Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B15/00—Layered products comprising a layer of metal
  • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
  • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0313—Organic insulating material
  • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
  • H05K1/036—Multilayers with layers of different types
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
  • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2311/00—Metals, their alloys or their compounds
  • B32B2311/12—Copper
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
  • B32B2379/08—Polyimides
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment
  • B32B2457/08—PCBs, i.e. printed circuit boards

Definitions

• This embodiment relates to a resin-coated metal foil, a method for manufacturing a printed wiring board, and a method for manufacturing a semiconductor package.
• the content of the (B) component is 0.5 to 20 mass% relative to the total solid content (100 mass%) of the resin composition.
• a method for producing a printed wiring board comprising forming an insulating material using the resin-coated metal foil according to any one of [1] to [9] above.
• a method for manufacturing a semiconductor package comprising forming an insulating material using the resin-coated metal foil according to any one of [1] to [9] above.
• each of the components and materials exemplified in this specification may be used alone or in combination of two or more kinds.
• the content of each component in a resin composition means, when a plurality of substances corresponding to each component are present in the resin composition, the total amount of the plurality of substances present in the resin composition, unless otherwise specified.
• the term "resin composition” refers to a mixture of two or more components containing at least a resin, and when the resin is a thermosetting resin, includes the mixture in a B-stage state.
• the type and content of each component in the resin composition in a B-stage state refers to the type and content of each component before the B-stage state, that is, the type and content of the components blended when producing the resin composition.
• layer when used, it includes not only a solid layer, but also layers that are not solid but have islands, holes, and layers where the interface with an adjacent layer is unclear.
• the "molecular weight" of a compound means the molecular weight that can be calculated from the structural formula if the compound is not a polymer and the structural formula of the compound can be specified, and means the number average molecular weight if the compound is a polymer.
• This embodiment also includes any combination of the items described in this specification.
• the resin-coated metal foil of this embodiment is A resin-coated metal foil having a metal foil and a resin layer containing a resin composition provided on one surface of the metal foil,
• the resin composition is a resin-attached metal foil containing (A) a thermosetting resin, (B) a compound that is liquid at 25°C, has a reactive group, and has a molecular weight of 1,000 or less, and (C) an inorganic filler.
• each component may be abbreviated as component (A), component (B), etc., and other components may be abbreviated in the same manner.
• component (B) a compound that is liquid at 25° C., has a reactive group, and has a molecular weight of 1,000 or less may be referred to as “(B) a reactive liquid compound”.
• the (B) reactive liquid compound since the (B) reactive liquid compound has a reactive group, the (B) reactive liquid compound may react with itself or with other components during the heat curing of the (A) thermosetting resin. That is, the (B) reactive liquid compound contributes to improving the fluidity while suppressing volatilization by the curing reaction. Therefore, it is considered that the resin-attached metal foil of this embodiment can improve the fluidity while suppressing the generation of volatile components, compared to the case where an organic solvent or the like is used as a component for improving the fluidity.
• the resin composition of the present embodiment contains (A) a thermosetting resin.
• the thermosetting resin (A) may be used alone or in combination of two or more kinds.
• thermosetting resins examples include epoxy resins, phenolic resins, maleimide resins, cyanate resins, isocyanate resins, benzoxazine resins, oxetane resins, amino resins, unsaturated polyester resins, allyl resins, dicyclopentadiene resins, silicone resins, triazine resins, and melamine resins.
• the (A) thermosetting resin is preferably a maleimide resin, and more preferably one or more types selected from the group consisting of maleimide resins having one or more N-substituted maleimide groups and derivatives of the maleimide resin.
• maleimide-based resins a maleimide resin having one or more N-substituted maleimide groups
• AX maleimide resin
• AX maleimide resin
• AY maleimide resin derivative
• the maleimide resin (AX) is not particularly limited as long as it is a maleimide resin having one or more N-substituted maleimide groups. From the viewpoints of conductor adhesion and heat resistance, the maleimide resin (AX) is preferably an aromatic maleimide resin having two or more N-substituted maleimide groups, and more preferably an aromatic bismaleimide resin having two N-substituted maleimide groups.
• aromatic maleimide resin refers to a compound having an N-substituted maleimide group directly bonded to an aromatic ring.
• the maleimide resin (AX) is preferably a maleimide resin that contains a condensed ring of an aromatic ring and an aliphatic ring in its molecular structure and has two or more N-substituted maleimide groups [hereinafter, sometimes referred to as "maleimide resin (A1)” or "(A1) component”].
• the fused ring contained in the maleimide resin (A1) preferably has a fused bicyclic structure, and more preferably is an indan ring.
• the maleimide resin (A1) containing an indane ring is preferably an aromatic bismaleimide resin containing an indane ring.
• the indane ring means a condensed bicyclic structure of an aromatic 6-membered ring and a saturated aliphatic 5-membered ring. At least one carbon atom among the ring-forming carbon atoms forming the indane ring has a bonding group for bonding to other groups constituting the maleimide resin (A1).
• the ring-forming carbon atom having the bonding group and the other ring-forming carbon atoms may not have a bonding group, a substituent, or the like other than the above-mentioned bonding group, but it is preferable that they have a bonding group other than the above-mentioned to form a divalent group.
• the indane ring is preferably contained as a divalent group represented by the following general formula (A1-1).
• R a1 represents an alkyl group having 1 to 10 carbon atoms, an alkyloxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group.
• n a1 represents an integer of 0 to 3.
• R a2 to R a4 each independently represent an alkyl group having 1 to 10 carbon atoms. * represents a bonding site.
• Examples of the aryl group having 6 to 10 carbon atoms represented by R a1 include a phenyl group and a naphthyl group.
• Examples of the aryl group contained in the aryloxy group having 6 to 10 carbon atoms and the arylthio group having 6 to 10 carbon atoms represented by R a1 include the same as the aryl group having 6 to 10 carbon atoms described above.
• Examples of the cycloalkyl group having 3 to 10 carbon atoms represented by R a1 include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a cyclononyl group, and a cyclodecyl group.
• the divalent group represented by general formula (A1-1) above is preferably a divalent group represented by the following formula (A1-1a) in which n a1 is 0 and R a2 to R a4 are methyl groups, and more preferably a divalent group represented by the following formula (A1-1a') or a divalent group represented by the following formula (A1-1a'').
• Examples of the alkyl group having 1 to 10 carbon atoms, the alkyloxy group having 1 to 10 carbon atoms, the alkylthio group having 1 to 10 carbon atoms, the aryl group having 6 to 10 carbon atoms, the aryloxy group having 6 to 10 carbon atoms, the arylthio group having 6 to 10 carbon atoms, and the cycloalkyl group having 3 to 10 carbon atoms represented by R a5 in the above general formula (A1-2) include the same as those for R a1 above, and preferred examples thereof are also the same.
• n a2 is an integer of 0 to 4, and from the viewpoints of compatibility with other resins, dielectric properties, conductor adhesion and ease of production, is preferably an integer of 1 to 3, more preferably 2 or 3, and even more preferably 2.
• the benzene ring and the N-substituted maleimide group have a twisted conformation, and intermolecular stacking is suppressed, which tends to further improve solvent solubility.
• the substitution position of R a5 is preferably the ortho position with respect to the N-substituted maleimide group.
• R a1 to R a5 , n a1 and n a3 are the same as those in the above general formula (A1-2).
• R a1 to R a4 , n a1 and n a3 are the same as those in the above general formula (A1-2).
• n a3 is the same as in the above general formula (A1-2).
• Examples of the alkylene group having 1 to 5 carbon atoms and the alkylidene group having 2 to 5 carbon atoms represented by X a13 in the above general formula (A2-3-1) include the same as those for X a12 above.
• n a18 is an integer of 1 to 8, preferably an integer of 1 to 5, more preferably an integer of 1 to 3, and even more preferably 1.
• n a18 is an integer of 2 or greater, multiple R a16s or multiple R a17s may be the same or different.
• Examples of the divalent hydrocarbon group having 1 to 20 carbon atoms represented by X a14 in general formula (A2-7) above include divalent aliphatic hydrocarbon groups such as alkylene groups having 1 to 5 carbon atoms and alkylidene groups having 2 to 5 carbon atoms; and divalent hydrocarbon groups containing an aromatic hydrocarbon group represented by the following general formula (A2-8).
• Examples of the alkylene group having 1 to 5 carbon atoms include a methylene group, a 1,2-dimethylene group, a 1,3-trimethylene group, a 1,4-tetramethylene group, a 1,5-pentamethylene group, etc.
• the alkylene group having 1 to 5 carbon atoms is preferably an alkylene group having 1 to 3 carbon atoms, more preferably an alkylene group having 1 or 2 carbon atoms, and even more preferably a methylene group.
• the alkylidene group having 2 to 5 carbon atoms is preferably an alkylidene group having 2 to 4 carbon atoms, more preferably an alkylidene group having 2 or 3 carbon atoms, and further preferably an isopropylidene group.
• Ar a1 is a divalent aromatic hydrocarbon group
• X a15 and X a16 are each independently a divalent aliphatic hydrocarbon group having 1 to 5 carbon atoms. * represents a bonding site.
• biphenylene group examples include a 4,2'-biphenylene group, a 4,3'-biphenylene group, a 4,4'-biphenylene group, and a 3,3'-biphenylene group. Of these, a 4,4'-biphenylene group is preferable.
• X a14 in the above general formula (A2-7) is preferably a divalent hydrocarbon group containing an aromatic hydrocarbon group represented by the above general formula (A2-8), and more preferably a divalent hydrocarbon group in which X a15 and X a16 are methylene groups and Ar a1 is a 4,4'-biphenylene group in the above general formula (A2-8).
• maleimide resin (A2) examples include aromatic bismaleimide resins, aromatic polymaleimide resins, and aliphatic maleimide resins.
• Specific examples of the maleimide resin (A2) include bis(4-maleimidophenyl)methane, m-phenylene bismaleimide, 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane, 4-methyl-1,3-phenylene bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, polyphenylmethane maleimide, biphenylaralkyl maleimide, etc.
• biphenylaralkyl maleimide is preferred.
• the maleimide resin derivative (AY) is preferably an aminomaleimide resin having a structural unit derived from the above-mentioned maleimide resin (AX) and a structural unit derived from a diamine compound.
• the aminomaleimide resin has a structural unit derived from a maleimide resin (AX) and a structural unit derived from a diamine compound.
• the aminomaleimide resin can be obtained, for example, by subjecting a maleimide resin (AX) to Michael addition with a diamine compound.
• the diamine compound for example, the same amine compound having at least two primary amino groups in one molecule as described in JP-A-2020-200406 can be used.
• thermosetting resins described above from the viewpoints of dielectric properties, conductor adhesion, and heat resistance, (A) thermosetting resins that contain a condensed ring of an aromatic ring and an aliphatic ring in the molecular structure and have two or more N-substituted maleimide groups are preferred.
• thermosetting resin preferably has a viscosity at 25°C measured by the above method of more than 100,000 mPa ⁇ s, and more preferably is solid at 25°C.
• the content of the (A) thermosetting resin is not particularly limited, but is preferably 5 to 60 mass%, more preferably 8 to 40 mass%, even more preferably 10 to 30 mass%, and particularly preferably 15 to 25 mass%, relative to the total amount (100 mass%) of the resin components in the resin composition of the present embodiment.
• the content of the (A) thermosetting resin is equal to or greater than the lower limit, the heat resistance, moldability, processability, and conductor adhesion tend to be improved.
• the content of the (A) thermosetting resin is equal to or less than the upper limit, the dielectric properties tend to be improved.
• the upper limit of the content of the (A) thermosetting resin may be 80% by mass or less, 70% by mass or less, or 60% by mass or less, based on the total amount (100% by mass) of the (A) thermosetting resin and the (B) reactive liquid compound.
• the lower limit of the content of the (A) thermosetting resin may be 5% by mass or more, 10% by mass or more, or 15% by mass or more, based on the total amount (100% by mass) of the (A) thermosetting resin and the (B) reactive liquid compound.
• the term "resin component” refers to a resin and a compound that forms a resin through a curing reaction.
• the component (A), the component (B), and the component (C) correspond to the resin component.
• the resin composition of the present embodiment contains, as optional components, a resin or a compound that forms a resin by a curing reaction in addition to the above components, these optional components are also included in the resin component.
• Optional components corresponding to the resin component include the components (E) and (F) described below.
• the component (D) is not included in the resin component.
• the amount of resin components contained in the resin composition of this embodiment is not particularly limited, but from the viewpoints of low thermal expansion, heat resistance, flame retardancy, and conductor adhesion, it is preferably 5 to 80 mass%, more preferably 10 to 60 mass%, and even more preferably 20 to 40 mass% relative to the total solid content (100 mass%) of the resin composition of this embodiment.
• the resin composition contained in the resin layer of the resin-coated metal foil of this embodiment contains the reactive liquid compound (B), which can increase the fluidity of the resin layer when it is heated and melted. Furthermore, the reactive liquid compound (B) can penetrate well between the molecules of the resin component, and can effectively weaken the intermolecular interaction of the resin component, thereby improving the flexibility of the resin layer. This makes it possible to suppress cracks from occurring in the resin layer when handling the resin-coated metal foil, even when the thickness of the resin layer is increased.
• the reactive liquid compound (B) preferably has two or more reactive groups in one molecule, more preferably has two to five reactive groups, even more preferably has two to four reactive groups, and particularly preferably has two or three reactive groups.
• the number of reactive groups is within the above range, volatilization during heat curing is more effectively suppressed, while excellent fluidity and flexibility tend to be easily obtained.
• the molecular weight of the reactive liquid compound (B) is 1,000 or less, preferably 100 to 800, more preferably 150 to 600, and even more preferably 200 to 400.
• the (B) reactive liquid compound tends to be easily prevented from volatilizing before the resin composition is heat-cured.
• the molecular weight of the (B) reactive liquid compound is equal to or less than the upper limit, better fluidity and flexibility tend to be easily obtained.
• the viscosity of the reactive liquid compound (B) at 25° C. is preferably 1 to 5,000 mPa ⁇ s, more preferably 2 to 1,000 mPa ⁇ s, and even more preferably 4 to 500 mPa ⁇ s.
• the viscosity of the (B) reactive liquid compound at 25° C. is equal to or higher than the above lower limit, the (B) reactive liquid compound tends to be easily prevented from volatilizing.
• the viscosity of the (B) reactive liquid compound at 25° C. is equal to or lower than the above upper limit, the (B) reactive liquid compound tends to have better fluidity and flexibility.
• the viscosity of the reactive liquid compound (B) at 25° C. can be measured by the above-mentioned measuring method.
• Examples of mono(meth)acrylic acid esters include methyl(meth)acrylate, ethyl(meth)acrylate, propyl(meth)acrylate, butyl(meth)acrylate, pentyl(meth)acrylate, hexyl(meth)acrylate, heptyl(meth)acrylate, 2-ethylhexyl(meth)acrylate, octyl(meth)acrylate, isooctyl(meth)acrylate, nonyl(meth)acrylate, decyl(meth)acrylate, dodecyl(meth)acrylate, lauryl(meth)acrylate, tridecyl(meth)acrylate, stearyl(meth)acrylate, ethyl ...
• acrylate polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, ethoxylated bisphenol F di(meth)acrylate, dioxane glycol di(meth)acrylate, and the like.
• trifunctional or higher (meth)acrylic acid esters examples include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, etc.
• R b1 is an alkylene group having 1 to 20 carbon atoms.
• alkylene group having 1 to 20 carbon atoms examples include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, a heptylene group, an octylene group, a nonylene group, a decylene group, an undecylene group, a dodecylene group, a tetradecylene group, a pentadecylene group, etc.
• the alkylene group may be linear, branched, or cyclic, but is preferably linear.
• the content of the (B) reactive liquid compound is not particularly limited, but is preferably 5 to 60 mass %, more preferably 8 to 40 mass %, even more preferably 10 to 30 mass %, and particularly preferably 15 to 25 mass %, relative to the total amount (100 mass %) of the resin components in the resin composition of the present embodiment.
• the content of the (B) reactive liquid compound is not particularly limited, but is preferably 0.5 to 20 mass%, more preferably 1.0 to 15 mass%, and even more preferably 1.5 to 10 mass%, relative to the total solid content (100 mass%) of the resin composition.
• conjugated diene polymer (D1)) means a polymer of a conjugated diene compound.
• conjugated diene polymer By containing the conjugated diene polymer (D1), the resin composition of the present embodiment tends to easily obtain better dielectric properties.
• the conjugated diene polymer (D1) may be used alone or in combination of two or more kinds.
• the structural unit having a 1,2-vinyl group a structural unit derived from butadiene represented by the above formula (D1-1) is preferable.
• the polybutadiene having a 1,2-vinyl group is preferably a 1,2-polybutadiene homopolymer.
• the content of the elastomer (D) is not particularly limited, but is preferably 10 to 80 mass%, more preferably 30 to 70 mass%, and even more preferably 50 to 60 mass%, relative to the total amount (100 mass%) of the resin components in the resin composition of the present embodiment.
• the content of the elastomer (D) is equal to or greater than the lower limit, better dielectric properties tend to be obtained.
• the content of the elastomer (D) is equal to or less than the upper limit, better heat resistance tends to be obtained.
• the thickness of the resin layer is not particularly limited, but is preferably 5 to 1,000 ⁇ m, more preferably 10 to 500 ⁇ m, even more preferably 20 to 200 ⁇ m, still more preferably 30 to 100 ⁇ m, and particularly preferably 40 to 70 ⁇ m.
• the thickness of the resin layer is equal to or greater than the lower limit, the circuit embedding property tends to be improved, whereas when the thickness of the resin layer is equal to or less than the upper limit, the wiring density tends to be increased.
• the relative dielectric constant (Dk) and the dielectric loss tangent (Df) are values based on the cavity resonator perturbation method, and more specifically, are values measured by the method described in the examples.
• the metal foil may have secondary particles, tertiary particles, an anti-rust layer, a heat-resistant layer, or the like formed from, for example, a single element selected from nickel, cobalt, copper, and zinc, or an alloy containing one or more of these elements.
• the surface may be subjected to a surface treatment such as a chromate treatment or a silane coupling treatment.
• the resin-attached metal foil of the present embodiment can be produced, for example, by applying a resin composition containing an organic solvent (hereinafter, the resin composition containing an organic solvent may be referred to as a "resin varnish”) to a metal foil and then drying by heating.
• a resin composition containing an organic solvent hereinafter, the resin composition containing an organic solvent may be referred to as a "resin varnish”
• a printed wiring board is formed in which a circuit board, an insulating layer in which the circuit of the circuit board is embedded, and a metal foil are laminated in this order.
• the outermost metal foil may be removed by etching, or may be used as is for forming a circuit.
• the method for manufacturing a semiconductor package according to the present embodiment is a method for manufacturing a semiconductor package in which an insulating material is formed using the resin-coated metal foil according to the present embodiment.
• the method for manufacturing a semiconductor package of this embodiment may be, for example, a method for manufacturing a semiconductor package by mounting a semiconductor chip on a printed wiring board manufactured by the method for manufacturing a printed wiring board of this embodiment.
• the semiconductor package manufactured by the manufacturing method of this embodiment has a printed wiring board having an insulating material formed using the resin-coated metal foil of this embodiment. Mounting of the semiconductor chip on the printed wiring board can be performed by a known method.
• the method for producing a semiconductor package according to the present embodiment may be, for example, a method for producing a semiconductor package by sealing a semiconductor chip with a cured resin layer of the metal foil with resin according to the present embodiment.
• the semiconductor package produced by the method for producing the semiconductor package according to the present embodiment has an insulating sealing material formed by using the metal foil with resin according to the present embodiment.
• Sealing of a semiconductor chip with a resin-coated metal foil can be carried out, for example, by placing a resin layer of the resin-coated metal foil on the semiconductor chip, heating and melting the resin layer to embed the semiconductor chip, and then heating and hardening the resin composition in that state.
• the solution containing the 1,2-polybutadiene homopolymer and the aromatic bismaleimide resin containing an indane ring before the start of the reaction and the solution after the reaction were subjected to GPC measurement by the above-mentioned method, and the peak areas derived from the aromatic bismaleimide resin containing an indane ring before and after the reaction were determined.
• the vinyl group modification rate of the aromatic bismaleimide resin containing an indane ring was calculated by the following formula. The vinyl group modification rate corresponds to the rate of decrease in the peak area derived from the aromatic bismaleimide resin containing an indane ring due to the reaction.
• Vinyl group modification rate (%) [(peak area derived from aromatic bismaleimide resin containing indane ring before reaction) ⁇ (peak area derived from aromatic bismaleimide resin containing indane ring after reaction)] ⁇ 100/(peak area derived from aromatic bismaleimide resin containing indane ring before reaction)
• the vinyl group modification rate calculated from the above formula was 40%.
• the resin composition obtained in each example was applied to one side of a 18 ⁇ m-thick low-profile copper foil (manufactured by Mitsui Mining & Smelting Co., Ltd., product name "3EC-VLP-18") in such a thickness that the thickness of the resin layer after drying would be 50 ⁇ m.
• the resin composition was applied to the M side of the low-profile copper foil. Thereafter, the resin composition was heated and dried at 105° C. for 5 minutes to bring the resin composition into a B-stage state, and a resin-coated copper foil was produced.
• the resin-coated copper foil obtained above was cut into a size of 250 mm long x 250 mm wide, and two sheets were stacked together with the resin layer sides facing each other, and then heated and pressurized at a temperature of 180°C, a pressure of 2.0 MPa, and a time of 60 minutes to harden the resin layer, thereby producing a resin plate with copper foil on both sides.
• the thickness of the resin plate part of the obtained resin plate with copper foil on both sides was about 0.1 mm.
• the resin composition obtained in each example was applied to one side of a 18 ⁇ m-thick low-profile copper foil (manufactured by Mitsui Mining & Smelting Co., Ltd., product name "3EC-VLP-18") in such a thickness that the thickness of the resin layer after drying would be 150 ⁇ m.
• the resin composition was applied to the M side of the low-profile copper foil. Thereafter, the resin composition was heated and dried at 105° C. for 5 minutes to bring the resin composition into a B-stage state, and a resin-coated copper foil was produced.
• the resin-coated copper foil was wrapped around a resin cylinder with a diameter of 85 mm at 25° C., with the resin layer facing outward.
• the appearance of the wrapped resin layer was visually observed and evaluated according to the following criteria. In the following criteria, A indicates the best.
• the resin plate with copper foil on both sides obtained in each example was immersed in a 10% by mass solution of ammonium persulfate (manufactured by Mitsubishi Gas Chemical Co., Ltd.), which is a copper etching solution, to remove the copper foil.
• the obtained resin plate was cut into a width of 0.4 mm and a length of 20 mm, and then dried at 105°C for 1 hour to prepare a test piece.
• the test piece was clamped at both ends in the long side direction of the test piece with upper and lower grippers with a gap of 10 mm between the grippers.
• thermomechanical measuring device manufactured by Seiko Instruments Inc., product name "SS6100"
• the inflection point of the dimensional change with respect to temperature was taken as the glass transition temperature, and the average value of the dimensional change per unit temperature at 30 to 150°C was taken as the linear expansion coefficient, and the evaluation was performed according to the following criteria. In the following criteria, A indicates the best.
• ⁇ Criteria for determining coefficient of linear expansion > A: Less than 20 ppm/K B: 20 ppm/K or more, less than 40 ppm/K C: 40 ppm/K or more, less than 60 ppm/K D: 60 ppm/K or more ⁇ Glass transition temperature judgment criteria> A: 180°C or higher B: Less than 180°C
• the resin plate with copper foil on both sides obtained in each example was immersed in a 10% by mass solution of ammonium persulfate (manufactured by Mitsubishi Gas Chemical Co., Ltd.), which is a copper etching solution, to remove the copper foil.
• the obtained resin plate was cut into a width of 10 mm and a length of 40 mm, and then dried at 105°C for 1 hour to obtain a test piece.
• the test piece was clamped at both ends in the long side direction of the test piece with upper and lower grippers with a gap of 20 mm between the grippers.
• the tensile modulus of the test piece was obtained under conditions of a 25°C environment and a tensile speed of 2 mm/min using a small tabletop tester (manufactured by Shimadzu Corporation, product name "EZ-TEST"). Five similar samples were prepared, and the tensile modulus was obtained under the same conditions as above, and the average value was taken as the 25°C tensile modulus. Other detailed conditions and the method of calculating the tensile modulus were performed in accordance with the international standard ISO5271 (1993). The obtained 25°C tensile modulus was evaluated according to the following criteria. In the following criteria, A indicates the best. ⁇ Criteria for tensile modulus at 25°C> A: Less than 1.5 GPa B: 1.5 GPa or more
• the resin plate with copper foil on both sides obtained in each example was immersed in a 10 mass% solution of ammonium persulfate (manufactured by Mitsubishi Gas Chemical Co., Ltd.) as a copper etching solution to remove the copper foil.
• the obtained resin plate was cut into 2 mm x 50 mm pieces and dried at 105°C for 1 hour to prepare test pieces.
• the relative dielectric constant (Dk) and dielectric loss tangent (Df) of the test pieces were measured at an atmospheric temperature of 25°C and in the 10 GHz band according to the cavity resonator perturbation method, and evaluated according to the following criteria. In the following criteria, A indicates the best.
• Modified conjugated diene polymer modified conjugated diene polymer obtained in Production Example 1, number average molecular weight 1,700
• the resin layers of the resin-coated copper foils of Examples 1 to 12 of this embodiment had low melt viscosity and high fluidity.
• the resin layers of the resin-coated copper foils of Examples 1 to 12 had a mass loss rate of 1.0 mass% or less at 170°C, which indicates that the generation of volatile components during heat curing was suppressed.
• the resin layers of the resin-coated copper foils of Comparative Examples 1 and 2 had high melt viscosity and poor fluidity.
• the resin-coated copper foil of the present embodiment has excellent flowability of the resin layer while suppressing the generation of volatile components during heat curing, and is therefore useful for printed wiring boards, semiconductor packages, etc.

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• 2023
  • 2023-12-25 CN CN202380036969.1A patent/CN119095724A/zh active Pending
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