WO2024219038A1 - 位相変調モジュール - Google Patents

位相変調モジュール Download PDF

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Publication number
WO2024219038A1
WO2024219038A1 PCT/JP2024/002434 JP2024002434W WO2024219038A1 WO 2024219038 A1 WO2024219038 A1 WO 2024219038A1 JP 2024002434 W JP2024002434 W JP 2024002434W WO 2024219038 A1 WO2024219038 A1 WO 2024219038A1
Authority
WO
WIPO (PCT)
Prior art keywords
phase modulation
wall portion
modulation element
side wall
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2024/002434
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
直樹 野沢
裕一 朝稲
純平 福神
幹夫 永田
巧 高橋
好希 秋澤
佑真 村松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Priority to EP24792314.7A priority Critical patent/EP4671857A1/en
Priority to CN202480026827.1A priority patent/CN120981763A/zh
Priority to JP2025515055A priority patent/JPWO2024219038A1/ja
Priority to KR1020257033990A priority patent/KR20250170057A/ko
Publication of WO2024219038A1 publication Critical patent/WO2024219038A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/50—Protective arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2203/00—Function characteristic
    • G02F2203/50—Phase-only modulation

Definitions

  • One aspect of the present disclosure relates to a phase modulation module.
  • the optical element package described in Patent Document 1 includes a housing formed by a bottom plate and side plates, and a reflective optical element housed in the housing.
  • the gap between the optical element and the housing is filled with sealing resin, and the side and back surfaces of the optical element are covered with the sealing resin.
  • the optical element is a phase modulation element
  • the amount of heat generated increases, and there is a risk of changes in characteristics or damage (for example, decomposition or carbonization of liquid crystal) occurring due to temperature rise.
  • one aspect of the present disclosure aims to provide a phase modulation module that allows for easy control of the filler and improves heat dissipation.
  • a phase modulation module includes: [1] "a base portion; a reflective phase modulation element disposed on the base portion; a first side wall portion facing a first side of the phase modulation element; a second side wall portion facing a second side of the phase modulation element opposite the first side; and a top wall portion connected to the first side wall portion and the second side wall portion, the holding portion being disposed on the base portion, the top wall portion having an opening formed therein that overlaps with at least a portion of the phase modulation element when viewed from a predetermined direction; and a filler material disposed between the phase modulation element and the holding portion, the side on which the phase modulation element is positioned relative to the base portion in the predetermined direction being defined as a first side, and the side opposite the first side being defined as a second side, the phase modulation element includes a circuit board disposed on the base portion; and a liquid crystal layer disposed on the first side relative to the circuit board; and a cover member formed in a plate shape from
  • the placement space of the filler (first space and second space) can be restricted by the holding part having a top wall part in addition to the first side wall part and the second side wall part, and the amount of the filler can be reduced.
  • the top wall part includes a first extension part extending from the first side wall part toward the phase modulation element and a second extension part extending from the second side wall part toward the phase modulation element, and the end face of the first extension part and the end face of the second extension part face the phase modulation element, so that the placement space of the filler can be effectively restricted.
  • the filler is placed in each of the first space and the second space, and connects the phase modulation element and the holding part to each other in the first space, and connects the phase modulation element and the holding part to each other in the second space.
  • This allows the heat generated in the phase modulation element to be efficiently transferred to the holding part via a small amount of filler, and the heat can be efficiently discharged to the base part via the holding part.
  • the heat since the heat is transferred to the holding part on the first side side and the second side side of the phase modulation element, the heat can be efficiently discharged in a balanced manner.
  • the filler may easily flow out onto the first side surface of the phase modulation element (cover member), making it difficult to control the filler.
  • the end face of the first extension portion of the top wall portion and the end face of the second extension portion face the phase modulation element. This makes it possible to prevent the filler from flowing out onto the effective area of the surface of the cover member, making it easier to control the filler (the allowable range for the amount of filler applied can be expanded). Therefore, with this phase modulation module, the filler can be easily controlled and heat dissipation can be improved.
  • the phase modulation module according to one aspect of the present disclosure may be [2] "the phase modulation module described in [1], in which the first side surface of the cover member is located on the first side relative to the first side surface of the top wall portion.”
  • the filling material can be further prevented from flowing out onto the surface of the cover member. Even if the filling material flows out onto the surface of the cover member, the filling material can be easily wiped away, for example, with a rag or the like.
  • the phase modulation module according to one aspect of the present disclosure may be [3] "the phase modulation module described in [1] or [2], in which the base portion includes a heat sink.” In this case, the heat dissipation properties of the base portion can be improved.
  • the phase modulation module according to one aspect of the present disclosure may be [4] "a phase modulation module according to any one of [1] to [3], in which the cover member is made of sapphire or diamond, and the filler is in contact with the cover member at the first side and the second side.”
  • the thermal conductivity of the cover member can be increased, and heat generated near the center of the liquid crystal layer can be efficiently transferred to the periphery of the cover member. Then, the heat transferred to the periphery of the cover member can be efficiently discharged from the first side and the second side.
  • the phase modulation module according to one aspect of the present disclosure may be [5] "a phase modulation module according to any one of [1] to [4], in which the holding portion is configured to define a first opening facing a third side surface different from the first side surface and the second side surface of the phase modulation element.”
  • the holding portion is configured to define a first opening facing a third side surface different from the first side surface and the second side surface of the phase modulation element.
  • the phase modulation module according to one aspect of the present disclosure may be [6] "the phase modulation module described in [5], in which the holding portion is configured to define a second opening facing a fourth side surface opposite the third side surface of the phase modulation element.” In this case, even if a large amount of filler is applied, the filler can escape to the second opening, and the flow of the filler onto the surface of the cover member can be more reliably prevented.
  • the phase modulation module according to one aspect of the present disclosure may be [7] "the phase modulation module according to any one of [1] to [6], further comprising a wiring board arranged on the base portion such that at least a portion of the wiring board is located between the first side wall portion and the second side wall portion when viewed from the predetermined direction, the circuit board being arranged on the base portion via the wiring board.”
  • the fixing strength of the phase modulation element can be increased, for example, compared to a case in which the circuit board is arranged directly on the base portion.
  • the phase modulation module according to one aspect of the present disclosure may be [8] "a phase modulation module according to any one of [1] to [7], further comprising a wiring board arranged on the base portion such that at least a portion of the wiring board is located between the first side wall portion and the second side wall portion when viewed from the predetermined direction, the holding portion is configured to define a first opening facing a third side surface different from the first side surface and the second side surface of the phase modulation element, and the circuit board and the wiring board are electrically connected to each other by a wire arranged in the first opening.”
  • the filler can be allowed to escape to the first opening, and the filler can be prevented from flowing out onto the surface of the cover member.
  • the first opening can ensure space for arranging the wire.
  • the phase modulation module according to one aspect of the present disclosure may be [9] "a phase modulation module according to any one of [1] to [8], in which the filler connects the first side of the phase modulation element and the first side wall of the holding part in the first space, and connects the second side of the phase modulation element and the second side wall of the holding part in the second space.”
  • the filler connects the first side of the phase modulation element and the first side wall of the holding part in the first space, and connects the second side of the phase modulation element and the second side wall of the holding part in the second space.
  • heat generated in the phase modulation element can be efficiently transferred to the holding part.
  • the phase modulation module according to one aspect of the present disclosure may be [10] "the phase modulation module according to any one of [1] to [9], in which the distance between the end face of the first extension portion and the phase modulation element, and the distance between the end face of the second extension portion and the phase modulation element are smaller than the thickness of the cover member.” In this case, it is possible to reliably prevent the filler from flowing out onto the surface of the cover member.
  • the phase modulation module according to one aspect of the present disclosure may be [11] "a phase modulation module according to any one of [1] to [10], in which the filler is in contact with the top wall portion.”
  • heat generated in the phase modulation element can be efficiently transferred to the retaining portion.
  • the filler can function as a cushion to mitigate the impact.
  • the phase modulation module according to one aspect of the present disclosure may be [12] "the phase modulation module according to any one of [1] to [11], in which the filler is disposed between the end face of the first extension portion and the phase modulation element, and between the end face of the second extension portion and the phase modulation element.” In this case, heat generated in the phase modulation element can be efficiently transferred to the retaining portion.
  • the phase modulation module according to one aspect of the present disclosure may be [13] "the phase modulation module according to any one of [1] to [12], in which the first side wall portion, the second side wall portion, and the top wall portion are integrally formed.”
  • the handling of the holding portion can be made easier.
  • the strength of the holding portion can be ensured.
  • the phase modulation module according to one aspect of the present disclosure may be [14] "a phase modulation module according to any one of [1] to [13], further comprising a housing part that has a housing side wall part surrounding the phase modulation element and the holding part when viewed from the predetermined direction, and a housing top wall part connected to the housing side wall part, and is disposed on the base part to accommodate the phase modulation element and the holding part, and a housing opening is formed in the housing top wall part that overlaps with at least a part of the phase modulation element when viewed from the predetermined direction.”
  • a housing part that has a housing side wall part surrounding the phase modulation element and the holding part when viewed from the predetermined direction, and a housing top wall part connected to the housing side wall part, and is disposed on the base part to accommodate the phase modulation element and the holding part, and a housing opening is formed in the housing top wall part that overlaps with at least a part of the phase modulation element when viewed from the predetermined direction.
  • the phase modulation module according to one aspect of the present disclosure may be [15] "the phase modulation module described in [14], in which, when viewed from the predetermined direction, the edge of the housing opening is located inside the outer edge of the cover member.” In this case, it is possible to effectively prevent stray light from entering the housing part through the housing opening.
  • the phase modulation module according to one aspect of the present disclosure may be [16] "the phase modulation module according to [14] or [15], in which the holding section is in contact with the inner surface of the housing section.” In this case, heat transferred from the phase modulation element to the holding section can be dissipated to the housing section, further improving heat dissipation.
  • the phase modulation module according to one aspect of the present disclosure may be [17] "a phase modulation module according to any one of [14] to [16], in which the first surface of the cover member is in contact with the top wall of the housing.” In this case, heat generated in the phase modulation element can be dissipated to the housing via the cover member.
  • the phase modulation module according to one aspect of the present disclosure may be [18] "the phase modulation module according to any one of [1] to [17], further comprising a covering member provided on the exposed portion of the filler so as to cover the exposed portion of the filler from the retaining portion.” In this case, bleeding and particle generation on the surface of the filler can be suppressed.
  • the phase modulation module may be [19] "a phase modulation module according to any one of [1] to [18], further comprising: a wiring board arranged on the base portion such that at least a portion of the wiring board is located between the first side wall portion and the second side wall portion when viewed from the predetermined direction; and a temperature monitoring element arranged on the wiring board for monitoring the temperature of the phase modulation element, the temperature monitoring element being arranged so as to overlap the first side wall portion, the second side wall portion, or the top wall portion when viewed from the predetermined direction, and a recess in which the temperature monitoring element is arranged is formed in the first side wall portion, the second side wall portion, or the top wall portion.”
  • the temperature monitoring element can be arranged near the phase modulation element while protecting the phase modulation element with a filling material.
  • the phase modulation module according to one aspect of the present disclosure may be [21] "the phase modulation module according to [20], in which a recess in which the wire is disposed is formed in the first side wall portion, the second side wall portion, or the top wall portion.”
  • the wire can be suitably disposed while limiting the arrangement space of the filler by the retaining portion.
  • the phase modulation module according to one aspect of the present disclosure may be [22] "the phase modulation module described in [20] or [21], in which a connection member having a predetermined height in the predetermined direction is disposed on the wiring board, an electrode pad electrically connected to the wiring board is formed on the connection member, and the wire is electrically connected to the electrode pad.”
  • a connection member having a predetermined height in the predetermined direction is disposed on the wiring board, an electrode pad electrically connected to the wiring board is formed on the connection member, and the wire is electrically connected to the electrode pad.
  • phase modulation module that allows for easy control of the filler and improves heat dissipation.
  • FIG. 2 is a perspective view of a phase modulation module according to an embodiment.
  • FIG. 2 is a perspective view of the device shown in FIG. 1 with a housing unit removed.
  • FIG. 2 is a cross-sectional view taken along line III-III in FIG.
  • FIG. 2 is a cross-sectional view taken along line IV-IV in FIG.
  • FIG. 5A is a plan view of the wiring board and the phase modulation element
  • FIG. 5B is a side view of the wiring board and the phase modulation element.
  • 6(a) is a side view of the holding portion as viewed from above in FIG. 6(b)
  • FIG. 6(b) is a bottom view of the holding portion
  • FIG. 6(c) is a side view of the holding portion as viewed from below in FIG.
  • FIG. 11 is a cross-sectional view of a phase modulation module according to a first modified example.
  • FIG. 11 is a cross-sectional view of a phase modulation module according to a second modified example.
  • FIG. 11 is a cross-sectional view of a phase modulation module according to a third modified example.
  • FIG. 13 is a cross-sectional view of a phase modulation module according to a fourth modified example.
  • FIG. 13 is a cross-sectional view of a phase modulation module according to a fifth modified example.
  • FIG. 13 is a perspective view of a phase modulation module according to a sixth modified example.
  • 13 is a cross-sectional view taken along line XIII-XIII in FIG. 12.
  • 14 is a cross-sectional view taken along line XIV-XIV in FIG. 12.
  • the phase modulation module 1 includes a base portion 2, a housing portion 3 (outer cover), a first wiring board 4, a second wiring board 5, a phase modulation element 6, a holding portion 7 (inner cover), and a filler 8.
  • the phase modulation element 6 includes a circuit board 61, a liquid crystal layer 62, and a cover member 63.
  • the laser light L is incident on the phase modulation element 6 and reflected. At this time, the phase of the laser light L is modulated by the liquid crystal layer 62.
  • the base portion 2 has a heat sink 21 and a base wall portion 22.
  • the heat sink 21 is a heat dissipation member formed in a rectangular parallelepiped shape from, for example, a metal material.
  • the heat sink 21 is water-cooled and is cooled by flowing a refrigerant through a flow path formed inside.
  • the temperature of the heat sink 21 during use is about 25°C.
  • the thickness of the heat sink 21 in the Z direction is thicker than the thickness of the phase modulation element 6 in the Z direction.
  • the base wall portion 22 is formed in a substantially rectangular plate shape from a metal material such as aluminum.
  • the base wall portion 22 is disposed on the heat sink 21 and is located on the first side S1 relative to the heat sink 21.
  • one side of the base wall portion 22 in the X direction (the left side in FIG. 3) is in contact with the heat sink 21, and the other side of the base wall portion 22 in the X direction is not in contact with the heat sink 21.
  • the entire base wall portion 22 is in contact with the heat sink 21.
  • the housing 3 is formed of a metal material such as aluminum.
  • the housing 3 has a side wall 31 (housing side wall) and a top wall 32 (housing top wall).
  • the side wall 31 is formed in a rectangular frame shape in a plan view (when viewed from the Z direction).
  • the side wall 31 is disposed on the base wall 22, and surrounds the phase modulation element 6 and the holding portion 7 in a plan view.
  • the side wall 31 has an opening for pulling the second wiring board 5 out of the housing 3.
  • the top wall portion 32 is connected to the side wall portion 31 and is formed in a rectangular plate shape.
  • the top wall portion 32 faces the base wall portion 22 in the Z direction.
  • the top wall portion 32 and the base wall portion 22 extend parallel to each other and perpendicular to the Z direction.
  • the base wall portion 22, the side wall portion 31, and the top wall portion 32 define an accommodation space R that accommodates the phase modulation element 6 and the holding portion 7.
  • the top wall 32 has an opening 33 (housing opening) through which the laser light L incident on the phase modulation element 6 and the laser light L reflected by the phase modulation element 6 pass.
  • the opening 33 has a rectangular shape that is elongated in the Y direction. In a plan view, the opening 33 overlaps with a part of the center side of the phase modulation element 6.
  • the edge 33a of the opening 33 is located inside the outer edge 63a of the cover member 63.
  • the inner surface (edge 33a) of the opening 33 has an inclined surface that is inclined (tapered) in the Z direction so as to move toward the center side of the phase modulation element 6 as it moves toward the second side S2.
  • the thickness of at least a part (all of it in this example) of the top wall 32 in the Z direction is thinner than the thickness of the base wall 22 and the thickness of the phase modulation element 6 in the Z direction.
  • the first wiring board 4 is a rectangular plate-shaped ceramic board made of, for example, ceramic (aluminum nitride), and is arranged in the accommodation space R.
  • the first wiring board 4 is arranged directly on the base wall portion 22.
  • the entire first wiring board 4 is arranged inside the side wall portion 31 in a plan view.
  • a part of the first wiring board 4 is located between a first side wall portion 71 and a second side wall portion 72 of the holding portion 7 described later in a plan view.
  • the first wiring board 4 may be arranged so that the entire first wiring board 4 does not overlap with the holding portion 7 in a plan view (for example, inside the opening 33).
  • connection member 41 is disposed on the first wiring board 4.
  • the connection member 41 is formed, for example, in a substantially rectangular parallelepiped shape and has a predetermined height in the Z direction.
  • the height of the connection member 41 is set to be approximately the same as the height of a surface 63c of the second side S2 of the cover member 63 described later.
  • the heights of the connection member 41 and the surface 63c of the cover member 63 are heights from the surface of the first wiring board 4.
  • An electrode pad 41a electrically connected to the first wiring board 4 is formed on the connection member 41.
  • a wire 11 for electrical connection to an electrode layer 67 described later is electrically connected to the electrode pad 41a.
  • the connection member 41 is disposed so as to be located between the phase modulation element 6 and the second wiring board 5 in the X direction, for example.
  • a temperature monitoring element 42 for monitoring (detecting) the temperature of the phase modulation element 6 is provided on the first wiring board 4.
  • the temperature monitoring element 42 is, for example, a temperature sensor such as a thermistor.
  • the temperature monitoring element 42 is disposed adjacent to (facing) the phase modulation element 6 in, for example, the Y direction.
  • the second wiring board 5 is electrically connected to the first wiring board 4.
  • the second wiring board 5 is, for example, a flexible circuit board having flexibility, and is electrically connected to the first wiring board 4 via a connection portion 5a. More specifically, the second wiring board 5 is connected to one side of the first wiring board 4 in the X direction (the right side in FIG. 3) within the storage space R. Predetermined wiring, electronic components, etc. may be provided on the second wiring board 5.
  • the second wiring board 5 is, for example, pulled out to the outside of the storage space R from an opening formed in the side wall portion 31 described above.
  • the phase modulation element 6 is disposed within the accommodation space R, and the entire phase modulation element 6 is located inside the side wall portion 31 in a plan view.
  • the phase modulation element 6 is disposed offset in the X direction from the center of the accommodation space R on the opposite side to the second wiring board 5 (the left side of the paper in FIG. 3).
  • a circuit board 61, a liquid crystal layer 62, and a cover member 63 are stacked in this order in the Z direction. That is, the liquid crystal layer 62 is formed on the circuit board 61, and the cover member 63 is formed on the liquid crystal layer 62.
  • the phase modulation element 6 is a reflective spatial light modulator.
  • the phase modulation element 6 is an LCOS-SLM (Liquid Crystal on Silicon-Spatial Light Modulator).
  • Laser light L is incident on the phase modulation element 6 from the cover member 63 side along the Z direction (thickness direction of the phase modulation element 6), for example.
  • the laser light L incident from the cover member 63 enters the liquid crystal layer 62, and the phase of the laser light L is modulated as it travels through the liquid crystal layer 62. More specifically, the tilt of the liquid crystal molecules in the liquid crystal layer 62 is controlled for each pixel by the voltage applied from the circuit board 61, and the phase of the laser light L incident on each pixel is controlled by changing the refractive index of the liquid crystal.
  • the laser light L incident on the liquid crystal layer 62 is reflected by the circuit board 61.
  • the circuit board 61 is a rectangular plate-shaped CMOS chip made of silicon, for example. For example, pixel electrodes are arranged two-dimensionally on the CMOS chip.
  • the circuit board 61 is arranged directly on the first wiring board 4, and arranged on the base wall portion 22 via the first wiring board 4.
  • the circuit board 61 being arranged directly on the first wiring board 4 includes the case where the circuit board 61 is connected to the first wiring board 4 via an adhesive, tape, or the like.
  • the circuit board 61 is electrically connected to the first wiring board 4 by, for example, a wire 12.
  • the circuit board 61 protrudes from the cover member 63 on both sides in the short side direction (X direction) of the cover member 63, which is rectangular in plan view.
  • the wire 12 is connected to the protruding portion of the circuit board 61.
  • the thickness of the CMOS chip constituting the circuit board 61 may be thinner than the thickness T (FIG. 4) of the cover member 63.
  • the circuit board 61 has an effective pixel area 61a in the center.
  • the effective pixel area 61a is, for example, a rectangular area, and has dimensions of 12.8 mm (X direction) x 16 mm (Y direction), for example.
  • the effective area RN on the surface 63b of the first side S1 of the cover member 63 is defined by the effective pixel area 61a.
  • the effective area RN is an area that overlaps with the effective pixel area 61a in a planar view.
  • the wire 12 is covered with a protective material 13.
  • the protective material 13 is made of a resin material different from the filler material 8.
  • the material of the protective material 13 is, for example, liquid rubber, and may be a rubber or resin with a higher viscosity than the filler material 8.
  • the protective material 13 may be made of a hardening resin that is not gel-like or putty-like. By providing the protective material 13, the wire 12 can be reliably protected from the filler material 8.
  • the liquid crystal layer 62 is formed on the circuit board 61 and is disposed on the first side S1 with respect to the circuit board 61.
  • the cover member 63 is formed on the liquid crystal layer 62 so as to cover the entire liquid crystal layer 62 and is disposed on the first side S1 with respect to the liquid crystal layer 62.
  • the thickness of the liquid crystal layer 62 may be thinner than the thickness T of the cover member 63.
  • a sealing resin 66 having a rectangular frame shape in a plan view is provided around the liquid crystal layer 62, and the periphery of the liquid crystal layer 62 is sealed by this sealing resin 66.
  • the width of one side of the sealing resin 66 in a plan view (the width in the direction perpendicular to the side) is, for example, about 1 mm.
  • the sealing resin 66 can be considered to be part of the liquid crystal layer 62.
  • the sealing resin 66 is formed, for example, from a UV-cured resin, and is bonded to the circuit board 61 and the cover member
  • the cover member 63 is formed, for example, in a rectangular plate shape from a light-transmitting material that is transparent to the laser light L.
  • the cover member 63 is a sapphire substrate made of sapphire.
  • the cover member 63 functions as a light entrance portion in the phase modulation element 6.
  • the cover member 63 also functions as a reference potential for the voltage application by the circuit board 61.
  • the size of the cover member 63 in plan view is, for example, approximately 18 mm (X direction) ⁇ 25 mm (Y direction).
  • the thickness T (length in the Z direction) of the cover member 63 is 0.5 mm or more, for example 3 mm. That is, the cover member 63 is formed in a rectangular shape in plan view, and has a long side direction and a short side direction. In this embodiment, the cover member 63 is arranged so that the long side direction is parallel to the Y direction.
  • the thickness T of the cover member 63 may be thicker than the thicknesses of the circuit board 61, the liquid crystal layer 62, the first wiring board 4, the second wiring board 5, and the base wall portion 22.
  • An electrode layer 67 is formed on the surface 63c of the second side S2 of the cover member 63 (FIGS. 4 and 5(b)).
  • the electrode layer 67 is a transparent electrode made of, for example, ITO (Indium Tin Oxide).
  • the electrode layer 67 is formed over the entire surface 63c and is located between the liquid crystal layer 62 and the cover member 63.
  • the cover member 63 has a protrusion 63e that protrudes to one side in the Y direction relative to the circuit board 61 and the liquid crystal layer 62 in a plan view.
  • the electrode layer 67 is also formed on the protrusion 63e, and the above-mentioned wire 11 is electrically connected to the electrode layer 67 on the protrusion 63e.
  • a reference voltage is applied to the electrode layer 67 via the wire 11.
  • the holding portion 7 is formed from a metal material such as aluminum. By forming the holding portion 7 from a metal material, heat in the phase modulation element 6 can be quickly dissipated to the base portion 2 via the holding portion 7.
  • the holding portion 7 is fixed to the base wall portion 22 of the base portion 2.
  • the holding portion 7 and the base portion, and the housing portion 3 and the base portion 2 are fixed by, for example, screws. These fixations are not limited to screws, and may be performed by, for example, adhesive, tape, etc.
  • the holding portion 7 has a first side wall portion 71, a second side wall portion 72, and a top wall portion 73.
  • the first side wall portion 71, the second side wall portion 72, and the top wall portion 73 are formed integrally with each other.
  • the first side wall portion 71 and the second side wall portion 72 are formed, for example, in a rectangular plate shape.
  • the first side wall portion 71 and the second side wall portion 72 extend perpendicular to the Y direction and face each other in the Y direction.
  • the first side wall portion 71 and the second side wall portion 72 are disposed directly on the base wall portion 22.
  • the first side wall portion 71 and the second side wall portion 72 face each other with the first wiring board 4 and the circuit board 61 in between. That is, the first wiring board 4 and the phase modulation element 6 are disposed between the first side wall portion 71 and the second side wall portion 72 in a plan view.
  • the first side wall portion 71 faces the first side surface 6a of the phase modulation element 6.
  • the first side surface 6a is a side surface on one side in the Y direction of the phase modulation element 6 (the left side in FIG. 4), and is constituted by the side surfaces of the circuit board 61, the liquid crystal layer 62, and the cover member 63.
  • the first side wall portion 71 faces the side surface of the circuit board 61.
  • the second side wall portion 72 faces the second side surface 6b of the phase modulation element 6.
  • the second side surface 6b is a side surface opposite the first side surface 6a of the phase modulation element 6, and is constituted by the side surfaces of the circuit board 61, the liquid crystal layer 62, and the cover member 63.
  • the second side wall portion 72 faces the side surface of the circuit board 61.
  • the top wall portion 73 is connected to the first side wall portion 71 and the second side wall portion 72, and is formed in a substantially rectangular plate shape.
  • the top wall portion 73 extends perpendicular to the Z direction, and faces the base wall portion 22 and the first wiring board 4 in the Z direction.
  • the thickness of at least a portion (in this example, the entirety) of the top wall portion 73 in the Z direction is thicker than the thickness of the top wall portion 32 (housing top wall portion) in the Z direction.
  • the top wall portion 73 has an opening 74 through which the laser light L incident on the phase modulation element 6 and the laser light L reflected by the phase modulation element 6 pass.
  • the opening 74 has a rectangular shape that is elongated in the Y direction.
  • the opening 74 overlaps with the phase modulation element 6 in a planar view. More specifically, a part of the phase modulation element 6 (in this example, the cover member 63) is disposed within the opening 74, and in a planar view, the edge 74a of the opening 74 is located outside the outer edge 63a of the cover member 63. In other words, the opening 74 is formed to a size that allows the cover member 63 to be disposed inside.
  • the opening 74 overlaps with the entire opening 33 formed in the top wall portion 32 of the housing unit 3.
  • the opening 74 is formed one size larger than the opening 33, and in a planar view, the edge 74a of the opening 74 is located outside the edge 33a of the opening 33.
  • the size of the opening 74 is, for example, 19 mm (X direction) x 26.5 mm (Y direction).
  • the top wall 73 has a first extending portion 75 extending from the first side wall 71 toward the phase modulation element 6, and a second extending portion 76 extending from the second side wall 72 toward the phase modulation element 6.
  • the first extending portion 75 and the second extending portion 76 are substantially rectangular flat portions extending perpendicular to the Z direction.
  • An end face 75a of the first extending portion 75 and an end face 76a of the second extending portion 76 face the phase modulation element 6 in the Y direction.
  • the end face 75a faces the side faces of the liquid crystal layer 62 and the cover member 63
  • the end face 76a faces the side faces of the circuit board 61, the liquid crystal layer 62, and the cover member 63.
  • the end faces 75a, 76a are flat surfaces perpendicular to the Y direction, for example.
  • the distance D1 (shortest distance) between the end face 75a of the first extension portion 75 in the Y direction and the phase modulation element 6 (liquid crystal layer 62 and cover member 63) is smaller than the thickness T of the cover member 63.
  • the distance D2 (shortest distance) between the end face 76a of the second extension portion 76 in the Y direction and the phase modulation element 6 (circuit board 61, liquid crystal layer 62 and cover member 63) is smaller than the thickness T of the cover member 63.
  • the distances D1 and D2 between the end faces 75a, 76a and the phase modulation element 6 are, for example, 5 mm or less, and preferably 3 mm or less.
  • the phase modulation element 6 is disposed inside the holding portion 7 so that a portion of the first side S1 of the cover member 63 protrudes from the opening 74 to the first side S1. Therefore, the surface 63b of the first side S1 of the cover member 63 is located (protrudes) on the first side S1 relative to the surface 73a of the first side S1 of the top wall portion 73.
  • the amount by which the surface 63b of the first side S1 of the cover member 63 protrudes from the surface 73a of the first side S1 of the top wall portion 73 in the Z direction is, for example, approximately 0.1 mm.
  • the holding portion 7 is configured to define a first opening 77 facing the third side surface 6c of the phase modulation element 6 and a second opening 78 facing the fourth side surface 6d of the phase modulation element 6.
  • the third side surface 6c is a side surface on one side in the X direction (the right side in FIG. 3) of the phase modulation element 6, and is constituted by the side surfaces of the circuit board 61, the liquid crystal layer 62, and the cover member 63.
  • the fourth side surface 6d is a side surface opposite to the third side surface 6c of the phase modulation element 6, and is constituted by the side surfaces of the circuit board 61, the liquid crystal layer 62, and the cover member 63.
  • the top wall portion 73 of the holding portion 7 faces the third side surface 6c and the fourth side surface 6d of the phase modulation element 6 in the X direction. This makes it possible to prevent the filling material 8 from flowing out onto the surface 63b of the cover member 63.
  • the holding portion 7 does not have a sidewall on one side in the X direction, and is open on one side in the X direction.
  • a first opening 77 is formed on one side in the X direction.
  • a recess 73b is formed in the top wall portion 73 at a portion located on one side in the X direction with respect to the phase modulation element 6 (FIGS. 6(a) and 6(b)).
  • the recess 73b is formed so as to open to the inside and outside of the holding portion 7.
  • This recess 73b also constitutes the first opening 77.
  • the holding portion 7 does not have a sidewall on the other side in the X direction, and is open on the other side in the X direction.
  • a second opening 78 is formed on the other side in the X direction.
  • a recess 73c is formed in the top wall portion 73 at a portion located on the other side in the X direction with respect to the phase modulation element 6 (FIGS. 6(b) and 6(c)).
  • the recess 73c is formed so as to open to the inside and outside of the holding portion 7. This recess 73c also constitutes the second opening 78.
  • the wire 12 and protective material 13 described above are disposed in the first opening 77.
  • the first opening 77 functions as an arrangement space for the wire 12.
  • the first wiring board 4 and the filler material 8 described later are disposed in the first opening 77 and the second opening 78.
  • the holding portion 7 also has a recess 81 formed therein for disposing the temperature monitor element 42 described above (FIGS. 4 and 6(b)).
  • the temperature monitor element 42 is disposed so as to overlap with the first extension portion 75 of the top wall portion 73 in a plan view, and the recess 81 is formed in the first extension portion 75.
  • a portion of the first side S1 of the temperature monitor element 42 is disposed within the recess 81, thereby preventing interference between the temperature monitor element 42 and the holding portion 7.
  • the holding portion 7 is also formed with a recess 82 for arranging the wire 11 described above, that is, the wire 11 that electrically connects the first wiring board 4 and the electrode layer 67 on the surface 63c of the second side S2 of the cover member 63 (FIGS. 6(a) and 6(b)).
  • the wire 11 is pulled out from the cover member 63 to one side in the X direction (the right side in FIG. 5), so that a recess 82 is formed in one portion of the top wall portion 73 in the X direction.
  • the recess 82 is connected to the recess 73b described above.
  • the filler 8 is disposed between the phase modulation element 6 and the holding portion 7 and is held by the holding portion 7. As shown in FIG. 4, the filler 8 is disposed in each of a first space P1 formed on one side of the phase modulation element 6 in the Y direction and a second space P2 formed on the other side of the phase modulation element 6 in the Y direction.
  • the first space P1 is formed by the first side surface 6a of the phase modulation element 6, the first side wall portion 71 and the top wall portion 73 (first extension portion 75) of the holding portion 7, the base wall portion 22, and the first wiring board 4, and the second space P2 is formed by the second side surface 6b of the phase modulation element 6, the second side wall portion 72 and the top wall portion 73 (second extension portion 76) of the holding portion 7, the base wall portion 22, and the first wiring board 4.
  • the filler 8 fills the entire first space P1 and connects the first side surface 6a of the phase modulation element 6 to the holding portion 7 in the first space P1.
  • the filler 8 connects the first side surface 6a to the first side wall portion 71 in the first space P1.
  • the filler 8 contacts the inner surface (surface of the second side S2) of the first extension portion 75 of the top wall portion 73 in the first space P1.
  • the filler 8 is disposed between the end surface 75a of the first extension portion 75 and the phase modulation element 6 (cover member 63) and contacts the end surface 75a and the side surface of the cover member 63.
  • the filler 8 does not contact the surface 63b of the first side S1 of the cover member 63.
  • the filler 8 contacts the circuit board 61, the liquid crystal layer 62, and the cover member 63 on the first side surface 6a.
  • the filler 8 also contacts the first wiring board 4 and the base wall portion 22 in the first space P1.
  • the filler 8 covers the temperature monitor element 42 in the first space P1.
  • the filler 8 may be in contact with the surface 63b of the cover member 63 in an area other than the effective area RN (the non-effective area on the periphery).
  • the filler 8 fills the entire second space P2 and connects the second side surface 6b of the phase modulation element 6 and the holding portion 7 to each other in the second space P2.
  • the filler 8 connects the second side surface 6b and the second side wall portion 72 to each other in the second space P2.
  • the filler 8 contacts the inner surface (surface of the second side S2) of the second extension portion 76 of the top wall portion 73 in the second space P2.
  • the filler 8 is disposed between the end surface 76a of the second extension portion 76 and the phase modulation element 6 (cover member 63) and contacts the end surface 76a and the side surface of the cover member 63.
  • the filler 8 contacts the circuit board 61, the liquid crystal layer 62, and the cover member 63 at the second side surface 6b.
  • the filler 8 also contacts the first wiring board 4 and the base wall portion 22 in the second space P2.
  • the filler 8 is also disposed in the first opening 77 and the second opening 78. More specifically, the filler 8 is disposed in substantially the entire first opening 77, covering the wire 12 and the protective material 13. The filler 8 also covers a portion of the wire 11 disposed in the recess 82 in the first opening 77. The filler 8 is disposed in the entire second opening 78. As shown in FIG. 3, the filler 8 may reach the outside of the retaining portion 7 through the first opening 77 or the second opening 78 in a plan view (a portion of the filler 8 may be located outside the retaining portion 7).
  • the filler 8 is made of a potting material having a high viscosity.
  • the filler 8 is made of a resin material such as silicone.
  • the filler 8 may be, for example, a non-silicone resin material, a silver paste, a heat dissipating adhesive, liquid rubber, or the like.
  • the thermal conductivity of the filler 8 is 0.5 W/(m ⁇ K) or more, for example, about 5.0 W/(m ⁇ K).
  • the filler 8 is gel-like or clay-like (putty-like) and is not hardened.
  • the filler 8 has a flow rate of, for example, 10 g/min to 60 g/min.
  • This flow rate is a value measured by measuring how many grams of flow rate per minute when a sample is extruded at a pressure of 0.6 MPa using a syringe with a diameter of 2.54 mm and a capacity of 30 cc, and the smaller the flow rate, the higher the viscosity.
  • the filler 8 has a viscosity of, for example, 100 to 15,000 Pa ⁇ s.
  • the arrangement space (first space P1 and second space P2) of the filler 8 can be restricted by the holding part 7 having the top wall part 73 in addition to the first side wall part 71 and the second side wall part 72, and the amount of the filler 8 can be reduced.
  • the top wall part 73 includes a first extension part 75 extending from the first side wall part 71 toward the phase modulation element 6 and a second extension part 76 extending from the second side wall part 72 toward the phase modulation element 6, and the end face 75a of the first extension part 75 and the end face 76a of the second extension part 76 face the phase modulation element 6, so that the arrangement space of the filler 8 can be effectively restricted.
  • the filler 8 is disposed in each of the first space P1 and the second space P2, and connects the phase modulation element 6 and the holding part 7 to each other in the first space P1, and also connects the phase modulation element 6 and the holding part 7 to each other in the second space P2.
  • the heat generated in the phase modulation element 6 can be efficiently transferred to the holding portion 7 via a small amount of the filler 8, and the heat can be efficiently discharged to the base portion 2 via the holding portion 7. That is, while the thermal conductivity of the filler 8 is, for example, about 3 to 5 W/(m ⁇ K), the aluminum constituting the holding portion 7 has a thermal conductivity of 237 W/(m ⁇ K), which is about 50 to 100 times higher.
  • the heat discharge efficiency can be improved.
  • the heat can be efficiently discharged in a well-balanced manner.
  • the filler 8 may easily flow out into the effective region RN on the surface 63b of the first side S1 of the phase modulation element 6 (cover member 63), which may make it difficult to control the filler 8.
  • the end face 75a of the first extension portion 75 of the top wall portion 73 and the end face 76a of the second extension portion 76 face the phase modulation element 6. This makes it possible to prevent the filler 8 from flowing out onto the surface 63b of the cover member 63, making it easier to control the filler 8 (the allowable range for the amount of filler 8 applied can be expanded). Therefore, with the phase modulation module 1, the filler 8 can be easily controlled and heat dissipation can be improved.
  • the first space P1 and the second space P2 are formed between the phase modulation element 6 and the holding portion 7, so that even if the holding portion 7 expands due to a change in temperature, the stress caused by the expansion can be prevented from being transmitted to the phase modulation element 6. Furthermore, if a filler material 8 is disposed in the first space P1 and the second space P2, the filler material 8 can absorb the stress, thereby reducing the stress transmitted to the phase modulation element 6.
  • the surface 63b of the first side S1 of the cover member 63 is located on the first side S1 relative to the surface 73a of the first side S1 of the top wall portion 73. This further prevents the filler 8 from flowing out onto the surface 63b of the cover member 63. Even if the filler 8 does flow out onto the surface 63b of the cover member 63, the filler 8 can be easily wiped off with, for example, a rag.
  • the base portion 2 includes a heat sink 21. This improves the heat dissipation properties of the base portion 2.
  • the cover member 63 is made of sapphire, and the filler 8 is in contact with the cover member 63 on the first side surface 6a and the second side surface 6b. This increases the thermal conductivity of the cover member 63, and allows heat generated near the center of the liquid crystal layer 62 to be efficiently transferred to the periphery of the cover member 63. The heat transferred to the periphery of the cover member 63 can then be efficiently dissipated from the first side surface 6a and the second side surface 6b.
  • the holding portion 7 is configured to define a first opening 77 that faces a third side 6c that is different from the first side 6a and the second side 6b of the phase modulation element 6. This allows the filler 8 to escape to the first opening 77 even if a large amount of the filler 8 is applied, and reliably prevents the filler 8 from flowing out onto the surface 63b of the cover member 63.
  • the holding portion 7 is configured to define a second opening 78 that faces the fourth side surface 6d opposite the third side surface 6c of the phase modulation element 6. This allows the filler 8 to escape to the second opening 78 even if a large amount of the filler 8 is applied, and more reliably prevents the filler 8 from flowing out onto the surface of the cover member 63.
  • the circuit board 61 is disposed on the base portion 2 via the first wiring board 4. This increases the fixing strength of the phase modulation element 6 compared to, for example, a case in which the circuit board 61 is disposed directly on the base portion 2.
  • the circuit board 61 and the first wiring board 4 are electrically connected to each other by wires 12 arranged in the first opening 77, and the wires 12 are covered with protective material 13 made of a material different from the filler 8. This allows the filler 8 to escape to the first opening 77 even if a large amount of filler 8 is applied, and prevents the filler 8 from flowing out onto the surface 63b of the cover member 63.
  • the first opening 77 also ensures space for placing the wires 12. Furthermore, because the wires 12 are covered with protective material 13, the wires 12 can be protected even if the filler 8 flows into the first opening 77.
  • the filler 8 connects the first side 6a of the phase modulation element 6 to the first side wall 71 of the holding portion 7 in the first space P1, and connects the second side 6b of the phase modulation element 6 to the second side wall 72 of the holding portion 7 in the second space P2. This allows heat generated in the phase modulation element 6 to be efficiently transferred to the holding portion 7.
  • the distance between the end face 75a of the first extension portion 75 and the phase modulation element 6, and the distance between the end face 76a of the second extension portion 76 and the phase modulation element 6 are smaller than the thickness of the cover member 63. This reliably prevents the filler 8 from flowing out onto the surface 63b of the cover member 63.
  • the filler 8 is in contact with the top wall portion 73. This allows the heat generated in the phase modulation element 6 to be efficiently transferred to the holding portion 7. Furthermore, if an impact is applied to the top wall portion 73, the filler 8 functions as a cushion to mitigate the impact.
  • the filler 8 is disposed between the end face 75a of the first extension portion 75 and the phase modulation element 6, and between the end face 76a of the second extension portion 76 and the phase modulation element 6. This allows the heat generated in the phase modulation element 6 to be efficiently transferred to the retaining portion 7.
  • the first side wall portion 71, the second side wall portion 72, and the top wall portion 73 are integrally formed. This makes it easier to handle the holding portion 7. It also ensures the strength of the holding portion 7.
  • the edge 33a of the opening 33 is located inside the outer edge 63a of the cover member 63. This effectively prevents stray light from entering the housing 3 through the opening 33.
  • the phase modulation module 1 includes a temperature monitoring element 42 arranged on the first wiring board 4 for monitoring the temperature of the phase modulation element 6.
  • the temperature monitoring element 42 is arranged so as to overlap with the top wall portion 73 in a plan view, and the top wall portion 73 has a recess 81 in which the temperature monitoring element 42 is arranged. This allows the temperature monitoring element 42 to be arranged near the phase modulation element 6 while protecting the phase modulation element 6 with the filling material 8.
  • An electrode layer 67 is formed on the surface 63c of the second side S2 of the cover member 63.
  • the cover member 63 has a protruding portion 63e that protrudes from the circuit board 61 in a plan view, and the electrode layer 67 on the protruding portion 63e and the first wiring board 4 are electrically connected to each other by the wire 11. This allows the wire 11 to be stably connected to the electrode layer 67.
  • a recess 82 in which the wire 11 is disposed is formed in the top wall portion 73. This allows the wire 11 to be appropriately disposed while limiting the placement space of the filler 8 by the retaining portion 7.
  • a connection member 41 having a predetermined height in the Z direction is disposed on the first wiring board 4.
  • An electrode pad 41a electrically connected to the first wiring board 4 is formed on the connection member 41.
  • the wire 11 is electrically connected to the electrode pad 41a.
  • the filler 8 may be in contact only with the top wall 73 without contacting the first side wall 71 and the second side wall 72.
  • the filler 8 connects the first side 6a of the phase modulation element 6 to the top wall 73 of the holding part 7 in the first space P1, and connects the second side 6b of the phase modulation element 6 to the top wall 73 of the holding part 7 in the second space P2.
  • the filler 8 can be easily controlled and the heat dissipation can be improved.
  • the filler 8 does not have to be disposed in the entire first space P1 or the second space P2, but may be disposed in only a part of the first space P1 or the second space P2.
  • the sealing resin 66 of the liquid crystal layer 62 is not shown in FIG. 7. This also applies to FIGS. 8 to 11.
  • the filler 8 does not have to be disposed between the end face 75a of the first extension portion 75 and the side face of the cover member 63, and between the end face 76a of the second extension portion 76 and the side face of the cover member 63. That is, the filler 8 may be disposed in the portion of the first space P1 formed by the first side face 6a of the phase modulation element 6, the inner surface (surface on the second side wall portion 72 side) of the first side wall portion 71 of the holding portion 7, and the inner surface (surface on the second side S2) of the top wall portion 73.
  • the filler 8 may be disposed in the portion of the second space P2 formed by the second side face 6b of the phase modulation element 6, the inner surface (surface on the first side wall portion 71 side) of the second side wall portion 72 of the holding portion 7, and the inner surface (surface on the second side S2) of the top wall portion 73.
  • the filler 8 can be easily controlled and heat dissipation can be improved, as in the above embodiment.
  • the first side wall portion 71 and the second side wall portion 72 may be formed integrally with the base wall portion 22. That is, the first side wall portion 71, the second side wall portion 72, and the top wall portion 73 may form a single member formed integrally with one another as in the above embodiment, or may be formed by separately formed parts as in the third modified example. As in the above embodiment, the third modified example also makes it possible to easily control the filler material 8 and improve heat dissipation.
  • the holding portion 7 may be in contact with the inner surface of the housing portion 3.
  • the surface 73a of the first side S1 of the top wall portion 73 is in contact with the inner surface (surface of the second side S2) of the top wall portion 32.
  • the filling material 8 can be easily controlled and the heat dissipation can be improved.
  • the holding portion 7 since the holding portion 7 is in contact with the inner surface of the housing portion 3, the heat transferred from the phase modulation element 6 to the holding portion 7 can be discharged to the housing portion 3, and the heat dissipation can be further improved.
  • the holding portion 7 may be in contact with the inner surface of the side wall portion 31 instead of or in addition to the inner surface of the top wall portion 32.
  • the top wall portion 73 is in direct contact with the top wall portion 32, but a non-insulating element may be interposed between the top wall portion 73 and the top wall portion 32, or the top wall portion 73 may be in contact with the top wall portion 32 via a non-insulating element.
  • non-insulating elements include heat dissipation sheets and adhesives.
  • the surface 63b of the first side S1 of the cover member 63 may be in contact with the inner surface of the top wall portion 32.
  • the fourth modification also allows the filler 8 to be easily controlled and improves heat dissipation.
  • the cover member 63 since the cover member 63 is in contact with the top wall portion 32, heat generated in the phase modulation element 6 can be dissipated to the housing portion 3 via the cover member 63.
  • the cover member 63 is in direct contact with the top wall portion 32, but a non-insulating element may be interposed between the cover member 63 and the top wall portion 32, or the cover member 63 may be in contact with the top wall portion 32 via a non-insulating element. Examples of non-insulating elements include a heat dissipation sheet and an adhesive.
  • the phase modulation module 1 does not include a housing 3, but includes a covering member 9.
  • the covering member 9 is provided on the exposed portion of the filler 8 from the holding portion 7 so as to cover the exposed portion.
  • the covering member 9 is formed of, for example, a thermosetting resin, an ultraviolet curing resin, a tape, or a metal material.
  • the covering member 9 covers the exposed portion of the filler 8 between the end face 75a of the first extension portion 75 and the cover member 63, and between the end face 76a of the second extension portion 76 and the cover member 63.
  • the covering member 9 also covers the exposed portion of the filler 8 at the first opening 77 and the second opening 78.
  • the filler 8 can be easily controlled and the heat dissipation can be improved. Furthermore, since the covering member 9 covers the exposed portion of the filler 8 from the holding portion 7, bleeding and generation of particles on the surface of the filler 8 can be suppressed.
  • the phase modulation module 1 may include a housing 3. As shown in Figures 12 to 14, in the fifth modified example, the covering member 9 reaches the surface 63b of the second side S2 of the cover member 63, but does not reach the effective region RN. In this way, it is sufficient that the covering member 9 does not reach the effective region RN.
  • the cover member 63 may be a diamond substrate made of diamond. In this case as well, the thermal conductivity of the cover member 63 can be increased.
  • the cover member 63 may be made of a material other than sapphire and diamond (e.g., quartz).
  • the first wiring board 4 is not limited to a ceramic substrate, and may be, for example, a flexible circuit board. The first wiring board 4 may be omitted. In this case, the circuit board 61 (phase modulation element 6) may be disposed directly on the base wall portion 22. The first wiring board 4 may be disposed outside the first side wall portion 71 and the second side wall portion 72 in a plan view.
  • the base portion 2 does not necessarily have to have a heat sink 21, and may be formed, for example, by only the base wall portion 22.
  • the surface 63b of the first side S1 of the cover member 63 may be located on the second side S2 with respect to the surface 73a of the first side S1 of the top wall portion 73, and may be located on the same plane as the surface 73a of the top wall portion 73.
  • the filler 8 may not be in contact with the cover member 63, and may be in contact, for example, only with the circuit board 61 and the liquid crystal layer 62.
  • the filler 8 may not be in contact with the top wall portion 73, and may be in contact, for example, only with the first side wall portion 71 and the second side wall portion 72.
  • the filler 8 may not be in contact with the first side surface 6a and the second side surface 6b of the phase modulation element 6, and may be in contact with the phase modulation element 6 only on the surface 63c of the second side S2 of the cover member 63, for example. Alternatively, the filler 8 may be in contact with the phase modulation element 6 only on the surface of the first side S1 of the circuit board 61.
  • the holding portion 7 may not have at least one of the first opening 77 and the second opening 78, and may further have, for example, a side wall portion facing the third side surface 6c of the phase modulation element 6 and a side wall portion facing the fourth side surface 6d of the phase modulation element 6. In other words, the holding portion 7 may have a side wall portion formed in a frame shape so as to surround the phase modulation element 6.
  • the distance D1 between the end face 75a of the first extension portion 75 and the phase modulation element 6, and the distance D2 between the end face 76a of the second extension portion 76 and the phase modulation element 6 may be greater than or equal to the thickness T of the cover member 63.
  • the housing 3 may be omitted.
  • the edge 33a of the opening 33 formed in the top wall portion 32 of the housing 3 may coincide with the outer edge 63a of the cover member 63 in a plan view, or may be located outside the outer edge 63a.
  • the temperature monitor element 42 may be omitted. At least one of the recesses 81, 82 may be omitted.
  • the cover member 63 may not have a protrusion 63e protruding from the circuit board 61 in a plan view.
  • the connection member 41 may be omitted.
  • the opening 74 which is a hole, is formed in the top wall portion 73, and the entire circumference of the opening 74 is surrounded by the top wall portion 73, but the opening 74 formed in the top wall portion 73 may be a notch.
  • the top wall portion 73 may be formed in a substantially U-shape in a plan view, and the opening 74 may be open to the side at one side of the top wall portion 73 (for example, one side in the X direction). At least a part of the end face 75a of the first extension portion 75 may face the phase modulation element 6, and only a part of the end face 75a may face the phase modulation element 6.
  • At least a part of the end face 76a of the second extension portion 76 may face the phase modulation element 6, and only a part of the end face 76a may face the phase modulation element 6.
  • the end faces 75a, 76a may be inclined surfaces inclined with respect to the Z direction, for example.
  • a part of the end surface 75a of the first extension portion 75 or a part of the end surface 76a of the second extension portion 76 may be in contact with the phase modulation element 6. That is, a part of the top wall portion 73 may be in contact with the phase modulation element 6. In this case, heat generated in the phase modulation element 6 can be efficiently discharged to the holding portion 7.
  • 1...phase modulation module 2...base portion, 21...heat sink, 3...housing portion, 31...side wall portion (housing side wall portion), 32...top wall portion (housing top wall portion), 33...opening (housing opening), 33a...edge, 4...first wiring board, 41...connecting member, 41a...electrode pad, 42...temperature monitoring element, 6...phase modulation element, 6a...first side surface, 6b...second side surface, 6c...third side surface, 6d...fourth side surface, 61...circuit board, 62...liquid crystal layer, 63...cover member, 63a...outer edge, 63b...third Surface of side 1, 63c...surface of second side, 63e...protrusion, 67...electrode layer, 7...holding portion, 71...first side wall portion, 72...second side wall portion, 73...top wall portion, 73a...surface of first side, 74...opening, 74a...edge, 75...first extension portion, 75a...end face, 76

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
PCT/JP2024/002434 2023-04-21 2024-01-26 位相変調モジュール Ceased WO2024219038A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP24792314.7A EP4671857A1 (en) 2023-04-21 2024-01-26 PHASE MODULATION MODULE
CN202480026827.1A CN120981763A (zh) 2023-04-21 2024-01-26 相位调制模块
JP2025515055A JPWO2024219038A1 (https=) 2023-04-21 2024-01-26
KR1020257033990A KR20250170057A (ko) 2023-04-21 2024-01-26 위상 변조 모듈

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JP2023-069885 2023-04-21
JP2023069885 2023-04-21
JP2023118048 2023-07-20
JP2023-118048 2023-07-20

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JP (1) JPWO2024219038A1 (https=)
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TW (1) TW202443253A (https=)
WO (1) WO2024219038A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010256656A (ja) * 2009-04-27 2010-11-11 Seiko Epson Corp 電気光学装置及び電子機器
JP2011150226A (ja) * 2010-01-25 2011-08-04 Seiko Epson Corp 電気光学装置及び電子機器
JP2017116735A (ja) 2015-12-24 2017-06-29 株式会社フジクラ 光学素子パッケージ
JP2020109490A (ja) * 2019-11-05 2020-07-16 サンテック株式会社 空間位相変調器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010256656A (ja) * 2009-04-27 2010-11-11 Seiko Epson Corp 電気光学装置及び電子機器
JP2011150226A (ja) * 2010-01-25 2011-08-04 Seiko Epson Corp 電気光学装置及び電子機器
JP2017116735A (ja) 2015-12-24 2017-06-29 株式会社フジクラ 光学素子パッケージ
JP2020109490A (ja) * 2019-11-05 2020-07-16 サンテック株式会社 空間位相変調器

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4671857A1

Also Published As

Publication number Publication date
CN120981763A (zh) 2025-11-18
KR20250170057A (ko) 2025-12-04
JPWO2024219038A1 (https=) 2024-10-24
TW202443253A (zh) 2024-11-01
EP4671857A1 (en) 2025-12-31

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