WO2024143432A1 - 静電チャック - Google Patents

静電チャック Download PDF

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Publication number
WO2024143432A1
WO2024143432A1 PCT/JP2023/046818 JP2023046818W WO2024143432A1 WO 2024143432 A1 WO2024143432 A1 WO 2024143432A1 JP 2023046818 W JP2023046818 W JP 2023046818W WO 2024143432 A1 WO2024143432 A1 WO 2024143432A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrostatic chuck
dechucking
dechuck
attracted
force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/046818
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
喬彬 長谷川
一哉 石橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Creative Technology Corp
Original Assignee
Creative Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Technology Corp filed Critical Creative Technology Corp
Priority to CN202380089729.8A priority Critical patent/CN120435818A/zh
Priority to EP23912210.4A priority patent/EP4645673A1/en
Priority to JP2024567900A priority patent/JPWO2024143432A1/ja
Publication of WO2024143432A1 publication Critical patent/WO2024143432A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0085—Gripping heads and other end effectors with means for applying an electrostatic force on the object to be gripped
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/92—Devices for picking-up and depositing articles or materials incorporating electrostatic or magnetic grippers

Definitions

  • the present invention relates to an electrostatic chuck for adsorbing an object (workpiece) that can be used in robot arms, fixing jigs, etc.
  • a first aspect of the electrostatic chuck of the present invention is a monopolar electrostatic chuck, a dielectric material having an electrode and a dielectric layer covering the electrode and having a volume resistivity of 10 9 to 10 13 ⁇ cm; a dechuck mechanism having a dechuck member that is a conductor; The dechucking member is connected to ground and is the counter pole to the electrode. The dechucking member is a conductor connected to ground and functions as a counter electrode for the electrostatic chuck, allowing the JR-type electrostatic chuck to adsorb an object to be adsorbed.
  • the seventh aspect of the electrostatic chuck of the present invention is the electrostatic chuck of the second aspect, in which the dechuck member has elasticity and functions as a drive unit that drives the dechuck member, or the dechuck mechanism has a spring that is connected to the dechuck member.
  • the Coulomb force that contributes to the suction force is weaker inversely proportional to the square of the mesh thickness, so a thinner mesh is preferable.
  • the maximum thickness of the mesh is greater than 100 ⁇ m, the desired suction force cannot be obtained.
  • the mesh thickness is less than 20 ⁇ m, there is a risk that the mesh will twist during dechucking, or wrinkle during suction. Therefore, a thickness of 20 ⁇ m or more is preferable.
  • the present invention adopts a monopolar charging method, which allows for a simple structure.
  • the counter electrode also functions as the dechucking mechanism, making it possible to simplify the structure and reduce costs.
  • the monopolar structure ensures that the object to be attracted can be in contact with the dechucking members of both electrodes.
  • the dechucking member can be placed at a position slightly away from the dielectric with a tension weaker than the gradient force, and the dechucking member can be attached to or peeled off from the dielectric by the gradient force depending on whether or not a voltage is applied.
  • the volume resistivity of the insulating layer 21 is lower than that of the dielectric layer 25, the charge does not move to the dielectric layer 25 side, but moves to the insulating layer 21 side, and therefore the dielectric layer 25 cannot accumulate charge. As a result, the electrostatic chuck 101 cannot exert an adsorption force and cannot adsorb the object to be adsorbed.
  • the dielectric layer 25 since the higher the flatness of the dielectric layer 25, the larger the contact area with the object to be attracted T can be, it is preferable to fabricate the dielectric 2 by a hot pressing process for thermocompression bonding or a lamination process for bonding.
  • the thickness of the metal thin film is preferably thin to shorten the distance to the object to be attracted T, and is preferably 100 ⁇ m or less, and more preferably 60 ⁇ m or less. This is because the gradient force weakens inversely proportional to the square of the distance, so if the metal thin film is thicker than 100 ⁇ m, there is a risk that the chucking rate for the object to be attracted T envisaged by the inventors may not be ensured. On the other hand, if the metal thin film is less than 20 ⁇ m thick, there is a risk that the metal thin film may twist during dechucking or wrinkle during chucking, resulting in a decrease in the dechucking rate for the object to be attracted T.
  • the dechuck member 1 having the opening 11 is preferably made by etching a thin metal film, laser processing, wire discharge processing, electroforming, or the like.
  • the opening in the thin metal film is made by mechanical processing such as punching, the area around the punched hole will be deformed into a convex or concave shape, which may cause unstable contact between the object to be sucked T and the dechuck member 1 and may not be able to stably suck the object to be sucked.
  • the housing 106 is also provided with an electric motor 103, which is connected to the lifting unit 112 via a mechanism (e.g., rack and pinion) that converts rotational force into linear motion.
  • the lifting unit 112 can move in the Z direction (the vertical direction in FIG. 1) by the rotational force of the electric motor 103.
  • the lifting unit 112 is composed of a pair of members that extend in the vertical direction in FIG. 1 and are spaced apart on the left and right.
  • a dechuck member 1 is connected to the lifting unit 112, and when a drive signal is received from a control unit (not shown), the dechuck member 1 moves in the Z direction by the rotational force of the electric motor 103, and the dechuck member 1 comes into contact with the dielectric layer 25.
  • the dechuck member 1 functions as a counter electrode that is connected to the earth (0 V), in this embodiment, a negative voltage is applied to the electrostatic chuck 101, but it can also be configured to apply a positive voltage.
  • FIGS. 2(a) and 2(b) are schematic cross-sectional views showing the action and effect of the chucking process and dechucking process when using an electrostatic chuck 101.
  • the chucking process in this embodiment starts with the electric motor 103 being driven, the lifting part 112 moving upward in the Z direction, and the dechucking member 1 contacting or approaching the dielectric 2.
  • the switch 110 of the power supply 108 provided on the electrostatic chuck 101 is turned on, the chucking process starts and a predetermined DC voltage is applied to the electrode 23. This induces a negative charge on the electrode 23 (see FIG. 2(a)).
  • the object to be adsorbed T (T shown in the example on the right side of FIG. 2(a)) can be adsorbed to the dielectric layer 25.
  • the dechuck member 1 Because the dechuck member 1 is connected to earth, the charge that has been transferred to the object to be attracted T is dumped onto the dechuck member 1, and the object to be attracted T is maintained at 0V. As a result, a potential difference is maintained between the dielectric layer 25 and the object to be attracted T that is sufficient to generate an adhesive force to attract the object to be attracted T.
  • the dechuck member 1 vibrates and swings, and pressure is applied to the chucking target T, which in turn causes the chucking target T to move in the direction of the stronger electric field, resulting in an excellent chucking rate.
  • the object to be attracted T When the object to be attracted T is a very small workpiece, it is possible to attract the object to be attracted T (T shown as an example on the left side of Figure 2(a)) using only the gradient force described above. This is because the gradient force is correlated with the surface area of the dielectric layer, and the smaller the volume (weight) of the object to be attracted T, the larger the surface area becomes relatively, and the larger the gradient force becomes relatively.
  • the electrostatic chuck can be attracted by the gradient force, and dechucking is possible using the same dechucking mechanism as in this embodiment.
  • the object to be attracted is dechucked from an electrostatic chuck with remaining attracting force, the object is charged to the opposite potential due to frictional charging or peeling charging, which makes it impossible to perform repeated attracting operations.
  • Example ⁇ The inventors conducted a verification test of the adhesion rate of the electrostatic chuck under the following conditions.
  • the insulating layer 21 in Examples 1 and 2 is made of NC nylon, which is a resin material, and has a thickness of 5 mm.
  • the electrode 23 in Examples 1 and 2 is made of a copper material and has a thickness of 7 ⁇ m.
  • the dielectric layer 25 in Example 1 was made of a polyacetal plate having a volume resistivity of 1.0 ⁇ 10 13 ⁇ cm and a thickness of 300 ⁇ m, and the dielectric layer 25 in Example 2 was made of soft PVC having a volume resistivity of 1.0 ⁇ 10 9 ⁇ cm and a thickness of 500 ⁇ m.
  • the dechucking member 1 (counter electrode) of the dechucking mechanism is a plate-shaped member in which multiple 1 mm diameter openings 11 are etched at a pitch of 100 ⁇ m into 20 ⁇ m thick SUS foil.
  • a pneumatic (air) cylinder is used as the drive unit for the dechucking member 1.
  • an attraction step of attracting the object to be attracted T by the electrostatic chuck 101 Under an environment of room temperature of 22° C., humidity of 30 to 35%, and atmospheric pressure, three steps were set as one cycle: an attraction step of attracting the object to be attracted T by the electrostatic chuck 101, a movement step of moving the electrostatic chuck 101 while holding the object to be attracted T, and a dechucking step of removing the object to be attracted T from the electrostatic chuck 101.
  • the cycle was performed five times continuously for 30 objects to be attracted, and the transition of the attraction rate and the dechucking rate was confirmed.
  • the time required for each of the attraction step, the movement step, and the dechucking step was 5 seconds.
  • the electrostatic chuck 101 was moved from a first predetermined point on a plane that took 5 seconds to move to a second predetermined point.
  • the target T falls during the moving process, it is excluded from the targets T that were successfully picked up during the suction process. Therefore, it is not included in the number of targets T that were released during the desorption process.
  • Comparative Example 1 evaluation tests were performed using a dielectric layer having a volume resistivity of 1.0x10 6 ⁇ cm, which is less than 1.00x10 9 (Comparative Example 1), and a dielectric layer having a volume resistivity of 1.0x10 18 ⁇ cm, which is more than 1.00x10 13 (Comparative Example 2).
  • Example 1 had an average adhesion rate of 99 percent over five runs, and Example 2 had an average adhesion rate of 94 percent over five runs, while Comparative Example 1 had an adhesion rate of 0 percent and Comparative Example 2 had an adhesion rate of 48 percent. Thus, it was confirmed that the electrostatic chuck according to the embodiment also had better results in terms of adhesion than Comparative Examples 1 and 2.
  • the insulating layer 21 is made of NC nylon, which is a resin material, and has a thickness of 5 mm.
  • the electrode 23 is made of copper material and has a thickness of 7 ⁇ m.
  • a polyacetal plate having a volume resistivity of 1.0 ⁇ 10 13 ⁇ cm and a thickness of 300 ⁇ m was used.
  • the dechucking member 1 (counter electrode) of the dechucking mechanism is a plate-shaped member made of SUS foil of 20 ⁇ m, 60 ⁇ m, 100 ⁇ m, and 200 ⁇ m thickness, with multiple 1 mm diameter openings 11 etched at a pitch of 100 ⁇ m.
  • a pneumatic (air) cylinder is used as the drive unit for the dechucking member 1.
  • the cycle was performed five times continuously for 30 objects to be attracted T, and the transition of the chucking rate and the dechucking rate was confirmed.
  • the time required for each of the chucking step, the moving step, and the dechucking step was 5 seconds.
  • the electrostatic chuck 101 was moved from a first predetermined point on a plane that took 5 seconds to move to a second predetermined point.
  • a driving unit 203 included in an electrostatic chuck 201 of the second embodiment is configured to move a support portion 205 in the direction of an arrow Z (up and down direction), unlike the driving unit 103 of the first embodiment.
  • the dielectric 2 is connected to the support portion 205, and the driving unit 203 can bring the dielectric 2 into contact with or away from the dechuck member 1.
  • the driving unit 203 is disposed relative to a housing 204 of the electrostatic chuck 201.
  • the driving unit 303 of the third embodiment does not include a power cylinder or a motor.
  • the driving unit 303 has a dechuck member 302 attached to the housing 112 of the electrostatic chuck 301 via a spring 303.
  • the spring 303 has an elastic force weaker than the Coulomb force that attracts the dechuck member 302 (e.g., a metal mesh) upward in the Z direction when a voltage is applied from the power source 108.
  • the Coulomb force of the electrostatic chuck 301 no longer acts, and the dechuck member 302 is released from the dielectric 2 by the elastic force of the spring 303. That is, the spring 303 extends downward in the Z direction and returns to the initial position.
  • the configuration of the electrostatic chuck 301 can be simplified and the cost can be reduced.
  • the dechuck member 1 and the dielectric 2 are arranged to face each other in the vertical direction, but the electrostatic chuck of the present invention is not limited to this configuration.
  • the positional relationship between the dechuck member 1 and the dielectric 2 may be within a range in which the dechuck mechanism can physically hook onto and peel off the object to be adsorbed. Therefore, the dechuck member 1 and the dielectric 2 can be arranged side by side in the horizontal direction, or in a direction inclined relative to the horizontal direction, i.e., parallel to each other in one direction.

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
PCT/JP2023/046818 2022-12-28 2023-12-26 静電チャック Ceased WO2024143432A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202380089729.8A CN120435818A (zh) 2022-12-28 2023-12-26 静电卡盘
EP23912210.4A EP4645673A1 (en) 2022-12-28 2023-12-26 Electrostatic chuck
JP2024567900A JPWO2024143432A1 (https=) 2022-12-28 2023-12-26

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-212754 2022-12-28
JP2022212754 2022-12-28

Publications (1)

Publication Number Publication Date
WO2024143432A1 true WO2024143432A1 (ja) 2024-07-04

Family

ID=91717759

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/046818 Ceased WO2024143432A1 (ja) 2022-12-28 2023-12-26 静電チャック

Country Status (5)

Country Link
EP (1) EP4645673A1 (https=)
JP (1) JPWO2024143432A1 (https=)
CN (1) CN120435818A (https=)
TW (1) TW202427678A (https=)
WO (1) WO2024143432A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031599A (ja) 2002-06-25 2004-01-29 Kyocera Corp 静電チャック
JP2005166820A (ja) * 2003-12-01 2005-06-23 Toshiba Ceramics Co Ltd 静電チャック装置
JP2006332204A (ja) * 2005-05-24 2006-12-07 Toto Ltd 静電チャック
JP2013058761A (ja) * 2007-03-19 2013-03-28 Nikon Corp 保持装置、露光装置、露光方法、及びデバイス製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031599A (ja) 2002-06-25 2004-01-29 Kyocera Corp 静電チャック
JP2005166820A (ja) * 2003-12-01 2005-06-23 Toshiba Ceramics Co Ltd 静電チャック装置
JP2006332204A (ja) * 2005-05-24 2006-12-07 Toto Ltd 静電チャック
JP2013058761A (ja) * 2007-03-19 2013-03-28 Nikon Corp 保持装置、露光装置、露光方法、及びデバイス製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4645673A1

Also Published As

Publication number Publication date
TW202427678A (zh) 2024-07-01
JPWO2024143432A1 (https=) 2024-07-04
CN120435818A (zh) 2025-08-05
EP4645673A1 (en) 2025-11-05

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