some redundant areas will be formed and need to be removed, that is, the areas to be peeled off in the embodiment of the present application.
- step 102 may specifically include:
- Sub-step 1022 controlling the stripping device to contact the side of the conductive layer provided with the pattern structure, so as to separate the remaining area to be stripped from the conductive layer.
- Method 1 involves using a flipping device 21 to flip the adsorption device 40 carrying the conductive layer 50 having the patterned structure 51 180°, such that the side of the conductive layer 50 facing away from the adsorption device 40 faces the direction of gravity, and gravity guides the removal of the area to be peeled.
- Method 2 involves using a peeling device 22 to apply a force to the side of the conductive layer 50 facing away from the adsorption device 40, thereby causing the area to be peeled to be removed.
- Sub-step 1031 stacking the back plate provided with the adhesive layer and the conductive layer that has been peeled off to form a workpiece to be processed; the adhesive layer is located between the back plate and the conductive layer that has been peeled off.
- Sub-step 1032 Pressing the workpiece to be processed.
- one side of the incoming backboard 60 can be covered with an adhesive layer in advance.
- the peeling mechanism 20 can also have a conveying function. Based on the conveying function, the peeling mechanism 20 can convey the backboard 60 covered with the adhesive layer and stack it with the conductive layer 50 that has been peeled off to form a workpiece to be processed. After that, the workpiece to be processed is pressed together by the composite mechanism 30 to obtain a photovoltaic backboard.
- the stripping mechanism 20 can also have a coating function and a conveying function. Based on the coating function, the stripping mechanism 20 can first coat one side of the incoming backboard 60 with an adhesive layer, and then based on the conveying function, convey the backboard 60 covered with the adhesive layer and stack it with the conductive layer 50 that has been peeled off to form a workpiece to be processed. After that, the workpiece to be processed is pressed together by the composite mechanism 30 to obtain a photovoltaic backboard.
- the method further includes:
- Step 104 performing image acquisition and image recognition on the laminated conductive layer and backplane.
- Step 105 When it is identified that there is residue in the area to be stripped of the conductive layer, the residue is removed.
- an operation of detecting the peeling effect of the to-be-peeled region may be performed.
- a small amount of to-be-peeled region residue may still exist in the conductive layer.
- the operation of detecting the peeling effect of the to-be-peeled region is intended to detect and remove the residue in the to-be-peeled region.
- electrical detection can be used to detect residue in the area to be stripped.
- This detection method places two probes on opposite sides of the area to be stripped. If there is residue in the area to be stripped that connects the two opposite sides of the area to be stripped, the two probes will short-circuit. Therefore, detecting a short-circuit indicates the presence of residue in the area to be stripped. However, if the residue is connected to only one side of the area to be stripped, and this residue does not contact the other side, the electrical detection method will not detect the short-circuit, and the residue will be missed.
- the embodiment of the present application can adopt a visual detection method. First, the conductive layer and the back plate after pressing are photographed to obtain a photographed image. Then, the photographed image can be subjected to image recognition to identify the features of the area to be peeled off in the conductive layer. If residue features are found in the area to be peeled off, it is confirmed that the residue has been identified. Then, the residue can be cleaned. The cleaning operation can be performed manually or by machine.
- the embodiment of the present application can also perform residue detection and cleaning operations when the area to be peeled off in the conductive layer is peeled off; it can also perform residue detection and cleaning operations when the area to be peeled off in the conductive layer is peeled off, and perform residue detection and cleaning operations after the peeled conductive layer and the back plate with an adhesive layer are pressed together.
- the method further includes:
- Step 106 Separate the adsorption device from the photovoltaic backsheet, and simultaneously use a backsheet flipping machine to flip the photovoltaic backsheet so that the conductive layer faces upward.
- Step 107 The flipped photovoltaic backsheet is transferred to a punching station, and punched at the busbar lead-out position.
- Step 108 weld the busbars to the conductive layer of the photovoltaic backsheet using a busbar welding machine, a busbar bending machine, and a busbar shaping machine in sequence, and bend and shape the busbars after welding.
- Step 109 hot pressing the photovoltaic backsheet and the insulating film after the busbar welding and bending and shaping to form a final integrated backsheet.
- the embodiment of the present application is based on photovoltaic backplane processing equipment and provides a photovoltaic backplane processing method.
- the area to be peeled off of the conductive layer can be peeled off first, and finally the backplane provided with the adhesive layer and the conductive layer that has been peeled off are laminated and hot pressed to obtain the photovoltaic backplane.
- the embodiment of the present application does not need to first hot-press the backplane and the conductive layer and then remove the area to be peeled off on the conductive layer.
- the embodiment of the present application can eliminate the inconvenience caused by the strong adhesion of the area to be peeled off to the backplane.
- the peeling is relatively simple, thereby solving the problem in the related art that when peeling off the area to be peeled off, part of the area to be peeled off is easy to break and difficult to peel off, thereby improving product quality and production efficiency.
- the peeling mechanism 20 includes: a flipping device 21 and a peeling device 22; the adsorption device 40 moves to the flipping device 21 after adsorbing the conductive layer 50, and the flipping device 21 flips the adsorption device 40 for the first time by rotating, so that the side of the conductive layer 50 facing away from the adsorption device 40 faces the gravity direction Y; after the adsorption device 40 is flipped for the first time, the peeling device 22 is located on the side of the conductive layer 50 facing away from the adsorption device 40; the peeling device 22 is used to contact the side of the conductive layer 50 facing away from the adsorption device 40 after the adsorption device 40 is flipped for the first time, so as to detach the area to be peeled off in the conductive layer 50.
- the peeling mechanism 20 can flip the adsorption device 40 (preferably 180°), so that when the side of the conductive layer 50 facing away from the adsorption device 40 is facing the gravity direction Y, gravity automatically guides at least a portion of the to-be-peeled area of the conductive layer 50 to be removed.
- This peeling method is simple and efficient. It should be noted that under the action of gravity, some or all of the to-be-peeled area of the conductive layer 50 may be removed.
- the embodiment of the present application can also introduce a peeling device 22 to further realize the peeling of the remaining area to be peeled off or the area to be peeled off that has not been removed by gravity, that is, the peeling device 22 can contact and apply a force to the side of the conductive layer 50 facing away from the adsorption device 40, so that the area to be peeled off is detached under the force.
- the peeling mechanism 20 also includes: a transport device 23; after the peeling device 22 is working, the flipping device 21 flips the adsorption device 40 again by rotating, so that the side of the conductive layer 50 facing away from the adsorption device 40 is away from the direction of gravity; after the adsorption device 40 is flipped again, the transport device 23 is used to grab the back panel 60 with an adhesive layer placed on the loading table 70, and stack the side of the back panel 60 with the adhesive layer with the side facing away from the adsorption device.
- the flipping device 21 can rotate and flip the adsorption device 40 again, so that the side of the conductive layer 50 facing away from the adsorption device 40 faces away from the direction of gravity. Then, the transporting device 23 provided in the peeling mechanism 20 can further automatically transport and place the back plate 60.
- the peeling mechanism 20 can be provided with a crossbeam 80, and the transporting device 23 can move on the crossbeam 80.
- the transporting device 23 includes but is not limited to a device with an adsorption function (as shown in Figure 1) or a mechanical claw.
- the transporting device 23 moves on the crossbeam 80 to the position of the loading platform 70 and grabs the back plate 60 with an adhesive layer placed on the loading platform 70. Then, the transporting device 23 moves on the crossbeam 80 to the position of the adsorption device 40 and puts down the grabbed back plate 60, so that the side of the back plate 60 with the adhesive layer contacts the side of the conductive layer 50 facing away from the adsorption device 40, forming a workpiece to be processed. The workpiece to be processed is still adsorbed by the adsorption device 40 and continues to be transported to the composite mechanism 30 via the transmission surface A.
- the peeling device 22 includes: a hair dryer 221; the air outlet direction of the hair dryer 221 faces the side of the conductive layer 50 away from the adsorption device; the air outlet width H1 of the hair dryer 221 is greater than or equal to the width h of the graphic structure 51 in the conductive layer 50; the hair dryer 221 is used to move along the length direction of the conductive layer 50 under drive.
- the stripping device 22 may include a blower 221.
- the blower 211 blows air toward the side of the conductive layer 50 facing away from the adsorption device, thereby applying a force to the area to be stripped in the conductive layer 50, causing the area to fall off.
- the blower 221 has a long strip-shaped air outlet. When driven, the blower 221 moves along the length of the conductive layer 50.
- the air outlet width H1 of the blower 221 is greater than or equal to the width h of the graphic structure 51 in the conductive layer 50.
- the blower 221 can move from one short side of the conductive layer 50 to the other short side, forming a force covering all the graphic structures 51 in the conductive layer 50, ensuring that the force is applied to all the areas to be stripped, thereby removing as many areas to be stripped as possible.
- the stripping device 22 includes: a brush 222; the brush 222 is used to contact the side of the conductive layer 50 facing away from the adsorption device; the width H2 of the brush 222 is greater than or equal to the width h of the graphic structure in the conductive layer 50; the brush 222 is used to move along the length direction of the conductive layer 50 under driving.
- the stripping device 22 may include a brush 222, that is, the brush 222 contacts the side of the conductive layer 50 facing away from the adsorption device, and applies a force to the area to be stripped in the conductive layer 50, so that the area to be stripped falls off.
- the brush 222 moves along the length direction of the conductive layer 50 under the drive, and the width H2 of the brush 222 is greater than or equal to the width h of the graphic structure in the conductive layer 50, that is, it can move from one short side of the conductive layer 50 to the other short side, forming a force covering all the graphic structures 51 in the conductive layer 50, ensuring the application of force to all the areas to be stripped, so as to remove all the areas to be stripped as much as possible.
- the bristles of the brush can be made of soft and elastic bristles, which can exert force without scratching the surface of the conductive layer.
- the peeling device 22 includes: a roller 223; the roller 223 is used to contact the side of the conductive layer 50 facing away from the adsorption device; the width H3 of the roller 223 is greater than or equal to the width h of the graphic structure in the conductive layer 50; the roller 223 is used to move along the length direction of the conductive layer 50 under drive.
- the stripping device 22 may include a roller 223.
- the roller 223 is in rolling contact with the side of the conductive layer 50 facing away from the adsorption device, thereby applying a force to the area to be stripped in the conductive layer 50, causing the area to be stripped to fall off.
- the roller 223 is driven to move along the length of the conductive layer 50.
- the width H3 of the roller 223 is greater than or equal to the width h of the pattern structure in the conductive layer 50.
- the roller 223 can move from one short side of the conductive layer 50 to the other short side, generating a force that covers all the pattern structures 51 in the conductive layer 50, ensuring that the force is applied to all areas to be stripped, thereby removing as many areas as possible.
- a flexible contact layer 224 is provided on the surface of the drum; and flexible protrusion structures 225 are provided on the surface of the flexible contact layer 224 at intervals.
- a flexible contact layer 224 (such as a silicone layer) is provided on the surface of the roller.
- the flexible contact layer 224 can exert a force without scratching the surface of the conductive layer.
- flexible protrusion structures 225 are arranged at intervals on the surface of the flexible contact layer 224, so that the flexible protrusion structure 225 can increase the force applied to the area to be peeled off in the graphic structure 51 without scratching the surface of the conductive layer, thereby further improving the peeling effect of the area to be peeled off.
- the photovoltaic backplane processing equipment also includes: a loading and cutting device 90 and a laser platemaking device 100 arranged on the carrier 10; the loading and cutting device 90 is at the loading end of the carrier 10, and the laser platemaking device 100 is between the loading and cutting device 90 and the peeling mechanism 20; a conductive layer coil 91 is arranged in the loading and cutting device 90; the loading and cutting device 90 is used to lead one end of the conductive layer coil 91 to the adsorption device 40 on the transmission surface A, and cut to form a conductive layer 50; the laser platemaking device 100 is used to laser engrave the passing conductive layer 50 to form a graphic structure on the surface of the conductive layer 50.
- automatic loading and cutting can be achieved through the loading and cutting device 90, and automatic engraving of the graphic structure in the conductive layer 50 can be achieved through the laser platemaking device 100, thereby improving the degree of automation of the overall process and thus improving production efficiency.
- a conductive layer coil 91 and a cutter are placed on the loading and cutting device 90.
- One end of the conductive layer coil 91 is led out to the adsorption device 40 on the transmission surface A.
- the transmission surface A drives the adsorption device 40 to move, more continuous conductive layers are led out from the conductive layer coil 91.
- the cutter can work, thereby cutting off a certain length of the continuous conductive layer, forming a conductive layer 50 adsorbed on the adsorption device 40 for subsequent laser engraving.
- the laser platemaking device 100 has multiple laser generators for releasing laser onto the surface of the conductive layer 50, thereby preparing a graphic structure on the surface of the conductive layer 50 by laser engraving. After laser engraving, some redundant areas will be formed and need to be removed, that is, the areas to be peeled off in the embodiment of the present application.
- the position of the laser platemaking device 100 can be fixed, and the transmission surface A drives the conductive layer 50 to move through the laser platemaking device 100.
- the laser platemaking device 100 works to realize laser engraving.
- the laser platemaking device 100 can be placed on a track so that the position of the laser platemaking device 100 can be moved, and the position of the adsorption device 40 carrying the conductive layer 50 on the transmission surface A can be stationary.
- the laser platemaking device 100 prepares a graphic structure on the surface of the conductive layer 50 by moving, thereby realizing laser engraving. After the preparation is completed, the transmission surface A continues to transmit the adsorption device 40.
- the adsorption device 40 is a vacuum adsorption carrier; the vacuum adsorption carrier is provided with adsorption holes 41.
- the vacuum adsorption carrier adsorbs the conductive layer 50, the position of the adsorption holes 41 (the adsorption holes 41 framed by dotted lines in Figure 2 are perspective structures, that is, the adsorption holes 41 are actually on the surface of the vacuum adsorption carrier) does not overlap with the area to be peeled off in the conductive layer 50.
- the adsorption device 40 is a vacuum adsorption carrier, and a vacuum generating mechanism 42 generates a vacuum adsorption effect, thereby firmly adsorbing the conductive layer 50.
- the vacuum adsorption carrier and the carrier's transmission surface can be fixed to each other using pins, for example, but not limited to this.
- the vacuum adsorption carrier achieves adsorption of the conductive layer 50 through adsorption holes 41, and the position of the adsorption holes 41 does not overlap with the area to be peeled off in the conductive layer 50, thereby avoiding the phenomenon of the area to be peeled off being stuck due to vacuum adsorption.
- the graphic structure 51 includes: a plurality of regions 511 arranged in parallel along the width direction of the conductive layer 50; further referring to FIG9 , each region 511 includes a plurality of spaced sub-regions 5111 connected end to end, the plurality of sub-regions 5111 being arranged in a zigzag pattern within the region 511; the sub-regions 5111 of each of the plurality of regions 511 constitute the region to be peeled; when the vacuum adsorption carrier adsorbs the conductive layer 50, the vacuum adsorption carrier is provided with spaced first adsorption holes 411 at positions outside the long sides of each region 511, and spaced second adsorption holes 412 at positions between at least one group of adjacent sub-regions 5111 in each region; the size of the second adsorption holes 412 is smaller than the size of the first adsorption holes 411.
- the zigzag arrangement may be, for example, an S-shaped arrangement, but
- the arrangement direction of the second adsorption holes 412 is perpendicular to the arrangement direction of the first adsorption holes 411 , and the spacing distance between the second adsorption holes 412 is smaller than the spacing distance between the first adsorption holes 411 .
- the graphic structure 51 may specifically include a plurality of regions 511 arranged in parallel along the width direction of the conductive layer 50.
- Figure 8 shows four laterally spaced regions 511, and each region 511 includes a plurality of vertically spaced sub-regions 5111. Adjacent sub-regions 5111 are connected end to end in sequence, and the connection parts are arc-shaped, so that the multiple sub-regions 5111 in each region 511 are arranged in an S shape (when viewed from above).
- the adsorption holes 41 include: first adsorption holes 411 spaced apart at positions corresponding to the outside of the long sides of each region 511, and second adsorption holes 412 spaced apart at positions corresponding to the positions between at least one group of adjacent sub-regions 5111 in each region.
- the arrangement direction of the first adsorption holes 411 can be perpendicular to the arrangement direction of the second adsorption holes 412, and the size of the second adsorption holes 412 is smaller than that of the first adsorption holes 411. This is because the area of the arrangement region of the first adsorption holes 411 is larger than the area of the arrangement region of the second adsorption holes 412.
- the size of the first adsorption holes 411 can be relatively large, and the gaps between the first adsorption holes 411 can be relatively wide, while the size of the second adsorption holes 412 can be relatively small, and the gaps between the second adsorption holes 412 can be relatively narrow.
- the adsorption holes in different non-peeling areas in different ways, a better adsorption effect can be achieved for the conductive layer after peeling without affecting the peeling of the area to be peeled.
- the minimum distance L between the edge of the second adsorption hole 412 and the edge of the to-be-peeled region is 0.1 mm to 2 mm.
- the position of the second adsorption hole 412 needs to be close to the area to be peeled, but not too close. Therefore, the embodiment of the present application can set the minimum distance L between the edge of the second adsorption hole 412 and the edge of the area to be peeled to 0.1mm to 2mm. In this way, the second adsorption hole 412 can fix the periphery of the area to be peeled as much as possible during adsorption, so as to facilitate the peeling of the area to be peeled; however, the second adsorption hole 412 cannot be too close to the area to be peeled.
- the distance range of 0.1mm to 2mm is adopted to take into account the above two considerations.
- the photovoltaic backplane processing equipment also includes: a visual inspection device and a cleaning device; the visual inspection device and the cleaning device are arranged behind the composite mechanism in the carrier; the visual inspection device is used to perform image acquisition and image recognition on the conductive layer and the backplane after pressing; the cleaning device is used to remove residues when it is identified that there are residues in the area to be peeled off the conductive layer.
- the embodiment of the present application can adopt a visual detection method. First, the conductive layer and the back plate after pressing are photographed by a visual detection device to obtain a photographed image. Then, the photographed image can be subjected to image recognition to identify the features of the area to be peeled off in the conductive layer. If residue features are found in the area to be peeled off, it is confirmed that the residue has been identified. Then, the residue can be removed. The removal operation can be performed manually or by a cleaning device.
- the embodiment of the present application can also perform residue detection and cleaning operations when the area to be peeled off in the conductive layer is peeled off; it can also perform residue detection and cleaning operations when the area to be peeled off in the conductive layer is peeled off, and perform residue detection and cleaning operations after the peeled conductive layer and the back plate with an adhesive layer are pressed together.
- an embodiment of the present application further provides a suction device 40 , comprising: a vacuum suction carrier; further referring to FIG8 , first suction holes 411 are spaced apart along a first direction P on the vacuum suction carrier, and second suction holes 412 are spaced apart along a second direction Q on the vacuum suction carrier.
- the first direction P intersects the second direction Q, and the first suction holes 411 and the second suction holes 412 have different sizes.
- the vacuum suction carrier adsorbs the conductive layer 50, the positions of the first suction holes 411 and the second suction holes 412 do not overlap with the area to be peeled off of the conductive layer 50.
- the first direction P is perpendicular to the second direction Q.
- the adsorption device 40 is a vacuum adsorption carrier, and a vacuum generating mechanism 42 generates a vacuum adsorption effect, thereby firmly adsorbing the conductive layer 50.
- the vacuum adsorption carrier and the carrier's transmission surface can be fixed to each other using, for example, pins.
- the vacuum adsorption carrier achieves better adsorption of the peeled conductive layer 50 by providing adsorption holes of different sizes in two different directions.
- the position of the adsorption holes 41 does not overlap with the area to be peeled in the conductive layer 50, thereby avoiding the phenomenon of the area to be peeled being unable to be detached due to vacuum adsorption.
- the graphic structure 51 includes: a plurality of regions 511 arranged in parallel along the width direction of the conductive layer 50; further referring to FIG9 , each region 511 includes a plurality of spaced sub-regions 5111 connected end to end, the plurality of sub-regions 5111 being arranged in a zigzag pattern within the region 511; the sub-regions 5111 of each of the plurality of regions 511 constitute the region to be peeled; when the vacuum adsorption carrier adsorbs the conductive layer 50, the vacuum adsorption carrier is provided with spaced first adsorption holes 411 at positions outside the long sides of each region 511, and spaced second adsorption holes 412 at positions between at least one group of adjacent sub-regions 5111 in each region; the size of the second adsorption holes 412 is smaller than the size of the first adsorption holes 411.
- the zigzag arrangement may be, for example, an S-shaped arrangement, but
- the arrangement direction of the second adsorption holes 412 is perpendicular to the arrangement direction of the first adsorption holes 411 , and the spacing distance between the second adsorption holes 412 is smaller than the spacing distance between the first adsorption holes 411 .
- the graphic structure 51 may specifically include a plurality of regions 511 arranged in parallel along the width direction of the conductive layer 50.
- Figure 8 shows four laterally spaced regions 511, and each region 511 includes a plurality of vertically spaced sub-regions 5111. Adjacent sub-regions 5111 are connected end to end in sequence, and the connection parts are arc-shaped, so that the multiple sub-regions 5111 in each region 511 are arranged in an S shape (when viewed from above).
- the adsorption holes 41 include: first adsorption holes 411 spaced apart at positions corresponding to the outside of the long sides of each region 511, and second adsorption holes 412 spaced apart at positions corresponding to the positions between at least one group of adjacent sub-regions 5111 in each region.
- the arrangement direction of the first adsorption holes 411 can be perpendicular to the arrangement direction of the second adsorption holes 412, and the size of the second adsorption holes 412 is smaller than that of the first adsorption holes 411. This is because the area of the arrangement region of the first adsorption holes 411 is larger than the area of the arrangement region of the second adsorption holes 412.
- the size of the first adsorption holes 411 can be relatively large, and the gaps between the first adsorption holes 411 can be relatively wide, while the size of the second adsorption holes 412 can be relatively small, and the gaps between the second adsorption holes 412 can be relatively narrow.
- the adsorption holes in different non-peeling areas in different ways, a better adsorption effect can be achieved for the conductive layer after peeling without affecting the peeling of the area to be peeled.
- the minimum distance L between the edge of the second adsorption hole 412 and the edge of the to-be-peeled region is 0.1 mm to 2 mm.
- the position of the second adsorption hole 412 needs to be close to the area to be peeled, but not too close. Therefore, the embodiment of the present application can set the minimum distance L between the edge of the second adsorption hole 412 and the edge of the area to be peeled to 0.1mm to 2mm. In this way, the second adsorption hole 412 can fix the periphery of the area to be peeled as much as possible during adsorption, so as to facilitate the peeling of the area to be peeled; however, the second adsorption hole 412 cannot be too close to the area to be peeled.
- the distance range of 0.1mm to 2mm is adopted to take into account the above two considerations.
- a graphic structure can be prepared on the conductive layer first, and then the area to be peeled off in the graphic structure can be peeled off and removed. Finally, the backplane provided with the adhesive layer is laminated with the peeled conductive layer and then hot-pressed to obtain a photovoltaic backplane.
- the embodiment of the present application does not need to first hot-press the backplane and the conductive layer before preparing the graphic structure on the conductive layer and removing the area to be peeled off. In this way, when removing the area to be peeled off, the inconvenience caused by the strong adhesion between the area to be peeled off and the backplane can be eliminated.
- the peeling is relatively simple, thereby solving the problem in the related art that when peeling off the area to be peeled off, the part of the area to be peeled off is easy to break and difficult to peel off, thereby improving product quality and production efficiency.
- an embodiment of the present application discloses a method for preparing a photovoltaic backsheet, the method comprising:
- Step 101 obtaining at least a conductive layer having a patterned structure on its surface.
- the surface of the conductive layer 1 has a graphic structure, and the graphic structure has a portion 11 to be separated, and at least the portion 11 to be separated in the conductive layer 1 is not connected to the backplane.
- the portion 11 to be separated is also the redundant portion that needs to be removed in the graphic structure.
- the material of the conductive layer 1 is determined specifically based on the material cost and conductivity requirements.
- the material of the conductive layer 1 can be a pure conductive material, or it can be a composite conductive material formed by multiple materials through electroplating, evaporation, chemical plating, etc. Based on cost and conductivity considerations, the thickness of the conductive layer 1 can be 0.01mm-50mm.
- the pattern of the pattern structure in the conductive layer can be designed based on the electrode structure on the back side of the back contact cell. This pattern is capable of forming an electrically isolated pattern, thereby preventing short circuits during interconnection.
- the specific design of the pattern structure is not specifically limited in this embodiment of the application. After the pattern structure is completed, any excess separation portion 11 needs to be separated from the conductive layer to form a pattern structure that can be used for subsequent electrical connections.
- obtaining at least a conductive layer having a patterned surface structure may include: obtaining only a conductive layer having a patterned surface structure.
- obtaining at least a conductive layer having a patterned surface structure may include: obtaining a partially laminated conductive layer, an adhesive layer, and a backplane; and forming a patterned surface structure on the conductive layer.
- Step 102 Blow air to the portion of the conductive layer to be separated.
- the portion 11 of the conductive layer 1 to be separated can be blown with air by a blowing device.
- the airflow from the blowing device can be directed upward.
- the conductive layer 1 can be adsorbed on the first carrier 2, with the conductive layer 1 positioned below the first carrier 2 and the blowing device positioned below the first carrier 2.
- Step 103 Separate the portion to be separated in the conductive layer.
- the portion to be separated in the conductive layer can be separated by a separation device, which can include any one of a clamping component 5 , a clamping and separating component 7 , and a roller brush 4 .
- the photovoltaic backsheet manufacturing process includes a waste removal process, which is the process of removing the portion 11 to be separated from the conductive layer 1.
- the waste removal process can include blowing air into the portion to be separated from the conductive layer 1 and separating the portion 11 to be separated from the conductive layer 1.
- the portion 11 to be separated is typically in the form of a thin, filamentous material and can therefore be referred to as waste material.
- the width of the portion 11 to be separated can range from 0.05 mm to 10 mm.
- the portion 11 to be separated is not connected to the backsheet, making it easy to blow away and separate the portion 11 to be separated.
- the portion 11 to be separated is not easily broken, which can improve the waste removal efficiency and avoid the problem of the excess area in the pattern structure being easily broken and difficult to peel off due to the strong adhesion between the metal conductive layer and the backsheet.
- the width of the portion 11 to be separated can be reduced.
- the resistivity of the photovoltaic backsheet can be reduced, and the conductivity of the photovoltaic backsheet can be improved, thereby increasing the power of the photovoltaic module including the photovoltaic backsheet.
- step 101 blowing air to the portion to be separated in the conductive layer, includes: blowing air to the portion to be separated in the conductive layer through an oscillating blowing component.
- the oscillating blowing assembly 3 includes a nozzle 31 that can periodically reciprocate.
- the oscillating blowing assembly 3 includes multiple nozzles 31, each connected to a first bracket 33 via multiple nozzle fixing blocks 32.
- the nozzles 31 specifically reciprocate periodically along the length of the first bracket 33.
- blowing through the nozzles 31 that can periodically reciprocate enhances the blowing effect, making it easier to blow away the portion to be separated 11 and preventing the portion to be separated 11 from adhering to the portion to be retained 12.
- step 103 separating the portion to be separated in the conductive layer, includes: clamping the portion to be separated in the blown-away conductive layer; and making the portion to be separated and the portion to be retained in the conductive layer move relative to each other to separate the portion to be separated in the conductive layer.
- the portion 12 to be retained of the conductive layer 1 is also the portion to be retained in the conductive layer 1.
- the portion to be separated in the blown-away conductive layer can be clamped by the clamping component 5 and the clamping separation component 7.
- the portion to be separated can be moved, or the conductive layer 1 itself can be moved, so that the portion to be separated and the portion to be retained in the conductive layer move relative to each other. After the blowing device blows away the portion to be separated 11, the end of the portion to be separated 11 may adhere to the portion to be retained 12.
- causing the portion to be separated and the portion to be retained of the conductive layer to move relative to each other includes: transporting the portion to be separated in a direction away from the portion to be retained of the conductive layer.
- the separation device includes a clamping and separation assembly 7, which is located below the first carrier 2.
- the clamping and separation assembly 7 includes two opposing, rotating rollers 71.
- the clamping and separation assembly also includes an anti-winding mechanism, which includes two auxiliary rollers 72 and two conveyor belts 73.
- a single conveyor belt 73 is wound around the auxiliary rollers 72 and the clamping roller 71, located on the same side of the clamping and separation assembly 7 along the arrangement direction of the two clamping rollers 71.
- the conveyor belt 73 can transport the portion 11 to be separated away from the portion 12 to be retained of the conductive layer 1, thereby preventing the portion 11 from being wound around the clamping rollers 71.
- the present application embodiment discloses another method for preparing a photovoltaic backsheet, the method comprising:
- Step 201 obtaining only a conductive layer having a patterned structure on the surface
- Step 202 blowing air to the portion of the conductive layer to be separated
- Step 203 separating the portion to be separated in the conductive layer
- Step 204 pressing the separated conductive layer and the back sheet provided with the adhesive layer together to obtain a photovoltaic back sheet.
- Producing only the conductive layer having a patterned structure on its surface may include: drawing a continuous conductive layer from one end of a conductive layer coil and cutting it to form the conductive layer; or laser scribing the conductive layer to form the patterned structure on the surface of the conductive layer.
- the patterned structure on the surface of the conductive layer may also be formed by other physical or chemical methods, such as cutting with a tool or integral stamping, or chemical methods such as chemical liquid etching.
- Automatic loading and cutting can be achieved through a loading and cutting device.
- a conductive layer coil and a cutter can be placed on the loading and cutting device.
- One end of the conductive layer coil is led out.
- the cutter can be activated to cut off a certain length of the continuous conductive layer to form a conductive layer 1.
- the conductive layer 1 can be laser engraved by a laser platemaking device.
- the laser platemaking device can include multiple laser generators. The laser generators are used to release laser light onto the surface of the conductive layer 1, thereby preparing a graphic structure on the surface of the conductive layer 1 by laser engraving. After laser engraving, some excess parts will be formed and need to be removed. This area is also the part to be separated in the embodiment of the present application.
- the adhesive layer can be an adhesive film, and the adhesive film can be an EVA (Ethylene Vinyl Acetate, ethylene-vinyl acetate copolymer) adhesive film, POE (Polyolefin Elastomer, polyolefin elastomer) adhesive film, etc.
- the physical form of the adhesive film can be solid or liquid.
- the backplane with an adhesive layer can be stacked with the separated conductive layer 1 to form a first workpiece to be pressed. After that, the first workpiece to be pressed is placed on a pressing device, and the separated conductive layer and the backplane with an adhesive layer are pressed by the pressing device. Among them, in the first workpiece to be pressed, the adhesive layer is located between the conductive layer 1 and the backplane.
- a patterned structure is first formed on the surface of a separate conductive layer.
- the portion 11 to be separated is then removed from the separate conductive layer 1.
- the separated conductive layer and the backing plate provided with the adhesive layer are laminated together.
- conventional laminating equipment can be used to laminate the separated conductive layer and the backing plate provided with the adhesive layer, eliminating the need for a dedicated laminating device.
- the present application embodiment discloses another method for preparing a photovoltaic backsheet, the method comprising:
- Step 301 Locally press the portion of the conductive layer to be retained and the back plate provided with the adhesive layer;
- Step 302 obtaining the partially laminated conductive layer, adhesive layer, and backplane
- Step 303 forming a pattern structure on the surface of the conductive layer
- Step 304 blowing air to the portion of the conductive layer to be separated
- Step 305 Separate the portion of the conductive layer that needs to be separated.
- the portion 12 of the conductive layer 1 to be retained and the backing plate provided with the adhesive layer can be partially laminated using the local lamination device 8.
- the backing plate provided with the adhesive layer and the conductive layer 1 can be first laminated to form a second workpiece to be laminated.
- the second workpiece to be laminated can then be placed on the lower pressing plate 82 of the local lamination device 8.
- the local lamination device 8 can then partially laminate the portion of the conductive layer to be retained and the backing plate provided with the adhesive layer.
- the adhesive layer is located between the conductive layer 1 and the backing plate.
- Forming a pattern structure on the surface of the conductive layer may include: laser scribing the conductive layer to form a pattern structure on the surface of the conductive layer.
- air is blown onto the portion 11 of the conductive layer 1 to be separated.
- the portion 12 of the conductive layer 1 to be retained is adhered to the backplane via the adhesive layer. Therefore, during the entire process of removing the portion 11 to be separated, the finger-shaped conductive portion 121 in the portion 12 to be retained is not blown away, thereby avoiding the risk of clamping the finger-shaped conductive portion 121 when subsequently clamping the portion 11 to be separated.
- the busbar is first welded to the photovoltaic backsheet, then the photovoltaic backsheet and the insulating film are hot pressed together, and then the battery cells are placed on the photovoltaic backsheet with the insulating film through typesetting technology. Then, the adhesive film and glass are laid, and finally the glass, adhesive film, battery cells and the photovoltaic backsheet with the insulating film are laminated to obtain a photovoltaic laminate.
- the main functions of the insulating film are insulation and hot pressing bonding.
- the surface of the insulating film is formed with a hole pattern by physical or chemical methods.
- the hole pattern can be any shape such as circular, triangular, square, etc.
- the hole pattern is established according to the size and position of the conductive part of the battery cell.
- the hole pattern is preferably a circular pattern, which can be used for circular solder pads, square solder pads, or solder pads of other patterns in the battery cell.
- the material of the insulating film can be a single material, or the material of the insulating film can be a composite of multiple materials, such as EVA, POE, PET (Polyethylene Terephthalate) and other materials composited together.
- an embodiment of the present application discloses a photovoltaic backplane preparation device, including a blowing device and a separation device, the blowing device is used to blow the part 11 to be separated in the graphic structure in the conductive layer 1, at least the part 11 to be separated in the conductive layer 1 is not connected to the backplane, and the separation device is used to separate the part 11 to be separated in the conductive layer 1.
- the airflow from the blowing device can be directed upward.
- the conductive layer 1 can be adsorbed on the first carrier 2, with the conductive layer 1 positioned below the first carrier 2 and the blowing device positioned below the first carrier 2.
- the separation device can include any one of the gripping assembly 5, the gripping and separation assembly 7, and the roller brush 4.
- the portion 11 to be separated is not connected to the backplane, and it is easy to blow away and separate the portion 11 to be separated, and the portion 11 to be separated is not easy to break, which can improve the waste removal efficiency and avoid the situation where the excess area in the graphic structure is easily broken and difficult to peel off due to the strong adhesion between the metal conductive layer and the backplane.
- the blowing device includes an oscillating blowing assembly 3
- the oscillating blowing assembly 3 includes a blowing nozzle 31 that can perform periodic reciprocating motion.
- the oscillating blowing assembly 3 includes multiple nozzles 31, each connected to a first bracket 33 via a plurality of nozzle fixing blocks 32.
- the nozzles 31 periodically reciprocate along the length of the first bracket 33.
- the cyclically reciprocating nozzles 31 enhance the blowing effect, making it easier to blow away the portion to be separated 11 and preventing adhesion between the portion to be separated 11 and the portion to be retained 12.
- the oscillating blow assembly 3 also includes a blow driver 34 and a second bracket 35.
- the blow driver 34 is connected to the first bracket 33 and is used to drive the first bracket 33 to reciprocate along its length.
- the blow driver 34 can be a pneumatic cylinder.
- the first bracket 33 is connected to the second bracket 35 via a first guide rail slider mechanism 36.
- the first guide rail slider mechanism 36 can include a first slider and a first guide rail.
- the first guide rail can be disposed on the second bracket 35.
- the first slider is slidably connected to the first guide rail and is connected to the first bracket 33.
- the first guide rail slider mechanism 36 serves as a guide.
- the position of the second bracket 35 can be fixed, and the second bracket 35 can also move along the first direction.
- the first direction is perpendicular to the length direction of the second bracket 35 and perpendicular to the height direction of the second bracket 35.
- the first direction can be parallel to the length direction of the finger-shaped conductive part 121 in the conductive layer 1.
- the length direction of the finger-shaped conductive part 121 in the conductive layer 1 can refer to the direction shown by the arrow B in Figure 12.
- the distance between the air blowing device and the conductive layer 1 along the thickness direction of the conductive layer 1 is greater than or equal to 55 mm. If the air blowing device is too close to the conductive layer 1, there is a risk of wrinkling the conductive layer 1, which may easily lead to hidden cracks in the battery cell. In this embodiment, when the distance between the air blowing device and the conductive layer 1 is within the above range, the risk of wrinkling the conductive layer 1 caused by the air blowing device being too close to the conductive layer 1 can be avoided.
- the flow rate of the airflow blown by the blowing device is greater than or equal to 600 L/min and less than or equal to 750 L/min.
- the flow rate of the airflow blown by the blowing device can be 600 L/min, 620 L/min, 650 L/min, 700 L/min, 750 L/min, etc.
- the photovoltaic backplane preparation equipment further includes a first carrier 2 , which is at least used to adsorb the conductive layer 1 , and the conductive layer 1 is located below the first carrier 2 .
- the separation device includes a gripping and separation assembly 7, which is located below the first carrier 2.
- the gripping and separation assembly 7 includes two oppositely disposed and mutually rotating clamping rollers 71. After the air blowing device blows away the portion 11 to be separated, the end of the portion 11 to be separated may adhere to the portion 12 to be retained. After the air blowing, the gripping and separation assembly 7 grips and separates the portion 11 to be separated, ensuring that the portion 11 to be separated is completely separated from the portion 12 to be retained, thereby improving the overall waste removal rate.
- the distance between the clamping and separating component 7 and the conductive layer 1 is greater than the length of the finger-shaped conductive portion 121 in the graphic structure.
- the finger-shaped conductive portion 121 is a bar pattern similar to a finger shape in the graphic structure.
- the length direction of the finger-shaped conductive portion 121 can refer to the direction shown by the arrow B in Figure 12, and the length of the finger-shaped conductive portion 121 can refer to L1 shown in Figure 12.
- the clamping and separating component 7 and the conductive layer 1 are set to be greater than the length of the finger-shaped conductive portion 121 in the graphic structure, even if the finger-shaped conductive portion 121 is blown away, the clamping and separating component 7 will not clamp the finger-shaped conductive portion 121.
- the clamping and separation component 7 also includes an anti-winding mechanism; the anti-winding mechanism includes two auxiliary rollers 72 and two transmission belts 73, and a single transmission belt 73 is wound around the auxiliary roller 72 and the clamping roller 71 located on the same side of the clamping and separation component 7 along the arrangement direction of the two clamping rollers 71.
- the two auxiliary rollers 72 are respectively located below the two clamping rollers 71.
- the arrangement direction of the two clamping rollers 71 is also the direction from one of the clamping rollers 71 to the other clamping roller 71.
- the clamping and separation component 7 also includes a drive motor 74, which is connected to the clamping roller 71 through a transmission mechanism 75, and the drive motor 74 is used to drive the clamping roller 71 to rotate through the transmission mechanism 75.
- the transmission mechanism 75 can be a belt transmission mechanism, and the belt transmission mechanism can include a pulley and a belt.
- the clamping roller 71 When the clamping roller 71 rotates, it will drive the transmission belt 73 wound thereon to move, so that the transmission belt 73 transmits the part to be separated 11 in the direction away from the part to be retained 12 of the conductive layer 1.
- the part to be separated 11 can be transmitted in the direction away from the part to be retained 12 of the conductive layer 1 through the transmission belt 73 to avoid the part to be separated 11 being wrapped around the clamping roller 71.
- a scraper mechanism and a protective cover may be installed on both sides and above the clamping roller 71 .
- the scraper mechanism can scrape off the portion 11 to be separated that is wound around the clamping roller 71 , thereby preventing the portion 11 to be separated from being rewound around the clamping roller 71 after the clamping roller 71 rotates.
- the protective cover can prevent the portion 11 to be separated from being hung on the roller shaft of the clamping roller 71 .
- the separation device includes a clamping assembly 5, which is located below the first carrier 2, and the clamping assembly 5 is used to clamp the part to be separated 11 in the blown-off conductive layer 1; the separation device also includes a separation drive, which is used to drive the clamping assembly 5 to move; and/or, the first carrier 2 includes a transmission assembly, which is used to transmit and adsorb the conductive layer.
- the clamping assembly 5 can be integrated with the oscillation blowing assembly 3.
- the clamping assembly 5 can be installed on the second bracket 35.
- the first carrier 2 includes a transmission assembly
- the separation device also includes a separation drive.
- the separation drive is specifically used to drive the clamping assembly 5 to move along the length direction of the second bracket 35. After the blowing device blows away the part to be separated 11, the end of the part to be separated 11 may adhere to the part to be retained 12. After blowing, the part to be separated 11 is clamped and separated by the clamping assembly 5, which can ensure that the part to be separated 11 and the part to be retained 12 are completely separated, thereby improving the overall waste removal rate.
- the clamping assembly 5 includes a first clamping bar 55 and a second clamping bar 52; the clamping assembly 5 also includes a clamping driving member 53, and the clamping driving member 53 is used to drive the first clamping bar 55 or the second clamping bar 52 to move along the length direction of the first clamping bar 55; the first clamping bar 55 and the second clamping bar 52 are stacked, and the first clamping bar 55 is provided with a plurality of clamping grooves 511 along the length direction of the first clamping bar 55, and the second clamping bar 52 includes a plurality of clamping hooks 521 arranged at intervals along the length direction of the first clamping bar 55; or, the first clamping bar 55 and the second clamping bar 52 respectively include a plurality of first clamping jaws and a plurality of second clamping jaws arranged at intervals along the length direction of the first clamping bar, and the first clamping jaws and the second clamping jaws are alternately arranged along the length direction
- the clamping drive 53 is specifically used to directly drive the second clamping bar 52 to move, so as to drive the second clamping bar 52 to move relative to the first clamping bar 55.
- the clamping drive 53 can be a cylinder.
- the clamping drive 53 is used to drive the second clamping bar 52 to move along the length direction of the first clamping bar 55, and the first clamping bar 55 is fixed to the second bracket 35.
- the length direction of the first clamping bar 55 can be parallel to the arrangement direction of the finger-shaped conductive portion 121 in the conductive layer 1.
- the length direction of the first clamping bar 55 can refer to the direction shown by the arrow C in Figures 15 and 18, and the arrangement direction of the finger-shaped conductive portion 121 in the conductive layer 1 can refer to the direction shown by the arrow A in Figure 12.
- the second guide rail slider mechanism 54 may include a second slider and a second guide rail.
- the second guide rail may be provided on the second bracket 35.
- the second slider is slidably connected to the second guide rail, and the second slider is connected to the first clamping strip 55.
- the second clamping bar 52 moves back and forth along the length of the first clamping bar 55.
- the first clamping bar 55 and the second clamping bar 52 respectively include a plurality of first clamping jaws and a plurality of second clamping jaws.
- initially there is a certain gap between the first clamping jaws and the second clamping jaws.
- the movement of the second clamping bar 52 drives the second clamping jaws to move toward the first clamping jaws to clamp the part 11 to be separated.
- the shape of the clamping hook 521 can be L-shaped.
- the first clamping strip 55 is provided with a plurality of clamping grooves 511
- the second clamping strip 52 includes a plurality of clamping hooks 521. After being blown away, the part 11 to be separated falls into the clamping grooves 511. Thereafter, the second clamping strip 52 moves, and the clamping hooks 521 cooperate with the clamping grooves 511 to clamp the part 11 to be separated.
- the shape of the clamping groove 511 can be V-shaped so that the part 11 to be separated can be better inserted into the clamping groove 511. It should be noted that since the width of the clamping groove 511 or the distance between the first clamping jaw and the second clamping jaw is small, even if the finger-shaped conductive part 121 is blown away, it will not fall into the clamping groove 511 or between the first clamping jaw and the second clamping jaw. Therefore, there is no limit on the distance between the clamping assembly 5 and the conductive layer 1.
- the separation device includes a roller brush 4 , which is configured to contact the surface of the conductive layer 1 facing away from the first carrier 2 .
- the roller brush 4 has a circle of bristles on its surface, which can scrape away the portion 11 to be separated from the conductive layer 1 . While scraping away the portion 11 to be separated from the conductive layer 1 , the roller brush 4 rotates and moves to scrape away the portion 11 to be separated from the entire conductive layer 1 .
- the photovoltaic backplane preparation equipment also includes a local pressing device 8, which is used to locally press the portion of the conductive layer 1 to be retained and the backplane provided with an adhesive layer;
- the local pressing device 8 includes an upper pressing plate 81 and a lower pressing plate 82, and the upper pressing plate 81 is provided with a first avoidance groove 811, and/or the lower pressing plate 82 is provided with a second avoidance groove 822.
- the upper pressing plate 81 includes a protrusion 812, and the protrusion 812 has an upper pressing surface.
- the protrusion 812 can be a long strip protrusion, and the length direction of the long strip protrusion is parallel to the width direction of the upper pressing plate 81.
- the lower pressing plate 82 has a lower pressing surface 821.
- the upper pressing surface of the protrusion 812 cooperates with the lower pressing surface 821 to locally press the portion 12 to be retained of the conductive layer 1 and the back plate provided with an adhesive layer.
- the shape and size of the first avoidance groove 811 and the second avoidance groove 822 can match the portion 11 to be separated. In this embodiment, through the cooperation of the first avoidance groove 811 and the second avoidance groove 822, it is possible to avoid the portion 11 to be separated in the conductive layer 1 from being bonded to the back plate during the hot pressing process.
- the embodiment of the present application further discloses a second carrier 6 and an adsorption device.
- the second carrier 6 is used to adsorb the conductive layer 1 , and the conductive layer 1 is located on the second carrier 6 .
- the adsorption device includes an adsorption hood 9 , which is located above the second carrier 6 .
- the adsorption hood 9 absorbs the parts 11 to be separated in the conductive layer 1 into the collection device one by one.
- the suction device includes a nozzle assembly 110, which is located above the second carrier 6.
- the nozzle assembly 110 may include a nozzle fixing bracket and multiple nozzles.
- the nozzle fixing bracket can move up and down and left and right.
- the nozzles can be connected to the nozzle fixing bracket via elastic members.
- the nozzles are used to suck the portion 11 to be separated from the conductive layer 1.
- the size of the nozzles can be consistent with the size of the portion 11 to be separated.
- the suction nozzle assembly 110 can be used in conjunction with two oppositely disposed and rotating pinch rollers.
- the suction nozzle first descends to suck up the portion 11 to be separated, it will then lift the portion 11 upward. After reaching a certain height, the two pinch rollers will clamp the sucked portion 11 and then lift the entire portion upward.
- the portion 11 to be separated from the portion to be retained 12 is lifted, the portion 11 to be separated is removed to a collection device.
- first,” “second,” and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “first,” “second,” and the like generally distinguish objects of a class and do not limit the number of objects. For example, the first object may be one or more.
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Abstract
本申请提供了一种光伏背板加工设备及方法和光伏背板制备方法及设备。光伏背板加工设备包括:具有传输面的载台,以及在载台上布置的剥离机构和复合机构;载台的传输面用于传输导电层并依次经过剥离机构和复合机构;剥离机构用于将导电层中的待剥离区域剥离,复合机构用于将完成剥离的导电层和设有粘接层的背板进行压合。本申请解决了相关技术中剥离待剥离区域时,待剥离区域的部分易断裂且难以剥离的问题,提高了产品质量和生产效率。
Description
相关申请的交叉引用
本公开要求在2024年4月19日提交中国专利局、申请号为202410480484.8、名称为“一种光伏背板加工设备及方法”的中国专利申请的优先权,以及在2024年9月26日提交中国专利局、申请号为202411356400.6、名称为“一种光伏背板加工设备及方法”的中国专利申请的优先权,以及在2024年12月17日提交中国专利局、申请号为202411868653.1、名称为“光伏背板制备方法及设备”的中国专利申请的优先权,其全部内容通过引用结合在本公开中。
本申请涉及光伏技术领域,特别是涉及一种光伏背板加工设备及方法。
光伏背板的生产过程中,需要在背板的一面设置导电层,并在导电层上刻画电隔离的图形结构,以避免光伏背板和电池片接触时的短路,刻画了图形结构后,导电层的图形结构中存在一些区域需要被剥离。
目前,可以将完整的导电层先与背板粘接并热压,之后再在导电层上制备图形结构,将图形结构中的多余区域剥离,从而获得用于与电池片连接的光伏背板。
但是,由于导电层与背板粘接较为牢固,在将导电层的图形结构中的多余区域剥离时,多余区域的部分易断裂且难以剥离,降低了产品质量和生产效率。
光伏组件中的电池片采用背接触电池片时,电池片之间可以通过导电背板电连接,导电背板通常包括金属导电层、胶膜和背板。
相关技术中,导电背板的制备工艺包括:先将完整的金属导电层、胶膜、背板一起热压敷合,之后,在金属导电层上制备图形结构,最后,将图形结构中的多余区域剥离。
然而,由于金属导电层与背板粘接较为牢固,在剥离图形结构中的多余区域时,多余区域易断裂且难以剥离。
本申请提供一种光伏背板加工设备及方法,以解决现有技术中导电层中多余区域的部分剥离时易断裂且难以剥离,降低了产品质量和生产效率的问题。
为了解决上述问题,本申请是这样实现的:
第一方面,本申请实施例提供了一种光伏背板加工设备,包括:
具有传输面的载台,以及在所述载台上布置的剥离机构和复合机构;
所述载台的传输面用于传输导电层,以使得所述导电层依次经过所述剥离机构和所述复合机构;
所述剥离机构用于将所述导电层中的待剥离区域剥离,所述复合机构用于将完成剥离的所述导电层和设有粘接层的背板进行压合。
可选的,所述导电层的表面形成有图形结构,所述图形结构中具有所述待剥离区域;所述载台的传输面上设置有吸附装置,所述吸附装置用于吸附所述导电层。
可选的,所述图形结构包括:沿所述导电层的宽度方向并列排布的多个区域,每个所述区域包括首尾依次连接的多个间隔的子区域,多个所述子区域呈弯折排列在所述区域中;多个所述区域各自的子区域构成所述待剥离区域;
在所述真空吸附载板吸附了所述导电层时,所述真空吸附载板中对应每个所述区域的长边外侧的位置,设置有间隔排列的第一吸附孔,对应每个所述区域中的至少一组相邻子区域之间的位置,设置有间隔排列的第二吸附孔;
所述第二吸附孔的尺寸小于所述第一吸附孔的尺寸。
可选的,所述第二吸附孔的排列方向垂直于所述第一吸附孔的排列方向,所述第二吸附孔之间的间隔距离小于所述第一吸附孔之间的间隔距离。
可选的,在所述真空吸附载板吸附了所述导电层时,所述第二吸附孔的边缘与所述待剥离区域的边缘之间的最小距离为0.1mm至2mm。
可选的,所述载台的传输面上设置有吸附装置,所述吸附装置用于吸附所述导电层;
所述剥离机构包括:翻转装置和剥离装置;
所述吸附装置在吸附所述导电层后移动至所述翻转装置上,所述翻转装置通过旋转将所述吸附装置首次翻转,让所述导电层背离所述吸附装置的一面朝向重力方向;在所述吸附装置首次翻转后,所述剥离装置处于所述导电层背离所述吸附装置的一侧位置;
所述剥离装置用于在所述吸附装置首次翻转后,与所述导电层背离所述吸附装置的一面接触,以使所述导电层中的所述待剥离区域脱离;
可选的,所述剥离机构还包括:
搬运装置;
待所述剥离装置工作后,所述翻转装置通过旋转将所述吸附装置再次翻转,让所述导电层背离所述吸附装置的一面背离重力方向;
所述吸附装置再次翻转后,所述搬运装置用于将上料台上放置的设有粘接层的背板进行抓取,并将所述背板具有粘接层的一面与所述导电层背离所述吸附装置的一面层叠接触。
可选的,所述剥离装置包括:吹风机;
所述吹风机的出风方向面向所述导电层背离所述吸附装置的一面;所述吹风机的出风宽度大于或等于所述导电层中图形结构的宽度。
可选的,所述剥离装置包括:刷子;
所述刷子用于与所述导电层背离所述吸附装置的一面接触;所述刷子的宽度大于或等于所述导电层中图形结构的宽度。
可选的,所述剥离装置包括:滚筒;
所述滚筒用于与所述导电层背离所述吸附装置的一面接触;所述滚筒的宽度大于或等于所述导电层中图形结构的宽度。
可选的,所述滚筒表面设置有柔性接触层;
所述柔性接触层表面间隔设置有柔性凸起结构。
可选的,所述光伏背板加工设备还包括:设置在所述载台上的上料裁切装置和激光制版装置;
所述上料裁切装置处于所述载台的上料端,所述激光制版装置处于所述上料裁切装置和所述剥离机构之间;
所述上料裁切装置中设置有导电层卷材;所述上料裁切装置用于将所述导电层卷材的一端引出至所述传输面上的所述吸附装置,并裁切形成所述导电层;
所述激光制版装置用于对经过的导电层进行激光刻画,在所述导电层表面形成所述图形结构。
可选的,所述吸附装置为真空吸附载板;
所述真空吸附载板上设置有吸附孔,在所述真空吸附载板吸附了所述导电层时,所述吸附孔的位置与所述导电层中的待剥离区域互不重叠。
可选的,所述光伏背板加工设备还包括:视觉检测装置和清洁装置;
所述视觉检测装置及所述清洁装置设置在所述载台中所述复合机构之后的位置;
所述视觉检测装置用于对压合后的导电层和背板进行图像采集及图像识别;
所述清洁装置用于在识别到所述导电层的待剥离区域中存在残渣时,清除所述残渣。
第二方面,本申请实施例提供了一种光伏背板加工方法,包括:
获取表面具有图形结构的导电层,所述图形结构中具有待剥离区域;
将所述导电层中的待剥离区域剥离;
将完成剥离的所述导电层和设有粘接层的背板进行压合,得到光伏背板。
可选的,所述将所述导电层中的待剥离区域剥离,包括:
将所述导电层翻转,让所述导电层设有图形结构的一面朝向重力方向;
控制剥离装置与所述导电层设有图形结构的一面接触,以使所述导电层中的所述待剥离区域脱离。
可选的,所述获取表面具有图形结构的导电层,包括:
从导电层卷材的一端引出连续导电层并裁切,形成所述导电层;
对所述导电层进行激光刻画,在所述导电层表面形成所述图形结构。
可选的,所述将完成剥离的所述导电层和设有粘接层的背板进行压合,包括:
将设有粘接层的所述背板与完成剥离的所述导电层进行层叠,以形成待加工件;所述粘接层位于所述背板与完成剥离的所述导电层之间;
压合所述待加工件。
可选的,在将完成剥离的所述导电层和设有粘接层的背板进行压合之后,所述方法还包括:
对压合后的导电层和背板进行图像采集及图像识别;
在识别到所述导电层的待剥离区域中存在残渣时,清除所述残渣。
第三方面,本申请实施例提供了一种吸附装置,包括:
真空吸附载板;
在所述真空吸附载板上沿第一方向间隔设置有第一吸附孔,在所述真空吸附载板上沿第二方向间隔设置有第二吸附孔,所述第一方向与所述第二方向相交,所述第一吸附孔和所述第二吸附孔的尺寸不同;
在所述真空吸附载板吸附了导电层时,所述第一吸附孔和所述第二吸附孔的位置与所述导电层中的待剥离区域互不重叠。
本申请可以先将导电层上的待剥离区域进行剥离去除,最后再将设有粘接层的背板与完成剥离的导电层层叠后进行热压,得到光伏背板。相较于相关技术,本申请实施例无需先将背板与导电层热压复合后,再在导电层上去除待剥离区域,这样去除待剥离区域时,就可以消除因待剥离区域与背板牢固粘接而带来的不便,本申请由于剥离待剥离区域时,导电层还未与背板粘接,因此剥离相对简单,从而解决了相关技术中剥离待剥离区域时,待剥离区域的部分易断裂且难以剥离的问题,提高了产品质量和生产效率。
本申请提供一种光伏背板制备方法及设备,旨在至少解决现有技术中在剥离图形结构中的多余区域时,多余区域易断裂且难以剥离的技术问题。
第四方面,本申请实施例提供了一种光伏背板制备方法,包括:
至少获得表面具有图形结构的导电层,其中,所述图形结构具有需分离部分,所述导电层中至少所述需分离部分未与背板连接;
对所述导电层中的需分离部分进行吹气;
将所述导电层中的需分离部分分离。
可选地,对所述导电层中的需分离部分进行吹气,包括:
通过振荡吹气组件对所述导电层中的需分离部分进行吹气;
其中,所述振荡吹气组件包括可周期性往复运动的吹嘴。
可选地,所述将所述导电层中的需分离部分分离,包括:
夹取被吹离的所述导电层中的需分离部分;
使所述需分离部分与所述导电层的需保留部分相对运动,以使所述导电层中的需分离部分分离。
可选地,所述使所述需分离部分与所述导电层的需保留部分相对运动,包括:
向远离所述导电层的需保留部分的方向传输所述需分离部分。
可选地,所述至少获得表面具有图形结构的导电层,包括:
仅获得表面具有图形结构的导电层;
所述将所述导电层中的需分离部分分离之后,还包括:
将完成分离的所述导电层和设有粘接层的背板进行压合,得到光伏背板。
可选地,所述至少获得表面具有图形结构的导电层之前,包括:
将导电层的需保留部分和设有粘接层的背板进行局部压合;
所述至少获得表面具有图形结构的导电层,包括:
获得局部压合后的导电层、粘接层和背板;
在所述导电层表面形成图形结构。
第五方面,本申请实施例提供了一种光伏背板制备设备,包括:
吹气装置,所述吹气装置用于对导电层中图形结构中的需分离部分进行吹气,其中,所述导电层中至少所述需分离部分未与背板连接;
分离装置,所述分离装置用于将所述导电层中的需分离部分分离。
可选地,所述吹气装置包括振荡吹气组件,所述振荡吹气组件包括可周期性往复运动的吹嘴。
可选地,沿所述导电层的厚度方向,所述吹气装置与所述导电层之间的距离大于或等于55毫米。
可选地,所述吹气装置吹出的气流的流量大于或等于600L/min,小于或等于750L/min。
可选地,所述光伏背板制备设备还包括第一载具,所述第一载具至少用于吸附所述导电层,所述导电层位于所述第一载具的下面。
可选地,所述分离装置包括夹取分离组件,所述夹取分离组件位于所述第一载具的下方;
所述夹取分离组件包括两个相对设置且相向转动的夹辊。
可选地,沿所述导电层的厚度方向,所述夹取分离组件与所述导电层之间的距离大于所述图形结构中指状导电部分的长度。
可选地,所述夹取分离组件还包括防缠绕机构;
所述防缠绕机构包括两个辅助辊和两个传输带,单个所述传输带绕设在位于所述夹取分离组件沿两个所述夹辊的排列方向的同一侧的辅助辊和夹辊上。
可选地,所述分离装置包括夹取组件,所述夹取组件位于所述第一载具的下方,所述夹取组件用于夹取被吹离的所述导电层中的需分离部分;
所述分离装置还包括分离驱动件,所述分离驱动件用于驱动所述夹取组件运动;和/或,所述第一载具包括传输组件,所述传输组件用于传输和吸附所述导电层。
可选地,所述夹取组件包括第一夹条和第二夹条;
所述夹取组件还包括夹取驱动件,所述夹取驱动件用于驱动所述第一夹条或者所述第二夹条沿所述第一夹条的长度方向移动;
所述第一夹条和所述第二夹条层叠设置,所述第一夹条沿所述第一夹条的长度方向上开设有若干夹槽,所述第二夹条包括沿所述第一夹条的长度方向间隔排布的若干夹钩;
或者,所述第一夹条和所述第二夹条分别包括沿所述第一夹条的长度方向间隔排布的若干第一夹爪和若干第二夹爪,沿所述第一夹条的长度方向,所述第一夹爪和所述第二夹爪交替排布。
可选地,所述分离装置包括滚刷,所述滚刷用于与所述导电层背离所述第一载具的一面接触。
可选地,所述光伏背板制备设备还包括局部压合装置,所述局部压合装置用于将所述导电层的需保留部分和设有粘接层的背板进行局部压合;
所述局部压合装置包括上压板和下压板,所述上压板上开设有第一避让凹槽,和/或,所述下压板上开设有第二避让凹槽。
本申请实施例中,对导电层中的需分离部分进行吹气,并将导电层中的需分离部分分离的过程中,需分离部分未与背板连接,易于将需分离部分吹离并分离,且需分离部分不易断裂,能够提高去废效率,能够避免因金属导电层与背板粘接较为牢固而导致的在剥离图形结构中的多余区域时,多余区域易断裂且难以剥离。此外,本实施例中,由于需分离部分不易断裂,因此,可以减小需分离部分的宽度,需分离部分的宽度减小后,能够降低光伏背板的电阻率,提高光伏背板的导电能力,从而能够提高包括该光伏背板的光伏组件的功率。
上述说明仅是本申请技术方案的概述,为了能够更清楚了解本申请的技术手段,可依照说明书的内容予以实施,并且为了让本申请的上述和其它目的、特征和优点能够更明显易懂,以下特举本申请的具体实施方式。
为了更清楚地说明本申请实施例的技术方案,下面将对本申请实施例的描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。
图1为本申请实施例所述的一种光伏背板加工设备的结构示意图;
图2为本申请实施例所述的一种承载了导电层的吸附装置的结构示意图;
图3为本申请实施例所述的一种光伏背板加工方法的步骤流程示意图;
图4为本申请实施例所述的一种剥离机构的横截面结构示意图;
图5为本申请实施例所述的一种剥离装置的结构示意图;
图6为本申请实施例所述的另一种剥离装置的结构示意图;
图7为本申请实施例所述的另一种剥离装置的结构示意图;
图8为本申请实施例所述的另一种承载了导电层的吸附装置的结构示意图;
图9为本申请实施例所述的一种承载了导电层的吸附装置的局部结构示意图;
图10为本申请实施例所述的一种承载了导电层的吸附装置的局部结构示意图;
图11为本申请实施例提供的一种光伏背板制备方法的步骤流程图;
图12为本申请实施例提供的一种导电层的结构示意图;
图13为本申请实施例提供的另一种光伏背板制备方法的步骤流程图;
图14为本申请实施例提供的再一种光伏背板制备方法的步骤流程图;
图15为本申请实施例提供的光伏背板制备设备中的振荡吹气组件和一种夹取组件的结构示意图一;
图16为本申请实施例提供的光伏背板制备设备中的振荡吹气组件和一种夹取组件的结构示意图二;
图17为本申请实施例提供的光伏背板制备设备中的振荡吹气组件和一种夹取组件的结构示意图三;
图18为本申请实施例提供的光伏背板制备设备中的另一种夹取组件中第一夹条和第二夹条的部分结构示意图;
图19为本申请实施例提供的光伏背板制备设备中的第一载具和导电层的结构示意图;
图20为本申请实施例提供的光伏背板制备设备中的一种夹取分离组件的结构示意图;
图21为本申请实施例提供的光伏背板制备设备中的另一种夹取分离组件的结构示意图;
图22为本申请实施例提供的光伏背板制备设备中的滚刷的结构示意图;
图23为本申请实施例提供的光伏背板制备设备中的局部压合装置的结构示意图;
图24为本申请实施例提供的光伏背板制备设备中的局部压合装置中上压板的结构示意图;
图25为本申请实施例提供的光伏背板制备设备中的局部压合装置中下压板的结构示意图;
图26为本申请实施例提供的第二载具和吸附罩的结构示意图;
图27为本申请实施例提供的第二载具和吸嘴组件的结构示意图。
其中:10-载台;A-传输面;20-剥离机构;30-复合机构;40-吸附装置;41-吸附孔;411-第一吸附孔;412-第二吸附孔;42-真空发生机构;50-导电层;51-图形结构;60-背板;21-翻转装置;22-剥离装置;23-搬运装置;70-上料台;80-横梁;221-吹风机;222-刷子;223-滚筒;224-柔性接触层;225-柔性凸起结构;90-上料裁切装置;100-激光制版装置;91-导电层卷材;1-导电层,11-需分离部分,12-需保留部分,121-指状导电部分,2-第一载具,3-振荡吹气组件,31-吹嘴,32-吹嘴固定块,33-第一支架,34-吹气驱动件,35-第二支架,36-第一导轨滑块机构,4-滚刷,5-夹取组件,55-第一夹条,511-夹槽,52-第二夹条,521-夹钩,53-夹取驱动件,54-第二导轨滑块机构,6-第二载具,7-夹取分离组件,71-夹辊,72-辅助辊,73-传输带,74-驱动电机,75-传动机构,8-局部压合装置,81-上压板,811-第一避让凹槽,812-凸出部,82-下压板,821-下压面,822-第二避让凹槽,9-吸附罩,110-吸嘴组件。
下面将参照附图更详细地描述本申请的示例性实施例。虽然附图中显示了本申请的示例性实施例,然而应当理解的是,还可以以各种形式实现本申请而不应被这里阐述的实施例所限制。相反,提供这些实施例是为了能够更透彻地理解本申请,并且能够将本申请的范围完整的传达给本领域的技术人员。
第一方面,如图1所示,为本申请提供一种光伏背板加工设备,包括:具有传输面A的载台10,以及在载台10上布置的剥离机构20和复合机构30;载台10的传输面A用于传输导电层50,以使得导电层50依次经过剥离机构20和复合机构30。
可选的,载台10的传输面A上设置有吸附装置40,吸附装置40用于吸附导电层50,以及在传输面A上移动,进一步参照图2,其示出了一种承载了导电层的吸附装置的结构示意图,导电层50的表面形成有图形结构51,图形结构51中具有待剥离区域(即描线所处的区域,例如图2导电层50中黑色连续弯曲描线所处的区域);剥离机构20用于将导电层50中的待剥离区域剥离,复合机构30用于将完成剥离的导电层50和设有粘接层的背板60进行压合。需要说明的是,背板60上设有的粘接层可通过涂覆方式或其它方式形成,或者背板60在来料时本身就设有粘接层,在此不做限定。
具体的,在压合之前,剥离机构20可将设有粘接层的背板60与完成剥离的导电层50层叠,形成待加工件,且粘接层位于背板60与导电层50之间;之后复合机构30可以压合待加工件,得到光伏背板。
在本申请实施例中,背板上设置具有图形结构的导电层,目的是使得背板在与背接触式电池片接触时,可以让背板通过导电层的图形结构与电池片背面的电极相互导电互联。
参照图2,可以基于背接触式电池片的背面的电极结构,对应设计在导电层50上设置的图形结构51的图案样式,该图案样式是能够形成电隔离的图形,这样可以避免互联时的短路现象,对图形结构的具体设计样式本申请实施例不做具体限定。其中,图形结构51刻画完成后,存在多余的待剥离区域(图2导电层50中黑色连续弯曲描线所处的区域)需要被从导电层50中剥离出去,从而形成可以用于后续电连接的图形结构。
具体的,本申请实施例可以采用一整套光伏背板加工设备实现光伏背板的自动化加工,其中,参照图1,光伏背板加工设备的载台10用于通过传输面A进行元件的传输,传输方向为X,沿传输方向X,在载台10上依次布置了剥离机构20和复合机构30,传输面A上放置有吸附装置40,吸附装置40可以吸附刻画有图形结构51的导电层50,导电层50上设置的图形结构51设置于导电层50背离传输面A的一面。导电层可以为导电金属材质。
传输面A具体可以带动吸附装置40沿传输方向X进行移动,并依次经过剥离机构20和复合机构30,在经过剥离机构20时,剥离机构20可以将导电层50的图形结构51中的待剥离区域剥离去除,具体的,由于导电层50在刻画了图形结构51后,待剥离区域已处于脱离或接近脱离的状态,因此剥离机构20具有多种方式将待剥离区域剥离去除:方式1,可以将承载具有图形结构51的导电层50的吸附装置40翻转180°,使得导电层50背离吸附装置40的一面朝向重力方向,基于重力引导待剥离区域脱离。方式2,剥离机构20可以对导电层50背离吸附装置40的一面施加作用力(如使用滚筒或刷子接触该表面以施加作用力),在作用力下使得待剥离区域脱离。
待剥离区域脱离后,可以将设有粘接层的背板60与完成剥离的导电层50层叠,并让粘接层位于背板60与导电层50之间,形成吸附装置40上承载的待加工件,之后在传输面A的传输下,吸附装置40可以吸附待加工件继续沿传输方向X移动,当移动至复合机构30时,复合机构30可以压合待加工件,得到光伏背板并输出,从而完成光伏背板的加工制备。具体的,压合方式可以包括热压操作。
基于上述实施例对光伏背板加工设备的描述,参照图3,本申请实施例提供了一种光伏背板加工方法,包括:
步骤101、获取表面具有图形结构的导电层,所述图形结构中具有待剥离区域。
步骤102、将所述导电层中的待剥离区域剥离。
步骤103、将完成剥离的所述导电层和设有粘接层的背板进行压合。
可选的,步骤101具体可以包括:
子步骤1011、从导电层卷材的一端引出连续导电层并裁切,形成所述导电层。
子步骤1012、对所述导电层进行激光刻画,在所述导电层表面形成所述图形结构。
在本申请实施例中,参照图1,可以通过上料裁切装置90实现自动上料及切割。具体的,上料裁切装置90上放置有导电层卷材91以及切刀,导电层卷材91的一端被引出到传输面A上的吸附装置40,当引出的连续导电层长度达到要求时,切刀可以工作,从而切断一定长度的连续导电层,形成在吸附装置40上吸附的用于进行后续激光雕刻的导电层50。
激光制版装置100具有多个激光发生器,用于向导电层50的表面释放激光,从而以激光雕刻的方式,在导电层50的表面制备图形结构,激光雕刻后会形成一些多余区域需要被去除,即本申请实施例的待剥离区域。
可选的,步骤102具体可以包括:
子步骤1021、将所述导电层翻转,让所述导电层设有图形结构的一面朝向重力方向,以引导所述导电层中的至少部分待剥离区域脱离。
子步骤1022、控制剥离装置与所述导电层设有图形结构的一面接触,以使所述导电层中的剩余待剥离区域脱离。
在本申请实施例中,参照图4,可以采样方式1和方式2结合的方式实现待剥离区域的去除,方式1可以通过翻转装置21将承载具有图形结构51的导电层50的吸附装置40翻转180°,使得导电层50背离吸附装置40的一面朝向重力方向,基于重力引导待剥离区域脱离。方式2可以通过剥离装置22对导电层50背离吸附装置40的一面施加作用力,在作用力下使得待剥离区域脱离。
可选的,步骤103具体可以包括:
子步骤1031、将设有粘接层的所述背板与完成剥离的所述导电层进行层叠,以形成待加工件;所述粘接层位于所述背板与完成剥离的所述导电层之间。
子步骤1032、压合所述待加工件。
需要说明的是,一种实现方式中,来料的背板60的一面可以提前覆有粘接层,参照图1,剥离机构20还可以具有搬运功能,基于搬运功能,剥离机构20可以搬运覆有粘接层的背板60并与完成剥离的导电层50进行层叠以形成待加工件,之后通过复合机构30压合待加工件即得到光伏背板。
另一种实现方式中,参照图1,剥离机构20还可以具有涂覆功能和搬运功能,基于涂覆功能,剥离机构20可以将来料的背板60的一面先涂覆粘接层,之后再基于搬运功能,搬运覆有粘接层的背板60并与完成剥离的导电层50进行层叠以形成待加工件,之后通过复合机构30压合待加工件即得到光伏背板。
可选的,在步骤103之后,所述方法还包括:
步骤104、对压合后的导电层和背板进行图像采集及图像识别。
步骤105、在识别到所述导电层的待剥离区域中存在残渣时,清除所述残渣。
在本申请实施例中,针对步骤104-105,在经过光伏背板加工方法中的导电层中的待剥离区域剥离,以及将完成剥离的导电层和设有粘接层的背板进行压合操作后,可以再进行检测待剥离区域的剥离效果的操作,此时导电层中可能依然存在较小的待剥离区域残渣。检测待剥离区域的剥离效果的操作,旨在检测出待剥离区域残渣并将其清除。
在一种相关技术中,可以采用电学检测方式进行待剥离区域残渣的检测,该检测方式可以将两个探针分别搭在待剥离区域的相对两侧,若待剥离区域中存在联通待剥离区域的相对两侧的残渣,会导致两个探针短路,因此,检测到短路状态即为检测到待剥离区域中存在残渣。但是,若待剥离区域中仅有一个侧边连接残渣,该残渣并不与相对另一侧边接触,则此时电学检测方式无法检测到短路现象,也就遗漏了对该残渣的检测。
本申请实施例可以采用视觉的检测方式,首先拍摄压合后的导电层和背板,得到拍摄图像,之后可以对拍摄图像进行图像识别,识别导电层中待剥离区域的特征,若发现待剥离区域中存在残渣特征,则确认识别到残渣,之后可以进行对残渣的清除操作,清除操作可以由人工或机器实现。
需要说明的是,本申请实施例还可以在完成将导电层中的待剥离区域剥离时,进行残渣的检测和清除操作;也可以既在完成将导电层中的待剥离区域剥离时,进行残渣的检测和清除操作,又在将完成剥离的导电层和设有粘接层的背板进行压合后,进行残渣的检测和清除操作。
可选的,在步骤103之后,所述方法还包括:
步骤106、将吸附装置与光伏背板分离,同时通过背板翻面机完成对光伏背板的翻面,使导电层朝上。
步骤107、将翻面后的光伏背板传输至冲孔工位,在汇流条引出位置处进行冲孔。
步骤108、依次通过汇流条焊接机、汇流条折弯机、汇流条整形机将汇流条焊接至光伏背板的导电层上,焊接完成后对汇流条进行折弯整形处理。
步骤109、将完成汇流条焊接、折弯整形的光伏背板与绝缘膜进行热压,形成最终的一体化背板。
本申请实施例基于光伏背板加工设备,提供了一种光伏背板加工方法,该方法流程中,可以先将导电层的待剥离区域进行剥离去除,最后再将设有粘接层的背板与完成剥离的导电层层叠后进行热压,得到光伏背板。相较于相关技术,本申请实施例无需先将背板与导电层热压复合后,再在导电层上去除待剥离区域,本申请实施例去除待剥离区域时,就可以消除因待剥离区域与背板牢固粘接而带来的不便,本申请由于剥离待剥离区域时,导电层还未与背板粘接,因此剥离相对简单,从而解决了相关技术中剥离待剥离区域时,待剥离区域的部分易断裂且难以剥离的问题,提高了产品质量和生产效率。
可选的,如图1和图4所示,所述剥离机构20包括:翻转装置21和剥离装置22;吸附装置40在吸附导电层50后移动至翻转装置21上,翻转装置21通过旋转将吸附装置40首次翻转,让导电层50背离吸附装置40的一面朝向重力方向Y;在吸附装置40首次翻转后,剥离装置22处于导电层50背离吸附装置40的一侧位置;剥离装置22用于在吸附装置40首次翻转后,与导电层50背离吸附装置40的一面接触,以使导电层50中的待剥离区域脱离。
在本申请实施例中,剥离机构20可以采用将吸附装置40翻转的方式(优选为翻转180°),使得在导电层50背离吸附装置40的一面朝向重力方向Y的情况下,通过重力作用自动引导导电层50中的至少部分待剥离区域脱离,这种剥离方式简单且高效。需要说明的是,在重力作用下,可能存在导电层50中的部分待剥离区域被去除的现象,也可能存在导电层50中的全部待剥离区域被去除的现象。
具体的,翻转装置21可以替代剥离机构20所处的这一段传输面的传输作用(翻转装置21未翻转时,表面可以进行物体的传输),即翻转装置21未翻转时,其承载面与传输面A齐平,翻转装置21的承载面可以承载并传输吸附装置40,翻转装置21进一步可以自身产生旋转以实现对承载的吸附装置40的翻转,使得导电层50背离吸附装置40的一面朝向重力方向Y。
进一步的,在导电层50中的至少部分待剥离区域依靠重力作用脱离后,可能还存在另一部分待剥离区域未脱离导电层50或重力作用未能去除待剥离区域,则为了保证待剥离区域的尽可能全部脱离,本申请实施例还可以引入剥离装置22进一步实现剩余待剥离区域或重力作用未能去除的待剥离区域的剥离,即剥离装置22可以对导电层50背离吸附装置40的一面接触并施加作用力,在作用力下使得待剥离区域脱离。
可选的,参照图1,剥离机构20还包括:搬运装置23;待剥离装置22工作后,翻转装置21通过旋转将吸附装置40再次翻转,让导电层50背离吸附装置40的一面背离重力方向;吸附装置40再次翻转后,搬运装置23用于将上料台70上放置的设有粘接层的背板60进行抓取,并将背板60具有粘接层的一面与背离吸附装置的一面层叠接触。
在本申请实施例中,可以在剥离机构20实现剥离后,翻转装置21通过旋转将吸附装置40再次翻转,使得导电层50背离吸附装置40的一面背离重力方向。之后通过剥离机构20中设置的搬运装置23进一步自动实现对背板60的搬运及放置,具体的,剥离机构20处可以设置有横梁80,搬运装置23可以在横梁80上移动,搬运装置23包括但不限于为具有吸附功能的装置(图1所示)或机械爪,搬运装置23在横梁80上移动到上料台70的位置,并抓取上料台70上放置的设有粘接层的背板60,之后搬运装置23在横梁80上移动到吸附装置40所处位置,并将抓取的背板60放下,使得背板60设有粘接层的一面与导电层50背离吸附装置40的一面接触,形成待加工件。待加工件依旧被吸附装置40所吸附,并由传输面A继续传输至复合机构30。
其中,复合机构30可以对待加工件的至少一个表面(导电层所处面、背板所处面)进行加热,并施加压力,使得背板60通过粘接层与导电层50热压形成牢固粘接。例如,复合机构30可以包括两个相对设置的导热板,通过导热板与待加工件的表面的接触实现加热,且两个相对设置的导热板可以相互靠近,从而实现对待加工件的表面的压力的施加。需要说明的是,热压为优选的实施方式,在其它实施方式中,复合机构30也可不具有加热功能,即压合步骤的优选的实施方式为热压。
可选的,参照图5,剥离装置22包括:吹风机221;吹风机221的出风方向面向导电层50背离吸附装置的一面;吹风机221的出风宽度H1大于或等于导电层50中图形结构51的宽度h;吹风机221用于在驱动下,沿导电层50的长度方向移动。
具体的,一种实现方式中,剥离装置22可以包括吹风机221,即通过吹风机211面向导电层50背离吸附装置的一面吹风作用,对导电层50中的待剥离区域施加作用力,使得待剥离区域脱落。其中,吹风机221具有长条形的出风口,吹风机221在驱动下沿导电层50的长度方向移动,吹风机221的出风宽度H1大于或等于导电层50中图形结构51的宽度h,即可以从导电层50的一个短边移动至另一个短边,形成覆盖导电层50中全部图形结构51的作用力,保证对全部待剥离区域的作用力的施加,从而尽可能的对所有待剥离区域进行去除。
可选的,参照图6,剥离装置22包括:刷子222;刷子222用于与导电层50背离吸附装置的一面接触;刷子222的宽度H2大于或等于导电层50中图形结构的宽度h;刷子222用于在驱动下,沿导电层50的长度方向移动。
具体的,另一种实现方式中,剥离装置22可以包括刷子222,即通过刷子222与导电层50背离吸附装置的一面的接触,对导电层50中的待剥离区域施加作用力,使得待剥离区域脱落。其中,刷子222在驱动下沿导电层50的长度方向移动,刷子222的宽度H2大于或等于导电层50中图形结构的宽度h,即可以从导电层50的一个短边移动至另一个短边,形成覆盖导电层50中全部图形结构51的作用力,保证对全部待剥离区域的作用力的施加,从而尽可能的对所有待剥离区域进行去除。刷子的刷毛可以采用具有弹性的软质刷毛,在起到作用力施加的基础上,又不至于对导电层的表面造成划伤。
可选的,参照图7,剥离装置22包括:滚筒223;滚筒223用于与导电层50背离吸附装置的一面接触;滚筒223的宽度H3大于或等于导电层50中图形结构的宽度h;滚筒223用于在驱动下,沿导电层50的长度方向移动。
具体的,另一种实现方式中,剥离装置22可以包括滚筒223,即通过滚筒223与导电层50背离吸附装置的一面的滚动接触,对导电层50中的待剥离区域施加作用力,使得待剥离区域脱落。其中,滚筒223在驱动下沿导电层50的长度方向移动,滚筒223的宽度H3大于或等于导电层50中图形结构的宽度h,即可以从导电层50的一个短边移动至另一个短边,形成覆盖导电层50中全部图形结构51的作用力,保证对全部待剥离区域的作用力的施加,从而尽可能的对所有待剥离区域进行去除。
可选的,参照图7,滚筒表面设置有柔性接触层224;柔性接触层224表面间隔设置有柔性凸起结构225。
在本申请实施例中,滚筒表面设置有柔性接触层224(如硅胶层),柔性接触层224可以在起到作用力施加的基础上,又不至于对导电层的表面造成划伤,进一步的,柔性接触层224表面间隔设置有柔性凸起结构225,使得柔性凸起结构225可以在不划伤导电层的表面的基础上,增加对图形结构51中待剥离区域所施加的作用力,从而进一步提升对待剥离区域的剥离效果。
可选的,参照图1,光伏背板加工设备还包括:设置在载台10上的上料裁切装置90和激光制版装置100;上料裁切装置90处于载台10的上料端,激光制版装置100处于上料裁切装置90和剥离机构20之间;上料裁切装置90中设置有导电层卷材91;上料裁切装置90用于将导电层卷材91的一端引出至传输面A上的吸附装置40,并裁切形成导电层50;激光制版装置100用于对经过的导电层50进行激光刻画,在导电层50表面形成图形结构。
在本申请实施例中,还可以通过上料裁切装置90实现自动上料及切割,以及通过激光制版装置100实现导电层50中图形结构的自动刻画,从而提高整体流程的自动化程度,从而提升生产效率。
具体的,上料裁切装置90上放置有导电层卷材91以及切刀,导电层卷材91的一端被引出到传输面A上的吸附装置40,随着传输面A带动吸附装置40移动,导电层卷材91引出的连续导电层也越多,当引出的连续导电层长度达到要求时,切刀可以工作,从而切断一定长度的连续导电层,形成在吸附装置40上吸附的用于进行后续激光雕刻的导电层50。
激光制版装置100具有多个激光发生器,用于向导电层50的表面释放激光,从而以激光雕刻的方式,在导电层50的表面制备图形结构,激光雕刻后会形成一些多余区域需要被去除,即本申请实施例的待剥离区域。
一种实现方式中,激光制版装置100位置可以固定,传输面A带动导电层50移动的过程中会经过激光制版装置100,导电层50从进入激光制版装置100至离开激光制版装置100的过程中,激光制版装置100工作实现了激光雕刻。
另一种实现方式中,激光制版装置100可以置于轨道上,使得激光制版装置100的位置可以移动,传输面A上承载导电层50的吸附装置40的位置可以静止,激光制版装置100通过移动在导电层50的表面制备图形结构,从而实现了激光雕刻,制备完成后,传输面A继续传输吸附装置40。
可选的,参照图2和图4,吸附装置40为真空吸附载板;真空吸附载板上设置有吸附孔41,在真空吸附载板吸附了导电层50时,吸附孔41(图2中虚线框出的吸附孔41为透视结构,即吸附孔41实际处于真空吸附载板表面)的位置与导电层50中的待剥离区域互不重叠。
在本申请实施例中,吸附装置40为真空吸附载板,并通过真空发生机构42产生真空吸附效应,从而可以牢牢的将导电层50进行吸附,真空吸附载板与载台的传输面之间例如可以使用销钉相互固定,但并不以此为限。具体的,真空吸附载板通过吸附孔41实现了对导电层50的吸附,且吸附孔41的位置与导电层50中的待剥离区域互不重叠,从而避免了因真空吸附对待剥离区域吸附,而导致待剥离区域无法脱离的现象。
可选的,参照图8,图形结构51包括:沿导电层50的宽度方向并列排布的多个区域511,进一步参照图9,每个区域511包括首尾依次连接的多个间隔的子区域5111,多个子区域5111呈弯折排列在区域511中;多个区域511各自的子区域5111构成待剥离区域;在真空吸附载板吸附了导电层50时,真空吸附载板中对应每个区域511的长边外侧的位置,设置有间隔排列的第一吸附孔411,对应每个区域中的至少一组相邻子区域5111之间的位置,设置有间隔排列的第二吸附孔412;第二吸附孔412的尺寸小于第一吸附孔411的尺寸。需要说明的是,弯折排列例如可为S型排列,但并不以此为限。
可选的,参照图8和图9,第二吸附孔412的排列方向垂直于第一吸附孔411的排列方向,第二吸附孔412之间的间隔距离小于第一吸附孔411之间的间隔距离。
在本申请实施例中,参照图8,图形结构51具体可以包括沿导电层50的宽度方向并列排布的多个区域511,图8中示出了4个横向间隔排列的区域511,每个区域511中包括多个竖向间隔排列的子区域5111,相邻子区域5111之间首尾依次连接,连接部位呈弧形,使得每个区域511的多个子区域5111呈S型排列(俯视视角下)。
具体的,吸附孔41包括:对应每个区域511的长边外侧的位置间隔设置的第一吸附孔411,以及对应每个区域中的至少一组相邻子区域5111之间的位置间隔设置的第二吸附孔412。其中,第一吸附孔411的排列方向可以与第二吸附孔412的排列方向垂直,并且第二吸附孔412的尺寸小于第一吸附孔411的尺寸。这是因为第一吸附孔411的排列区域的面积大于第二吸附孔412的排列区域的面积,因此,第一吸附孔411的尺寸可以相对较大,第一吸附孔411之间的间隙可以相对较宽,而第二吸附孔412的尺寸可以相对较小,第二吸附孔412之间的间隙可以相对较窄,即在不同的非剥离区域以不同的方式设置吸附孔来实现更好的吸附效果且不影响剥离效果。换言之,通过上述形式的第一吸附孔411和第二吸附孔412的配合,可以对完成剥离的导电层实现更好吸附效果,且不影响待剥离区域的剥离。
可选的,参照图10,在真空吸附载板吸附了导电层时,第二吸附孔412的边缘与待剥离区域的边缘之间的最小距离L为0.1mm至2mm。
在本申请实施例中,第二吸附孔412的位置需要与待剥离区域设置的近,但又不至于太近,因此,本申请实施例可以将第二吸附孔412的边缘与待剥离区域的边缘之间的最小距离L设置为0.1mm至2mm,这样可以使得第二吸附孔412在吸附时,能够尽可能的固定住待剥离区域的周边,以利于待剥离区域的剥离;但第二吸附孔412也不能靠待剥离区域太近,考虑到真空吸附载板与导电层吸附时会存在对位误差,若太近,可能会使得第二吸附孔412没有对位好而与待剥离区域有所重叠,影响后续的剥离操作。故采用了0.1mm~2mm这个距离范围,以兼顾以上两者。
可选的,光伏背板加工设备还包括:视觉检测装置和清洁装置;视觉检测装置及清洁装置设置在载台中复合机构之后的位置;视觉检测装置用于对压合后的导电层和背板进行图像采集及图像识别;清洁装置用于在识别到导电层的待剥离区域中存在残渣时,清除残渣。
本申请实施例可以采用视觉的检测方式,首先通过视觉检测装置拍摄压合后的导电层和背板,得到拍摄图像,之后可以对拍摄图像进行图像识别,识别导电层中待剥离区域的特征,若发现待剥离区域中存在残渣特征,则确认识别到残渣,之后可以进行对残渣的清除,清除操作可以由人工或清洁装置实现。
需要说明的是,本申请实施例还可以在完成将导电层中的待剥离区域剥离时,进行残渣的检测和清除操作;也可以既在完成将导电层中的待剥离区域剥离时,进行残渣的检测和清除操作,又在将完成剥离的导电层和设有粘接层的背板进行压合后,进行残渣的检测和清除操作。
参照图2,本申请实施例还提供一种吸附装置40,吸附装置40包括:真空吸附载板;进一步参照图8,在真空吸附载板上沿第一方向P间隔设置有第一吸附孔411,在真空吸附载板上沿第二方向Q间隔设置有第二吸附孔412,第一方向P与第二方向Q相交,第一吸附孔411和第二吸附孔412的尺寸不同;在真空吸附载板吸附了导电层50时,第一吸附孔411和第二吸附孔412的位置与导电层50中的待剥离区域互不重叠。优选的,第一方向P与第二方向Q垂直。
在本申请实施例中,吸附装置40为真空吸附载板,并通过真空发生机构42产生真空吸附效应,从而可以牢牢的将导电层50进行吸附,真空吸附载板与载台的传输面之间例如可以使用销钉相互固定。具体的,真空吸附载板通过在两个不同的方向设置有尺寸不同的吸附孔实现了对完成剥离的导电层50的更好吸附,且吸附孔41的位置与导电层50中的待剥离区域互不重叠,从而避免了因真空吸附对待剥离区域吸附,而导致待剥离区域无法脱离的现象。
可选的,参照图8,图形结构51包括:沿导电层50的宽度方向并列排布的多个区域511,进一步参照图9,每个区域511包括首尾依次连接的多个间隔的子区域5111,多个子区域5111呈弯折排列在区域511中;多个区域511各自的子区域5111构成待剥离区域;在真空吸附载板吸附了导电层50时,真空吸附载板中对应每个区域511的长边外侧的位置,设置有间隔排列的第一吸附孔411,对应每个区域中的至少一组相邻子区域5111之间的位置,设置有间隔排列的第二吸附孔412;第二吸附孔412的尺寸小于第一吸附孔411的尺寸。需要说明的是,弯折排列例如可为S型排列,但并不以此为限。
可选的,参照图8和图9,第二吸附孔412的排列方向垂直于第一吸附孔411的排列方向,第二吸附孔412之间的间隔距离小于第一吸附孔411之间的间隔距离。
在本申请实施例中,参照图8,图形结构51具体可以包括沿导电层50的宽度方向并列排布的多个区域511,图8中示出了4个横向间隔排列的区域511,每个区域511中包括多个竖向间隔排列的子区域5111,相邻子区域5111之间首尾依次连接,连接部位呈弧形,使得每个区域511的多个子区域5111呈S型排列(俯视视角下)。
具体的,吸附孔41包括:对应每个区域511的长边外侧的位置间隔设置的第一吸附孔411,以及对应每个区域中的至少一组相邻子区域5111之间的位置间隔设置的第二吸附孔412。其中,第一吸附孔411的排列方向可以与第二吸附孔412的排列方向垂直,并且第二吸附孔412的尺寸小于第一吸附孔411的尺寸。这是因为第一吸附孔411的排列区域的面积大于第二吸附孔412的排列区域的面积,因此,第一吸附孔411的尺寸可以相对较大,第一吸附孔411之间的间隙可以相对较宽,而第二吸附孔412的尺寸可以相对较小,第二吸附孔412之间的间隙可以相对较窄,即在不同的非剥离区域以不同的方式设置吸附孔来实现更好的吸附效果且不影响剥离效果。换言之,通过上述形式的第一吸附孔411和第二吸附孔412的配合,可以对完成剥离的导电层实现更好吸附效果,且不影响待剥离区域的剥离。
可选的,参照图10,在真空吸附载板吸附了导电层时,第二吸附孔412的边缘与待剥离区域的边缘之间的最小距离L为0.1mm至2mm。
在本申请实施例中,第二吸附孔412的位置需要与待剥离区域设置的近,但又不至于太近,因此,本申请实施例可以将第二吸附孔412的边缘与待剥离区域的边缘之间的最小距离L设置为0.1mm至2mm,这样可以使得第二吸附孔412在吸附时,能够尽可能的固定住待剥离区域的周边,以利于待剥离区域的剥离;但第二吸附孔412也不能靠待剥离区域太近,考虑到真空吸附载板与导电层吸附时会存在对位误差,若太近,可能会使得第二吸附孔412没有对位好而与待剥离区域有所重叠,影响后续的剥离操作。故采用了0.1mm~2mm这个距离范围,以兼顾以上两者。
在本申请实施例中,可以先在导电层上制备图形结构,之后再对图形结构中的待剥离区域进行剥离去除,最后再将设有粘接层的背板与完成剥离的导电层层叠后进行热压,得到光伏背板。相较于相关技术,本申请实施例无需先将背板与导电层热压复合后,再在导电层上制备图形结构并去除待剥离区域,这样去除待剥离区域时,就可以消除因待剥离区域与背板牢固粘接而带来的不便,本申请由于剥离待剥离区域时,导电层还未与背板粘接,因此剥离相对简单,从而解决了相关技术中剥离待剥离区域时,待剥离区域的部分易断裂且难以剥离的问题,提高了产品质量和生产效率。
第二方面,参照图11,本申请实施例公开了一种光伏背板制备方法,该光伏背板制备方法包括:
步骤101,至少获得表面具有图形结构的导电层。
其中,参照图12,导电层1的表面具有图形结构,图形结构具有需分离部分11,导电层1中至少需分离部分11未与背板连接。需分离部分11也即图形结构中需要被去除的多余部分。导电层1的材料具体根据材料成本和导电能力的要求确定。导电层1的材料可以为纯导电材料,也可以为由多种材料通过电镀、蒸镀、化学镀等方式形成的复合导电材料。基于成本和导电能力考虑,导电层1的厚度可以为0.01mm-50mm。
可以基于背接触电池片的背面的电极结构,对应设计导电层中的图形结构的图案样式,该图案样式是能够形成电隔离的图形,这样可以避免互联时的短路现象,对图形结构的具体设计样式本申请实施例不做具体限定。其中,图形结构刻画完成后,存在多余的需分离部分11需要被从导电层中分离出去,从而形成可以用于后续电连接的图形结构。
一种实施方式中,至少获得表面具有图形结构的导电层可以包括:仅获得表面具有图形结构的导电层。另一种实施方式中,至少获得表面具有图形结构的导电层可以包括:获得局部压合后的导电层、粘接层和背板;在导电层表面形成图形结构。
步骤102,对导电层中的需分离部分进行吹气。
其中,可以通过吹气装置对导电层1中的需分离部分11进行吹气。吹气装置吹出的气流的方向可以为从下向上的方向。对导电层1中的需分离部分11进行吹气时,导电层1可以被吸附在第一载具2上,导电层1位于第一载具2的下面,吹气装置位于第一载具2的下方。
步骤103,将导电层中的需分离部分分离。
其中,可以通过分离装置将导电层中的需分离部分分离。分离装置可以包括夹取组件5、夹取分离组件7、滚刷4中的任一个。
光伏背板制备工艺包括去废工艺,去废工艺也即去除导电层1中的需分离部分11的工艺。本实施例中,去废工艺可以包括对导电层中的需分离部分进行吹气和将导电层1中的需分离部分11分离。需分离部分11通常为较细的丝状,因此,需分离部分11又可以称为废丝。需分离部分11的宽度越细,光伏背板的导电能力越强。需分离部分11的宽度可以为0.05mm-10mm。
本申请实施例中,对导电层1中的需分离部分11进行吹气,并将导电层1中的需分离部分11分离的过程中,需分离部分11未与背板连接,易于将需分离部分11吹离并分离,且需分离部分11不易断裂,能够提高去废效率,能够避免因金属导电层与背板粘接较为牢固而导致的在剥离图形结构中的多余区域时,多余区域易断裂且难以剥离。此外,本实施例中,由于需分离部分11不易断裂,因此,可以减小需分离部分11的宽度,需分离部分11的宽度减小后,能够降低光伏背板的电阻率,提高光伏背板的导电能力,从而能够提高包括该光伏背板的光伏组件的功率。
在本申请的一个可选实施例中,步骤101,对导电层中的需分离部分进行吹气,包括:通过振荡吹气组件对导电层中的需分离部分进行吹气。
其中,振荡吹气组件3包括可周期性往复运动的吹嘴31。振荡吹气组件3包括多个吹嘴31,多个吹嘴31分别通过多个吹嘴固定块32连接在第一支架33上。吹嘴31具体沿第一支架33的长度方向周期性往复运动。本实施例中,通过可周期性往复运动的吹嘴31进行吹气,能够增强吹气效果,更加容易吹离需分离部分11,避免需分离部分11与需保留部分12粘连。
在本申请的一个可选实施例中,步骤103,将导电层中的需分离部分分离,包括:夹取被吹离的导电层中的需分离部分;使需分离部分与导电层的需保留部分相对运动,以使导电层中的需分离部分分离。
其中,导电层1的需保留部分12也即导电层1中需要留下的部分。可以通过夹取组件5、夹取分离组件7夹取被吹离的导电层中的需分离部分。可以使需分离部分运动,或者,使导电层1本身运动,来使需分离部分与导电层的需保留部分相对运动。吹气装置将需分离部分11吹离后,需分离部分11的端部可能会粘连在需保留部分12上,通过在吹气后夹取并分离需分离部分11,能够保证需分离部分11与需保留部分12的彻底分离,提高整体去废率。
在本申请的一个可选实施例中,使需分离部分与导电层的需保留部分相对运动,包括:向远离导电层的需保留部分的方向传输需分离部分。
其中,分离装置包括夹取分离组件7,夹取分离组件7位于第一载具2的下方;夹取分离组件7包括两个相对设置且相向转动的夹辊71。夹取分离组件还包括防缠绕机构;防缠绕机构包括两个辅助辊72和两个传输带73,单个传输带73绕设在位于夹取分离组件7沿两个夹辊71的排列方向的同一侧的辅助辊72和夹辊71上。具体可以通过传输带73向远离导电层1的需保留部分12的方向传输需分离部分11,以避免需分离部分11缠绕在夹辊71上。
在本申请的一个可选实施例中,参照图13,本申请实施例公开了另一种光伏背板制备方法,该光伏背板制备方法包括:
步骤201,仅获得表面具有图形结构的导电层;
步骤202,对导电层中的需分离部分进行吹气;
步骤203,将导电层中的需分离部分分离;
步骤204,将完成分离的导电层和设有粘接层的背板进行压合,得到光伏背板。
其中,仅获得表面具有图形结构的导电层可以包括:从导电层卷材的一端引出连续导电层并裁切,形成导电层;对导电层进行激光刻画,在导电层表面形成图形结构。需要说明的是,还可以通过其它物理或者化学方式在导电层表面形成图形结构,其它物理方式可以为刀具切割、一体冲压等,化学方式可以为化学液腐蚀等。
可以通过上料裁切装置实现自动上料及切割,上料裁切装置上可以放置有导电层卷材以及切刀,导电层卷材的一端被引出,当引出的连续导电层长度达到要求时,切刀可以工作,从而切断一定长度的连续导电层,形成导电层1。可以通过激光制版装置对导电层1进行激光刻画,激光制版装置可以包括多个激光发生器,激光发生器用于向导电层1的表面释放激光,从而以激光雕刻的方式,在导电层1的表面制备图形结构,激光雕刻后会形成一些多余部分需要被去除,该区域也即本申请实施例中的需分离部分。
背板的一面可以提前覆有粘接层。粘接层可以为胶膜,胶膜可以为EVA(Ethylene Vinyl Acetate,乙烯-醋酸乙烯共聚物)胶膜、POE(Polyolefin Elastomer,聚烯烃弹性体)胶膜等。胶膜的物理形态可以为固体状态,也可以为液体胶状。可以先将设有粘接层的背板与完成分离的导电层1层叠,形成第一待压合工件,之后,将第一待压合工件放置在压合装置上,通过压合装置将完成分离的导电层和设有粘接层的背板进行压合。其中,第一待压合工件中,粘接层位于导电层1与背板之间。
本实施例中,先在单独的导电层表面形成图形结构,之后将单独的导电层1中的需分离部分11去除,最后,将完成分离的导电层和设有粘接层的背板进行压合。该实施例中,可以利用常规的压合装置将完成分离的导电层和设有粘接层的背板进行压合,无需额外配置特制的压合装置。
在本申请的一个可选实施例中,参照图14,本申请实施例公开了再一种光伏背板制备方法,该光伏背板制备方法包括:
步骤301,将导电层的需保留部分和设有粘接层的背板进行局部压合;
步骤302,获得局部压合后的导电层、粘接层和背板;
步骤303,在导电层表面形成图形结构;
步骤304,对导电层中的需分离部分进行吹气;
步骤305,将导电层中的需分离部分分离。
其中,可以通过局部压合装置8将导电层1的需保留部分12和设有粘接层的背板进行局部压合。可以先将设有粘接层的背板与导电层1层叠,形成第二待压合工件,之后,将第二待压合工件放置在局部压合装置8中的下压板82上,通过局部压合装置8将导电层的需保留部分和设有粘接层的背板进行局部压合。其中,第二待压合工件中,粘接层位于导电层1与背板之间。
在导电层表面形成图形结构可以包括:对导电层进行激光刻画,在导电层表面形成图形结构。本申请实施例中,对导电层1中的需分离部分11进行吹气,将导电层1中的需分离部分11分离的整个过程中,导电层1的需保留部分12通过粘接层粘接在背板上,因此,去除需分离部分11的整个过程中,需保留部分12中的指状导电部分121不会被吹离,从而能够避免后续夹取需分离部分11时夹取到指状导电部分121的风险。
光伏背板制备完成后,先将汇流条焊接在光伏背板上,之后,将光伏背板与绝缘膜热压在一起,然后,通过排版技术将电池片摆放到设置有绝缘膜的光伏背板上,之后,铺设胶膜和玻璃,最后将玻璃、胶膜、电池片、设置有绝缘膜的光伏背板进行层压,得到光伏层压件。
绝缘膜的主要作用为绝缘、热压粘合作用。绝缘膜的表面通过物理或化学的方法形成有孔图形,孔图形可以是圆形、三角形、方形等任意图形,孔图形根据电池片需要导电部位的尺寸和位置设立。孔图形优选为圆形图形,圆形图形可以用于电池片中的圆形的焊盘点、方形的焊盘点,或其它图形的焊盘点。绝缘膜的材质可以是单一材质,绝缘膜的材质也可以是多种材质复合在一起,例如EVA、POE、PET(Polyethylene Terephthalate,聚对苯二甲酸乙二醇酯)等多种材质复合在一起。
第三方面,参照图15至图22,本申请实施例公开了一种光伏背板制备设备,包括吹气装置和分离装置,吹气装置用于对导电层1中图形结构中的需分离部分11进行吹气,导电层1中至少需分离部分11未与背板连接,分离装置用于将导电层1中的需分离部分11分离。
其中,吹气装置吹出的气流的方向可以为从下向上的方向。对导电层1中的需分离部分11进行吹气时,导电层1可以被吸附在第一载具2上,导电层1位于第一载具2的下面,吹气装置位于第一载具2的下方。分离装置可以包括夹取组件5、夹取分离组件7、滚刷4中的任一个。
本申请实施例中,对导电层1中的需分离部分11进行吹气,并将导电层1中的需分离部分11分离的过程中,需分离部分11未与背板连接,易于将需分离部分11吹离并分离,且需分离部分11不易断裂,能够提高去废效率,能够避免因金属导电层与背板粘接较为牢固而导致的在剥离图形结构中的多余区域时,多余区域易断裂且难以剥离。
在本申请的一个可选实施例中,参照图15至图17,吹气装置包括振荡吹气组件3,振荡吹气组件3包括可周期性往复运动的吹嘴31。
其中,振荡吹气组件3包括多个吹嘴31,多个吹嘴31分别通过多个吹嘴固定块32连接在第一支架33上。吹嘴31具体沿第一支架33的长度方向周期性往复移动。本实施例中,通过可周期性往复运动的吹嘴31进行吹气,能够增强吹气效果,更加容易吹离需分离部分11,避免需分离部分11与需保留部分12粘连。
振荡吹气组件3还包括吹气驱动件34和第二支架35,其中,吹气驱动件34与第一支架33相连,吹气驱动件34用于驱动第一支架33沿其长度方向往复移动。吹气驱动件34可以为气缸。第一支架33通过第一导轨滑块机构36与第二支架35相连,第一导轨滑块机构36可以包括第一滑块和第一导轨,第一导轨可以设置在第二支架35上,第一滑块滑动连接在第一导轨上,第一滑块与第一支架33相连。第一导轨滑块机构36起导向作用。
振荡吹气组件3吹气过程中,第二支架35的位置可以固定不动,第二支架35也可以沿第一方向移动,第一方向与第二支架35的长度方向相垂直,且与第二支架35的高度方向相垂直,第一方向可以与导电层1中指状导电部分121的长度方向相平行,导电层1中指状导电部分121的长度方向可参照图12中B箭头示出的方向。
在本申请的一个可选实施例中,沿导电层1的厚度方向,吹气装置与导电层1之间的距离大于或等于55毫米。吹气装置若距离导电层1太近,存在将导电层1吹褶皱的风险,从而易导致电池片隐裂,本实施例中,吹气装置与导电层1之间的距离在上述范围内时,能够避免因吹气装置若距离导电层1太近而导致的将导电层1吹褶皱的风险。
在本申请的一个可选实施例中,吹气装置吹出的气流的流量大于或等于600L/min,小于或等于750L/min。其中,吹气装置吹出的气流的流量可以为600L/min、620L/min、650L/min、700L/min、750L/min等。吹气装置吹出的气流的流量在上述范围内时,能够保证吹气效果,且能够避免损伤导电层1。
在本申请的一个可选实施例中,参照图19,光伏背板制备设备还包括第一载具2,第一载具2至少用于吸附导电层1,导电层1位于第一载具2的下面。
在本申请的一个可选实施例中,参照图20和图21,分离装置包括夹取分离组件7,夹取分离组件7位于第一载具2的下方;夹取分离组件7包括两个相对设置且相向转动的夹辊71。吹气装置将需分离部分11吹离后,需分离部分11的端部可能会粘连在需保留部分12上,在吹气后,通过夹取分离组件7夹取并分离需分离部分11,能够保证需分离部分11与需保留部分12的彻底分离,提高整体去废率。
在本申请的一个可选实施例中,沿导电层1的厚度方向,夹取分离组件7与导电层1之间的距离大于图形结构中指状导电部分121的长度。其中,指状导电部分121是图形结构中类似手指形状的条形图案,指状导电部分121的长度方向可参照图12中B箭头示出的方向,指状导电部分121的长度可参照图12中示出的L1。吹气装置吹气时,指状导电部分121存在被吹离的风险。本实施例中,通过夹取分离组件7与导电层1之间的距离大于图形结构中指状导电部分121的长度的设置,即使指状导电部分121被吹离,夹取分离组件7也不会夹到指状导电部分121。
在本申请的一个可选实施例中,参照图20,夹取分离组件7还包括防缠绕机构;防缠绕机构包括两个辅助辊72和两个传输带73,单个传输带73绕设在位于夹取分离组件7沿两个夹辊71的排列方向的同一侧的辅助辊72和夹辊71上。
其中,两个辅助辊72分别位于两个夹辊71的下方。两个夹辊71的排列方向也即由其中一个夹辊71指向另一个夹辊71的方向。夹取分离组件7还包括驱动电机74,驱动电机74通过传动机构75与夹辊71相连,驱动电机74用于通过传动机构75驱动夹辊71转动。传动机构75可以皮带传动机构,皮带传动机构可以包括带轮和皮带。夹辊71转动时,会带动绕设在其上的传输带73运动,以使传输带73向远离导电层1的需保留部分12的方向传输需分离部分11。本实施例中,通过传输带73能够向远离导电层1的需保留部分12的方向传输需分离部分11,以避免需分离部分11缠绕在夹辊71上。
需要说明的是,图21中,夹取分离组件7包括夹辊71,不包括传输带73时,可以在夹辊71的两侧及上方需安装刮板机构及保护罩,刮板机构能够刮下绕卷在夹辊71上的需分离部分11,从而能够避免需分离部分11经夹辊71转动再次缠绕到夹辊71上。保护罩能够避免需分离部分11悬挂夹辊71的辊轴上。
在本申请的一个可选实施例中,参照图15和图18,分离装置包括夹取组件5,夹取组件5位于第一载具2的下方,夹取组件5用于夹取被吹离的导电层1中的需分离部分11;分离装置还包括分离驱动件,分离驱动件用于驱动夹取组件5运动;和/或,第一载具2包括传输组件,传输组件用于传输和吸附导电层。
其中,夹取组件5可以与振荡吹气组件3集成在一起。夹取组件5可以安装在第二支架35上。优选地,第一载具2包括传输组件,且分离装置还包括分离驱动件。需要说明的是,分离驱动件驱动夹取组件5运动时,传输组件可以不工作。分离驱动件具体用于驱动夹取组件5沿第二支架35的长度方向移动。吹气装置将需分离部分11吹离后,需分离部分11的端部可能会粘连在需保留部分12上,在吹气后,通过夹取组件5夹取并分离需分离部分11,能够保证需分离部分11与需保留部分12的彻底分离,提高整体去废率。
在本申请的一个可选实施例中,参照图15和图18,夹取组件5包括第一夹条55和第二夹条52;夹取组件5还包括夹取驱动件53,夹取驱动件53用于驱动第一夹条55或者第二夹条52沿第一夹条55的长度方向移动;第一夹条55和第二夹条52层叠设置,第一夹条55沿第一夹条55的长度方向上开设有若干夹槽511,第二夹条52包括沿第一夹条55的长度方向间隔排布的若干夹钩521;或者,第一夹条55和第二夹条52分别包括沿第一夹条的长度方向间隔排布的若干第一夹爪和若干第二夹爪,沿第一夹条55的长度方向,第一夹爪和第二夹爪交替排布。
其中,夹取驱动件53具体用于直接驱动第二夹条52移动,以驱动第二夹条52相对于第一夹条55移动。夹取驱动件53可以为气缸。优选地,夹取驱动件53用于驱动第二夹条52沿第一夹条55的长度方向移动,第一夹条55固定在第二支架35上。第一夹条55的长度方向可以与导电层1中指状导电部分121的排布方向相平行,第一夹条55的长度方向可参照图15和图18中C箭头示出的方向,导电层1中指状导电部分121的排布方向可以参照图12中A箭头示出的方向。
夹取组件5与振荡吹气组件3集成在一起时,第一夹条55通过第二导轨滑块机构54与第二支架35连接。第二导轨滑块机构54可以包括第二滑块和第二导轨,第二导轨可以设置在第二支架35上,第二滑块滑动连接在第二导轨上,第二滑块与第一夹条55相连。
第二夹条52移动时具体沿第一夹条55的长度方向往复移动。第一夹条55和第二夹条52分别包括若干第一夹爪和若干第二夹爪这一实施方式中,初始时,第一夹爪与第二夹爪之间具有一定的间隙,需分离部分11被吹离后会落在第一夹爪与第二夹爪之间,之后第二夹条52移动会带动第二夹爪朝向第一夹爪移动,以实现对需分离部分11的夹取。
夹钩521的形状可以为类L形。第一夹条55上开设有若干夹槽511,第二夹条52包括若干夹钩521这一实施方式中,需分离部分11被吹离后会落在夹槽511内,之后,第二夹条52移动,在夹钩521与夹槽511的配合下,实现对需分离部分11的夹取。
夹槽511的形状可以为V形,以便需分离部分11更好地进入至夹槽511内。需要说明的是,由于夹槽511的宽度或者第一夹爪与第二夹爪之间的距离较小,因此,即使指状导电部分121被吹离,也不会落入夹槽511内或者第一夹爪与第二夹爪之间,因此,对于夹取组件5与导电层1之间的距离可以不做限制。
在本申请的一个可选实施例中,参照图22,分离装置包括滚刷4,滚刷4用于与导电层1背离第一载具2的一面接触。其中,滚刷4的表面具有一圈刷毛,通过刷毛能够刮去导电层1中的需分离部分11。滚刷4刮去导电层1中的需分离部分11的过程中,滚刷4边转动边移动,以将整个导电层1中的需分离部分11刮除。
在本申请的一个可选实施例中,参照图23至图25,光伏背板制备设备还包括局部压合装置8,局部压合装置8用于将导电层1的需保留部分和设有粘接层的背板进行局部压合;局部压合装置8包括上压板81和下压板82,上压板81上开设有第一避让凹槽811,和/或,下压板82上开设有第二避让凹槽822。
其中,上压板81包括凸出部812,凸出部812具有上压面,凸出部812可以为长条形凸起,长条形凸起的长度方向与上压板81的宽度方向相平行。下压板82具有下压面821,热压时,凸出部812的上压面与下压面821配合将导电层1的需保留部分12和设有粘接层的背板进行局部压合。第一避让凹槽811和第二避让凹槽822的形状和尺寸可以与需分离部分11匹配。本实施例中,通过第一避让凹槽811和第二避让凹槽822的配合,能够避免热压过程中,导电层1中的需分离部分11与背板粘接在一起。
参照图26和图27,本申请实施例还公开了第二载具6和吸附装置,第二载具6用于吸附导电层1,导电层1位于第二载具6的上面。
一种实施方式中,吸附装置包括吸附罩9,吸附罩9位于第二载具6的上方,吸附罩9将导电层1中的需分离部分11逐一吸至收集装置内。
另一种实施方式中,吸附装置包括吸嘴组件110,吸嘴组件110位于第二载具6的上方。吸嘴组件110可以包括吸嘴固定支架和多个吸嘴,吸嘴固定支架可上下移动和左右移动,吸嘴可以通过弹性件连接在吸嘴固定支架上,吸嘴用于吸取导电层1中的需分离部分11。吸嘴的尺寸大小可以与需分离部分11的尺寸一致。
需要说明的是,吸嘴组件110可以与两个相对设置且相向转动的夹辊配合使用。当吸嘴先下降吸取需分离部分11后,会向上提起需分离部分11,到达一定高度后,两个夹辊会将吸起的需分离部分11夹住,再整体向上抬起,当抬起到需分离部分11脱离需保留部分12后,将需分离部分11移除到收集装置内。
需要说明的是,在本文中,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象,而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换,以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施,且“第一”、“第二”等所区分的对象通常为一类,并不限定对象的个数,例如第一对象可以是一个,也可以是多个。
在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本申请中的具体含义。
以上所述仅为本申请的较佳实施例而已,并非用于限定本申请的保护范围。凡在本申请的精神和原则之内所作的任何修改、等同替换、改进等,包含在本申请的保护范围内。
Claims (35)
- 一种光伏背板加工设备,其中,所述光伏背板加工设备包括:具有传输面的载台,以及在所述载台上布置的剥离机构和复合机构;所述载台的传输面用于传输导电层,以使得所述导电层依次经过所述剥离机构和所述复合机构;所述剥离机构用于将所述导电层中的待剥离区域剥离,所述复合机构用于将完成剥离的所述导电层和设有粘接层的背板进行压合。
- 如权利要求1所述的光伏背板加工设备,其中,所述导电层的表面形成有图形结构,所述图形结构中具有所述待剥离区域;所述载台的传输面上设置有吸附装置,所述吸附装置用于吸附所述导电层。
- 如权利要求2所述的光伏背板加工设备,其中,所述吸附装置为真空吸附载板;所述真空吸附载板上设置有吸附孔,在所述真空吸附载板吸附了所述导电层时,所述吸附孔的位置与所述待剥离区域互不重叠。
- 如权利要求3所述的光伏背板加工设备,其中,所述图形结构包括:沿所述导电层的宽度方向并列排布的多个区域,每个所述区域包括首尾依次连接的多个间隔的子区域,多个所述子区域呈弯折排列在所述区域中;多个所述区域各自的子区域构成所述待剥离区域;在所述真空吸附载板吸附了所述导电层时,所述真空吸附载板中对应每个所述区域的长边外侧的位置,设置有间隔排列的第一吸附孔,对应每个所述区域中的至少一组相邻子区域之间的位置,设置有间隔排列的第二吸附孔;所述第二吸附孔的尺寸小于所述第一吸附孔的尺寸。
- 如权利要求4所述的光伏背板加工设备,其中,所述第二吸附孔的排列方向垂直于所述第一吸附孔的排列方向,所述第二吸附孔之间的间隔距离小于所述第一吸附孔之间的间隔距离。
- 如权利要求4或5所述的光伏背板加工设备,其中,在所述真空吸附载板吸附了所述导电层时,所述第二吸附孔的边缘与所述待剥离区域的边缘之间的最小距离为0.1mm至2mm。
- 如权利要求2所述的光伏背板加工设备,其中,所述剥离机构包括:翻转装置和剥离装置;所述吸附装置在吸附所述导电层后移动至所述翻转装置上,所述翻转装置通过旋转将所述吸附装置首次翻转,让所述导电层背离所述吸附装置的一面朝向重力方向;在所述吸附装置首次翻转后,所述剥离装置处于所述导电层背离所述吸附装置的一侧位置;所述剥离装置用于在所述吸附装置首次翻转后,与所述导电层背离所述吸附装置的一面接触,以使所述导电层中的所述待剥离区域脱离。
- 如权利要求7所述的光伏背板加工设备,其中,所述剥离机构还包括:搬运装置;待所述剥离装置工作后,所述翻转装置通过旋转将所述吸附装置再次翻转,让所述导电层背离所述吸附装置的一面背离重力方向;所述吸附装置再次翻转后,所述搬运装置用于将上料台上放置的设有粘接层的背板进行抓取,并将所述背板具有粘接层的一面与所述导电层背离所述吸附装置的一面层叠接触。
- 如权利要求7或8所述的光伏背板加工设备,其中,所述剥离装置包括:吹风机;所述吹风机的出风方向面向所述导电层背离所述吸附装置的一面;所述吹风机的出风宽度大于或等于所述导电层中图形结构的宽度;或,所述剥离装置包括:刷子;所述刷子用于与所述导电层背离所述吸附装置的一面接触;所述刷子的宽度大于或等于所述导电层中图形结构的宽度;或,所述剥离装置包括:滚筒;所述滚筒用于与所述导电层背离所述吸附装置的一面接触;所述滚筒的宽度大于或等于所述导电层中图形结构的宽度;所述滚筒表面设置有柔性接触层;所述柔性接触层表面间隔设置有柔性凸起结构。
- 如权利要求2所述的光伏背板加工设备,其中,所述光伏背板加工设备还包括:设置在所述载台上的上料裁切装置和激光制版装置;所述上料裁切装置处于所述载台的上料端,所述激光制版装置处于所述上料裁切装置和所述剥离机构之间;所述上料裁切装置中设置有导电层卷材;所述上料裁切装置用于将所述导电层卷材的一端引出至所述传输面,并裁切形成所述导电层;所述激光制版装置用于对经过的导电层进行激光刻画,在所述导电层表面形成所述图形结构。
- 如权利要求1所述的光伏背板加工设备,其中,所述光伏背板加工设备还包括:视觉检测装置和清洁装置;所述视觉检测装置及所述清洁装置设置在所述载台中所述复合机构之后的位置;所述视觉检测装置用于对压合后的导电层和背板进行图像采集及图像识别;所述清洁装置用于在识别到所述导电层的待剥离区域中存在残渣时,清除所述残渣。
- 一种光伏背板加工方法,其中,包括:获取表面具有图形结构的导电层,所述图形结构中具有待剥离区域;将所述导电层中的待剥离区域剥离;将完成剥离的所述导电层和设有粘接层的背板进行压合,得到光伏背板。
- 如权利要求12所述的光伏背板加工方法,其中,所述将所述导电层中的待剥离区域剥离,包括:将所述导电层翻转,让所述导电层设有图形结构的一面朝向重力方向;控制剥离装置与所述导电层设有图形结构的一面接触,以使所述导电层中的所述待剥离区域脱离。
- 如权利要求12所述的光伏背板加工方法,其中,所述获取表面具有图形结构的导电层,包括:从导电层卷材的一端引出连续导电层并裁切,形成所述导电层;对所述导电层进行激光刻画,在所述导电层表面形成所述图形结构。
- 如权利要求12所述的光伏背板加工方法,其中,所述将完成剥离的所述导电层和设有粘接层的背板进行压合,包括:将设有粘接层的所述背板与完成剥离的所述导电层进行层叠,以形成待加工件;所述粘接层位于所述背板与完成剥离的所述导电层之间;压合所述待加工件。
- 如权利要求12所述的光伏背板加工方法,其中,在将完成剥离的所述导电层和设有粘接层的背板进行压合之后,所述方法还包括:对压合后的导电层和背板进行图像采集及图像识别;在识别到所述导电层的待剥离区域中存在残渣时,清除所述残渣。
- 一种吸附装置,其中,所述吸附装置包括:真空吸附载板;在所述真空吸附载板上沿第一方向间隔设置有第一吸附孔,在所述真空吸附载板上沿第二方向间隔设置有第二吸附孔,所述第一方向与所述第二方向相交,所述第一吸附孔和所述第二吸附孔的尺寸不同;在所述真空吸附载板吸附了导电层时,所述第一吸附孔和所述第二吸附孔的位置与所述导电层中的待剥离区域互不重叠。
- 一种光伏背板制备方法,其中,包括:至少获得表面具有图形结构的导电层,其中,所述图形结构具有需分离部分,所述导电层中至少所述需分离部分未与背板连接;对所述导电层中的需分离部分进行吹气;将所述导电层中的需分离部分分离。
- 根据权利要求18所述的光伏背板制备方法,其中,对所述导电层中的需分离部分进行吹气,包括:通过振荡吹气组件对所述导电层中的需分离部分进行吹气;其中,所述振荡吹气组件包括可周期性往复运动的吹嘴。
- 根据权利要求18所述的光伏背板制备方法,其中,所述将所述导电层中的需分离部分分离,包括:夹取被吹离的所述导电层中的需分离部分;使所述需分离部分与所述导电层的需保留部分相对运动,以使所述导电层中的需分离部分分离。
- 根据权利要求20所述的光伏背板制备方法,其中,所述使所述需分离部分与所述导电层的需保留部分相对运动,包括:向远离所述导电层的需保留部分的方向传输所述需分离部分。
- 根据权利要求18至21任一项所述的光伏背板制备方法,其中,所述至少获得表面具有图形结构的导电层,包括:仅获得表面具有图形结构的导电层;所述将所述导电层中的需分离部分分离之后,还包括:将完成分离的所述导电层和设有粘接层的背板进行压合,得到光伏背板。
- 根据权利要求18至21任一项所述的光伏背板制备方法,其中,所述至少获得表面具有图形结构的导电层之前,包括:将导电层的需保留部分和设有粘接层的背板进行局部压合;所述至少获得表面具有图形结构的导电层,包括:获得局部压合后的导电层、粘接层和背板;在所述导电层表面形成图形结构。
- 一种光伏背板制备设备,其中,包括:吹气装置,所述吹气装置用于对导电层中图形结构中的需分离部分进行吹气,其中,所述导电层中至少所述需分离部分未与背板连接;分离装置,所述分离装置用于将所述导电层中的需分离部分分离。
- 根据权利要求24所述的光伏背板制备设备,其中,所述吹气装置包括振荡吹气组件,所述振荡吹气组件包括可周期性往复运动的吹嘴。
- 根据权利要求24或25所述的光伏背板制备设备,其中,沿所述导电层的厚度方向,所述吹气装置与所述导电层之间的距离大于或等于55毫米。
- 根据权利要求24或25所述的光伏背板制备设备,其中,所述吹气装置吹出的气流的流量大于或等于600L/min,小于或等于750L/min。
- 根据权利要求24所述的光伏背板制备设备,其中,所述光伏背板制备设备还包括第一载具,所述第一载具至少用于吸附所述导电层,所述导电层位于所述第一载具的下面。
- 根据权利要求28所述的光伏背板制备设备,其中,所述分离装置包括夹取分离组件,所述夹取分离组件位于所述第一载具的下方;所述夹取分离组件包括两个相对设置且相向转动的夹辊。
- 根据权利要求29所述的光伏背板制备设备,其中,沿所述导电层的厚度方向,所述夹取分离组件与所述导电层之间的距离大于所述图形结构中指状导电部分的长度。
- 根据权利要求29所述的光伏背板制备设备,其中,所述夹取分离组件还包括防缠绕机构;所述防缠绕机构包括两个辅助辊和两个传输带,单个所述传输带绕设在位于所述夹取分离组件沿两个所述夹辊的排列方向的同一侧的辅助辊和夹辊上。
- 根据权利要求28所述的光伏背板制备设备,其中,所述分离装置包括夹取组件,所述夹取组件位于所述第一载具的下方,所述夹取组件用于夹取被吹离的所述导电层中的需分离部分;所述分离装置还包括分离驱动件,所述分离驱动件用于驱动所述夹取组件运动;和/或,所述第一载具包括传输组件,所述传输组件用于传输和吸附所述导电层。
- 根据权利要求32所述的光伏背板制备设备,其中,所述夹取组件包括第一夹条和第二夹条;所述夹取组件还包括夹取驱动件,所述夹取驱动件用于驱动所述第一夹条或者所述第二夹条沿所述第一夹条的长度方向移动;所述第一夹条和所述第二夹条层叠设置,所述第一夹条沿所述第一夹条的长度方向上开设有若干夹槽,所述第二夹条包括沿所述第一夹条的长度方向间隔排布的若干夹钩;或者,所述第一夹条和所述第二夹条分别包括沿所述第一夹条的长度方向间隔排布的若干第一夹爪和若干第二夹爪,沿所述第一夹条的长度方向,所述第一夹爪和所述第二夹爪交替排布。
- 根据权利要求28所述的光伏背板制备设备,其中,所述分离装置包括滚刷,所述滚刷用于与所述导电层背离所述第一载具的一面接触。
- 根据权利要求24所述的光伏背板制备设备,其中,所述光伏背板制备设备还包括局部压合装置,所述局部压合装置用于将所述导电层的需保留部分和设有粘接层的背板进行局部压合;所述局部压合装置包括上压板和下压板,所述上压板上开设有第一避让凹槽,和/或,所述下压板上开设有第二避让凹槽。
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| JPH04116887A (ja) * | 1990-09-06 | 1992-04-17 | Toshiba Corp | 回路パターンの形成方法 |
| CN1985552A (zh) * | 2004-04-28 | 2007-06-20 | 大日本印刷株式会社 | 用于非接触型数据载体的导电元件及其制造方法和装置 |
| JP2011100951A (ja) * | 2009-11-09 | 2011-05-19 | Casio Computer Co Ltd | 薄膜トランジスタ、発光装置、電子機器、及び、薄膜トランジスタの形成方法 |
| WO2013115851A1 (en) * | 2012-02-03 | 2013-08-08 | Avery Dennison Corporation | Laser patterning of photovoltaic backsheet |
| KR20140041104A (ko) * | 2012-09-27 | 2014-04-04 | (주)우리엔지니어링 | 인쇄회로기판의 외층 동박 제거방법 및 외층 동박 제거장치 |
| CN103889725A (zh) * | 2011-10-31 | 2014-06-25 | E.I.内穆尔杜邦公司 | 用于背接触式光伏组件的集成背板 |
| KR20160003930A (ko) * | 2014-07-01 | 2016-01-12 | (주)프로템 | 레이저를 이용한 롤투롤 필름 패터닝 장치 |
| WO2020253980A1 (de) * | 2019-06-18 | 2020-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum bohren oder schneiden durch abtragen von schmelzfähigem oder verdampfungsfähigem material eines werkstücks |
| CN115008030A (zh) * | 2022-06-29 | 2022-09-06 | 深圳凯世光研股份有限公司 | 工件批量激光图像切割方法及设备 |
| CN117558814A (zh) * | 2023-08-10 | 2024-02-13 | 泰州隆基乐叶光伏科技有限公司 | 背板模组及其加工方法、背接触光伏组件 |
| CN118514411A (zh) * | 2024-04-19 | 2024-08-20 | 隆基绿能科技股份有限公司 | 一种光伏背板加工设备及方法 |
-
2024
- 2024-04-19 CN CN202410480484.8A patent/CN118514411A/zh not_active Withdrawn
- 2024-09-26 CN CN202411356400.6A patent/CN120534049A/zh active Pending
- 2024-12-17 CN CN202411868653.1A patent/CN119855271A/zh active Pending
-
2025
- 2025-04-15 WO PCT/CN2025/089087 patent/WO2025218669A1/zh active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04116887A (ja) * | 1990-09-06 | 1992-04-17 | Toshiba Corp | 回路パターンの形成方法 |
| CN1985552A (zh) * | 2004-04-28 | 2007-06-20 | 大日本印刷株式会社 | 用于非接触型数据载体的导电元件及其制造方法和装置 |
| JP2011100951A (ja) * | 2009-11-09 | 2011-05-19 | Casio Computer Co Ltd | 薄膜トランジスタ、発光装置、電子機器、及び、薄膜トランジスタの形成方法 |
| CN103889725A (zh) * | 2011-10-31 | 2014-06-25 | E.I.内穆尔杜邦公司 | 用于背接触式光伏组件的集成背板 |
| WO2013115851A1 (en) * | 2012-02-03 | 2013-08-08 | Avery Dennison Corporation | Laser patterning of photovoltaic backsheet |
| KR20140041104A (ko) * | 2012-09-27 | 2014-04-04 | (주)우리엔지니어링 | 인쇄회로기판의 외층 동박 제거방법 및 외층 동박 제거장치 |
| KR20160003930A (ko) * | 2014-07-01 | 2016-01-12 | (주)프로템 | 레이저를 이용한 롤투롤 필름 패터닝 장치 |
| WO2020253980A1 (de) * | 2019-06-18 | 2020-12-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum bohren oder schneiden durch abtragen von schmelzfähigem oder verdampfungsfähigem material eines werkstücks |
| CN115008030A (zh) * | 2022-06-29 | 2022-09-06 | 深圳凯世光研股份有限公司 | 工件批量激光图像切割方法及设备 |
| CN117558814A (zh) * | 2023-08-10 | 2024-02-13 | 泰州隆基乐叶光伏科技有限公司 | 背板模组及其加工方法、背接触光伏组件 |
| CN118514411A (zh) * | 2024-04-19 | 2024-08-20 | 隆基绿能科技股份有限公司 | 一种光伏背板加工设备及方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN120534049A (zh) | 2025-08-26 |
| CN119855271A (zh) | 2025-04-18 |
| CN118514411A (zh) | 2024-08-20 |
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