CN101901865B - 金属层压板和使用其的发光二极管封装的制造方法 - Google Patents
金属层压板和使用其的发光二极管封装的制造方法 Download PDFInfo
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 8
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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Abstract
本发明涉及一种金属层压板和使用其的发光二极管封装的制造方法，本发明提供了一种金属层压板，其包括：由绝缘材料制成的芯层；设置在该芯层的一个表面上的金属层；设置在该芯层的另一表面上的热辐射金属层；以及沿着热辐射金属层的外表面设置并由热辐射金属层的氧化物制成的保护性金属氧化层。
Description
相关申请的交叉参考
本申请要求于2009年5月28日向韩国知识产权局提交的韩国专利申请第10-2009-0046991号的优先权，其公开的内容通过引证结合于此。
技术领域
本发明涉及一种金属层压板和使用其的发光二极管封装的制造方法，更具体地，涉及一种具有沿着热辐射金属层的外表面设置并由热辐射金属层的氧化物制成的保护性金属氧化层的金属层压板和使用其的发光二极管封装的制造方法。
背景技术
通常，发光二极管器件由于诸如低能耗和高亮度的若干优点而被广泛地用作光源。
尤其是最近，发光二极管器件被用作照明装置和用于液晶显示器(LCD)的背光。发光二极管器件以可以容易地安装于诸如照明装置的各种装置的封装的形式配置。
发光二极管封装包括安装于印刷电路板上的发光二极管器件。这里，发光二极管器件产生热和光。此时，通过印刷电路板辐射由发光二极管器件产生的热量。然而，由于印刷电路板由具有低导热效率的绝缘材料制成，所以传统的发光二极管封装不能有效地辐射由发光二极管器件产生的热量。因此，存在发光二极管器件的使用寿命减少和特性退化的问题。
作为解决此问题的一种方式，提出了这样一种技术：在发光二极管器件的安装区域的印刷电路板中形成通孔，并用导热材料填充通孔，但是，存在制造工艺复杂且制造成本增加的问题。
因此，通过将发光二极管封装直接安装到在下表面上包括具有热辐射效果的Al的封装基底上，有可能改进热辐射效率并简化制造工艺。
然而，为了防止由于在封装基底上形成电路图案(电路图案与发光二极管器件电连接)的过程中所使用的化学物引起Al的腐蚀，应将附加的带子附接至Al的表面。此时，需要用于附接和拆卸带子的附加的处理和人力，并且，由于带子在处理过程中的损坏而产生的污染物可能导致封装基底或处理的失效。
因此，为了实现热辐射效果并简化处理，传统的发光二极管封装包括具有Al层的封装基底，但是，由于用于防止Al与化学物接触的带子附接处理，存在失效和处理数量增加的问题。
发明内容
为了解决上述问题，提出了本发明，因此，本发明的一个目的是提供一种具有沿着热辐射金属层的外表面设置并由热辐射金属层的氧化物制成的保护性金属氧化层的金属层压板，以及使用该金属层压板的发光二极管封装的制造方法。
根据实现目的的本发明的一个方面，提出了一种金属层压板，其包括：由绝缘材料制成的芯层；设置在芯层的一个表面上的金属层；设置在芯层的另一表面上的热辐射金属层；以及沿着热辐射金属层的外表面设置并由热辐射金属层的氧化物制成的保护性金属氧化层。
这里，芯层可进一步包括热辐射填充料。
此外，热辐射金属层可包括铝，保护性金属氧化层可包括氧化铝膜。
此外，金属层可由铜或铜合金中的任何一个制成。
根据实现目的的本发明的另一方面，提供了一种发光二极管封装的制造方法，其包括以下步骤：制备金属层压板，其包括由绝缘材料制成的芯层、设置在芯层的一个表面上的金属层、设置在芯层的另一表面上的热辐射金属层、以及沿着热辐射金属层的外表面设置并由热辐射金属层的氧化物制成的保护性金属氧化层；通过使金属层形成图案而形成电连接至发光二极管的电路图案；并在电路图案上安装发光二极管器件。
这里，可通过阳极氧化热辐射金属层的表面而形成保护性金属氧化层。
此外，热辐射金属层可由铝制成，保护性金属氧化层可由氧化铝膜制成。
此外，本方法可还包括在形成电路图案的步骤和安装发光二极管器件的步骤之间的去除保护性金属氧化层的步骤。
此外，芯层可还包括热辐射填充料。
附图说明
结合附图，通过以下实施例的描述，本发明总的发明构思的这些和/或其它方面及优点将变得显而易见且更容易理解，其中：
图1是根据本发明的第一实施例的金属层压板的截面图；
图2是具有根据本发明的第一实施例的金属层压板的发光二极管封装的截面图；
图3至图6是描述根据本发明的第二实施例的发光二极管封装的制造方法的截面图。
具体实施方式
在下文中，将参照金属层压板和发光二极管封装的图详细说明本发明的优选实施例。应该理解，以下实施例是为了使本领域技术人员完全理解本发明的实质而作为实例提供的。因此，本发明不限于以下实施例，而是可以以其它形式体现。并且，在附图中，为了方便，可放大元件的大小和厚度。在全文中，相同的参考标号表示相同的元件。
图1是根据本发明的第一实施例的金属层压板的截面图。
参照图1，金属层压板包括芯层110、金属层120、热辐射金属层130、以及保护性金属氧化层140。
芯层110由绝缘材料制成。例如，芯层110可以包括环氧树脂或酚醛树脂。此外，芯层110可进一步包括玻璃纤维以改进耐久性。
另外，芯层110进一步包括热辐射填充料111。热辐射填充料111是具有高导热率的导热材料，例如，银、镍、铜、铝、石墨、铁氧体和碳中的任何一种的粉末。因此，芯层110更有效地将热量从金属层120传导至热辐射金属层130。
金属层120设置在芯层110的一个表面上。金属层120是用于形成电路图案的导电膜。例如，金属层120可由铜或铜合金制成。
热辐射金属层130设置在芯层110的另一表面上。热辐射金属层130由具有高导热率的金属制成，例如，铝。然而，在本发明的实施例中，热辐射金属层130的材料不受限制。
保护性金属氧化层140沿着热辐射金属层130的外周表面设置。也就是说，保护性金属氧化层140被形成为覆盖暴露至外部的热辐射金属层130的表面。保护性金属氧化层140起到防止由于在金属层120的图案化过程中使用的化学物或外部氧气或湿气而引起的热辐射金属层130腐蚀的作用。此时，保护性金属氧化层140由热辐射金属层130的氧化物制成。也就是说，保护性金属氧化层140通过由于阳极氧化处理而产生的热辐射金属层130的表面氧化而形成。例如，在热辐射金属层130由铝制成的情况中，保护性金属氧化层140则由氧化铝制成。因此，热辐射金属层130通过诸如表面氧化的简单处理来形成。
因此，就像本发明的实施例，能够通过形成具有带热辐射金属层的基底的发光二极管封装的电路板来改进发光二极管封装的热辐射效率。
此外，在形成电路图案的处理中，通过在热辐射金属层的表面上进一步配置保护性金属氧化层，能够防止热辐射金属层的腐蚀。
在下文中，将参照图2描述由根据本发明的第一实施例的金属层压板制造的发光二极管封装。
图2是具有根据本发明的第一实施例的金属层压板的发光二极管封装的截面图。
参照图2，发光二极管封装包括封装基底200和安装于封装基底200上的发光二极管250。
封装基底200包括由绝缘材料制成的芯层210、设置在芯层210上表面上的电路图案220、以及设置在芯层210下表面上的热辐射金属层230。
发光二极管250电连接至电路图案220，并通过引线260焊接安装于封装基底200上。例如，在发光二极管250是竖直发光二极管的情况下，发光二极管250的下表面直接电接合至电路图案220，并且，发光二极管250的上表面通过引线260焊接而电接合至电路图案220。然而，在本发明的实施例中，发光二极管250的形状并没有限制，并且，发光二极管250可以通过倒装焊接安装在封装基底200上。
芯层210进一步包括用于有效地将热量从电路图案220传导至热辐射金属层230的热辐射填充料211。热辐射填充料211可以是银、镍、铜、铝、石墨、铁氧体和碳中的任何一种的导热粉末。
热辐射金属层230在将从安装在封装基底200上的发光二极管250产生的热量辐射至外部的过程中起作用。
因此，由于发光二极管250直接安装在具有热辐射金属层230的封装基底200上，所以，能够有效地将热量辐射至外部，从而延长发光二极管250的使用寿命并确保其可靠性。
另外，保护性金属氧化层240沿着热辐射金属层230的外表面设置，以在发光二极管封装的制造过程中保护热辐射金属层230。保护性金属氧化层240由形成热辐射金属层230的金属的氧化物制成。因此，通过对热辐射金属层230作阳极氧化处理可以容易地制造保护性金属氧化层240。
在本发明的实施例中，虽然示出并描述了发光二极管封装包括保护性金属氧化层240，但是，保护性金属氧化层240也可在发光二极管封装的制造完成处理中去除。
另外，发光二极管封装进一步包括覆盖发光二极管250的模塑部分270。模塑部分270起到从外部保护发光二极管250的作用。模塑部分270可由透明树脂制成，例如，硅树脂、环氧树脂、聚氨酯树脂和环氧模塑化合物。另外，模塑部分270可进一步包括荧光材料，其转换从发光二极管250发射的光的波长。因此，模塑部分270可执行波长转换功能，并保护发光二极管250。
因此，就像本发明的实施例，通过形成具有带热辐射金属层的金属层压板而不是印刷电路板的发光二极管封装的封装基底，可以容易地将由发光二极管产生的热量辐射至外部，而不用改变发光二极管封装的厚度或增加单独的处理。
在下文中，将参照图3至图6描述使用根据本发明的第一实施例的金属层压板的发光二极管封装的制造方法。
图3至图6是描述根据本发明的第二实施例的发光二极管封装的制造方法的截面图。
参照图3，为了制造发光二极管封装，首先，形成金属层压板。
为了制造金属层压板，形成由绝缘材料制成的芯层210。芯层210可包括环氧树脂或酚醛树脂。此外，芯层210可进一步包括玻璃纤维以改进耐久性。此外，芯层进一步包括热辐射填充料211，以改进金属层压板的热辐射效果。例如，热辐射填充料211可由银、镍、铜、铝、石墨、铁氧体或碳制成。
通过将金属层220a和热辐射金属层230分别堆叠在芯层210的两个表面上并对其进行加热和挤压来形成金属层压板。
金属层220a由导电材料制成，例如，铜或铜合金。
此外，热辐射金属层230由具有比其它材料更高的导热率的材料制成，例如，铝或铝合金。
参照图4，沿着热辐射金属层230的外表面形成保护性金属氧化层240。也就是说，在热辐射金属层230的表面上形成保护性金属氧化层240，其暴露至外部。保护性金属氧化层240起到防止热辐射金属层230由于在金属层220a的形成图案过程中使用的化学物而腐蚀的作用。
保护性金属氧化层240由形成热辐射金属层230的金属的氧化物制成。例如，在热辐射金属层230由铝制成的情况中，保护性金属氧化层240由氧化铝制成。
此时，通过对热辐射金属层230作阳极氧化处理来形成保护性金属氧化层240。这里，例如，阳极氧化处理方法可以是硫酸法、氢氟酸法或有机酸法。
因此，由于不需要用于附接保护带以保护热辐射金属层230的额外的处理和人力，所以能够减少处理数量和处理成本，并保护热辐射金属层230的表面。
参照图5，通过蚀刻金属层220a来形成电路图案220。此时，保护性金属氧化层240保护热辐射金属层230的表面不受在形成电路图案220的过程中使用的化学物的影响。
参照图6，安装发光二极管250以电连接至电路图案220。这里，发光二极管250通过引线260焊接法或倒装焊接法安装，并且不限于本发明的实施例。
在此之后，形成模塑部分270，以覆盖发光二极管250。模塑部分270可由硅树脂、环氧树脂、聚氨酯树脂或环氧模塑化合物制成。另外，模塑部分270可进一步包括用于转换由发光二极管250产生的光的荧光材料。这里，例如，可通过铸塑法、分配法(dispensingmethod)、注塑法、传递模塑法或针尖浇口模塑(pin gate molding)法将模塑部分270形成为期望的形状。
另外，可以进一步执行用湿法去除保护性金属氧化层240的处理。
因此，就像本发明的实施例，可以通过形成具有高导热率的金属层压板的封装基底，改进发光二极管封装的热辐射效率，并用简单的制造工艺制造发光二极管封装。
此外，通过用保护性金属氧化层保护金属层压板的热辐射金属层的表面，可以防止热辐射效率的降低。
此外，通过用热辐射金属层的阳极氧化处理方法容易地形成保护性金属氧化层，可以防止加工成本的增加，而无需购买辅助材料。
本发明通过形成具有包括金属层、芯层和热辐射金属层的金属层压板的封装基底，通过简单处理制造了具有高热辐射效率的发光二极管封装。
此外，通过在热辐射金属层的外表面上形成保护性金属氧化层，可以保护热辐射金属层不受在形成电路图案的过程中使用的化学物的影响。
此外，可以通过对热辐射金属层作阳极氧化处理来容易地形成保护性金属氧化层。
虽然已经示出并描述了本发明总的发明构思的几个实施例，但是，本领域的技术人员将理解，在不背离总的发明构思的原理和实质的前提下可进行改变，本发明的范围由所附的权利要求及其等价物来限定。
Claims (7)
1.一种金属层压板，包括：
芯层，由绝缘材料制成并且包括热辐射填充料，其中，所述热辐射填充料是银、镍、铜、铝、石墨、铁氧体和碳中的任何一种的具有高导热率的导热材料；
金属层，设置在所述芯层的一个表面上；
热辐射金属层，设置在所述芯层的另一个表面上；以及
保护性金属氧化层，沿着所述热辐射金属层的包括底面和侧面的所有外部暴露表面设置并由所述热辐射金属层的氧化物制成。
2.根据权利要求1所述的金属层压板，其中，所述热辐射金属层包括铝，所述保护性金属氧化层包括氧化铝膜。
3.根据权利要求1所述的金属层压板，其中，所述金属层由铜或铜合金制成。
4.一种发光二极管封装的制造方法，包括以下步骤：
制备金属层压板，其包括由绝缘材料制成并且包括热辐射填充料的芯层、设置在所述芯层的一个表面上的金属层、设置在所述芯层的另一表面上的热辐射金属层、以及沿着所述热辐射金属层的包括底面和侧面的所有外部暴露表面设置并由所述热辐射金属层的氧化物制成的保护性金属氧化层，其中，所述热辐射填充料是银、镍、铜、铝、石墨、铁氧体和碳中的任何一种的具有高导热率的导热材料；
通过使所述金属层形成图案而形成电连接至发光二极管的电路图案；并且
在所述电路图案上安装发光二极管器件。
5.根据权利要求4所述的方法，其中，通过阳极氧化所述热辐射金属层的表面而形成所述保护性金属氧化层。
6.根据权利要求4所述的方法，其中，所述热辐射金属层由铝制成，所述保护性金属氧化层由氧化铝膜制成。
7.根据权利要求4所述的方法，在所述形成电路图案的步骤和所述安装发光二极管器件的步骤之间，还包括去除所述保护性金属氧化层的步骤。
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2009
- 2009-05-28 KR KR1020090046991A patent/KR101003591B1/ko not_active IP Right Cessation
-
2010
- 2010-01-11 TW TW099100611A patent/TWI487138B/zh not_active IP Right Cessation
- 2010-01-20 US US12/690,743 patent/US8481171B2/en not_active Expired - Fee Related
- 2010-01-27 JP JP2010015965A patent/JP5086378B2/ja not_active Expired - Fee Related
- 2010-02-08 CN CN201010110963.9A patent/CN101901865B/zh not_active Expired - Fee Related
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2013
- 2013-03-04 US US13/784,321 patent/US8568861B2/en not_active Expired - Fee Related
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| JP特开2007-317701A 2007.12.06 |
| JP特开2008-208183A 2008.09.11 |
| JP特开平11-163485A 1999.06.18 |
| JP特开平8-255960A 1996.10.01 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101003591B1 (ko) | 2010-12-22 |
| US20130183479A1 (en) | 2013-07-18 |
| KR20100128544A (ko) | 2010-12-08 |
| TW201042779A (en) | 2010-12-01 |
| JP5086378B2 (ja) | 2012-11-28 |
| TWI487138B (zh) | 2015-06-01 |
| US20100304162A1 (en) | 2010-12-02 |
| CN101901865A (zh) | 2010-12-01 |
| JP2010278417A (ja) | 2010-12-09 |
| US8481171B2 (en) | 2013-07-09 |
| US8568861B2 (en) | 2013-10-29 |
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