CN120936871A - 基板、封装件、气敏传感器模块、气敏传感器及气敏传感器的制造方法 - Google Patents

基板、封装件、气敏传感器模块、气敏传感器及气敏传感器的制造方法

Info

Publication number
CN120936871A
CN120936871A CN202480021511.3A CN202480021511A CN120936871A CN 120936871 A CN120936871 A CN 120936871A CN 202480021511 A CN202480021511 A CN 202480021511A CN 120936871 A CN120936871 A CN 120936871A
Authority
CN
China
Prior art keywords
substrate
gas sensor
heater
view
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480021511.3A
Other languages
English (en)
Chinese (zh)
Inventor
中本孝太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN120936871A publication Critical patent/CN120936871A/zh
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/12Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
CN202480021511.3A 2023-03-27 2024-03-25 基板、封装件、气敏传感器模块、气敏传感器及气敏传感器的制造方法 Pending CN120936871A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023050547 2023-03-27
JP2023-050547 2023-03-27
PCT/JP2024/011720 WO2024204073A1 (ja) 2023-03-27 2024-03-25 基板、パッケージ、ガスセンサモジュール、ガスセンサおよびガスセンサの製造方法

Publications (1)

Publication Number Publication Date
CN120936871A true CN120936871A (zh) 2025-11-11

Family

ID=92905228

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202480021511.3A Pending CN120936871A (zh) 2023-03-27 2024-03-25 基板、封装件、气敏传感器模块、气敏传感器及气敏传感器的制造方法

Country Status (3)

Country Link
JP (1) JPWO2024204073A1 (https=)
CN (1) CN120936871A (https=)
WO (1) WO2024204073A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5267389U (https=) * 1975-11-13 1977-05-18
JPH06242041A (ja) * 1993-02-18 1994-09-02 Nohmi Bosai Ltd ニオイセンサ
DE102006060113A1 (de) * 2006-12-20 2008-06-26 Appliedsensor Gmbh Sensor und Herstellungsverfahren eines Sensors
JP2017150819A (ja) * 2016-02-22 2017-08-31 Tdk株式会社 ガスセンサ
JP2018159564A (ja) * 2017-03-22 2018-10-11 株式会社フジクラ 水素ガスセンサ
CN109100398B (zh) * 2018-07-23 2021-01-22 华进半导体封装先导技术研发中心有限公司 一种酒精浓度检测系统封装结构及其制造方法
JP7119202B2 (ja) * 2019-02-20 2022-08-16 京セラ株式会社 蓋体、パッケージ、電子装置および電子モジュール
WO2022131181A1 (ja) * 2020-12-18 2022-06-23 京セラ株式会社 基板、パッケージ、センサ装置、および電子機器

Also Published As

Publication number Publication date
WO2024204073A1 (ja) 2024-10-03
JPWO2024204073A1 (https=) 2024-10-03

Similar Documents

Publication Publication Date Title
TWI794921B (zh) 電池用封裝體及電池模組
WO2024048326A1 (ja) 電池用パッケージおよび電池モジュール
JPWO2008066087A1 (ja) 微小構造体装置およびその製造方法ならびに封止用基板
JP2001356064A (ja) 圧力検出装置用パッケージ
CN120936871A (zh) 基板、封装件、气敏传感器模块、气敏传感器及气敏传感器的制造方法
JP2019129189A (ja) 配線基板、パッケージおよび電子装置
JP5665797B2 (ja) 圧力センサ用パッケージおよびその製造方法、ならびに圧力センサ
CN117178353A (zh) 基板、封装件、电子部件以及发光装置
JP7011563B2 (ja) 回路基板および電子部品
JP4582889B2 (ja) 圧力検出装置用パッケージ
CN101233614A (zh) 电容器装载型半导体器件
JP2005039006A (ja) 中継基板、半導体素子付き中継基板、中継基板付きパッケージ、半導体素子と中継基板とパッケージとからなる構造体、および中継基板の製造方法
JP4859280B2 (ja) 圧力検出装置用パッケージおよびその製造方法
JP4974424B2 (ja) 圧力検出装置用パッケージ
WO2024162055A1 (ja) パッケージ、母基板、ガスセンサモジュール、および電子装置
JP3850263B2 (ja) 圧力検出装置用パッケージおよび圧力検出装置
JP4925522B2 (ja) 圧力検出装置用パッケージ
JP4753926B2 (ja) 圧力検出器および圧力検出器組立体
JP4034995B2 (ja) 圧力検出装置用パッケージ及び圧力検出装置
JP4794072B2 (ja) 圧力検出装置用パッケージ
JP3878836B2 (ja) 圧力検出装置用パッケージ
JP4713029B2 (ja) 圧力検出装置用パッケージ
JP4789357B2 (ja) 圧力検出装置用パッケージ
JP4582888B2 (ja) 圧力検出装置用パッケージ
JP4034989B2 (ja) 圧力検出装置用パッケージ及び圧力検出装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination