WO2024166971A1 - 回路装置、および回路基板 - Google Patents
回路装置、および回路基板 Download PDFInfo
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- WO2024166971A1 WO2024166971A1 PCT/JP2024/004251 JP2024004251W WO2024166971A1 WO 2024166971 A1 WO2024166971 A1 WO 2024166971A1 JP 2024004251 W JP2024004251 W JP 2024004251W WO 2024166971 A1 WO2024166971 A1 WO 2024166971A1
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- wiring
- coil
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- coil component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/09—Filters comprising mutual inductance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
Definitions
- This disclosure relates to a circuit device and a circuit board.
- Filter circuits used for noise suppression include, for example, EMI (Electro-Magnetic Interference) removal filters, which allow necessary components of the current flowing through a conductor to pass through, while removing unnecessary components.
- EMI Electro-Magnetic Interference
- filter circuits use capacitors, which are capacitance elements, it is known that the noise suppression effect is reduced by the equivalent series inductance (ESL), which is the parasitic inductance of the capacitor.
- ESL equivalent series inductance
- a technology is known that cancels the equivalent series inductance ESL of a capacitor with the negative inductance generated by magnetically coupling two coils, thereby broadening the bandwidth of the noise suppression effect of a filter circuit (for example, JP 2001-160728 A: Patent Document 1).
- Patent Document 1 When the coil component described in JP 2001-160728 A (Patent Document 1) is used in a filter circuit, it is connected in series to a power supply line, and the coil component itself generates heat due to the current of the power supply line flowing through the coil component.
- Large electronic components such as active components can be provided with heat dissipation means such as heat dissipation electrodes, but small electronic components such as passive components measuring a few mm square cannot be provided with heat dissipation means such as heat dissipation electrodes due to restrictions on component size.
- circuit devices that implement coil components such as filter circuits, a configuration that can efficiently dissipate heat from the coil component is desired.
- the objective of this disclosure is to provide a circuit device and a circuit board that can dissipate heat from a coil component.
- a circuit device includes a circuit board on which a plurality of wirings are arranged, a coil component electrically connected to the plurality of wirings, and a capacitor element electrically connected to the coil component.
- the coil component includes a first coil and a second coil, with one end of the first coil being a first terminal, one end of the second coil being a second terminal, and a portion connecting the other end of the first coil to the other end of the second coil being an intermediate terminal.
- the circuit board includes a first wiring electrically connected to the first terminal, a second wiring electrically connected to the second terminal, and an intermediate wiring electrically connecting the intermediate terminal to one end of the capacitor element.
- the intermediate wiring has a portion extending along the wiring direction of at least one of the first wiring and the second wiring, and the length of the intermediate wiring in the extension direction of the intermediate wiring is longer than the length of the coil component.
- Another circuit device includes a circuit board on which a plurality of wirings are arranged, a coil component electrically connected to the plurality of wirings, and a capacitor element electrically connected to the coil component.
- the coil component includes a first coil and a second coil, with one end of the first coil being a first terminal, one end of the second coil being a second terminal, and a portion connecting the other end of the first coil to the other end of the second coil being an intermediate terminal.
- the circuit board includes a first wiring electrically connected to the first terminal, a second wiring electrically connected to the second terminal, and an intermediate wiring electrically connecting the intermediate terminal to one end of the capacitor element.
- the intermediate wiring has a portion extending in a width direction perpendicular to the wiring direction of the first wiring and the second wiring, and the portion is disposed between the first wiring and the second wiring.
- a circuit board is a circuit board on which a coil component electrically connected to the multiple wirings is arranged and on which a capacitor element electrically connected to the coil component can be mounted.
- the circuit board includes a first wiring electrically connected to a first terminal of a first coil included in the coil component, a second wiring electrically connected to a second terminal of a second coil included in the coil component, and an intermediate wiring electrically connecting an intermediate terminal connecting the first coil and the second coil to one end of the capacitor element.
- the intermediate wiring has a portion extending along the wiring direction of at least one of the first wiring and the second wiring, and the length of the intermediate wiring in the extension direction of the intermediate wiring is longer than the length of the coil component.
- Another circuit board is a circuit board on which a coil component electrically connected to the multiple wirings is arranged and capable of mounting a capacitor element electrically connected to the coil component.
- the circuit board includes a first wiring electrically connected to a first terminal of a first coil included in the coil component, a second wiring electrically connected to a second terminal of a second coil included in the coil component, and an intermediate wiring electrically connecting an intermediate terminal connecting the first coil and the second coil to one end of the capacitor element.
- the intermediate wiring has a portion extending in a width direction perpendicular to the wiring direction of the first wiring and the second wiring, and the portion is arranged between the first wiring and the second wiring.
- the circuit device and circuit board disclosed herein allow heat from the coil components mounted on the circuit board to be efficiently released to the wiring.
- FIG. 1 is a schematic diagram of a filter circuit according to a first embodiment
- 1 is a circuit diagram of a filter circuit according to a first embodiment
- 2 is a perspective view of a coil component mounted in the filter circuit according to the first embodiment
- FIG. 4 is a diagram for explaining a flow of heat in the coil component according to the first embodiment.
- FIG. 1 is a schematic diagram of a circuit board according to a first embodiment
- FIG. 11 is a schematic diagram of a filter circuit according to a modified example of the first embodiment.
- FIG. 11 is a schematic diagram of a filter circuit according to a second embodiment.
- FIG. 13 is a schematic diagram of a filter circuit according to a modification of the second embodiment.
- FIG. 11 is a schematic diagram of a filter circuit according to a third embodiment.
- circuit device a power supply filter circuit in which a coil component, which is an example of a passive component, is mounted on a circuit board will be described with reference to the drawings.
- the circuit device is not limited to a filter circuit, and can be similarly applied to any circuit device that requires heat to be dissipated from a coil component to wiring on a circuit board.
- Fig. 1 is a schematic diagram of a filter circuit 100 according to the first embodiment.
- Fig. 2 is a circuit diagram of the filter circuit 100 according to the first embodiment.
- Fig. 3 is a perspective view of a coil component 1 mounted in the filter circuit 100 according to the first embodiment. Note that, with respect to the X-axis, Y-axis, and Z-axis defined in Fig. 3, the X-axis direction represents the left-right direction of the coil component 1, the Y-axis direction represents the front-rear direction of the coil component 1, and the Z-axis direction represents the up-down direction of the coil component 1, respectively.
- Coil component 1 is, for example, a transformer coil mounted in a filter circuit 100 used to reduce noise in power supply wiring. As described below, coil component 1 magnetically couples two coils (coil L1 and coil L2) to cancel the parasitic inductance of a capacitor mounted in filter circuit 100.
- the circuit board 10 is mounted with a power supply 20, a power supply IC 30 which is a power supply circuit, and a filter circuit 100 arranged between the power supply 20 and the power supply IC 30.
- the circuit board 10 shown in FIG. 1 is an example, and the power supply 20 may be a battery, a connection terminal for connecting to an external power supply, or a power supply circuit that performs voltage step-up or step-down.
- the power supply IC 30 may be a power supply circuit that performs voltage step-up or step-down, or a power supply circuit such as a converter. Furthermore, it may be a circuit that is driven by power from the power supply 20, rather than the power supply IC 30.
- the filter circuit 100 may be arranged anywhere on the circuit board 10, as long as it is arranged to remove unnecessary components between the input and output.
- the filter circuit 100 includes a coil component 1, a capacitor C1 which is a capacitance element, and an intermediate wiring 60 which electrically connects the coil component 1 and the capacitor C1.
- An electrode 2c (first terminal) of the coil component 1 is electrically connected to the power supply 20 via a power supply wiring 51 (first wiring).
- an electrode 3c (second terminal) of the coil component 1 is electrically connected to the power supply IC 30 via a power supply wiring 52 (second wiring).
- the electrodes 2e and 3e of the coil component 1 are intermediate terminals T of the two coils, and are electrically connected by a first portion 61 of the intermediate wiring 60.
- the intermediate terminal T is connected to the GND wiring 53 via the capacitor C1 by the intermediate wiring 60.
- the electrode 2e may be regarded as a first intermediate terminal, and the electrode 3e may be regarded as a second intermediate terminal.
- the intermediate wiring 60 has second portions 62 to 64 in order to improve the heat dissipation of the coil component 1, as described later.
- Electrically connected refers to a state in which electrical continuity is established using wiring, solder mounting, wire, etc., and includes cases in which the wiring and coil components are directly connected, as well as cases in which a conductive member is sandwiched between them.
- Filter circuit 100 is, for example, an EMI removal filter as shown in FIG. 2, and is a third-order T-type LC filter circuit. This filter circuit 100 connects electrode 2c to power supply 20, and electrode 3c to power supply IC 30. Filter circuit 100 passes necessary components of the current flowing from power supply 20 to power supply IC 30 and removes unnecessary components.
- This filter circuit 100 uses capacitor C1, which is a capacitance element, and therefore uses the negative inductance generated by the magnetic coupling of two coils to cancel the equivalent series inductance ESL (La) of the capacitor.
- the filter circuit 100 will be described using a third-order T-type LC filter circuit, but coil components of a similar configuration can also be applied to a fifth-order T-type LC filter circuit or a higher-order T-type LC filter circuit.
- the filter circuit 100 includes a capacitor C1, electrodes 2c and 3c, an intermediate terminal T (electrodes 2e and 3e), a coil L1, and a coil L2.
- the capacitor C1 has one end connected to the intermediate terminal T and the other end connected to the GND wiring 53.
- the capacitor C1 may be a multilayer ceramic capacitor mainly made of BaTiO 3 (barium titanate), a multilayer ceramic capacitor mainly made of other materials, or another type of capacitor such as an aluminum electrolytic capacitor.
- the capacitor C1 has an inductor La as a parasitic inductance (equivalent series inductance (ESL)), and is equivalent to a circuit configuration in which the inductor La is connected in series to the capacitor C1a.
- the capacitor C1 may also be equivalent to a circuit configuration in which a parasitic resistance (equivalent series resistance (ESR)) is connected in series to the inductor La and the capacitor C1a.
- coils L1 and L2 are connected to intermediate terminal T. Coils L1 and L2 are summed and magnetically coupled, generating a negative inductance component in the path from intermediate terminal T to GND.
- This negative inductance component can be used to cancel out the parasitic inductance of capacitor C1 (inductor La), making the inductance component of capacitor C1 appear smaller.
- filter circuit 100 which is composed of capacitor C1, coil L1, and coil L2, can suppress the decrease in noise removal effect in the high frequency band caused by the parasitic inductance of capacitor C by canceling out the parasitic inductance of capacitor C1 with the negative inductance component due to the mutual inductance between coils L1 and L2, thereby improving the noise suppression effect in the high frequency band.
- coil component 1 includes coil L1 (first coil), coil L2 (second coil), and housing 4.
- Coil L1 and coil L2 are formed from a metal plate, for example, copper or an alloy of copper and other metals.
- Coil L1 and coil L2, which are formed from the metal plate, are covered with an insulating material (not shown).
- the insulating material covering coil L1 and coil L2 is a resin such as polyimide or epoxy.
- the coil L1 includes a coil portion 2a having a rectangular opening, a terminal 2b (first terminal) extending from one end of the coil portion 2a, and a terminal 2d (second terminal) extending from the other end of the coil portion 2a.
- the coil portion 2a is arranged inside the housing 4 parallel to the main surface 40A (first main surface).
- the coil portion 2a is illustrated as a one-turn coil, but may be a multiple-turn coil.
- the terminal 2d and the terminal 2d are drawn out from the side surface 41 (first side surface) of the housing 4 and extend along the side surface 41 in the direction of the main surface 40B (second main surface).
- the electrode 2c is electrically connected to the first portion 61 of the intermediate wiring 60 on the circuit board 10.
- the coil L2 includes a coil portion 3a having a rectangular opening, a terminal 3b (third terminal) extending from one end of the coil portion 3a, and a terminal 3d (fourth terminal) extending from the other end of the coil portion 3a.
- the coil portion 3a is arranged on the upper side of the coil portion 2a inside the housing 4, parallel to the main surface 40A.
- the coil portion 3a is illustrated as a one-turn coil, but may be a multiple-turn coil.
- the terminal 3d and the terminal 3d are drawn out from the side surface 42 (second side surface) of the housing 4 and extend along the side surface 42 in the direction of the main surface 40B.
- the electrode 3c is electrically connected to the first portion 61 of the intermediate wiring 60 on the circuit board 10.
- the electrodes 2e and 3e are electrically connected by the first portion 61 of the intermediate wiring 60 arranged on the circuit board 10.
- coil portion 2a When terminal 2b of coil L1 is connected to power supply 20 via electrode 2c, current flows in a clockwise direction in coil portion 2a.
- the current that flows through coil portion 2a flows counterclockwise through terminal 2d, electrode 2e, first portion 61 of intermediate wiring 60, electrode 3e, and terminal 3d in that order.
- Coil portion 2a and coil portion 3a are arranged so that they overlap when viewed from the main surface 40A direction, so coil L1 and coil L2 are magnetically coupled.
- the housing 4 fixes the relative positions of the coils L1 and L2, and is made of, for example, molded resin.
- the molded resin is made of various resins, such as epoxy resin with added silica filler, silicone resin, liquid crystal polymer, or resins mixed with metallic magnetic material.
- the housing 4 has side 41 (first side) and side 42 (second side) that face each other, and the side closer to terminal 2b (first terminal) is side 43 (third side), and the side closer to terminal 2d (second terminal) is side 44 (fourth side).
- the coil L1 and the coil L2 are formed from a metal plate, and the coil portion 2a of the coil L1 and the coil portion 3a of the coil L2 are fixed by the molded resin of the housing 4 at a position where they overlap. Furthermore, in this coil component, the terminals 2b, 2d, 3b, and 3d drawn out from the side of the housing 4 are bent along the side of the housing 4.
- the coil component 1 is not limited to this configuration, and may be configured by laminating multiple substrates (ceramic green sheets) on which the wiring pattern of the coil is formed, or may be a wound coil with a metal wire wound around a bobbin, or may have other configurations. Note that in the coil component 1, as shown in FIG.
- the terminal 2d extending from the other end of the coil L1 and the terminal 3d extending from the other end of the coil L2 are separate terminals.
- the coil component 1 is not limited to this, and may be configured such that the other end of the coil L1 and the other end of the coil L2 are connected inside the coil component 1, and an intermediate terminal extends from the connected portion to the outside.
- the heat dissipation properties of the intermediate wiring connected to the intermediate terminal can be improved to dissipate heat from the coil component 1 efficiently.
- coil component 1 when filter circuit 100 including coil component 1 is provided between power supply 20 and power supply IC 30, coil component 1 itself will generate heat due to the current of the power supply line flowing through coil component 1.
- Coil component 1 is a passive component and a small electronic component. Therefore, coil component 1 has a smaller surface area than large electronic components such as active components, and a larger proportion of heat is released to the wiring via electrodes 2c, 2e, 3c, and 3e than the proportion of heat released directly from coil component 1 itself.
- power supply wiring 51 and 52 are wiring for passing a large current, and therefore the width of the wiring is wide as shown in FIG. 1, so that heat generated by coil component 1 can be released through electrodes 2c and 3c.
- coil component 1 is a transformer coil having three terminals: a terminal of coil L1, a terminal of coil L2, and an intermediate terminal T that connects coils L1 and L2. Therefore, electrode 2c, which is the terminal of coil L1, is connected to power supply wiring 51, and electrode 3c, which is the terminal of coil L2, is connected to power supply wiring 52, so heat can be released directly, but intermediate terminal T is not directly connected to power supply wiring 51, 52 and is far away, so heat cannot be released efficiently.
- the intermediate wiring 60 connected to the intermediate terminal T is extended to the vicinity of the power wiring 51, 52, which has good heat dissipation properties, so that heat can be dissipated from the intermediate terminal T to the power wiring 51, 52, and the heat from the coil component 1 mounted on the circuit board 10 can be efficiently dissipated to the power wiring 51, 52.
- the intermediate wiring 60 has a portion (second portion 62) that extends in a width direction perpendicular to the wiring direction (extension direction of the intermediate wiring 60) of the power supply wirings 51 and 52, and the second portion 62 is disposed between the power supply wirings 51 and 52. Furthermore, the intermediate wiring 60 has a portion (third portion 63) that extends along the wiring direction of the power supply wiring 51, and a portion (fourth portion 64) that extends along the wiring direction of the power supply wiring 52, and the length of the third portion 63 and the fourth portion 64 of the intermediate wiring 60 in the extension direction of the intermediate wiring 60 is longer than the length of the coil component 1.
- the intermediate wiring 60 can increase the number of paths for dissipating heat from the intermediate terminal T to the power supply wirings 51 and 52, and can efficiently dissipate heat from the coil component 1 mounted on the circuit board 10 to the power supply wirings 51 and 52.
- the power supply wiring 52 is narrower at the portion where it is connected to the power supply IC 30, but has a width similar to that of the power supply wiring 51 at the portion where it is connected to the coil component 1.
- the width of the power supply wirings 51 and 52 at the portion where it is connected to the coil component 1 is about 5 to 6 times thicker than the width of the portion where it is connected to the power supply IC 30.
- the cross section shown in FIG. 4 shows a cross section of plane IV-IV in FIG. 1, and illustrates the heat dissipation path from the second portion 62 of the intermediate wiring 60 to the power wiring 51. Note that a heat dissipation path from the second portion 62 to the power wiring 52 also exists, but is not shown.
- air with low thermal conductivity approximately 0.0157 W/mK
- the circuit board 10 which has a higher thermal conductivity than air, is present in the heat dissipation path R2 from the second portion 62 to the power wiring 51 via the circuit board 10.
- the circuit board 10 is, for example, FR-4 (Flame Retardant Type 4)
- the thermal conductivity is about 0.3 W/mK.
- the coil component 1, which has a higher thermal conductivity than air, is also present in the heat dissipation path R3 from the second portion 62 to the power wiring 51 via the coil component 1.
- the thermal conductivity is about 0.2 W/mK, if it is liquid crystal polymer, the thermal conductivity is about 3 W/mK, and if it is ceramic, the thermal conductivity is about 20 to 30 W/mK.
- the heat dissipation path R3 it is preferable that the main surface 40B of the coil component 1 and the second portion 62 are in contact with each other, but even if there is a small gap between the main surface 40B of the coil component 1 and the second portion 62, the heat dissipation may be higher than that of the heat dissipation path R2.
- the heat dissipation from the second portion 62 to the power supply wiring 51 is most efficient in the order of heat dissipation path R3, heat dissipation path R2, and heat dissipation path R1. Therefore, the second portion 62 has all of the heat dissipation paths R1 to R3 because it passes under the coil component 1 and is disposed between the power supply wiring 51 and the power supply wiring 52.
- the third portion 63 and the fourth portion 64 have no portions that pass under the coil component 1, so they have the heat dissipation paths R1 to R2 and have a lower ability to dissipate heat than the second portion 62.
- FIG. 5 is a schematic diagram of the circuit board 10 according to the first embodiment.
- the circuit board 10 is, for example, FR-4, which is made by soaking glass fiber cloth in epoxy resin and subjecting it to a heat curing process to form a plate.
- wiring patterns such as power supply wiring 51, power supply wiring 52, GND wiring 53, and intermediate wiring 60 are provided.
- the power supply wiring 51 is provided with a land electrode 81 for electrically connecting to the electrode 2c of the coil component 1.
- the power supply wiring 52 is provided with a land electrode 82 for electrically connecting to the electrode 3c of the coil component 1.
- the intermediate wiring 60 is provided with a land electrode 83 for electrically connecting to the electrode 2e of the coil component 1 between the first portion 61 and the third portion 63. Furthermore, the intermediate wiring 60 is provided with a land electrode 84 for electrically connecting to the electrode 3e of the coil component 1 between the first portion 61 and the fourth portion 64.
- the intermediate wiring 60 also includes wiring 60a provided with a land electrode 85 for electrically connecting to one electrode of the capacitor C1, and wiring 60b provided with a land electrode 86 for electrically connecting to the other electrode of the capacitor C1.
- the wiring 60a has the first portion 61 to the fourth portion 64, and the wiring 60b is electrically connected to the GND wiring 53.
- the wiring 60b and the GND wiring 53 do not necessarily have to be on the board, but may be connected by a via from the land electrode 86 to the GND wiring 53 formed on the inside of the circuit board 10.
- the circuit board 10 shown in FIG. 5 can efficiently release heat from the mounted coil component 1 to the power supply wiring 51, 52 when the power supply 20, power supply IC 30, coil component 1, and capacitor C1 are mounted on it by providing the second portion 62 to the fourth portion 64 in the intermediate wiring 60.
- the length of the portion of the second portion 62 of the intermediate wiring 60 that extends in the width direction of the power supply wiring 51, 52 is the same as the length of the power supply wiring 51, 52 in the width direction.
- the second portion 62 is not limited to this, and the tip of the second portion 62 may be extended further along the wiring direction of the power supply wiring 51, 52, even if it has a length that overlaps with the coil component 1 when viewed from the direction of the main surface 40A.
- FIG. 6 is a schematic diagram of a filter circuit 100A according to a modification of the first embodiment. Note that in the filter circuit 100A shown in FIG. 6, the same components as those in the filter circuit 100 shown in FIG. 1 are denoted by the same reference numerals and detailed descriptions will not be repeated.
- the circuit board 10A is mounted with a power supply 20, a power supply IC 30 which is a power supply circuit, and a filter circuit 100A arranged between the power supply 20 and the power supply IC 30.
- the filter circuit 100A includes a coil component 1, a capacitor C1 which is a capacitance element, and an intermediate wiring 60 which electrically connects the coil component 1 and the capacitor C1.
- the intermediate wiring 60 is provided with a second portion 62 to improve the heat dissipation of the coil component 1. Since the second portion 62 has heat dissipation paths R1 to R3 as described in FIG.
- the filter circuit 100A can efficiently dissipate heat from the mounted coil component 1 to the power supply wiring 51, 52.
- FR-4 is shown for the circuit board, it can also be formed of LTCC, which has a higher thermal conductivity than FR-4, in which case the heat dissipation of the heat dissipation path R2 is further improved.
- one capacitor C1 is provided between the coil component 1 and the GND wiring 53, but two or more capacitors C1 may be provided in series for redundancy.
- the heat dissipation from the coil component 1 to the GND wiring 53 decreases compared to when one capacitor C1 is provided. Therefore, in the second embodiment, a configuration that can more efficiently dissipate heat from the coil component to the power supply wiring will be described.
- FIG. 7 is a schematic diagram of a filter circuit 100B according to a second embodiment.
- the same components as those in the filter circuit 100 shown in FIG. 1 are denoted by the same reference numerals and detailed description will not be repeated.
- a power supply 20, a power supply IC 30 which is a power supply circuit, and a filter circuit 100B arranged between the power supply 20 and the power supply IC 30 are mounted on the circuit board 10B.
- the filter circuit 100B includes a coil component 1, capacitors C1 and C2 which are capacitance elements, and an intermediate wiring 60 which electrically connects the coil component 1 to the capacitors C1 and C2.
- the intermediate wiring 60 has a third portion 63 and a fourth portion 64 to improve the heat dissipation of the coil component 1.
- the third portion 63 is further connected to the power supply wiring 51 via a ceramic capacitor C3.
- the ceramic capacitor C3 has many electrodes stacked close to each other in the housing, and uses ceramics with a higher thermal conductivity than the circuit board 10B, making it easy to transfer heat. Furthermore, since no current flows through the ceramic capacitor C3, it does not short-circuit the power supply wiring 51 and the intermediate wiring 60. Also, since there is no voltage difference between the power supply wiring 51 and the intermediate wiring 60, no voltage is applied to the ceramic capacitor C3. Therefore, the ceramic capacitor C3 may have a small capacitance, be small, and be inexpensive, as long as it functions as a heat dissipation path R4 from the intermediate wiring 60 to the power supply wiring 51.
- the ceramic capacitor C3 has a large capacitance, low-frequency resonance occurs between the coil component 1, which is a transformer coil, and this may adversely affect the filter circuit 100B that removes noise.
- the ceramic capacitor C3 has a large number of electrodes to improve thermal conductivity, and is preferably made of a low-dielectric material.
- the filter circuit 100B adds a heat dissipation path R4 by providing a ceramic capacitor C3 between the power supply wiring 51 and the third portion 63, so that heat from the coil component 1 can be dissipated to the power supply wirings 51, 52 more efficiently than in a configuration in which the intermediate wiring 60 is provided with only the third portion 63 and the fourth portion 64.
- the ceramic capacitor C3 may be provided not only between the power supply wiring 51 and the third portion 63, but also between the power supply wiring 52 and the fourth portion 64. Of course, the ceramic capacitor C3 may not be provided between the power supply wiring 51 and the third portion 63, but may be provided only between the power supply wiring 52 and the fourth portion 64.
- FIG. 8 is a schematic diagram of a filter circuit 100C according to a modified example of the second embodiment.
- the same components as those in the filter circuit 100 shown in FIG. 1 are denoted by the same reference numerals and will not be described in detail again.
- the circuit board 10C is mounted with a power supply 20, a power supply IC 30 which is a power supply circuit, and a filter circuit 100C arranged between the power supply 20 and the power supply IC 30.
- the filter circuit 100C includes a coil component 1, capacitors C1 and C2 which are capacitance elements, and an intermediate wiring 60 which electrically connects the coil component 1 to the capacitors C1 and C2.
- the intermediate wiring 60 has second to fourth portions 62 to 64 to improve the heat dissipation of the coil component 1.
- the third portion 63 is further connected to the power supply wiring 51 via a ceramic capacitor C3, and the second portion 62 is further connected to the power supply wiring 52 via a ceramic capacitor C4.
- the ceramic capacitor C4 like the ceramic capacitor C3, has many electrodes stacked alternately in close proximity inside the housing, and uses ceramics with a higher thermal conductivity than the circuit board 10C, so it is easy to transfer heat. Furthermore, since no current flows through the ceramic capacitor C4, it does not short-circuit the power supply wiring 52 and the intermediate wiring 60. Also, since there is no voltage difference between the power supply wiring 52 and the intermediate wiring 60, no voltage is applied to the ceramic capacitor C4. Therefore, the ceramic capacitor C4 only needs to function as a heat dissipation path R5 from the intermediate wiring 60 to the power supply wiring 52, and may be small in capacitance or small and inexpensive.
- the ceramic capacitor C4 has a large capacitance, low-frequency resonance occurs between the coil component 1, which is a transformer coil, and it is considered that this may have an adverse effect on the filter circuit 100C that removes noise.
- the ceramic capacitor C4 has a large number of electrodes to improve thermal conductivity, and is preferably made of a low-dielectric material.
- the filter circuit 100C adds a heat dissipation path R4 by providing a ceramic capacitor C3 between the power supply wiring 51 and the third portion 63, and adds a heat dissipation path R5 by providing a ceramic capacitor C4 between the power supply wiring 52 and the second portion 62, so that the heat from the coil component 1 can be dissipated to the power supply wiring 51, 52 more efficiently than the filter circuit 100B.
- the ceramic capacitor C4 may be provided not only between the power supply wiring 52 and the second portion 62, but also between the power supply wiring 51 and the second portion 62. Of course, the ceramic capacitor C4 may be provided only between the power supply wiring 51 and the second portion 62, without being provided between the power supply wiring 52 and the second portion 62.
- a single ceramic capacitor C3, C4 is provided between the power supply wiring 51, 52 and the intermediate wiring 60, but this is not limiting and multiple ceramic capacitors may be provided.
- the ceramic capacitors C3, C4 are used as connecting members connecting the power supply wiring 51, 52 and the intermediate wiring 60, but the connecting members are not limited to ceramic capacitors as long as they are thermally conductive and insulating.
- a liquid crystal polymer may be provided instead of the ceramic capacitors C3, C4.
- the thermal conductivity of the liquid crystal polymer is lower than that of ceramics, at approximately several W/mK, but is higher than that of the circuit boards 10B, 10C (e.g., FR-4), so the heat dissipation of the filter circuit can be improved.
- Fig. 9 is a schematic diagram of a filter circuit 100D according to a third embodiment.
- the same components as those in the filter circuit 100 shown in Fig. 1 are denoted by the same reference numerals and detailed description will not be repeated.
- two winding coils 1a and 1b are arranged in parallel along the extension direction of the second portion 62 on the circuit board 10.
- the winding coil 1a is configured as a first coil component
- the winding coil 1b is configured as a second coil component, each of which is a separate element.
- the winding coils 1a and 1b have a winding axis parallel to the circuit board 10 and in the extension direction of the second portion 62.
- the winding coil 1a corresponds to L1 in FIG. 2, with one end 2ca connected to the power supply wiring 51 and the other end 2ea connected to the intermediate wiring 60.
- the winding coil 1b corresponds to L2 in FIG. 2, with one end 3ca connected to the power supply wiring 52 and the other end 3ea connected to the intermediate wiring 60.
- the filter circuit 100D is constructed inexpensively using general-purpose parts such as the winding coils 1a and 1b, the equivalent series inductance ESL (La) can be canceled using the negative inductance generated by the magnetic coupling of the two coils, just like the filter circuit 100.
- the winding axes of the winding coils 1a and 1b are described as being parallel to the circuit board 10 and in the extension direction of the second portion 62.
- the winding axes of the winding coils 1a and 1b are not limited to this and may be perpendicular to the circuit board 10. If the winding axes of the winding coils 1a and 1b are both perpendicular to the circuit board 10, a magnetic field passes in a direction perpendicular to the circuit board 10, and the winding coils 1a (coil L1) and 1b (coil L2) are magnetically coupled. In other words, it is sufficient that the winding coils 1a and 1b are arranged in a direction that allows for magnetic coupling.
- a circuit device A circuit board on which a plurality of wirings are arranged; A coil component electrically connected to the plurality of wirings; a capacitor element electrically connected to the coil component, The coil parts are A first coil and a second coil are included.
- the circuit board is A first wiring electrically connected to the first terminal; A second wiring electrically connected to the second terminal; an intermediate wiring electrically connecting the intermediate terminal and one end of the capacitor element;
- the intermediate wire has a portion extending along a wiring direction of at least one of the first wire and the second wire, and the length of the intermediate wire in the extension direction of the intermediate wire is longer than the length of the coil component.
- the width of the intermediate wiring perpendicular to the extending direction of the intermediate wiring is smaller than the widths of the first wiring and the second wiring.
- the intermediate wiring has a portion extending in a width direction perpendicular to the extension direction of the intermediate wiring, and the portion is disposed between the first wiring and the second wiring.
- the circuit device (4) The circuit device according to (3), The length of the intermediate wiring extending in the width direction is the same as the width of the first wiring and the second wiring.
- Another circuit device is A circuit board on which a plurality of wirings are arranged; A coil component electrically connected to the plurality of wirings; a capacitor element electrically connected to the coil component, The coil parts are A first coil and a second coil are included.
- the circuit board is A first wiring electrically connected to the first terminal; A second wiring electrically connected to the second terminal; an intermediate wiring electrically connecting the intermediate terminal and one end of the capacitor element;
- the intermediate wiring has a portion extending in a width direction perpendicular to the wiring direction of the first wiring and the second wiring, and the portion is disposed between the first wiring and the second wiring.
- the circuit device according to (5), The length of the intermediate wiring extending in the width direction is the same as the width of the first wiring and the second wiring.
- the intermediate wire has a portion extending along a wiring direction of at least one of the first wire and the second wire, and the length of the intermediate wire in the extension direction of the intermediate wire is longer than the length of the coil component.
- the intermediate terminals include a first intermediate terminal and a second intermediate terminal;
- the first intermediate terminal is electrically connected to the other end of the first coil, and the second intermediate terminal is electrically connected to the other end of the second coil.
- the coil component includes a first coil component having a first coil and a second coil component having a second coil, and the first coil component and the second coil component are arranged in a direction in which they are magnetically coupled to each other.
- the circuit device according to any one of (1) to (9),
- the intermediate wiring is a connection member having thermal conductivity and insulating properties, and is connected to at least one of the first wiring and the second wiring.
- connection member is a ceramic capacitor.
- the circuit device according to any one of (1) to (11),
- the coil component has a first coil and a second coil that are magnetically coupled to each other.
- a circuit board includes: A circuit board on which a plurality of wirings are arranged, and on which a coil component electrically connected to the plurality of wirings and a capacitor element electrically connected to the coil component can be mounted, a first wiring electrically connected to a first terminal of a first coil included in the coil component; a second wiring electrically connected to a second terminal of a second coil included in the coil component; an intermediate wiring electrically connecting an intermediate terminal that connects the first coil and the second coil to one end of the capacitor element;
- the intermediate wire has a portion extending along a wiring direction of at least one of the first wire and the second wire, and the length of the intermediate wire in the extension direction of the intermediate wire is longer than the length of the coil component.
- Another circuit board includes: A circuit board on which a plurality of wirings are arranged, and on which a coil component electrically connected to the plurality of wirings and a capacitor element electrically connected to the coil component can be mounted, a first wiring electrically connected to a first terminal of a first coil included in the coil component; a second wiring electrically connected to a second terminal of a second coil included in the coil component; an intermediate wiring electrically connecting an intermediate terminal that connects the first coil and the second coil to one end of the capacitor element;
- the intermediate wiring has a portion extending in a width direction perpendicular to the wiring direction of the first wiring and the second wiring, and the portion is disposed between the first wiring and the second wiring.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Filters And Equalizers (AREA)
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| Application Number | Priority Date | Filing Date | Title |
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| JP2024576899A JPWO2024166971A1 (https=) | 2023-02-09 | 2024-02-08 |
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| JP2023-018369 | 2023-02-09 | ||
| JP2023018369 | 2023-02-09 |
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| WO2024166971A1 true WO2024166971A1 (ja) | 2024-08-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2024/004251 Ceased WO2024166971A1 (ja) | 2023-02-09 | 2024-02-08 | 回路装置、および回路基板 |
Country Status (2)
| Country | Link |
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| JP (1) | JPWO2024166971A1 (https=) |
| WO (1) | WO2024166971A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021117393A1 (ja) * | 2019-12-13 | 2021-06-17 | 株式会社村田製作所 | 回路装置、およびフィルタ回路 |
| WO2023090181A1 (ja) * | 2021-11-22 | 2023-05-25 | 株式会社村田製作所 | 回路装置 |
| WO2023210499A1 (ja) * | 2022-04-28 | 2023-11-02 | 株式会社村田製作所 | 回路装置、およびフィルタ回路 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6642742B2 (ja) * | 2017-02-14 | 2020-02-12 | 株式会社村田製作所 | コモンモードチョークコイル、モジュール部品および電子機器 |
| JP7003955B2 (ja) * | 2019-03-19 | 2022-02-04 | 株式会社豊田中央研究所 | ノイズフィルタ |
| JP6981584B2 (ja) * | 2019-12-10 | 2021-12-15 | 株式会社村田製作所 | 多層基板、回路装置、およびフィルタ回路基板 |
-
2024
- 2024-02-08 WO PCT/JP2024/004251 patent/WO2024166971A1/ja not_active Ceased
- 2024-02-08 JP JP2024576899A patent/JPWO2024166971A1/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021117393A1 (ja) * | 2019-12-13 | 2021-06-17 | 株式会社村田製作所 | 回路装置、およびフィルタ回路 |
| WO2023090181A1 (ja) * | 2021-11-22 | 2023-05-25 | 株式会社村田製作所 | 回路装置 |
| WO2023210499A1 (ja) * | 2022-04-28 | 2023-11-02 | 株式会社村田製作所 | 回路装置、およびフィルタ回路 |
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| JPWO2024166971A1 (https=) | 2024-08-15 |
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