WO2024204073A1 - 基板、パッケージ、ガスセンサモジュール、ガスセンサおよびガスセンサの製造方法 - Google Patents

基板、パッケージ、ガスセンサモジュール、ガスセンサおよびガスセンサの製造方法 Download PDF

Info

Publication number
WO2024204073A1
WO2024204073A1 PCT/JP2024/011720 JP2024011720W WO2024204073A1 WO 2024204073 A1 WO2024204073 A1 WO 2024204073A1 JP 2024011720 W JP2024011720 W JP 2024011720W WO 2024204073 A1 WO2024204073 A1 WO 2024204073A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
gas sensor
gas
heater
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2024/011720
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
孝太郎 中本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2025510862A priority Critical patent/JPWO2024204073A1/ja
Priority to CN202480021511.3A priority patent/CN120936871A/zh
Publication of WO2024204073A1 publication Critical patent/WO2024204073A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid

Definitions

  • This disclosure relates to substrates, packages, gas sensors, and methods for manufacturing gas sensors.
  • Known small gas sensors include a CAN-type gas sensor as disclosed in Patent Document 1, and a gas sensor equipped with a MEMS element as disclosed in Patent Document 2.
  • the substrate according to one embodiment of the present disclosure includes a base body including a plurality of insulating layers made of a ceramic material, and having a first surface and a second surface located opposite the first surface, a gas sensor region located on the first surface in which a gas sensor is disposed, electrode wiring located in the gas sensor region and connected to the gas sensor, a heater located between the insulating layers and overlapping the gas sensor region in a plan view, and an external electrode electrically connected to the electrode wiring or the heater.
  • the package according to one embodiment of the present disclosure comprises the substrate and a lid.
  • a gas sensor includes the package and a gas sensor.
  • a gas sensor module includes the gas sensor and a mounting substrate, and the gas sensor is surface-mounted on the mounting substrate by soldering.
  • a method for manufacturing a gas sensor includes the steps of preparing a mother substrate having a plurality of substrate regions corresponding to the substrate, forming a gas sensor in the gas sensor region, and singulating the mother substrate.
  • FIG. 1 is a cross-sectional view of a gas sensor according to a first embodiment of the present disclosure.
  • FIG. 2 is a top view of the substrate according to the first embodiment of the present disclosure.
  • 1 is a plan view perspective view showing a configuration of a heater surface of a substrate according to a first embodiment of the present disclosure.
  • FIG. FIG. 2 is a bottom view of the substrate according to the first embodiment of the present disclosure.
  • FIG. 2 is a top view of the lid according to the first embodiment of the present disclosure.
  • 1 is a cross-sectional view of a gas sensor module including a gas sensor according to a first embodiment of the present disclosure.
  • FIG. 11 is a cross-sectional view of a substrate according to a second embodiment of the present disclosure.
  • FIG. 11 is a top view of a substrate according to a second embodiment of the present disclosure.
  • FIG. 11 is a plan view perspective view showing the configuration of a heater surface of a substrate according to a second embodiment of the present disclosure.
  • FIG. 11 is a cross-sectional view of a substrate according to a second embodiment of the present disclosure.
  • FIG. 13 is a plan perspective view showing a heater surface configuration illustrating another embodiment of a cavity.
  • FIG. 13 is a plan perspective view showing a heater surface configuration illustrating another embodiment of a cavity.
  • FIG. 13 is a plan perspective view showing a heater surface configuration illustrating another embodiment of a cavity.
  • FIG. 13 is a cross-sectional view showing another embodiment of a cavity.
  • FIG. 11 is a cross-sectional view of a substrate according to a third embodiment of the present disclosure.
  • FIG. 11 is a top view of a substrate according to a third embodiment of the present disclosure.
  • FIG. 11 is a cross-sectional view of a substrate according to a fourth embodiment of the present disclosure.
  • FIG. 11 is a top view of a substrate according to a fourth embodiment of the present disclosure.
  • FIG. 11 is a cross-sectional view of a gas sensor according to a fifth embodiment of the present disclosure.
  • FIG. 11 is a top view of a substrate according to a fifth embodiment of the present disclosure.
  • FIG. 13 is a top view of a lid according to a fifth embodiment of the present disclosure.
  • FIG. 11 is a cross-sectional view of a gas sensor according to a sixth embodiment of the present disclosure.
  • FIG. 13 is a cross-sectional view of a gas sensor according to a seventh embodiment of the present disclosure.
  • FIG. 13 is a cross-sectional view of a gas sensor according to an eighth embodiment of the present disclosure.
  • FIG. 13 is a top view of a substrate according to an eighth embodiment of the present disclosure.
  • FIG. 13 is a perspective view of a gas sensor according to an eighth embodiment of the present disclosure.
  • FIG. 13 is a cross-sectional view of a gas sensor according to a ninth embodiment of the present disclosure.
  • FIG. 13 is a top view of a substrate according to a ninth embodiment of the present disclosure.
  • FIG. 13 is a cross-sectional view of a gas sensor according to a ninth embodiment of the present disclosure.
  • FIG. 13 is a cross-sectional view of a gas sensor according to a tenth embodiment of the present disclosure.
  • FIG. 13 is a cross-sectional view of another gas sensor according to embodiment 10 of the present disclosure.
  • FIG. 13 is a cross-sectional view of another gas sensor according to embodiment 10 of the present disclosure.
  • FIG. 13 is a cross-sectional view of another gas sensor according to embodiment 10 of the present disclosure.
  • FIG. 13 is a cross-sectional view of another gas sensor according to embodiment 10 of the present disclosure.
  • FIG. 13 is a top view of another gas sensor according to embodiment 10 of the present disclosure.
  • FIG. 23 is a cross-sectional view of a gas sensor according to an eleventh embodiment of the present disclosure.
  • FIG. 23 is a top view of a substrate according to an eleventh embodiment of the present disclosure.
  • 13 is a cross-sectional view of a gas sensor module and electronic device including a gas sensor according to an eleventh embodiment of the present disclosure.
  • FIG. 23 is a schematic plan view showing a portion of a mother substrate according to a twelfth embodiment of the present disclosure.
  • FIG. 23 is a cross-sectional view of a gas sensor according to a thirteenth embodiment of the present disclosure.
  • FIG. 23 is a top view of a gas sensor according to an eleventh embodiment of the present disclosure.
  • One aspect of the present disclosure is to simplify and miniaturize the structure of a gas sensor.
  • the structure of the gas sensor can be simplified and made smaller.
  • top and bottom is for convenience and does not limit the top and bottom when the substrate, package, and gas sensor are actually used.
  • the surface of the substrate 10 on which the gas sensor 8 is provided is defined as the top surface.
  • the positive Z-axis direction is the upward direction.
  • the X-axis direction is a direction parallel to any one side of the substrate 10, and the Y-axis is an axis perpendicular to the X-axis and Z-axis.
  • the thickness direction of the substrate 10 is the Z-axis direction.
  • the dimensions of the components in each drawing do not need to faithfully represent the actual dimensions of the components and the dimensional ratios of each member.
  • a rectangular shape is not limited to a strict rectangular shape, and includes a shape that can be visually recognized as a rectangular shape overall, even if the corners are curved, for example.
  • FIG. 1 is a cross-sectional view of the gas sensor 900 according to the first embodiment, and shows a cross-sectional view taken along line I-I in a state where a bonding material B and a lid 7 are attached to the substrate 10 shown in FIG. 2.
  • FIG. 2 is a top view of the substrate 10.
  • FIG. 3 is a plan view perspective showing the configuration of the heater surface of the substrate 10. The heater surface is the surface on which a heater 5, which will be described later, is located. In FIG. 3, a virtual area of the gas sensing region 3 is shown for ease of explanation.
  • FIG. 4 is a bottom view of the substrate 10.
  • FIG. 5 is a top view of the lid 7.
  • a plan view seen from the positive direction of the Z axis may be referred to as a top view
  • a plan view seen from the negative direction of the Z axis may be referred to as a bottom view.
  • the present disclosure relates to a substrate-type gas sensor.
  • the gas sensor 900 according to the first embodiment includes a package 100 and a gas sensor 8.
  • the package 100 includes a substrate 10 and a lid 7.
  • the substrate 10 includes a base 2, a gas sensor region 3, wiring 4, and a heater 5.
  • the substrate 10 functions as a supporting substrate for the gas sensor 8 and also as a wiring substrate. Each member constituting the substrate 10 will be described in detail below.
  • the base 2 is the main body of the substrate 10 and includes a plurality of insulating layers 20 stacked in the thickness direction of the substrate 10.
  • the insulating layers 20 are made of a ceramic material.
  • the substrate 10 has a first surface 201 located in the stacking direction and a second surface 202 located on the opposite side to the first surface 201.
  • the insulating layer having the first surface 201 is referred to as the first insulating layer 21.
  • the insulating layer stacked on the first insulating layer 21 is referred to as the second insulating layer 22.
  • the second insulating layer 22 is an insulating layer stacked on the opposite side of the first insulating layer 21 from the first surface 201.
  • the first insulating layer 21 is located above the heater 5 and may be a group of insulating layers including a plurality of insulating layers 20.
  • the second insulating layer 22 is located on the opposite side of the first insulating layer 21 across the heater 5 and may be a group of insulating layers including a plurality of insulating layers 20.
  • the planar shape of the base 2 may be rectangular.
  • the base 2 is made of ceramics such as aluminum oxide sintered body (alumina ceramics), aluminum nitride sintered body, mullite sintered body, or glass ceramic sintered body.
  • the planar shape of the base 2 in embodiment 1 is substantially square, but may be rectangular.
  • the base 2 may have notches at the corners as shown in FIG. 2.
  • the planar shape of the base 2 is not limited to a rectangle, and may be changed as appropriate depending on the application, etc.
  • the gas sensitive region 3 is located on the first surface 201 and is a region in which the gas sensitive body 8 is placed.
  • the gas sensitive region 3 may be a region on the first surface 201 that overlaps with the gas sensitive body 8 placed in the gas sensitive region 3.
  • the gas sensitive region 3 may be a region located on the first surface 201 that is surrounded by virtual lines connecting alignment marks used when placing the gas sensitive body 8.
  • the wiring 4 includes an electrode wiring 41, an external electrode 42, and a through conductor 43.
  • the wiring 4 may include an interlayer conductor 44.
  • the through conductor 43 penetrates at least one insulating layer 20 in the vertical direction, and connects the wirings located above and below the through conductor 43.
  • the wiring connected via the through conductor 43 may be the electrode wiring 41, the external electrode 42, or the interlayer conductor 44.
  • the interlayer conductor 44 is a conductor located between the insulating layers 20.
  • the electrode wiring 41 is a wiring at least part of which is located in the gas sensing region 3 and is connected to the gas sensing body 8. As shown in FIG. 2, the electrode wiring 41 may include a first portion 41P and a second portion 41L. The first portion 41P and the second portion 41L may be continuous and integral. The first portion 41P and the second portion 41L may be a metallized pattern formed by printing and sintered simultaneously with the ceramic base body 2. Alternatively, the first portion 41P and the second portion 41L may be a metallized pattern formed by printing or vapor deposition after sintering the ceramic base body 2.
  • the first portion 41P may be a plate-shaped conductor.
  • the first portion 41P functions as a connection pad for connecting to the through conductor 43X, and has an area larger than the diameter of the through conductor 43X in a plan view.
  • the first portion 41P is connected to the through conductor 43X that is positioned overlapping the first portion 41P in a plan view and penetrates the base 2.
  • the through conductor 43X is connected to the first external electrode 42X.
  • the through conductor 43X is positioned overlapping the first external electrode 42X in a plan view.
  • the first portion 41P may have a rectangular shape with a side length larger than the diameter of the cross section perpendicular to the Z axis of the through conductor 43.
  • the shape of the first portion 41P is not limited to a rectangular shape and may be any shape.
  • the shape of the first portion 41P may be a circle having a diameter larger than the diameter of the cross section of the through conductor 43.
  • the two first portions 41P are located along a diagonal line of the substrate 10.
  • the arrangement of the first portions 41P is not limited to this arrangement, and for example, the two first portions 41P may be arranged along any one side of the rectangular substrate 10.
  • the second portion 41L is at least partially located in the gas sensitive region 3 and includes an extension portion extending from the gas sensitive region 3 to the first portion 41P.
  • the portion of the second portion 41L located in the gas sensitive region 3 may have a comb-tooth shape.
  • the shape of the portion located in the gas sensitive region 3 is not limited to a comb-tooth shape.
  • the second portion 41L may be in the shape of a single strip extending from the gas sensitive region 3 to the first portion 41P.
  • the external electrode 42 is located on the second surface 202 of the base 2 and is electrically connected to the electrode wiring 41 or the heater 5.
  • the external electrode 42 is located on the second surface 202, which enables surface mounting.
  • the external electrode 42 may include, for example, two first external electrodes 42X electrically connected to the two electrode wirings 41, respectively, and two second external electrodes 42Y electrically connected to the two terminals of the heater 5, respectively, as shown in FIG. 4.
  • the first external electrode 42X is electrically connected to the electrode wiring 41 via the through conductor 43X.
  • the second external electrode 42Y is electrically connected to the heater 5 via the through conductor 43Y.
  • the two first external electrodes 42X are located along the diagonal of the substrate 10. In other words, the two first external electrodes 42X are located at opposing corners of the base 2.
  • the arrangement of the first external electrodes 42X is not limited to the arrangement.
  • the two first external electrodes 42X may be arranged along any one side of the rectangular substrate 10.
  • the external electrode 42 When the gas sensor 900 is mounted on a mounting board such as a printed circuit board (PCB), the external electrode 42 is connected to a circuit board (external electrical circuit) of the device via a solder material.
  • the external electrode 42 may be provided from the second surface 202 to the side surface of the base 2. As shown in Figures 1 and 2, when the substrate 10 has a cutout portion at a corner, the external electrode 42 located on the side surface may be located in the cutout portion.
  • the electrode wiring 41, external electrode 42, through conductor 43 and interlayer conductor 44 mainly contain, as the conductor material, a metal such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel or cobalt, or an alloy containing these metals.
  • the electrode wiring 41 and external electrode 42 are formed on the surface of the base 2 as a metal layer such as a metallized layer or a plated layer of a conductor material.
  • the metal layer may be a single layer or multiple layers.
  • the interlayer conductor 44 is formed inside the base 2 by metallizing the conductor material.
  • the electrode wiring 41 and the external electrode 42 are, for example, tungsten metallization layers, they can be formed by applying a metal paste made by mixing tungsten powder with an organic solvent and an organic binder to a predetermined position on the insulating layer 20 by a method such as screen printing. Furthermore, the through conductor 43 may be formed by providing a through hole at a predetermined position on the ceramic green sheet prior to printing the above-mentioned metal paste, and filling this through hole with the same metal paste as above.
  • the exposed surface of the metallized layer after firing may be further coated with a plating layer of nickel or gold, etc., using electrolytic plating or electroless plating, etc.
  • the heater 5 is located between the first insulating layer 21 and the second insulating layer 22.
  • the gas sensor 8 detects gas while generally being heated to about 200 to 500°C, although this varies depending on the gas to be detected.
  • the heater 5 is for heating the gas sensor 8.
  • the heater 5 may be a heater circuit pattern as shown in FIG. 3.
  • the heater 5 is connected to a heater terminal 44Y located in the same interlayer as the heater 5. As shown in FIG. 3, the heater 5 and the heater terminal 44Y may be integrally formed.
  • the heater terminal 44Y is an example of an interlayer conductor 44.
  • the heater terminal 44Y is connected to a through conductor 43Y that overlaps with the heater terminal 44Y in a planar perspective and penetrates the second insulating layer 22.
  • the heater terminal 44Y is a portion that functions as a connection pad for connecting to the through conductor 43Y, and has an area larger than the diameter of the through conductor 43Y in a planar view.
  • the planar shape of the heater terminal 44Y may be circular as shown in FIG. 3, or may be other shapes such as rectangular.
  • the through conductor 43Y is positioned so as to overlap the second external electrode 42Y in a planar perspective view, and is connected to the second external electrode 42Y.
  • the first insulating layer 21 may be thinner than the second insulating layer 22.
  • the distance between the heater 5 and the first surface 201 may be smaller than the distance between the heater 5 and the second surface 202.
  • the distance between the heater 5 and the first surface 201 may be 10 ⁇ m or more and 100 ⁇ m or less.
  • the thickness of the first insulating layer 21 may be 10 ⁇ m or more and 100 ⁇ m or less.
  • the heat of the heater 5 is easily transferred to the gas sensor 8.
  • the thickness of the first insulating layer 21 is 10 ⁇ m or more, the risk of the heater being exposed to the first surface 201 can be reduced.
  • the thickness of the first insulating layer 21 is 10 ⁇ m or more, electrical insulation between the heater 5 and the electrode wiring 41 can be ensured.
  • the external electrode 42 located on the second surface 202 is joined to the circuit electrode of the mounting board via solder or a conductive adhesive made of resin. Since heat from the heater 5 is more easily transferred to the first surface side where the gas sensor 8 is located than to the second surface side, by positioning the external electrode 42 on the second surface 202, the effect of heat on the conductive adhesive can be reduced. Therefore, for example, the distance between the heater 5 and the second surface 202 may be 100 ⁇ m or more. In other words, the thickness of the second insulating layer 22 may be 100 ⁇ m or more. By having the thickness of the second insulating layer 22 be 100 ⁇ m or more, the effect of heat from the heater 5 on the conductive adhesive can be reduced.
  • the gas sensor 8 includes a metal oxide semiconductor material according to the type of the gas sensor 900.
  • the metal oxide semiconductor material include one or more selected from tin oxide (SnO2 , etc. ), indium oxide ( In2O3 , etc. ), zinc oxide (ZnO, etc.), tungsten oxide (WO3 , etc.), and iron oxide ( Fe2O3 , etc. ).
  • the gas to be detected by the gas sensor can be appropriately selected.
  • the gas sensor 8 detects the gas to be detected based on a change in resistance value due to contact with the gas to be detected.
  • the gas sensor 8 is protected by a lid 7.
  • the gas sensor 900 includes a cap-shaped lid 7 that covers the electrode wiring 41 and the gas sensor 8 located on the first surface 201 of the substrate 10.
  • the lid 7 may have a through hole 71 for ventilation.
  • the lid 7 may have a plurality of through holes 71. By having a plurality of through holes, the ventilation can be improved.
  • the through hole 71 may be provided at a position that does not overlap with the gas sensor 8 in a planar perspective. By not overlapping with the gas sensor 8 in a planar perspective, the possibility that dust or the like that has entered through the through hole 71 will adhere to the gas sensor 8 can be reduced.
  • the lid body 7 may be, for example, ceramic or metal.
  • FIG. 1 shows an example in which the lid body 7 is made of metal.
  • a cap-shaped lid body can be easily manufactured by bending.
  • the lid body 7 can be formed thin, and the package 100 and the gas sensor 900 can be made smaller.
  • the metallic lid 7 and the substrate 10 can be joined, for example, by resin. That is, the joining material B can be resin. Alternatively, the lid 7 and the substrate 10 can be joined by soldering or brazing. These joining methods are performed by total heating using a batch furnace or a tunnel furnace. In the case of soldering or brazing, a frame-shaped metal film can be positioned on the first surface 201, and the lid 7 can be joined onto the frame-shaped metal film. The frame-shaped metal film can be formed by metallizing the first surface 201.
  • direct seam welding When joining the metallic lid 7 and the frame-shaped metal film, direct seam welding, laser welding, or electron beam welding may be used. These welding methods involve localized heating of the joint, allowing sealing at lower temperatures than joining by heating the entire surface.
  • an iron-nickel (Fe-Ni) alloy or an iron-nickel-cobalt (Fe-Ni-Co) alloy may be used as the material for the lid 7. These alloys have a small difference in thermal expansion with ceramics, making them suitable for the lid 7 of the substrate 10.
  • the substrate 10 includes a base 2 that includes a plurality of insulating layers 20 made of a ceramic material and has a first surface 201 and a second surface 202 located on the opposite side to the first surface 201.
  • the substrate 10 includes a gas sensor region 3 located on the first surface 201, which is a region in which a gas sensor 8 is disposed.
  • the substrate 10 includes an electrode wiring 41 located in the gas sensor region 3 and connected to the gas sensor 8.
  • the substrate 10 includes a heater 5 that is located between the first insulating layer 21 and the second insulating layer 22 and overlaps the gas sensor region 3 in a plan view.
  • the substrate 10 includes an external electrode 42 that is electrically connected to the electrode wiring 41 or the heater 5.
  • the substrate 10 is configured such that a gas sensor can be placed directly on the wiring board, the structure of the gas sensor manufactured using the substrate 10 can be simplified and made smaller. The simplified structure also simplifies the manufacturing process, contributing to reduced manufacturing costs. Furthermore, the substrate 10 does not require an additional MEMS (Micro Electro Mechanical Systems) with a built-in heater or an alumina substrate with a heater circuit printed on it, and since the heater is built into the wiring board itself, the wiring board can become a gas sensor device by applying a gas sensor to it.
  • MEMS Micro Electro Mechanical Systems
  • the package 100 is provided with a substrate 10 and a lid 7, and is therefore capable of protecting the gas sensor 8.
  • the package 100 also simplifies the structure of the gas sensor manufactured using the package 100, making it possible to reduce the size of the sensor.
  • the gas sensor 900 can be made smaller than conventional gas sensors by including the package 100 and the gas sensor 8.
  • the gas sensor 900 also has a configuration that allows it to be modularized by surface mounting.
  • FIG. 6 is a cross-sectional view of a gas sensor module 90 including the gas sensor 900.
  • the gas sensor module 90 includes a mounting substrate 50 and the gas sensor 900.
  • the mounting substrate 50 is equipped with the gas sensor 900, a semiconductor IC 60, and a capacitor 70.
  • the semiconductor IC 60 may be, for example, an ASIC (application specific integrated circuit).
  • the gas sensor 900, the semiconductor IC 60, and the capacitor 70 are each surface-mounted on the mounting substrate 50 by solder S.
  • the gas sensor 900 can be directly soldered onto the mounting substrate together with electronic components such as the semiconductor IC and the capacitor to form the gas sensor module 90.
  • FIG. 7 is a cross-sectional view of the substrate 10A according to the second embodiment, taken along line VII-VII in FIG. 8.
  • FIG. 8 is a top view of the substrate 10A.
  • FIG. 9 is a plan view perspective showing the configuration of the heater surface of the substrate 10A.
  • FIG. 10 is a cross-sectional view of the substrate 10A, taken along line X-X in FIG. 7.
  • the shapes of the components and cavities in plan view perspective are appropriately shown with dashed lines to make the positional relationships easier to understand.
  • the substrate 10A differs from the substrate 10 of embodiment 1 in that the substrate 10A has a cavity 6 therein.
  • the substrate 10A includes a base 2A.
  • the base 2A has a cavity 6 between the heater 5 and the second surface 202. More specifically, the base 2A has a hollow structure having a cavity 6 inside the second insulating layer 22.
  • the cavity 6 is located overlapping the heater 5 in a top perspective. Also, in a plan perspective, the outer edge of the cavity 6 may be larger than the heater 5. Since the cavity 6 is located between the heater 5 and the external electrode 42, the thermal conduction to the bonding material or solder and the external terminal is reduced. As shown in FIG.
  • the second insulating layer 22 is an insulating layer group including a plurality of insulating layers 20, and the insulating layer 20 located in the middle of the plurality of insulating layers 20 may have a through hole.
  • the through hole and the insulating layers 20 located above and below it may form the cavity 6.
  • the shape of the cavity 6 may be rectangular in plan view, as shown in Figures 7 to 10. The shape of the cavity 6 is not limited to a rectangle.
  • the second portion 41L of the electrode wiring 41 may be in the shape of a single strip extending from the gas sensing region 3 to the first portion 41P.
  • the thickness of the second portion 41L may be designed as appropriate taking into consideration the resistance, design tolerance, and the like.
  • the two first portions 41P located on the first surface 201 may be arranged to be approximately symmetrical with respect to a center line connecting the centers of the opposing sides in a plan view.
  • the first portion 41P of the electrode wiring is connected to a through conductor 43X1 that overlaps the first portion 41P in planar perspective and penetrates the first insulating layer 21.
  • the through conductor 43X1 is connected to the through conductor 43X2 via the interlayer conductor 44X as shown in FIG. 9.
  • the through conductor 43X1 and the through conductor 43X2 are located inside the interlayer conductor 44X in planar perspective.
  • the area of the interlayer conductor 44X at the joint surface between the interlayer conductor 44X and the through conductor 43X1 or the through conductor 43X2 may be larger than the area of the through conductor 43X1 or the through conductor 43X2.
  • the through conductor 43X2 is a conductor that overlaps the first external electrode 42X in planar perspective and penetrates the second insulating layer 22.
  • the through conductor 43X2 is connected to the first external electrode 42X.
  • the substrate 10A has a hollow structure, the area of the second surface 202 can be secured even if a cavity 6 is provided below the heater 5. This increases the degree of freedom in arranging the external electrodes 42 located on the second surface 202. In addition, the area of the external electrodes 42 can be increased, improving mounting reliability.
  • Figures 11 to 14 are views showing another embodiment of the cavity 6.
  • Figures 11 to 13 are planar perspective views showing the configuration of the heater surface.
  • Figure 14 is a cross-sectional view taken along the same cross section as Figure 7.
  • Figures 11 to 13 in order to make the positional relationship easier to understand, the shapes of the members and cavities in planar perspective are appropriately indicated by dashed lines.
  • the substrate 10A may have multiple cavities 6 at positions overlapping with the heater 5 in planar perspective.
  • the second insulating layer 22 is an insulating layer group including multiple insulating layers 20, and among the multiple insulating layers 20, an intermediate insulating layer 20 may have multiple through holes.
  • the multiple through holes may be located in different insulating layers 20.
  • the shape of the cavity 6 may be circular in planar view as shown in FIG. 11.
  • the multiple through holes may be larger than the heater 5 as a whole. In other words, the multiple through holes may be arranged in an area wider than the heater 5 in planar perspective.
  • the substrate 10A By having the substrate 10A have multiple cavities 6, parts of the insulating layer 20 are positioned between the cavities 6, which reduces the reduction in substrate strength and rigidity caused by the cavities 6. In addition, the risk of deformation occurring during the manufacture of the substrate 10A, which includes the insulating layer 20 made of a ceramic material, can be reduced.
  • the substrate 10A may have a large number of minute cavities 6 at positions overlapping with the heater 5 in a plan view.
  • the second insulating layer 22 is an insulating layer group including a plurality of insulating layers 20, and among the plurality of insulating layers 20, an insulating layer 20 located in the middle may have a plurality of through holes. The plurality of through holes may be located in different insulating layers 20.
  • the substrate 10A By having a large number of minute cavities 6 in the substrate 10A, it is possible to further reduce the reduction in substrate strength and rigidity due to the cavities 6. In addition, it is possible to further reduce the possibility of deformation occurring during the manufacture of the substrate 10A, which includes the insulating layer 20 made of a ceramic material.
  • the substrate 10A may have multiple cavities 6 of different sizes in plan view at a position overlapping the heater 5 in plan view.
  • the multiple cavities 6 include a large-diameter cavity 6 that is approximately the same size as the gas-sensing region 3 and is located at a position overlapping the gas-sensing region 3, and small-diameter cavities 6 surrounding it.
  • the substrate 10A which includes the insulating layer 20 made of a ceramic material.
  • the substrate 10A may have a number of microvoids arranged three-dimensionally inside the base body 2A.
  • the microvoids are an example of the cavity 6. While the above-mentioned cavity 6 is a through hole that penetrates the insulating layer 20, each of the many microvoids does not penetrate the insulating layer 20. In other words, the height of the microvoid is considerably smaller than the thickness of the insulating layer 20.
  • a plurality of microvoids are present in the thickness direction of one insulating layer 20.
  • the region in which the many microvoids are arranged may be a position that overlaps with the heater 5 in a planar perspective view.
  • a large number of microvoids arranged three-dimensionally can be formed, for example, by filling a through hole for forming the cavity 6 shown in FIG. 7 with a ceramic green sheet, ceramic paste, etc. that contains a large amount of binder, and firing it.
  • the substrate 10A By having a large number of microvoids in the substrate 10A, it is possible to reduce the decrease in substrate strength and rigidity caused by the cavity 6. It is also possible to reduce the possibility of deformation occurring during the manufacture of the substrate 10A, which includes the insulating layer 20 made of a ceramic material.
  • a layer made of a ceramic material with a lower thermal conductivity than the other layers may be used between the heater 5 and the external electrode 42. This makes it difficult for heat to be transferred to the solder or bonding material joined to the external electrode 42 and to the external terminal, reducing the possibility of the solder remelting.
  • FIG. 15 is a cross-sectional view of the substrate 10B according to the third embodiment, taken along line XV-XV in FIG. 16.
  • FIG. 16 is a top view of the substrate 10B.
  • Substrate 10B differs from substrate 10A of embodiment 2 in that it has a through hole 61 extending from cavity 6 to first surface 201.
  • the arrangement of electrode wiring 41 on first surface 201 differs from that of substrate 10A.
  • two first portions 41P located on first surface 201 may be arranged along any one side of substrate 10A.
  • the shape of the second portion 41L of the electrode wiring 41 of the substrate 10B is different from that of the substrate 10A of the second embodiment.
  • the shape of the portion of the second portion 41L located in the gas sensitive region 3 may have a pad shape.
  • the substrate 10B includes a base body 2B.
  • the base body 2B has four through holes 61.
  • the through holes 61 are positioned so as not to overlap the gas sensitive region 3 in a plan view and so as to overlap the cavity 6.
  • the number of through holes 61 is not limited to four. Furthermore, as long as the through holes do not overlap the gas sensitive region 3 and penetrate from the cavity 6 to the surface of the substrate 10B, there are no particular limitations on the number, position, size, shape, etc. of the through holes 61 and they can be changed as appropriate.
  • the insulation is improved compared to substrate 10A of embodiment 2, and the conduction of heat from heater 5 to second surface 202 can be further reduced. Furthermore, the gas in cavity 6 heated by heater 5 is easily ventilated to the outside, reducing the temperature rise of second surface 202. Furthermore, by having through holes 61, the through holes 61 act as gas vent holes in the firing process of substrate 10 including insulating layer 20 made of ceramic material, reducing the possibility of deformation occurring during the manufacturing process.
  • FIG. 17 is a cross-sectional view of the substrate 10C according to the fourth embodiment, and is a cross-sectional view taken along line XVII-XVII in FIG. 18.
  • FIG. 18 is a top view of the substrate 10C. In FIG. 18, the shapes of the components when viewed from above are appropriately indicated by dashed lines to make the positional relationships easier to understand.
  • the substrate 10C differs from the substrate 10A of the second embodiment in that the cavity is a recess 6A opening to the second surface 202.
  • the substrate 10C has a recess 6A opening to the second surface 202 at a position overlapping with the heater 5 in a planar perspective.
  • the second insulating layer of the substrate 10C has a recess 6A opening to the second surface 202.
  • the second insulating layer 22 is an insulating layer group including a plurality of insulating layers 20, and among the plurality of insulating layers 20, an insulating layer 20 other than the insulating layer in which the heater 5 is located may have a through hole that forms the recess 6A.
  • the shape of the recess 6A may be rectangular in a planar view, as shown in FIG. 18.
  • the shape of the recess 6A is not limited to a rectangle and may be designed as appropriate.
  • the cavity When the cavity is in a concave shape, as in substrate 10C, the cavity can be made larger than in a hollow structure such as substrate 10A of embodiment 2.
  • the cavity is an open concave 6A, heat is dissipated from the inner surface of concave 6A to the outside. This further improves the insulation.
  • a concave shape is easier to manufacture than a hollow structure.
  • the outer edge of the bottom surface of the recess 6A may be located outboard of the outer edge of the heater 5. This configuration can improve thermal insulation.
  • the angle ⁇ between a line extending in the Z-axis direction from the outer edge of the heater 5 and a line connecting the outer edge and the outer edge of the bottom surface of the recess 6A may be 45° or more.
  • the base 2C has one large rectangular recess in plan view, but the number, shape, and size of the recess are not limited to this example.
  • the recess may have a circular shape in plan view, or may have multiple recesses as shown in Figs. 11, 12, and 13. By having multiple recesses, the strength of the substrate 10C is improved compared to the case in which there is one large recess 1.
  • the substrate 10C may have a through hole extending from the bottom surface of the recess 6A to the first surface 201. By having a through hole, the insulation property is further improved, and the conduction of heat from the heater 5 to the second surface 202 can be further reduced.
  • the gas in the recess 6A heated by the heater 5 is easily ventilated to the outside, and the temperature rise of the second surface 202 can be reduced.
  • the through hole acts as a gas vent hole in the firing process of the substrate 10C including the insulating layer 20 made of a ceramic material, so that the possibility of deformation occurring in the manufacturing process can be reduced.
  • a gas sensor 900D, a package 100D, and a substrate 10D which are another embodiment of the first embodiment, will be described with reference to Figs. 19 to 21.
  • the gas sensor 900D according to the fifth embodiment includes a package 100D and a gas sensor 8.
  • the package 100D includes a substrate 10D and a lid 7D.
  • the substrate 10D includes a base 2, an insulating frame 23, a gas sensor region 3, wiring 4, and a heater 5.
  • FIG. 19 is a cross-sectional view of the gas sensor 900D, and the state in which the bonding material B and the lid body 7D are attached is shown in the cross-sectional view taken along line XVIX-XVIIX in FIG. 20.
  • FIG. 20 is a top view of the substrate 10D. In FIG. 20, the shape of the through conductor 43X when viewed from above is shown by a dashed line to make the positional relationship easier to understand.
  • FIG. 21 is a top view of the lid body 7D.
  • the fifth embodiment differs from the first embodiment in that the gas sensor 900D includes a flat lid 7D, and the substrate 10D includes an insulating frame 23. Other than those points not specifically mentioned below, the configuration is the same as the first embodiment.
  • the substrate 10D includes an insulating frame 23 located on the first surface 201 of the base 2 so as to surround the gas sensor region 3.
  • the length of the insulating frame 23 in the Z-axis direction is greater than the height of the gas sensor 8.
  • the insulating frame 23 may be an insulating layer made of the same ceramic material as the base 2.
  • the gas sensor 900D may include a flat lid 7D that covers the storage recess formed by the base 2 and the insulating frame 23. Making the lid 7D flat facilitates manufacturing.
  • the lid 7D may have a plurality of through holes 71 as shown in FIG. 21. By having a plurality of through holes 71, it is possible to improve breathability.
  • the through holes 71 may be provided at a position that does not overlap with the gas sensor 8 in planar perspective. By not overlapping with the gas sensor 8 in planar perspective, it is possible to reduce the possibility of dust and the like that enters through the through holes 71 adhering to the gas sensor 8.
  • the lid 7D may be made of a ceramic material. By making the lid 7D from ceramic, no difference in thermal expansion occurs with the substrate 10D, and the possibility that the gas sensor 900D will be deformed due to thermal stress caused by this difference in thermal expansion can be reduced. This results in a gas sensor 900D with high connection reliability between the gas sensor 8 and the electrode wiring 41, and between the external electrode 42X and the mounting substrate.
  • the lid body 7D made of a ceramic material and the insulating frame body 23 may be joined using a joining material B such as glass frit or resin.
  • a frame-shaped metal film may be provided on the upper surface of the insulating frame body 23 and joined using brazing material or solder.
  • a metal film of the same configuration as the frame-shaped metal film may also be provided on the underside of the lid body 7D.
  • a nickel film may be formed by plating on the surfaces of the frame-shaped metal film and the lid body 7D to improve the bondability of the joint using the brazing material.
  • a gas sensor 900E, a package 100E, and a substrate 10E according to another embodiment will be described with reference to Fig. 22.
  • the gas sensor 900E according to the sixth embodiment includes a package 100E and a gas sensor 8.
  • the package 100E includes a substrate 10E and a lid 7D.
  • the substrate 10E includes a base 2E, an insulating frame 23, a gas sensor region 3, wiring 4, and a heater 5.
  • FIG. 22 is a cross-sectional view of gas sensor 900E, showing a cross section at the same position as in FIG. 19.
  • substrate 10E has a recess 6A that opens into second surface 202 at a position that overlaps with heater 5 in a plan view.
  • the second insulating layer of substrate 10C has a recess 6A that opens into second surface 202.
  • a gas sensor 900F, a package 100F, and a substrate 10F which are another embodiment of the sixth embodiment shown in Fig. 22 will be described with reference to Fig. 23.
  • the gas sensor 900F according to the seventh embodiment includes a package 100F and a gas sensor 8.
  • the package 100F includes a substrate 10F and a lid 7D.
  • the substrate 10F includes a base 2F, an insulating frame 23, a gas sensor region 3, wiring 4, and a heater 5.
  • FIG. 23 is a cross-sectional view of a gas sensor 900F.
  • the substrate 10F has a hollow cavity 6 instead of the recess 6A of the substrate 10E of the sixth embodiment. Even with this configuration, it is possible to reduce the conduction of heat from the heater 5 to the second surface 202.
  • a gas sensor 900G, a package 100G, and a substrate 10G will be described with reference to Fig. 24 to Fig. 26.
  • the gas sensor 900G according to the eighth embodiment includes a package 100G and a gas sensor 8.
  • the package 100G includes a substrate 10G and a lid 7D.
  • the substrate 10G includes a base 2, an insulating frame 23G, a gas sensor region 3, wiring 4, and a heater 5.
  • FIG. 24 is a cross-sectional view of the gas sensor 900G, showing a cross-sectional view taken along line XXIV-XXIV of the substrate 10G in FIG. 25 with bonding material B and lid 7D attached.
  • FIG. 25 is a top view of the substrate 10G.
  • FIG. 26 is a perspective view of the gas sensor 900G. In FIG. 25, to make the positional relationship easier to understand, the shapes of the through conductor 43X and through hole 25 when viewed from above are shown by dashed lines.
  • the substrate 10G has a through hole that penetrates from the inner surface of the insulating frame 23G to the outer surface of the substrate 10G. More specifically, the insulating frame 23G of the substrate 10G has a through hole 25 that penetrates from the outer surface to the inner surface of the insulating frame 23G. In the example shown in FIG. 25, one through hole 25 is located in the center of one side of the insulating frame 23G, but the position, number and shape of the through hole 25 are not limited to this.
  • Gas heated by the heater 5 located below the gas sensor 8 is discharged to the outside through the through hole 71 of the lid 7D by the rising air current. This causes the internal pressure of the package 100G to decrease, and external gas flows into the package 100G through the through hole 25 of the insulating frame 23G. In other words, a series of gas flows are formed. This increases the gas permeability in the package 100G, and improves the accuracy of gas detection by the gas sensor 8.
  • a gas sensor 900H, a package 100H, and a substrate 10H according to another embodiment will be described with reference to Fig. 27 to Fig. 29.
  • the gas sensor 900H according to the ninth embodiment includes a package 100H and a gas sensor 8.
  • the package 100H includes a substrate 10H and a lid 7D.
  • the substrate 10H includes a base 2H, an insulating frame 23, a gas sensor region 3, wiring 4, and a heater 5.
  • FIG. 27 is a cross-sectional view of gas sensor 900H, showing a cross-sectional view taken along line XXVII-XXVII of substrate 10H in FIG. 28 with bonding material B and lid 7D attached.
  • FIG. 28 is a top view of substrate 10H.
  • FIG. 29 is a cross-sectional view of gas sensor 900H, showing a cross-sectional view taken along line XXIX-XXVIIX of substrate 10H in FIG. 28 with bonding material B and lid 7D attached.
  • FIG. 28 in order to make the positional relationship easier to understand, the shapes of through conductor 43X and part of the through hole when viewed from above are shown by dashed lines.
  • the substrate 10H has a through hole that penetrates from the first surface 201 to the outer surface of the substrate 10H.
  • the through hole of the substrate 10H penetrates from the outer surface of the substrate 10H to the storage space of the gas sensor 8 in the package 100H.
  • the through hole opens to the side surface of the substrate 10H and the first surface 201.
  • the first insulating layer 21 of the substrate 10H may have a recess 26, and the recess may form the through hole in the substrate 10H.
  • one through hole is located in the center of one side of the substrate 10H, but the position, number, and shape of the through holes are not limited to this.
  • the gas permeability in the package 100G can be improved, as in the gas sensor 900G according to the eighth embodiment, and the gas detection accuracy of the gas sensor 8 can be improved.
  • a gas sensor 900I, a package 100I, and a substrate 10I according to another embodiment will be described first with reference to Fig. 30.
  • Fig. 30 is a cross-sectional view of the gas sensor 900I according to the tenth embodiment.
  • the gas sensor 900I according to the tenth embodiment includes a package 100I and a gas sensor 8.
  • the package 100I includes a substrate 10I and a lid 7I.
  • the substrate 10I includes a base body 2H, an insulating frame body 23I, a gas sensor region 3, wiring 4, and a heater 5.
  • the insulating frame 23I includes a first frame 231 positioned on the first surface 201 of the base 2H so as to surround the gas-sensing region 3, a second frame 232 positioned on the upper surface of the first frame 231, and a third frame 233 positioned on the upper surface of the second frame 232.
  • the inner edge of the second frame 232 is positioned outside the inner edge of the third frame 233.
  • the inner edge of the third frame may overlap with or be positioned outside the inner edge of the first frame 231.
  • the portion protruding inward of the substrate 10I beyond the second frame 232 functions as a limiting portion that limits the movement of the lid 7I in a direction away from the substrate 10I.
  • the insulating frame 23I of the substrate 10I has a limiting portion 233L that limits the movement of the lid 7I in a direction away from the substrate.
  • the lid 7I is an elastic metal lid, and may have a through hole 71.
  • the edge of the lid 7I is located inside the insulating frame 23I.
  • the edge of the lid 7I is located below the limiting portion 233L.
  • the lid body 7I is held to the substrate 10I by the elastic force of the lid body 7I and the limiting portion 233L that limits the movement of the lid body 7I. This allows the lid body 7I to be held by the substrate 10I without being bonded to the substrate 10I using a bonding material such as resin.
  • FIG. 31 is a cross-sectional view of a gas sensor 900J showing another embodiment.
  • the gas sensor 900J shown in FIG. 31 has the same configuration as the gas sensor 900I shown in FIG. 30, except for the shape of the cover body 7J.
  • the cover body 7J is also a cover body made of an elastic metal.
  • the cover body 7J has a curved or bent portion at the end portion, which is formed by bending it outward. The cover body 7J having the curved or bent portion makes it easier to insert the cover body 7J into the insulating frame body 23I.
  • FIG. 31 is a cross-sectional view of a gas sensor 900K according to another embodiment.
  • the insulating frame 23K shown in FIG. 32 includes a first frame 231 positioned on the first surface 201 of the base 2H so as to surround the gas sensing region 3, and a second frame 232 positioned on the upper surface of the first frame 231.
  • the inner edge of the second frame 232 which is the uppermost layer, is positioned outside the inner edge of the third frame 233. This configuration makes it easy to insert the lid 7K into the insulating frame 23K.
  • the lid body 7K is an elastic metal lid body.
  • the elastic force of the lid body 7K allows the lid body 7K to be held to the substrate 10K without using resin or the like.
  • the lid body 7K has a cap shape, and has a curved or bent portion formed by bending the end outward.
  • the lid body 7K having a curved or bent portion makes it easier to insert the lid body 7K into the insulating frame body 23K.
  • FIG. 33 is a cross-sectional view of a gas sensor 900L according to another embodiment.
  • the insulating frame 23L shown in FIG. 33 is positioned on the first surface 201 of the base 2H so as to surround the gas sensing region 3.
  • the outer edge of the insulating frame 23L is positioned outside the outer edge of the base 2H.
  • the lid 7L is made of an elastic metal.
  • the lid 7L has a cap shape that can accommodate the insulating frame 23L, and has a bent portion formed by bending the end inward.
  • the bent portion of the lid body 7L can be engaged with the protruding portion 23LX of the insulating frame body 23L, which protrudes outward beyond the base body 2H.
  • the protruding portion 23LX of the insulating frame body 23L which protrudes outward beyond the base body 2H, functions as a limiting portion that limits the movement of the lid body 7I in a direction away from the substrate 10I.
  • the lid 7L can be held to the substrate 10L without using a bonding material such as resin.
  • a bonding material such as resin.
  • Figure 34 is a cross-sectional view of a gas sensor 900N according to another embodiment.
  • Figure 34 shows a cross-sectional view taken along the line XXXIV-XXXIV in Figure 35.
  • Figure 35 is a top view of the gas sensor 900N.
  • the base 2N of the substrate 10N shown in Figures 34 and 35 has a recess 6A.
  • the base 2N also has a through-hole 61N that penetrates from the bottom surface of the recess 6A to the first surface 201 of the base 2N.
  • the lid body 7N is an elastic metal lid body.
  • the lid body 7N has a cap-shaped main body portion that covers the gas sensor 8, and a claw portion extending from the main body portion. The claw portion is inserted into the through hole 61N and engages with the bottom surface of the recess 6A.
  • the lid body 7N may have a through hole 71.
  • the lid body 7N may have, for example, a notch 72 in the main body portion to prevent a short circuit with the electrode wiring 41 and to improve ventilation.
  • the lid 7N can be held to the substrate 10N without using a bonding material such as resin.
  • a bonding material such as resin.
  • gas sensors 900, 900D, 900E, 900F, 900G, 900H, 900I, 900J, 900K, 900L, and 900N each include a lid.
  • the lid is not an essential component of the gas sensor. In other words, it should be understood that aspects of these gas sensors that do not include a lid are also within the scope of this disclosure.
  • a gas sensor 900M and a substrate 10M which are another embodiment of the fifth embodiment will be described with reference to Figs. 36 and 37.
  • Fig. 36 is a cross-sectional view of the gas sensor 900M, taken along line XXXVI-XXXVI in Fig. 37.
  • Fig. 37 is a top view of the substrate 10M.
  • the gas sensor 900M according to the eleventh embodiment includes a substrate 10M and a gas sensor 8.
  • the substrate 10M includes a base body 2M, an insulating frame 23M, a gas sensor region 3, wiring 4, and a heater 5.
  • the substrate 10M has a first external electrode 42X and a second external electrode 42Y on an insulating frame 23M.
  • the gas sensing region 3 differs from the other embodiments described above in that it is located between the surface on which the first external electrode 42X and the second external electrode 42Y are located and the surface on which the heater 5 is located.
  • the first external electrode 42X is electrically connected to the electrode wiring 41 via the penetrating conductor 43X.
  • the second external electrode 42Y is electrically connected to the heater 5 via the penetrating conductor 43Y.
  • the first external electrode 42X and the second external electrode 42Y By positioning the first external electrode 42X and the second external electrode 42Y on the insulating frame 23M, surface mounting is possible on the upper side of the insulating frame 23M. Furthermore, by positioning the first external electrode 42X and the second external electrode 42Y on the insulating frame 23M, the distance from the heater 5 to the two external electrodes is increased. This reduces the effect of heat on the conductive bonding material when mounting the gas sensor 900M. In this case, the substrate 10M can also serve as the lid, eliminating the need to provide a separate lid. This provides the effects of simplifying the manufacturing process, reducing manufacturing costs, and achieving a low-profile gas sensor.
  • the base 2M of the substrate 10M has through holes 27 for ventilation.
  • the base 2M has through holes that penetrate from the first surface 201 to the outer surface of the substrate 10M. More specifically, the base 2M has through holes 27 that penetrate from the first surface 201 to the second surface 202.
  • the base 2M may have multiple through holes 27. By having multiple through holes 27, the breathability can be improved.
  • the through holes 27 may be located at the corners of a rectangular region inside the insulating frame 23M in a plan view. By arranging the through holes 27 at corners with a large area, it is possible to reduce a decrease in the strength of the base 2M.
  • the through holes 27 may have an L-shape extending from each corner along the inner surface of the insulating frame 23M. By making the through holes 27 L-shaped, it is possible to increase the area of the through holes 27 while ensuring the area of the region in which the gas sensing region 3 and the electrode wiring 41 are placed.
  • the distance between the heater 5 and the first surface 201 may also be smaller than the distance between the heater 5 and the second surface 202. Because the first insulating layer 21 is thinner than the second insulating layer 22, heat from the heater 5 is more easily transferred to the first surface 201 side where the gas sensor 8 is located than to the second surface 202 side connected to the outside.
  • the distance between the heater 5 and the first surface 201 may be 10 ⁇ m or more and 100 ⁇ m or less. This configuration can reduce the risk of the heater 5 being exposed to the first surface 201.
  • the distance between the heater 5 and the second surface 202 may be 100 ⁇ m or more. This configuration can reduce the temperature rise of the second surface 202.
  • the insulating frame 23M may have a through hole penetrating from the inner surface to the outer surface of the substrate 10M.
  • the outer surface of the substrate 10M includes the outer surface and the second surface 202 of the substrate 10M.
  • the substrate 10M may further have a through hole penetrating from the inner surface to the outer surface of the insulating frame 23M. This configuration can increase the gas permeability in the package 100G, and can improve the gas detection accuracy by the gas sensor 8.
  • the substrate 10M may further have a through hole that penetrates from the first surface 201 to the outer surface of the substrate 10M (the side surface of the base body 2M) as shown in FIG. 27.
  • This configuration can increase the gas permeability in the package 100G, and can improve the gas detection accuracy of the gas sensor 8.
  • Figure 38 is a cross-sectional view of a gas sensor module 90A equipped with a gas sensor 900M.
  • Figure 38 shows the gas sensor module 90A attached to a housing 80 of an electronic device or the like.
  • the gas sensor module 90A includes a mounting substrate 50 and a gas sensor 900M.
  • the mounting substrate 50 is equipped with a gas sensor 900M, a semiconductor IC 60, and a capacitor 70.
  • the gas sensor 900, the semiconductor IC 60, and the capacitor 70 are each surface-mounted on the mounting substrate 50 by solder S.
  • the mounting substrate 50 has a through hole 52 at a position corresponding to the gas sensor 8.
  • the housing 80 may also have a through hole 82 at a position corresponding to the gas sensor 8 or the through hole 52.
  • the gas sensor 900M can be directly soldered onto the mounting substrate 50 together with electronic components such as the semiconductor IC 60 and the capacitor 70 to form the gas sensor module 90A.
  • the gas sensor 900M and other components are mounted on the surface of the mounting substrate 50 opposite the housing 80. If the through-hole 82 in the housing 80 and the through-hole 52 in the mounting substrate 50 are large and provide sufficient ventilation, the substrate of the gas sensor 900M does not need to have a through-hole.
  • the gas sensor 900M and the electronic components may be mounted on the surface of the mounting substrate 50 facing the housing 80.
  • the mounting substrate 50 does not need to have a through hole 52.
  • Fig. 39 is a schematic plan view showing a part of a mother substrate MB according to an exemplary embodiment.
  • a mother substrate having a plurality of substrate regions 10X corresponding to the substrate 10 is prepared. As shown in FIG. 39, the mother substrate MB has a plurality of substrate regions 10X corresponding to the substrate 10 of embodiment 1.
  • the mother substrate MB is manufactured as follows.
  • a slurry is manufactured by adding and mixing a suitable organic binder and solvent to raw material powders such as aluminum oxide and silicon oxide.
  • This slurry is formed into a sheet shape by a doctor blade method or a calendar roll method to manufacture a ceramic green sheet for the insulating layer 20 of the base 2.
  • the ceramic green sheet for the insulating layer 20 is subjected to a suitable punching process to form through holes for the through conductors 43, and is filled with a metal paste that will become the through conductors 43.
  • the metal paste that will become the electrode wiring 41, the external electrode 42, the interlayer conductor 44, the frame-shaped metal film M, and the heater 5 is applied by a method such as screen printing. Then, a plurality of ceramic green sheets for the insulating layer are stacked to manufacture a laminate. The laminate is then fired at a high temperature (approximately 1300 to 1600°C) to manufacture the mother substrate MB.
  • the gas sensor 8 is formed.
  • the gas sensor 8 is obtained by forming a semiconductor material that will become the gas sensor 8 in a thin or thick film in the gas sensor region 3 in each substrate region 10X of the mother substrate MB, and then sintering it at a high temperature of about 500°C to 800°C.
  • the lid 7 is fixed to each substrate area 10X, for example by resin bonding.
  • the mother substrate MB is divided into individual pieces by a method such as snap breaking or dicing to obtain multiple gas sensors 900.
  • the above-described method enables highly efficient mass production of the substrate 10. Furthermore, since the gas sensor 900 has a simple structure in which the gas sensor 8 is directly disposed on the substrate 10, the gas sensor 900 can be manufactured through a simple process.
  • a package and a gas sensor are described that include a substrate in which a first external electrode 42X and a second external electrode 42Y are located on an insulating frame 23P, and a lid.
  • Figures 40 and 41 describe a gas sensor 900P that is an example of such an embodiment.
  • Figure 40 is a cross-sectional view of the gas sensor 900P, and shows a cross-sectional view taken along the XXXX-XXXX line in Figure 41.
  • Figure 41 is a top view of the gas sensor 900P.
  • the substrate 10P has the same configuration as the substrate 10M shown in FIG. 36, except that it has a step that can engage the lid body 7P.
  • the step for engaging the lid body 7P may be formed on the inner surface of the through hole 27, as shown in FIG. 40.
  • the lid body 7P may be made of metal.
  • the lid body 7P has a cap-shaped main body that covers the gas sensor 8 and a claw portion extending from the main body. The claw portion is inserted into the through hole 27 and engages with the bottom surface of the first insulating layer.
  • the lid body 7P may have a through hole on the top surface.
  • the package and gas sensor may be such that the first external electrode 42X and the second external electrode 42Y are located on the insulating frame.
  • the package and gas sensor may have a substrate 10M shown in Figures 36 and 37 and a flat lid that is joined to the insulating frame 23M other than the first external electrode 42X and the second external electrode 42Y located at the corners.
  • the lid may be ceramic.
  • the gas sensor 8 can be protected by providing a lid.
  • a substrate in a first aspect of the present disclosure includes a base including a plurality of insulating layers made of a ceramic material and having a first surface and a second surface located opposite the first surface, a gas sensor region located on the first surface which is an area in which a gas sensor is placed, electrode wiring located on the gas sensor region and connected to the gas sensor, a heater located between the insulating layers and positioned overlapping the gas sensor region in a planar perspective, and an external electrode located on the second surface and electrically connected to the electrode wiring or the heater.
  • a substrate in a second aspect of the present disclosure is the substrate in aspect 1 above, in which the distance between the heater and the first surface is smaller than the distance between the heater and the second surface.
  • the substrate is the substrate of aspect 1 or 2 above, in which the distance between the heater and the first surface is 10 ⁇ m or more and 100 ⁇ m or less.
  • the substrate is any of the substrates in aspects 1 to 3 above, in which the distance between the heater and the second surface is 100 ⁇ m or more.
  • a fifth aspect of the present disclosure is a substrate according to any one of aspects 1 to 4 above, in which the base has a cavity between the heater and the second surface.
  • a sixth aspect of the present disclosure is directed to a substrate in accordance with the fifth aspect, in which the cavity is a recess that opens onto the second surface.
  • a seventh aspect of the present disclosure is a substrate according to the fifth or sixth aspect, wherein the base further includes a through hole extending from the cavity to the first surface.
  • the substrate is the substrate of any one of aspects 1 to 7 above, and is provided with an insulating frame on the first surface that is positioned to surround the gas-sensing region.
  • a ninth aspect of the present disclosure is a substrate according to the eighth aspect, in which the base overlaps the heater in a plan view and has a recess that opens into the second surface.
  • the substrate in the tenth aspect of the present disclosure is the substrate in aspect 8 above, which has a through hole that penetrates from the inner surface of the insulating frame to the outer surface of the substrate.
  • the substrate is any of the substrates in aspects 1 to 10 above, and has a through hole that penetrates from the first surface to the outer surface of the substrate.
  • the substrate in the twelfth aspect of the present disclosure includes a base body having a first surface, including a plurality of insulating layers made of a ceramic material, a gas sensing region located on the first surface where a gas sensing body is disposed, an insulating frame body located on the first surface so as to surround the gas sensing region, electrode wiring located in the gas sensing region and connected to the gas sensing body, a heater located between the insulating layers and overlapping the gas sensing region in a plan view, and an external electrode located on the insulating frame body and electrically connected to the electrode wiring or the heater.
  • the substrate in the thirteenth aspect of the present disclosure is the substrate in the twelfth aspect above, which has a through hole that penetrates from the first surface to the outer surface of the base.
  • a fourteenth aspect of the present disclosure is a substrate according to the twelfth or thirteenth aspect, in which the base includes a second surface located opposite the first surface, and the distance between the heater and the first surface is smaller than the distance between the heater and the second surface.
  • the substrate is the substrate of the above-mentioned fourteenth aspect, in which the distance between the heater and the first surface is 10 ⁇ m or more and 100 ⁇ m or less.
  • the substrate is the substrate of the fourteenth or fifteenth aspect, in which the distance between the heater and the second surface is 100 ⁇ m or more.
  • the substrate is any one of the substrates in the above aspects 12 to 16, and has a through hole that penetrates from the inner surface of the insulating frame to the outer surface of the substrate.
  • the substrate is any one of the substrates in aspects 12 to 16 above, and has a through hole that penetrates from the first surface to the outer surface of the substrate.
  • a package according to a nineteenth aspect of the present disclosure includes a substrate according to any one of aspects 1 to 11 above, and a lid.
  • a package according to a twentieth aspect of the present disclosure is the package according to the nineteenth aspect, in which the lid is made of metal.
  • the package in the twenty-first aspect of the present disclosure is the package in the nineteenth aspect above, in which the lid is made of a ceramic material.
  • a package according to a twenty-second aspect of the present disclosure includes the substrate of aspect eight above and a lid, the lid being made of an elastic metal, and the edge of the lid being positioned inside the insulating frame.
  • a package according to a 23rd aspect of the present disclosure is the package according to the 22nd aspect, in which the insulating frame has a limiting portion that limits the movement of the lid in a direction away from the substrate.
  • a gas sensor in a twenty-fourth aspect of the present disclosure includes a package according to any one of aspects 19 to 23 above and a gas sensor.
  • a gas sensor according to a twenty-fifth aspect of the present disclosure includes a substrate according to any one of aspects 12 to 18 above and a gas sensor.
  • a gas sensor module includes the gas sensor according to the twenty-fourth aspect and a mounting substrate, and the gas sensor is surface-mounted on the mounting substrate via a conductive bonding material.
  • a gas sensor module includes the gas sensor according to the 25th aspect and a mounting substrate, and the gas sensor is surface-mounted on the mounting substrate via a conductive bonding material.
  • a gas sensor module according to a 28th aspect of the present disclosure is the gas sensor module according to the 27th aspect, in which the mounting substrate has a through hole at a position opposite the gas sensor that allows gas to flow in from the outside.
  • a method for manufacturing a gas sensor in a twenty-ninth aspect of the present disclosure includes the steps of preparing a mother substrate having a plurality of substrate regions corresponding to any one of the substrates in aspects 1 to 18 above, forming a gas sensor in the gas sensor region, and singulating the mother substrate.
  • Heater terminal (interlayer conductor) 5 heater 6: cavity 61: through hole 7, 7D, 7I, 7J, 7K, 7L, 7N, 7P: lid body 71: through hole 8: gas sensor B: bonding material 100, 100D, 100E, 100F, 100G, 100H, 100I: package MB: mother substrate 10X: substrate area 900, 900D, 900E, 900F, 900G, 900H, 900I, 900J, 900K, 900L, 900M, 900N, 900P: gas sensor 90, 90A: gas sensor module

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
PCT/JP2024/011720 2023-03-27 2024-03-25 基板、パッケージ、ガスセンサモジュール、ガスセンサおよびガスセンサの製造方法 Ceased WO2024204073A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2025510862A JPWO2024204073A1 (https=) 2023-03-27 2024-03-25
CN202480021511.3A CN120936871A (zh) 2023-03-27 2024-03-25 基板、封装件、气敏传感器模块、气敏传感器及气敏传感器的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023050547 2023-03-27
JP2023-050547 2023-03-27

Publications (1)

Publication Number Publication Date
WO2024204073A1 true WO2024204073A1 (ja) 2024-10-03

Family

ID=92905228

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2024/011720 Ceased WO2024204073A1 (ja) 2023-03-27 2024-03-25 基板、パッケージ、ガスセンサモジュール、ガスセンサおよびガスセンサの製造方法

Country Status (3)

Country Link
JP (1) JPWO2024204073A1 (https=)
CN (1) CN120936871A (https=)
WO (1) WO2024204073A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5267389U (https=) * 1975-11-13 1977-05-18
JPH06242041A (ja) * 1993-02-18 1994-09-02 Nohmi Bosai Ltd ニオイセンサ
EP1936364A1 (de) * 2006-12-20 2008-06-25 AppliedSensor GmbH Sensor und Herstellungsverfahren eines Sensors
JP2017150819A (ja) * 2016-02-22 2017-08-31 Tdk株式会社 ガスセンサ
JP2018159564A (ja) * 2017-03-22 2018-10-11 株式会社フジクラ 水素ガスセンサ
CN109100398A (zh) * 2018-07-23 2018-12-28 华进半导体封装先导技术研发中心有限公司 一种酒精浓度检测系统封装结构及其制造方法
WO2020171123A1 (ja) * 2019-02-20 2020-08-27 京セラ株式会社 蓋体、パッケージ、電子装置および電子モジュール
WO2022131181A1 (ja) * 2020-12-18 2022-06-23 京セラ株式会社 基板、パッケージ、センサ装置、および電子機器

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5267389U (https=) * 1975-11-13 1977-05-18
JPH06242041A (ja) * 1993-02-18 1994-09-02 Nohmi Bosai Ltd ニオイセンサ
EP1936364A1 (de) * 2006-12-20 2008-06-25 AppliedSensor GmbH Sensor und Herstellungsverfahren eines Sensors
JP2017150819A (ja) * 2016-02-22 2017-08-31 Tdk株式会社 ガスセンサ
JP2018159564A (ja) * 2017-03-22 2018-10-11 株式会社フジクラ 水素ガスセンサ
CN109100398A (zh) * 2018-07-23 2018-12-28 华进半导体封装先导技术研发中心有限公司 一种酒精浓度检测系统封装结构及其制造方法
WO2020171123A1 (ja) * 2019-02-20 2020-08-27 京セラ株式会社 蓋体、パッケージ、電子装置および電子モジュール
WO2022131181A1 (ja) * 2020-12-18 2022-06-23 京セラ株式会社 基板、パッケージ、センサ装置、および電子機器

Also Published As

Publication number Publication date
CN120936871A (zh) 2025-11-11
JPWO2024204073A1 (https=) 2024-10-03

Similar Documents

Publication Publication Date Title
TWI794921B (zh) 電池用封裝體及電池模組
US10334740B2 (en) Electronic-component mount substrate, electronic device, and electronic module
JP7753560B2 (ja) 電池用パッケージおよび電池モジュール
JP4732804B2 (ja) ガスセンサ及びその製造方法
WO2024204073A1 (ja) 基板、パッケージ、ガスセンサモジュール、ガスセンサおよびガスセンサの製造方法
CN114026785B (zh) 电子部件收纳用封装件、电子装置以及电子模块
JP2019129189A (ja) 配線基板、パッケージおよび電子装置
CN117178353A (zh) 基板、封装件、电子部件以及发光装置
JP7011563B2 (ja) 回路基板および電子部品
JP4582889B2 (ja) 圧力検出装置用パッケージ
WO2024162055A1 (ja) パッケージ、母基板、ガスセンサモジュール、および電子装置
JP7212783B2 (ja) 電子素子実装用基板、電子装置、電子モジュールおよび電子素子実装用基板の製造方法
JP2005039006A (ja) 中継基板、半導体素子付き中継基板、中継基板付きパッケージ、半導体素子と中継基板とパッケージとからなる構造体、および中継基板の製造方法
JP4974424B2 (ja) 圧力検出装置用パッケージ
JP7433766B2 (ja) 回路基板、電子部品および電子モジュール
JP4794072B2 (ja) 圧力検出装置用パッケージ
JP4753926B2 (ja) 圧力検出器および圧力検出器組立体
JP2009049281A (ja) 半導体センサモジュール
JP4925522B2 (ja) 圧力検出装置用パッケージ
JP2015076584A (ja) 電子部品収納用パッケージ
JP4223709B2 (ja) 圧力検出装置用パッケージの製造方法
JP3878836B2 (ja) 圧力検出装置用パッケージ
JP4557406B2 (ja) 圧力検出装置用パッケージ
JP2020035825A (ja) 回路基板、電子部品および電子モジュール
JP4582888B2 (ja) 圧力検出装置用パッケージ

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24780191

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2025510862

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2025510862

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 24780191

Country of ref document: EP

Kind code of ref document: A1