WO2024122462A1 - 電解コンデンサ - Google Patents

電解コンデンサ Download PDF

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Publication number
WO2024122462A1
WO2024122462A1 PCT/JP2023/043113 JP2023043113W WO2024122462A1 WO 2024122462 A1 WO2024122462 A1 WO 2024122462A1 JP 2023043113 W JP2023043113 W JP 2023043113W WO 2024122462 A1 WO2024122462 A1 WO 2024122462A1
Authority
WO
WIPO (PCT)
Prior art keywords
sealing material
main body
body case
external pressure
pressure deformation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/043113
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
善昭 狹場
貴久 阿立
乾治 濱野
雅和 細木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Electronic Industries Corp
Original Assignee
Sun Electronic Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Electronic Industries Corp filed Critical Sun Electronic Industries Corp
Priority to CN202380084132.4A priority Critical patent/CN120322838A/zh
Priority to JP2024562737A priority patent/JPWO2024122462A1/ja
Priority to EP23900577.0A priority patent/EP4632775A1/en
Publication of WO2024122462A1 publication Critical patent/WO2024122462A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/10—Sealing, e.g. of lead-in wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
    • H01G9/08—Housing; Encapsulation
    • H01G9/12—Vents or other means allowing expansion

Definitions

  • the present invention relates to electrolytic capacitors.
  • the electrolytic capacitor comprises a cylindrical main body case that is closed at one end and has an opening at the other end, a capacitor element housed within the main body case, and a plate-shaped sealing material that seals the opening of the main body case.
  • the capacitor element is made by winding an anode foil and a cathode foil that face each other with a separator interposed therebetween, and one end of each of the lead terminals is connected to the anode foil and the cathode foil, and the other end of each of the lead terminals penetrates the sealing material and is pulled out to the outside of the opening of the main body case.
  • the outer surface of the main body case of the sealing material is covered with an insulating inorganic layer (Patent Document 1), covered with a resin layer (Patent Document 2), or a ceramic reinforcing member is provided on the outside of the main body case of the sealing material (Patent Document 3).
  • the inorganic layer, resin layer, and ceramic reinforcing member have the same outer diameter as the sealing material, and are integrated into the sealing material by adhesion or the like.
  • the sealing material will have difficulty in following the expansion or contraction of the main case due to the environment in which the electrolytic capacitor is placed, and as a result, the sealing effect of the sealing material for the main case will be reduced.
  • the present invention aims to prevent the sealing effect of the sealing material from decreasing when the main case expands or contracts due to the environment in which the electrolytic capacitor is placed, and to prevent the sealing material from being significantly pressed and deformed into the main case by the molding resin when the outer periphery of the electrolytic capacitor is molded with the molding resin, which can have a detrimental effect on the capacitor element.
  • the present invention provides an electrolytic capacitor comprising a cylindrical main case having one end closed and an opening at the other end, a capacitor element housed within the main case, and a plate-shaped sealing material sealing the opening of the main case, the capacitor element being formed by winding an anode foil and a cathode foil facing each other via a separator, the anode foil and the cathode foil each being connected to one end of a lead terminal, the other end of which penetrates the sealing material and is drawn out to the outside of the opening of the main case, the sealing material having a recess on the surface of the opening side of the main case that is recessed towards the capacitor element and has an outer diameter smaller than the outer diameter of the sealing material, and a plate-shaped sealing material sealing the opening of the main case.
  • a plate-shaped external pressure deformation suppression plate is provided in the recess, and at least a portion of the outer periphery of the external pressure deformation suppression plate provided in the recess is covered by the inner periphery of the outer periphery holding part of the sealing material.
  • a portion of the main body case that corresponds to the portion of the sealing material that is closer to the capacitor element than the external pressure deformation suppression plate in the plate thickness direction is provided with a drawn portion in the radial direction of the sealing material.
  • a bent portion is provided at the opening of the main body case by bending the tip side of the opening side of the main body case toward the sealing material, and the tip of this bent portion is in contact with or close to the surface of the opening side of the main body case of the external pressure deformation suppression plate, which is provided on the inner side of the outer periphery holding part of the sealing material.
  • the sealing material of the electrolytic capacitor of the present invention has an outer peripheral surface of the outer peripheral holding portion of the sealing material that is an inclined surface or a curved surface that decreases in diameter from the capacitor element side toward the opening side of the main body case.
  • the gap formed on the inner surface of the main body case in the portion facing the inclined or curved surface of the outer peripheral holding portion of the sealing material is smaller on the capacitor element side of the outer peripheral holding portion and larger on the opening side of the main body case of the outer peripheral holding portion.
  • the external pressure deformation suppression plate in the electrolytic capacitor of the present invention is made of a synthetic resin plate containing a reinforcing material.
  • the electrolytic capacitor of the present invention has a recess on the surface of the sealing material on the opening side of the main case, the recess having an outer diameter smaller than the outer diameter of the sealing material, recessed toward the capacitor element, and an outer peripheral holding part provided on the outer periphery of the recess, a plate-shaped external pressure deformation suppression plate is provided within the recess, and at least a portion of the outer periphery of the external pressure deformation suppression plate provided within the recess is covered by the inner periphery of the sealing material's outer peripheral holding part.
  • a portion of the main body case that corresponds to the portion of the sealing material closer to the capacitor element than the external pressure deformation suppression plate in the thickness direction of the sealing material is provided with a drawn portion in the radial direction of the sealing material, and a bent portion is provided at the opening of the main body case by bending the tip side of the opening side of the main body case toward the sealing material, and the tip of this bent portion is configured to abut or be close to the surface of the external pressure deformation suppression plate on the opening side of the main body case, which is provided on the inner side of the outer periphery holding portion of the sealing material.
  • the present invention prevents the sealing effect of the main body case from decreasing when the main body case expands or contracts due to the environment in which the electrolytic capacitor is placed, and also prevents the sealing material from being significantly pressed and deformed into the main body case by the molding resin when the outer periphery of the electrolytic capacitor is molded with the molding resin, which can adversely affect the capacitor element.
  • the sealing material of the present invention has a recess with an outer diameter smaller than the outer diameter of the sealing material, and an external pressure deformation suppression plate is provided within this recess. Therefore, the outer periphery of the sealing material is less likely to be restricted by the external pressure deformation suppression plate, and when the main body case expands or contracts due to the environment in which the electrolytic capacitor is placed, the outer periphery of the sealing material responds by expanding and contracting, and as a result, the sealing effect of the main body case is prevented from decreasing.
  • an external pressure deformation suppression plate is provided on the opening side of the main case of the sealing material, and the outer periphery of this external pressure deformation suppression plate is held by the outer periphery holding part of the sealing material, so the sealing material does not deform significantly towards the capacitor, and as a result, adverse effects on the capacitor element can be prevented.
  • FIG. 1 is a cross-sectional view showing a state in which an electrolytic capacitor according to an embodiment of the present invention is mounted on a substrate.
  • Enlarged cross-sectional view of the electrolytic capacitor Enlarged cross-sectional view of the main part of the electrolytic capacitor
  • FIG. 1 shows a state in which an electrolytic capacitor 1 according to this embodiment is mounted on a circuit board 2.
  • the electrolytic capacitor 1 comprises a cylindrical main case 4 that is closed at one end and has an opening 3 at the other end, a capacitor element 5 housed within the main case 4, and a plate-shaped sealing material 6 that seals the opening 3 of the main case 4.
  • the main body case 4 is made of aluminum, for example, and the sealing material 6 is made of butyl rubber, for example.
  • the capacitor element 5 is constructed by winding an anode foil (not shown) and a cathode foil (not shown) facing each other with a separator (not shown) between them, with one end of a lead terminal 7 connected to each of the anode foil and the cathode foil, and the other end of the lead terminal 7 penetrating the sealing material 6 and extending outside the opening 3 of the main body case 4.
  • the capacitor element 5 also holds an electrolyte.
  • the electrolytic capacitor 1 shown in FIG. 1 is provided with a well-known seat plate 1a to improve mountability on the circuit board 2, and the other end of the lead terminal 7 passes through the seat plate 1a and is bent to the left and right, and this bent portion is the part to be soldered to the circuit board 2.
  • a recess 8 recessed toward the capacitor element 5 with an outer diameter smaller than that of the sealing material 6 is provided on the surface of the sealing material 6 facing the opening 3 of the main body case 4, an outer peripheral holding portion 9 is provided on the outer periphery of the recess 8, a plate-shaped external pressure deformation suppression plate 10 is provided within the recess 8, and at least a part of the outer periphery of the external pressure deformation suppression plate 10 provided within the recess 8 is covered by the inner periphery of the outer peripheral holding portion 9 of the sealing material 6.
  • both the sealing material 6 and the external pressure deformation suppression plate 10 have a through hole through which the other end of the lead terminal 7 penetrates. In other words, the other end of the lead terminal 7 penetrates the through hole of the sealing material 6 and the through hole of the external pressure deformation suppression plate 10, and is pulled out to the outside of the opening 3 of the main body case 4.
  • the external pressure deformation suppression plate 10 is made of a synthetic resin plate containing reinforcing material, such as Bakelite (registered trademark).
  • FIGs 2 and 3 show the characteristic parts of the electrolytic capacitor 1 shown in Figure 1, and do not show the seat plate 1a, but instead focus on the sealing material 6, the external pressure deformation suppression plate 10, and the main body case 4.
  • a portion of the main body case 4 that corresponds to the portion of the sealing material 6 that is closer to the capacitor element 5 than the external pressure deformation suppression plate 10 in the thickness direction of the sealing material 6 has a drawn portion 4a in the radial direction of the sealing material 6.
  • Figure 5 shows an example of the dimensional relationship between the sealing material 6, the external pressure deformation suppression plate 10, and the main case 4. Note that Figure 5 focuses on the dimensional relationship between the sealing material 6, the external pressure deformation suppression plate 10, and the main case 4, and omits the through holes in the sealing material 6 and the external pressure deformation suppression plate 10 through which the other end of the lead terminal 7 passes.
  • the thickness (A) of the disk-shaped sealing material 6 shown in FIG. 5 is 3.3 mm, and the thickness (B) of the disk-shaped external pressure deformation suppression plate 10 is 0.8 mm. Therefore, the thickness (C) of the sealing material 6 on the capacitor element 5 side excluding the thickness of the external pressure deformation suppression plate 10 is 2.5 mm.
  • the dimension (D) of the central portion of the plate thickness (2.5 mm) on the capacitor element 5 side, excluding the plate thickness of the external pressure deformation suppression plate 10, is 1.25 mm, and this portion is the center portion of the drawn portion 4a.
  • the drawn portion 4a is provided in the approximate center of the thickness of the sealing material 6 excluding the thickness of the external pressure deformation suppression plate 10.
  • the opening 3 of the main case 4 is provided with a bent portion 4b, which is bent and curved toward the sealing material 6 at the tip of the opening 3 side of the main case 4, and the tip of this bent portion 4b is in contact with or in close proximity to the surface of the opening 3 side of the main case 4 of the external pressure deformation suppression plate 10, which is provided on the inner side of the outer periphery holding portion 9 of the sealing material 6.
  • the tip of the bent portion 4b of the main case 4 is in contact with or close to the surface of the external pressure deformation suppression plate 10 on the opening 3 side of the main case 4 (the tip of the bent portion 4b is not embedded in the sealing material 6).
  • the outer peripheral surface of the outer peripheral holding portion 9 of the sealing material 6 is an inclined surface 9a whose diameter decreases from the capacitor element 5 side toward the opening 3 side of the main body case 4.
  • This inclined surface 9a may be a curved surface whose diameter decreases from the capacitor element 5 side toward the opening 3 side of the main body case 4.
  • the gap 4c formed on the inner surface of the main case 4 in the portion facing the inclined surface 9a (or curved surface) of the outer peripheral holding portion 9 of the sealing material 6 is small on the capacitor element 5 side of the outer peripheral holding portion 9, and large on the opening 3 side of the main case 4 of the outer peripheral holding portion 9.
  • the electrolytic capacitor 1 of this embodiment configured as described above can be molded with the main case 4 and the circuit board 2 in molded resin 11 as shown in Figures 4 and 5, for example, to improve waterproofing, moisture resistance, chemical resistance, and dust resistance.
  • This molding can be done by molding the electrolytic capacitor 1 side (front side) of the electrolytic capacitor 1 and the circuit board 2 in molded resin 11, or by molding the back side of the circuit board 2 together.
  • molding involves placing a circuit board 2 on which an electrolytic capacitor 1 is mounted in a metal mold (not shown) and injecting molding resin 11 under pressure through a resin injection port (not shown) in the metal mold.
  • an external pressure deformation suppression plate 10 is provided on the side of the sealing material 6 facing the opening 3 of the main case 4, and the outer periphery of this external pressure deformation suppression plate 10 is held by the outer periphery holding portion 9 of the sealing material 6, so that the sealing material 6 does not deform significantly toward the capacitor element 5, and as a result, adverse effects on the capacitor element 5 can be prevented.
  • the molding resin 11 is injected into the mold with a force of, for example, 180 N.
  • an external pressure deformation suppression plate 10 is provided on the side of the sealing material 6 facing the opening 3 of the main case 4, and a radially drawn portion 4a is provided in the part of the main case 4 that corresponds to the part of the sealing material 6 closer to the capacitor element 5 than the external pressure deformation suppression plate 10 in the thickness direction of the sealing material 6.
  • the side of the sealing material 6 facing the capacitor element 5 is less likely to move towards the capacitor element 5.
  • a recess 8 is provided on the surface of the sealing material 6 on the opening 3 side of the main case 4, with an outer diameter smaller than the outer diameter of the sealing material 6, recessed toward the capacitor element 5, and an outer periphery retaining portion 9 is provided on the outer periphery of this recess 8.
  • a plate-shaped external pressure deformation suppression plate 10 is provided within the recess 8, and at least a portion of the outer periphery of the external pressure deformation suppression plate 10 provided within the recess 8 is covered by the inner periphery of the outer periphery retaining portion 9 of the sealing material 6.
  • a portion of the main case 4 that corresponds to the portion closer to the capacitor element 5 than the external pressure deformation suppression plate 10 is provided with a drawn portion 4a in the radial direction of the sealing material 6, and the opening 3 of the main case 4 is provided with a bent portion 4b that is curved and bent toward the sealing material 6 at the tip side of the opening 3 side of the main case 4, and the tip of this bent portion 4b is configured to abut or be close to the surface of the external pressure deformation suppression plate 10 on the opening 3 side of the main case 4, which is provided on the inner side than the outer peripheral holding portion 9 of the sealing material 6.
  • the outer periphery of the external pressure deformation suppression plate 10 is firmly held by the outer periphery holding portion 9 of the sealing material 6, and the external pressure deformation suppression plate 10 absorbs the deformation of the sealing material 6 that tends to occur toward the inside of the main body case 4 due to the pressing force of the molded resin 11. It is believed that this makes it difficult for the side of the capacitor element 5 of the sealing material 6 to move toward the capacitor element 5.
  • the outer peripheral surface of the outer peripheral holding portion 9 of the sealing material 6 in this embodiment is an inclined surface 9a (or curved surface) that decreases in diameter from the capacitor element 5 side toward the opening 3 side of the main body case 4, so that the area that receives the pressing force from the molded resin 11 in the direction of the external pressure deformation suppression plate 10 in the outer peripheral holding portion 9 of the sealing material 6 increases, and as a result, the outer peripheral portion of the external pressure deformation suppression plate 10 is firmly held by the outer peripheral holding portion 9 of the sealing material 6.
  • the gap formed on the inner surface of the main case 4 in the portion facing the inclined surface 9a (or curved surface) of the outer peripheral holding portion 9 of the sealing material 6 is a small gap 4c on the side of the outer peripheral holding portion 9 facing the capacitor element 5, and a large gap 4c on the side of the outer peripheral holding portion 9 facing the opening 3 of the main case 4.
  • the pressing force of the molded resin 11 tends to move the outer peripheral holding portion 9 of the sealing material 6 toward the external pressure deformation suppression plate 10, and as a result, the outer peripheral portion of the external pressure deformation suppression plate 10 is firmly held by the outer peripheral holding portion 9 of the sealing material 6.
  • the external pressure deformation suppression plate 10 receives the deformation of the sealing material 6 toward the inside of the main body case 4 due to the pressing force of the molded resin 11, and the capacitor element 5 side of the sealing material 6 is less likely to move toward the capacitor element 5.
  • the external pressure deformation suppression plate 10 is made of a synthetic resin plate mixed with reinforcing materials such as glass fiber, cellulose fiber, and ceramic. It is believed that the external pressure deformation suppression plate 10 also prevents the sealing material 6 from deforming toward the inside of the main body case 4 due to the pressing force of the molded resin 11, making it difficult for the side of the capacitor element 5 of the sealing material 6 to move toward the capacitor element 5.
  • the sealing material 6 of this embodiment is provided with a recess 8 having an outer diameter smaller than the outer diameter of the sealing material 6, and an external pressure deformation suppression plate 10 is provided within this recess 8, so that the outer periphery of the sealing material 6 is less likely to be restricted by the external pressure deformation suppression plate 10.
  • an external pressure deformation suppression plate 10 having the same outer diameter as the sealing material 6 is attached to the sealing material 6, the expansion and contraction of the sealing material 6 is restricted by the external pressure deformation suppression plate 10, and effective expansion and contraction is not possible, and the sealing effect of the sealing material 6 for the main body case 4 is reduced.
  • a recess 8 having an outer diameter smaller than the outer diameter of the sealing material 6 is provided, and an external pressure deformation suppression plate 10 is provided within this recess 8, so that the outer periphery of the sealing material 6 is less likely to be restricted by the external pressure deformation suppression plate 10, and as a result, when the main body case 4 expands or contracts due to the environment in which the electrolytic capacitor 1 is placed, the outer periphery of the sealing material 6 responds by expanding and contracting, and as a result, the sealing effect of the main body case 4 can be prevented from decreasing.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Double-Layer Capacitors Or The Like (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Sealing Battery Cases Or Jackets (AREA)
PCT/JP2023/043113 2022-12-06 2023-12-01 電解コンデンサ Ceased WO2024122462A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202380084132.4A CN120322838A (zh) 2022-12-06 2023-12-01 电解电容器
JP2024562737A JPWO2024122462A1 (https=) 2022-12-06 2023-12-01
EP23900577.0A EP4632775A1 (en) 2022-12-06 2023-12-01 Electrolytic capacitor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-194856 2022-12-06
JP2022194856 2022-12-06

Publications (1)

Publication Number Publication Date
WO2024122462A1 true WO2024122462A1 (ja) 2024-06-13

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ID=91379204

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PCT/JP2023/043113 Ceased WO2024122462A1 (ja) 2022-12-06 2023-12-01 電解コンデンサ

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EP (1) EP4632775A1 (https=)
JP (1) JPWO2024122462A1 (https=)
CN (1) CN120322838A (https=)
TW (1) TW202431297A (https=)
WO (1) WO2024122462A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026071084A1 (ja) * 2024-09-27 2026-04-02 サン電子工業株式会社 コンデンサと、その製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5211145U (https=) * 1975-07-11 1977-01-26
JPH06338438A (ja) * 1993-05-27 1994-12-06 Rubycon Corp アルミニウム電解コンデンサ
JP2015173241A (ja) 2014-02-20 2015-10-01 睦月電機株式会社 密閉型電気化学デバイス用封口体およびその封口体を用いた密閉型電気化学デバイス
JP2019140257A (ja) 2018-02-09 2019-08-22 パナソニックＩｐマネジメント株式会社 電解コンデンサおよびその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08293435A (ja) 1995-04-24 1996-11-05 Matsushita Electric Ind Co Ltd チップ形アルミ電解コンデンサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5211145U (https=) * 1975-07-11 1977-01-26
JPH06338438A (ja) * 1993-05-27 1994-12-06 Rubycon Corp アルミニウム電解コンデンサ
JP2015173241A (ja) 2014-02-20 2015-10-01 睦月電機株式会社 密閉型電気化学デバイス用封口体およびその封口体を用いた密閉型電気化学デバイス
JP2019140257A (ja) 2018-02-09 2019-08-22 パナソニックＩｐマネジメント株式会社 電解コンデンサおよびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026071084A1 (ja) * 2024-09-27 2026-04-02 サン電子工業株式会社 コンデンサと、その製造方法

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JPWO2024122462A1 (https=) 2024-06-13
CN120322838A (zh) 2025-07-15
EP4632775A1 (en) 2025-10-15
TW202431297A (zh) 2024-08-01

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