WO2024224784A1 - 輻射フィルム、輻射フィルムの製造方法、放熱フィルム、放熱装置、及び塗布液 - Google Patents

輻射フィルム、輻射フィルムの製造方法、放熱フィルム、放熱装置、及び塗布液 Download PDF

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WO2024224784A1
WO2024224784A1 PCT/JP2024/006458 JP2024006458W WO2024224784A1 WO 2024224784 A1 WO2024224784 A1 WO 2024224784A1 JP 2024006458 W JP2024006458 W JP 2024006458W WO 2024224784 A1 WO2024224784 A1 WO 2024224784A1
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Prior art keywords
film
heat
polyvinyl alcohol
radiation
heat dissipation
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English (en)
French (fr)
Japanese (ja)
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勲 平野
恭 藤井
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
    • C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
    • C08J5/128—Adhesives without diluent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/011—Crosslinking or vulcanising agents, e.g. accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/02—Homopolymers or copolymers of unsaturated alcohols
    • C08L29/04—Polyvinyl alcohol; Partially hydrolysed homopolymers or copolymers of esters of unsaturated alcohols with saturated carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials

Definitions

  • the present invention relates to a radiation film capable of absorbing and releasing heat, a heat dissipation device that absorbs and releases heat generated by heat-generating bodies such as electronic components, and a heat dissipation film.
  • a conventional heat dissipation device is, for example, a fin-type heat sink, which is attached to the outer surface of a heat generating body such as an electronic component, and the heat from the heat generating body is transferred to the heat sink, and the heat is then released from the fins to the atmosphere, or a fan is used to forcibly circulate the air between the fins and release the heat into the atmosphere (see, for example, Patent Document 1).
  • heat dissipation devices dissipate heat by utilizing thermal conduction, so they require low-temperature components such as heat sinks, which can lead to an increase in the size of the device.
  • heat dissipation device and the equipment equipped with the heat dissipation device can be made smaller and that efficient heat dissipation can be achieved without using a fin-type heat sink or a fan.
  • the present invention has been made in consideration of the above problems, and aims to provide a radiation film that exhibits good heat dissipation performance, a manufacturing method for said radiation film, a heat dissipation film made of said radiation film, a heat dissipation device equipped with said heat dissipation film, and a coating liquid that can be suitably used to form the aforementioned radiation film.
  • the inventors have found that the above problems can be solved by using, as a radiation film, a film made of a composition containing a crosslinked SPA obtained by crosslinking sodium polyacrylate with a crosslinking agent made of a metal compound containing a divalent or higher metal ion, and a crosslinked PVA obtained by crosslinking polyvinyl alcohol, and have completed the present invention.
  • the present invention provides the following.
  • a radiative film consisting of a composition containing an SPA crosslinked body in which sodium polyacrylate is crosslinked with a crosslinking agent made of a metal compound containing divalent or higher metal ions, and a PVA crosslinked body in which polyvinyl alcohol is crosslinked.
  • the metal compound containing a divalent or higher metal ion is at least one water-soluble metal salt selected from magnesium chloride, calcium chloride, aluminum chloride, iron chloride, barium chloride, copper chloride, nickel chloride, lead chloride, cobalt chloride, gold chloride, chloroplatinic acid, iron sulfate, copper sulfate, manganese sulfate, chromium sulfate, copper nitrate, magnesium nitrate, iron nitrate, manganese nitrate, cobalt nitrate, and chromium nitrate.
  • the metal compound containing a divalent or higher metal ion is at least one water-soluble metal salt selected from magnesium chloride, calcium chloride, aluminum chloride, iron chloride, barium chloride, copper chloride, nickel chloride, lead chloride, cobalt chloride, gold chloride, chloroplatinic acid, iron sulfate, copper sulfate, manganese sulfate,
  • crosslinking agent for crosslinking the polyvinyl alcohol is at least one selected from sodium tetraborate and a polyfunctional aldehyde.
  • a heat dissipation film having a heat absorbing surface provided on one side thereof for absorbing heat emitted from a heat source, and a heat releasing surface provided on the other side thereof for releasing at least a portion of the heat absorbed from the heat absorbing surface,
  • a heat dissipation film comprising the radiation film according to any one of the above [1] to [7].
  • a heat dissipation device comprising the heat dissipation film described in [8] above.
  • the method for producing a radiation film described in [10] above which includes a coating liquid production step of preparing a dispersion containing the sodium polyacrylate, an inorganic filler, and water, in which the inorganic filler is dispersed in the water, and adding the polyvinyl alcohol to the dispersion to produce the coating liquid.
  • the present invention can provide a radiation film that exhibits good heat dissipation performance, a heat dissipation film made of said radiation film, a method for manufacturing said radiation film, a heat dissipation device equipped with said heat dissipation film, and a coating liquid that can be suitably used to form the aforementioned radiation film.
  • FIG. 1 is a cross-sectional view of an electronic device to which a heat dissipation device according to an embodiment of the present invention is applied.
  • the radiation film is made of a composition containing a crosslinked SPA obtained by crosslinking sodium polyacrylate with a crosslinking agent made of a metal compound containing a divalent or higher metal ion, and a crosslinked PVA obtained by crosslinking polyvinyl alcohol.
  • the composition may further contain an inorganic filler.
  • the above-mentioned radiant film exhibits good heat dissipation performance. It is presumed that the reason why the radiant film exhibits such good heat dissipation performance is because the SPA crosslinked body exhibits good heat dissipation performance by undergoing an endothermic reaction, and the PVA crosslinked body allows it to be molded into a film. Furthermore, by including an inorganic filler, the radiant film can exhibit even better heat dissipation performance.
  • the above-mentioned radiation film can exhibit good heat dissipation performance even if it is thin.
  • the average film thickness of the radiation film is, for example, 20 ⁇ m or more and 1000 ⁇ m or less, preferably 30 ⁇ m or more and 200 ⁇ m or less, and may be 170 ⁇ m or less, 100 ⁇ m or less, or 50 ⁇ m or less.
  • the average film thickness is determined by measuring the film thickness at any three points on the radiation film with a contact film thickness meter and calculating the average value of these values.
  • the following describes the SPA crosslinked body and PVA crosslinked body contained in the radiant film (composition), as well as the inorganic filler and other optional components contained in the radiant film (composition).
  • the SPA crosslinked material is a crosslinked material obtained by crosslinking sodium polyacrylate with a crosslinking agent made of a metal compound containing a divalent or higher metal ion.
  • the degree of polymerization of sodium polyacrylate is not particularly limited, but is preferably 2,000 or more and 60,000 or less.
  • the metal compound containing a divalent or higher metal ion is not particularly limited as long as it can crosslink sodium polyacrylate.
  • metals that are divalent or higher valent metal ions include magnesium, calcium, aluminum, iron, barium, copper, nickel, lead, cobalt, gold, platinic acid, manganese, and chromium.
  • metal compounds containing divalent or higher metal ions include chlorides of divalent or higher metals, sulfates of divalent or higher metals, and nitrates of divalent or higher metals.
  • metal compounds containing divalent or higher metal ions include water-soluble metal salts such as magnesium chloride, calcium chloride, aluminum chloride, iron chloride, barium chloride, copper chloride, nickel chloride, lead chloride, cobalt chloride, gold chloride, chloroplatinic acid, iron sulfate, copper sulfate, manganese sulfate, chromium sulfate, copper nitrate, magnesium nitrate, iron nitrate, manganese nitrate, cobalt nitrate, and chromium nitrate.
  • the metal compounds containing divalent or higher valent metal ions may be used alone or in combination of two or more kinds.
  • the SPA crosslinked body is a crosslinked body formed by the metal ion of such a metal compound containing a divalent or higher metal ion replacing the sodium ion of sodium polyacrylate, and the divalent or higher metal ion forming an ionic bond with a plurality of carboxylate anion groups (-COO-) of the polyacrylic acid ion.
  • a metal compound containing a divalent or higher metal ion replacing the sodium ion of sodium polyacrylate
  • the divalent or higher metal ion forming an ionic bond with a plurality of carboxylate anion groups (-COO-) of the polyacrylic acid ion.
  • the magnesium ion forms an ionic bond with two carboxylate anion groups (-COO-) of the polyacrylic acid ion, and the chain molecules derived from sodium polyacrylate are crosslinked by ionic bonds.
  • the crosslinked body formed in this manner is the SPA crosslinked body.
  • the SPA crosslinked material is a crosslinked material in which polyacrylic acid ions are crosslinked with divalent or higher metal ions. It is preferable that all of the sodium ions in the sodium polyacrylate are substituted with divalent or higher metal ions, but sodium ions may remain in the crosslinked SPA.
  • the ratio of the metal compound containing divalent or higher metal ions to the polyacrylic acid ions in the SPA crosslinked body is not particularly limited, but is preferably 0.001 to 5 in mass ratio, more preferably 0.01 to 1 in mass ratio.
  • the PVA crosslinked material is a crosslinked material in which polyvinyl alcohol is crosslinked.
  • the crosslinking agent for crosslinking polyvinyl alcohol is not particularly limited.
  • cross-linking agents for cross-linking polyvinyl alcohol include sodium tetraborate and polyfunctional aldehydes.
  • Sodium tetraborate may be produced by mixing boric acid with a basic sodium compound such as sodium bicarbonate.
  • the polyfunctional aldehyde is not particularly limited as long as it is a compound containing two or more aldehyde groups in one molecule, and examples of the polyfunctional aldehyde include glutaraldehyde, glyoxal, malondialdehyde, adipic dialdehyde, maleic dialdehyde, and phthalaldehyde.
  • the crosslinking agent for crosslinking polyvinyl alcohol may be used alone or in combination of two or more kinds.
  • the ratio of the crosslinking agent that crosslinks polyvinyl alcohol to polyvinyl alcohol in the PVA crosslinked body is not particularly limited, but is preferably 0.1 to 30 in mass ratio, and more preferably 0.5 to 20 in mass ratio.
  • the inorganic filler is a component that further imparts the heat dissipation properties of the radiation film through radiation.
  • Inorganic fillers include layered silicates, Kucha, and red brick.
  • the layered silicate is not particularly limited as long as the desired effect is not impaired.
  • the layered silicate can be appropriately selected from known layered silicates. Examples of the layered silicate that can be used include mica, smectite, talc, kaolin, pyrophyllite, and sericite. It is preferable that the layered silicate contains kaolin, since it is easy to obtain, can be easily dispersed uniformly in the radiation film, and can easily form a radiation film with excellent heat dissipation properties.
  • the kaolin may be kaolin modified with a vinyl group.
  • Kucha is a natural rock mud found in Okinawa, and is usually made up of fine particles smaller than 100 ⁇ m.
  • the particle diameter of the inorganic filler is not particularly limited.
  • the particle diameter of the inorganic filler is preferably 0.1 ⁇ m or more and 100 ⁇ m or less, and more preferably 0.1 ⁇ m or more and 40 ⁇ m or less.
  • the particle diameter of the inorganic filler can be measured as the volume average particle diameter using a laser diffraction type particle size distribution measuring device.
  • the ratio of the mass of the inorganic filler to the mass of the radiation film is preferably 0.5% by mass or more and 1% by mass or less.
  • the radiation film may contain various additives and water as long as the desired purpose is not impaired.
  • Additives include dispersants, antioxidants, anti-agglomeration agents, defoamers, viscosity modifiers, pigments, dyes, etc.
  • the above-described radiating film can be produced by a radiating film precursor production process, which comprises forming a coating liquid containing, for example, sodium polyacrylate, polyvinyl alcohol, and water into a film shape and drying the coating liquid to produce a radiating film precursor;
  • the radiating film precursor can be produced by a method for producing a radiating film, which includes a crosslinking step of contacting the radiating film precursor with a crosslinking agent that crosslinks polyvinyl alcohol and a crosslinking agent that is a metal compound containing a divalent or higher metal ion.
  • the method for producing the radiative film preferably comprises a coating liquid production step of preparing a dispersion containing sodium polyacrylate, the inorganic filler, and water, in which the inorganic filler is dispersed in water, and adding polyvinyl alcohol to the dispersion to produce a coating liquid.
  • a coating liquid production step of preparing a dispersion containing sodium polyacrylate, the inorganic filler, and water, in which the inorganic filler is dispersed in water, and adding polyvinyl alcohol to the dispersion to produce a coating liquid.
  • Radio film precursor manufacturing process In the radiation film precursor manufacturing process, a coating liquid containing sodium polyacrylate, polyvinyl alcohol, and water is formed into a film and dried to manufacture a radiation film precursor.
  • the method for producing the coating liquid is not particularly limited.
  • an aqueous solution of sodium polyacrylate and an aqueous solution of polyvinyl alcohol may be prepared, and then the aqueous solution may be mixed to produce the coating liquid.
  • the concentration of sodium polyacrylate in the aqueous solution of sodium polyacrylate is preferably 0.01% by mass or more and 5% by mass or less, and more preferably 0.1% by mass or more and 1.0% by mass or less.
  • the concentration of polyvinyl alcohol in the aqueous solution of polyvinyl alcohol is preferably 1.0% by mass or more and 30% by mass or less, more preferably 1.0% by mass or more and 20% by mass or less, and even more preferably 5.0% by mass or more and 15% by mass or less.
  • the ratio of the mass of sodium polyacrylate to the total mass of sodium polyacrylate and polyvinyl alcohol in the coating liquid is preferably 1.0 mass% or more and 10 mass% or less, more preferably 3.0 mass% or more and 8.0 mass% or less.
  • the coating liquid may contain a thickener such as xanthan gum.
  • the method for forming the coating liquid into a film is not particularly limited.
  • the coating liquid may be poured into a mold to form a film.
  • the coating liquid may also be formed into a film by extrusion molding or solution casting.
  • the drying conditions are not particularly limited as long as they can remove at least a portion of the water.
  • the drying temperature is preferably 30° C. or higher and 80° C. or lower, and more preferably 40° C. or higher and 60° C. or lower.
  • the drying time is preferably 10 minutes or longer and 3 hours or shorter, and more preferably 30 minutes or longer and 2 hours or shorter. Drying allows the radiative film produced in the crosslinking step described below to be in a state that contains almost no water.
  • the radiative film precursor is contacted with a crosslinking agent that crosslinks the polyvinyl alcohol and a crosslinking agent that comprises a metal compound that contains a divalent or higher metal ion.
  • the radiative film precursor is brought into contact with a crosslinking agent capable of crosslinking polyvinyl alcohol, thereby crosslinking the polyvinyl alcohol to produce a crosslinked PVA body.
  • the radiative film precursor by contacting the radiative film precursor with a crosslinking agent made of a metal compound containing a divalent or higher metal ion, the sodium polyacrylate is crosslinked with the crosslinking agent made of a metal compound containing a divalent or higher metal ion, and a crosslinked SPA is produced.
  • the radiative film precursor is formed using a coating liquid (aqueous solution) containing polyvinyl alcohol, sodium polyacrylate, and water
  • the crosslinking step can provide a single layer film in which the SPA crosslinked body and the PVA crosslinked body are not separated into layers.
  • the method of contacting the radiant film precursor with the crosslinking agent that crosslinks polyvinyl alcohol and the crosslinking agent made of a metal compound containing divalent or higher metal ions is not particularly limited.
  • the radiant film precursor may be immersed in an aqueous solution of the crosslinking agent that crosslinks polyvinyl alcohol and the crosslinking agent made of a metal compound containing divalent or higher metal ions.
  • the radiative film precursor is heated in contact with the multifunctional aldehyde.
  • the heating temperature is preferably 30° C. or more and 80° C. or less, more preferably 40° C. or more and 60° C. or less.
  • the heating time is preferably 10 minutes or more and 3 hours or less, more preferably 30 minutes or more and 2 hours or less.
  • a crosslinking catalyst such as citric acid.
  • the order in which the radiative film precursor is contacted with the crosslinking agent that crosslinks polyvinyl alcohol and the crosslinking agent that comprises a metal compound that contains a divalent or higher metal ion is not particularly limited.
  • the radiative film precursor may be contacted with a crosslinking agent that crosslinks the polyvinyl alcohol, and then with a crosslinking agent made of a metal compound that contains divalent or higher metal ions.
  • the radiative film precursor may be contacted with a crosslinking agent comprising a metal compound containing divalent or higher metal ions, and then contacted with a crosslinking agent that crosslinks the polyvinyl alcohol.
  • the radiative film precursor may be simultaneously contacted with a crosslinking agent for crosslinking polyvinyl alcohol and a crosslinking agent made of a metal compound containing a divalent or higher metal ion.
  • the radiative film precursor may be contacted with a mixed solution containing a crosslinking agent for crosslinking polyvinyl alcohol and a crosslinking agent made of a metal compound containing a divalent or higher metal ion.
  • the crosslinked film is washed with water and dried as necessary to produce a radiation film.
  • the drying conditions are not particularly limited as long as they can remove at least a part of the water.
  • the drying temperature is preferably 30° C. or higher and 80° C. or lower, and more preferably 40° C. or higher and 60° C. or lower.
  • the drying time is preferably 10 minutes or longer and 3 hours or shorter, and more preferably 30 minutes or longer and 2 hours or shorter. Drying can result in the radiative film being produced being substantially free of water.
  • the method for producing the radiating film preferably includes a coating liquid production step.
  • a coating liquid preparation step a dispersion liquid containing sodium polyacrylate, an inorganic filler, and water, in which the inorganic filler is dispersed in the water, is prepared, and polyvinyl alcohol is added to the dispersion liquid to prepare the coating liquid.
  • the surface of the inorganic filler is surrounded by the polyacrylate ions of sodium polyacrylate, and the charge repulsion of the polyacrylate ions occurs, so that the inorganic filler does not settle and a dispersion liquid can be formed in which the inorganic filler is dispersed in water.
  • the dispersion is then mixed with polyvinyl alcohol to produce a coating liquid.
  • An aqueous solution of polyvinyl alcohol may be mixed with the dispersion.
  • the inorganic filler is dispersed in water.
  • the coating liquid produced in the coating liquid production process is used as the coating liquid in the aforementioned radiant film precursor production process.
  • FIG. 1 shows an embodiment of the present invention, and is a cross-sectional view of an electronic device to which a heat dissipation device is applied.
  • the heat dissipation device 10 of this embodiment can be applied to an electronic device 1, as shown in FIG. 1.
  • the electronic device 1 comprises a housing 2, a board 3 attached inside the housing 2, an electronic component 4 as a heat source attached to the board 3, and a heat dissipation device 10 according to the present invention attached to the electronic component 4.
  • the electronic component 4 is, for example, a CPU (central processing unit), which emits heat during operation.
  • the heat dissipation device includes a heat dissipation film 12 for dissipating heat generated by the electronic component 4 by thermal radiation.
  • the heat dissipation device 10 includes a heat dissipation film 12 and a thermally conductive material 11 for conducting heat dissipated from the electronic component 4 to the heat dissipation film 12 .
  • thermally conductive material 11 examples include, but are not limited to, a sheet-like member made of a resin to which a filler such as alumina, silicon nitride, or aluminum nitride has been added, a metal substrate such as alumina, silicon nitride, or aluminum nitride, or thermally conductive grease. Further, the thermally conductive material 11 may be exemplified by, but is not limited to, a material attached to the outer surface of the electronic component 4.
  • the thermally conductive material 11 may be in any form as long as it can conduct the heat emitted from the electronic component 4 to the heat dissipation film 12, and is preferably a material that can uniformly conduct the heat emitted from the electronic component 4 over the entire surface of the heat dissipation film 12.
  • the thermally conductive material 11 is preferably a material that can transmit the heat emitted from the electronic component 4 to the heat dissipation film 12 regardless of the outer surface shape of the electronic component 4, and is preferably in the form of grease, paste, or gel.
  • the heat dissipation film 12 is made of the above-mentioned radiation film.
  • the radiation film exhibits good heat dissipation performance, and can therefore be used as the heat dissipation film 12 of the electronic device 1 that includes a heat generating body (electronic component 4) that can reach high temperatures (for example, 110° C. or higher, or even 130° C. or higher).
  • the heat dissipation film 12 has a heat absorption surface 12a provided on one side for absorbing heat dissipated from the electronic component 4, and a heat dissipation surface 12b provided on the other side for dissipating at least a portion of the heat absorbed from the heat absorption surface 12a as electromagnetic waves.
  • the heat absorbing surface 12a of the heat dissipation film 12 is in contact with the thermally conductive material 11. It is preferable that the heat absorbing surface 12a is in contact with the thermally conductive material 11 over its entire surface.
  • the heat releasing surface 12b of the heat dissipation film 12 faces the inner surface of the housing 2 with a gap therebetween.
  • a portion of the heat emitted from the electronic components 4 is transferred to the housing 2 via the substrate 3 by thermal conduction, and the remaining heat emitted from the electronic components 4 is transferred to the housing 2 via the heat dissipation device 10 by thermal radiation and convection.
  • the heat transferred to the housing 2 is released into the air outside the housing 2.
  • the heat transferred from the electronic component 4 to the heat dissipation device 10 is absorbed by the heat dissipation film 12 from the entire heat absorption surface 12a. At least a portion of the heat absorbed by the heat dissipation film 12 is released as electromagnetic waves from the entire heat release surface 12b by thermal radiation, and is transferred to the inner surface of the housing 2.
  • a heat dissipation device 10 having a heat conductive material 11 and a heat dissipation film 12 is shown, but the heat dissipation device may have a member other than the heat conductive material 11 as long as it has the heat dissipation film 12 of the present invention.
  • the heat dissipation device may have multiple heat conductive materials 11 or multiple members other than the heat conductive material 11.
  • the heat dissipation device 10 having the thermally conductive material 11 and the heat dissipation film 12 is installed on an electronic component, but this is not limited to this.
  • the heat dissipation film may be installed on the electronic component without the thermally conductive material 11 in between, with the heat absorbing surface directly abutting against the electronic component. In this case, the heat released from the electronic component is absorbed directly by the heat absorbing surface of the heat dissipation film.
  • Example 1 0.5 g of sodium polyacrylate (Fujifilm Wako Pure Chemical Industries, Ltd., degree of polymerization 30,000 to 40,000) was dissolved in ion-exchanged water to prepare a 0.5 mass% sodium polyacrylate aqueous solution. 1 g of kaolin C1 (particle size approximately 0.1 to 4 ⁇ m, manufactured by Nacalai Tesque, Inc.) was dispersed in 100 g of this sodium polyacrylate aqueous solution using a stirrer to prepare a kaolin dispersion.
  • kaolin C1 particle size approximately 0.1 to 4 ⁇ m, manufactured by Nacalai Tesque, Inc.
  • the liquid uniformly filled in the silicone mold was dried on a hot plate at 50°C for 1 hour to obtain a film (radiation film precursor).
  • the obtained film (radiation film precursor) was immersed for 10 minutes in a 3% by mass aqueous solution of sodium tetraborate containing 3 g of sodium hydrogen carbonate, to crosslink the PVA and boric acid.
  • the film was then washed three times with water, and then immersed in a 1% by weight aqueous magnesium chloride solution for 10 minutes. When the film was observed after 10 minutes, it was confirmed that the film's appearance had changed from transparent to white. This confirmed crosslinking between polyacrylic acid and magnesium ions. Thereafter, the film was washed with water three times.
  • the film was dried on a hot plate at 50°C.
  • the mold was removed from the Teflon (registered trademark) vat, and the obtained film was peeled off from the vat to obtain a radiating film.
  • the obtained radiating film was designated as Film 1.
  • the film thickness was measured at three arbitrary points on the film using a contact type film thickness meter (manufactured by Techlock Corporation, product name: low pressure thickness meter; J type PJ-02) and the average value was calculated, resulting in an average film thickness of 100 ⁇ m.
  • Example 2 Film 2 was obtained in the same manner as in Example 1, except that when 10 g of a 10% by mass aqueous solution of polyvinyl alcohol (PVA) was added to the vial, 2 g of water was not added so that the average film thickness of the resulting radiative film would be 170 ⁇ m.
  • PVA polyvinyl alcohol
  • Example 3 Film 3 was obtained in the same manner as in Example 2, except that a 1% by mass aqueous solution of iron chloride was used instead of the 1% by mass aqueous solution of magnesium chloride.
  • Example 4 Film 4 was obtained in the same manner as in Example 2, except that kucha (particle size 2 ⁇ m) was used instead of kaolin C1.
  • Example 5 A film 5 was obtained in the same manner as in Example 2, except that Kaolin C2 (passed through a 350 mesh screen, manufactured by Nacalai Tesque, Inc.) was used instead of Kaolin C1.
  • Example 6 Film 6 was obtained in the same manner as in Example 2, except that kaolin was not used, and 10 g of a 0.5% by mass aqueous solution of sodium polyacrylate was weighed into a vial, and 10 g of a 10% by mass aqueous solution of polyvinyl alcohol (PVA) was added to the vial.
  • PVA polyvinyl alcohol
  • Example 7 Film 7 was obtained in the same manner as in Example 1, except that when 10 g of a 10% by weight aqueous solution of polyvinyl alcohol (PVA) was added to the vial, 5 g of water was added instead of 2 g of water, so that the average film thickness of the resulting radiative film would be 40 ⁇ m.
  • PVA polyvinyl alcohol
  • Example 8 Film 8 was obtained in the same manner as in Example 7, except that instead of immersing the obtained film (radiation film precursor) in a 3 mass % aqueous solution of sodium tetraborate containing 3 g of sodium bicarbonate for 10 minutes to crosslink the PVA and boric acid, the obtained film (radiation film precursor) was immersed in a 1 mass % aqueous solution of glutaraldehyde containing citric acid (crosslinking catalyst) and heated at 50°C for 1 hour to crosslink the PVA.
  • Example 9 2.0 g of sodium polyacrylate (Fujifilm Wako Pure Chemical Industries, Ltd., degree of polymerization 2700 to 7500) was dissolved in ion-exchanged water to prepare a 2.0 mass% sodium polyacrylate aqueous solution. 4 g of kaolin C1 (particle size approximately 0.1 to 4 ⁇ m, manufactured by Nacalai Tesque, Inc.) was dispersed in 100 g of this sodium polyacrylate aqueous solution using a stirrer to prepare a kaolin dispersion.
  • kaolin C1 particle size approximately 0.1 to 4 ⁇ m, manufactured by Nacalai Tesque, Inc.
  • the obtained film (radiation film precursor) was immersed for 10 minutes in a 3% by mass aqueous solution of sodium tetraborate containing 3 g of sodium hydrogen carbonate, to crosslink the PVA and boric acid.
  • the film was then washed three times with water, and then immersed in a 1% by weight aqueous magnesium chloride solution for 10 minutes.
  • the film was observed after 10 minutes, it was confirmed that the film's appearance had changed from transparent to white. This confirmed crosslinking between polyacrylic acid and magnesium ions.
  • the film was washed with water three times. After washing with water, the film was dried on a hot plate at 50°C.
  • the obtained film was peeled off from the PET film to obtain a radiating film.
  • the obtained radiating film was named Film 9.
  • the film thickness was measured at three arbitrary points of the film using a contact type film thickness meter (manufactured by Techlock Corporation, product name: low pressure thickness meter; J type PJ-02) and the average value was calculated, and the average film thickness was found to be 100 ⁇ m.
  • Example 1 The same procedure as in Example 1 was carried out except that 0.5 g of ammonium polyacrylate was used instead of 0.5 g of sodium polyacrylate (Fuji Film Wako Pure Chemical Industries, Ltd., degree of polymerization 30,000 to 40,000). However, the ammonium polyacrylate and kaolin were not miscible, and a film could not be produced.
  • Example 2 The same procedure as in Example 1 was carried out except that 10 g of a 10 mass % aqueous solution of sodium polystyrene sulfonate was used instead of 10 g of a 10 mass % aqueous solution of polyvinyl alcohol (PVA) (Poval PVA505C, manufactured by Kuraray Co., Ltd.).
  • PVA polyvinyl alcohol
  • the sodium polystyrene sulfonate and kaolin were not miscible, and a film could not be produced.
  • ⁇ Radiation performance evaluation> [Evaluation of radiation performance of radiation films of Examples 1 to 5, 8, and 9 (films 1 to 5, 8, and 9)]
  • a first thermally conductive material layer (thickness: 0.05 mm, N-777 manufactured by Shin-Etsu Chemical Co., Ltd.), a silicon layer (thickness: 0.6 mm), and a second thermally conductive material layer (thickness: 0.05 mm, N-777 manufactured by Shin-Etsu Chemical Co., Ltd.) were laminated in this order on a plate-shaped rubber heater equipped with a thermocouple (manufactured by Three High Corporation).
  • the radiative film pieces obtained above were cut into rectangles measuring 3 cm in length and 4 cm in width, and were laminated on the second thermally conductive material layer. While heating the rubber heater, the temperature at which the rubber heater no longer increased was measured to evaluate the radiation performance of each radiative film. The rubber heater continued to heat the plate so as to maintain a constant temperature of 155.7° C. without any of the radiant film pieces of Examples 1 to 5, 8 and 9 being laminated thereon. The lower the temperature reached when the temperature of the rubber heater no longer increases, the higher the heat dissipation performance of the radiation film through radiation. For each Example, the temperature reached when the temperature of the rubber heater no longer increased is shown in Table 1.
  • the radiation films of Examples 1 to 9 which are made of a composition containing an SPA crosslinked body in which sodium polyacrylate is crosslinked with a crosslinking agent made of a metal compound containing divalent or higher metal ions, and a PVA crosslinked body in which polyvinyl alcohol is crosslinked, all reach temperatures of 105°C or less and have a heat dissipation effect of 45°C or more, demonstrating extremely excellent heat dissipation performance through radiation.

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121226940A (zh) * 2025-11-28 2025-12-30 国网吉林省电力有限公司电力科学研究院 一种接地降阻材料及其制备方法

Citations (4)

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Publication number Priority date Publication date Assignee Title
JPH07242504A (ja) * 1994-03-03 1995-09-19 Nippon Bayeragrochem Kk 水稲病害防除方法
JP2000272054A (ja) * 1999-03-26 2000-10-03 Toppan Printing Co Ltd 化粧シート
JP2013049022A (ja) * 2011-08-31 2013-03-14 Dainippon Printing Co Ltd 積層体の製造方法
JP2019006726A (ja) * 2017-06-27 2019-01-17 持田製薬株式会社 易服用性カプセル

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07242504A (ja) * 1994-03-03 1995-09-19 Nippon Bayeragrochem Kk 水稲病害防除方法
JP2000272054A (ja) * 1999-03-26 2000-10-03 Toppan Printing Co Ltd 化粧シート
JP2013049022A (ja) * 2011-08-31 2013-03-14 Dainippon Printing Co Ltd 積層体の製造方法
JP2019006726A (ja) * 2017-06-27 2019-01-17 持田製薬株式会社 易服用性カプセル

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121226940A (zh) * 2025-11-28 2025-12-30 国网吉林省电力有限公司电力科学研究院 一种接地降阻材料及其制备方法

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