JPWO2024143280A1 - - Google Patents
Info
- Publication number
- JPWO2024143280A1 JPWO2024143280A1 JP2024567805A JP2024567805A JPWO2024143280A1 JP WO2024143280 A1 JPWO2024143280 A1 JP WO2024143280A1 JP 2024567805 A JP2024567805 A JP 2024567805A JP 2024567805 A JP2024567805 A JP 2024567805A JP WO2024143280 A1 JPWO2024143280 A1 JP WO2024143280A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
- B32B2379/08—Polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022212318 | 2022-12-28 | ||
| PCT/JP2023/046437 WO2024143280A1 (ja) | 2022-12-28 | 2023-12-25 | 樹脂付き金属箔、並びにプリント配線板の製造方法及び半導体パッケージの製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024143280A1 true JPWO2024143280A1 (https=) | 2024-07-04 |
Family
ID=91717994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024567805A Pending JPWO2024143280A1 (https=) | 2022-12-28 | 2023-12-25 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024143280A1 (https=) |
| KR (1) | KR20250130603A (https=) |
| CN (1) | CN119095724A (https=) |
| TW (1) | TW202436098A (https=) |
| WO (1) | WO2024143280A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025163931A1 (ja) * | 2024-01-31 | 2025-08-07 | 株式会社レゾナック | 樹脂フィルム、プリント配線板及び半導体パッケージ |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6301173B2 (ja) * | 2014-03-28 | 2018-03-28 | 新日鉄住金化学株式会社 | 硬化性樹脂組成物、その硬化物、複合材料 |
| JP6570259B2 (ja) * | 2015-02-11 | 2019-09-04 | ナミックス株式会社 | 樹脂組成物、絶縁フィルム、および半導体装置 |
| JP2018012747A (ja) | 2016-07-19 | 2018-01-25 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法 |
| KR102601823B1 (ko) * | 2017-12-28 | 2023-11-14 | 파나소닉 아이피 매니지먼트 가부시키가이샤 | 수지 조성물, 프리프레그, 수지 부착 필름, 수지 부착 금속박, 금속 클래드 적층판, 및 배선판 |
| JP7020332B2 (ja) * | 2018-07-26 | 2022-02-16 | 味の素株式会社 | 樹脂組成物 |
| JP7555694B2 (ja) * | 2019-02-08 | 2024-09-25 | 味の素株式会社 | 樹脂組成物 |
| TWI853957B (zh) * | 2019-07-12 | 2024-09-01 | 日商味之素股份有限公司 | 樹脂組成物 |
| JP7354664B2 (ja) * | 2019-08-14 | 2023-10-03 | 株式会社レゾナック | 感光性樹脂組成物、感光性樹脂フィルム、多層プリント配線板及び半導体パッケージ、並びに多層プリント配線板の製造方法 |
| JP2022076777A (ja) * | 2020-11-10 | 2022-05-20 | リンテック株式会社 | 硬化性樹脂組成物、金属張積層板およびその製造方法 |
| JP7774963B2 (ja) * | 2021-01-14 | 2025-11-25 | 味の素株式会社 | 樹脂組成物 |
| JP7666047B2 (ja) * | 2021-03-22 | 2025-04-22 | 味の素株式会社 | 樹脂シート |
-
2023
- 2023-12-25 CN CN202380036969.1A patent/CN119095724A/zh active Pending
- 2023-12-25 WO PCT/JP2023/046437 patent/WO2024143280A1/ja not_active Ceased
- 2023-12-25 KR KR1020257021241A patent/KR20250130603A/ko active Pending
- 2023-12-25 JP JP2024567805A patent/JPWO2024143280A1/ja active Pending
- 2023-12-27 TW TW112150992A patent/TW202436098A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN119095724A (zh) | 2024-12-06 |
| WO2024143280A1 (ja) | 2024-07-04 |
| KR20250130603A (ko) | 2025-09-02 |
| TW202436098A (zh) | 2024-09-16 |