CN119095724A - 带树脂的金属箔、以及印刷线路板的制造方法和半导体封装体的制造方法 - Google Patents

带树脂的金属箔、以及印刷线路板的制造方法和半导体封装体的制造方法 Download PDF

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Publication number
CN119095724A
CN119095724A CN202380036969.1A CN202380036969A CN119095724A CN 119095724 A CN119095724 A CN 119095724A CN 202380036969 A CN202380036969 A CN 202380036969A CN 119095724 A CN119095724 A CN 119095724A
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CN
China
Prior art keywords
resin
group
metal foil
maleimide
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380036969.1A
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English (en)
Chinese (zh)
Inventor
葛冈广喜
池谷卓二
小竹智彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Resonac Corp filed Critical Resonac Corp
Publication of CN119095724A publication Critical patent/CN119095724A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
CN202380036969.1A 2022-12-28 2023-12-25 带树脂的金属箔、以及印刷线路板的制造方法和半导体封装体的制造方法 Pending CN119095724A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-212318 2022-12-28
JP2022212318 2022-12-28
PCT/JP2023/046437 WO2024143280A1 (ja) 2022-12-28 2023-12-25 樹脂付き金属箔、並びにプリント配線板の製造方法及び半導体パッケージの製造方法

Publications (1)

Publication Number Publication Date
CN119095724A true CN119095724A (zh) 2024-12-06

Family

ID=91717994

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380036969.1A Pending CN119095724A (zh) 2022-12-28 2023-12-25 带树脂的金属箔、以及印刷线路板的制造方法和半导体封装体的制造方法

Country Status (5)

Country Link
JP (1) JPWO2024143280A1 (https=)
KR (1) KR20250130603A (https=)
CN (1) CN119095724A (https=)
TW (1) TW202436098A (https=)
WO (1) WO2024143280A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025163931A1 (ja) * 2024-01-31 2025-08-07 株式会社レゾナック 樹脂フィルム、プリント配線板及び半導体パッケージ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6301173B2 (ja) * 2014-03-28 2018-03-28 新日鉄住金化学株式会社 硬化性樹脂組成物、その硬化物、複合材料
JP6570259B2 (ja) * 2015-02-11 2019-09-04 ナミックス株式会社 樹脂組成物、絶縁フィルム、および半導体装置
JP2018012747A (ja) 2016-07-19 2018-01-25 日立化成株式会社 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法
KR102601823B1 (ko) * 2017-12-28 2023-11-14 파나소닉 아이피 매니지먼트 가부시키가이샤 수지 조성물, 프리프레그, 수지 부착 필름, 수지 부착 금속박, 금속 클래드 적층판, 및 배선판
JP7020332B2 (ja) * 2018-07-26 2022-02-16 味の素株式会社 樹脂組成物
JP7555694B2 (ja) * 2019-02-08 2024-09-25 味の素株式会社 樹脂組成物
TWI853957B (zh) * 2019-07-12 2024-09-01 日商味之素股份有限公司 樹脂組成物
JP7354664B2 (ja) * 2019-08-14 2023-10-03 株式会社レゾナック 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法
JP2022076777A (ja) * 2020-11-10 2022-05-20 リンテック株式会社 硬化性樹脂組成物、金属張積層板およびその製造方法
JP7774963B2 (ja) * 2021-01-14 2025-11-25 味の素株式会社 樹脂組成物
JP7666047B2 (ja) * 2021-03-22 2025-04-22 味の素株式会社 樹脂シート

Also Published As

Publication number Publication date
WO2024143280A1 (ja) 2024-07-04
KR20250130603A (ko) 2025-09-02
JPWO2024143280A1 (https=) 2024-07-04
TW202436098A (zh) 2024-09-16

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