WO2024116986A1 - 弾性波装置および電子機器 - Google Patents

弾性波装置および電子機器 Download PDF

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Publication number
WO2024116986A1
WO2024116986A1 PCT/JP2023/041939 JP2023041939W WO2024116986A1 WO 2024116986 A1 WO2024116986 A1 WO 2024116986A1 JP 2023041939 W JP2023041939 W JP 2023041939W WO 2024116986 A1 WO2024116986 A1 WO 2024116986A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring portion
wave device
ground terminal
wiring
elastic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/041939
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English (en)
French (fr)
Japanese (ja)
Inventor
宏行 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2024561424A priority Critical patent/JP7847668B2/ja
Publication of WO2024116986A1 publication Critical patent/WO2024116986A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves

Definitions

  • This disclosure relates to an acoustic wave device and an electronic device.
  • Patent Document 1 a surface acoustic wave device equipped with a ladder-type filter is known.
  • An elastic wave device includes a ladder-type filter including a series resonator, a first wiring section and a second wiring section connected to the series resonator, a ground terminal, a non-ground terminal that is electrically independent from the ground terminal, and a third wiring section connected to the first wiring section and the non-ground terminal.
  • FIG. 1 is a plan view illustrating a schematic configuration of an elastic wave device according to a first embodiment of the present disclosure.
  • FIG. 1 is a circuit diagram of a ladder-type filter.
  • FIG. 11 is a plan view illustrating a schematic configuration of an elastic wave device according to a second embodiment of the present disclosure.
  • FIG. 11 is a plan view illustrating a schematic configuration of an elastic wave device according to a third embodiment of the present disclosure.
  • 1 is a plan view showing a schematic configuration of a series resonator that is a SAW filter.
  • FIG. 13 is a plan view illustrating a schematic configuration of an elastic wave device according to a first modified example of embodiment 3 of the present disclosure.
  • FIG. 13 is a plan view illustrating a schematic configuration of an elastic wave device according to a second modified example of the third embodiment of the present disclosure.
  • FIG. 13 is a plan view illustrating a schematic configuration of an elastic wave device according to a fourth embodiment of the present disclosure.
  • 13 is a cross-sectional view showing a schematic configuration of an electronic device according to a first example of a fifth embodiment of the present disclosure.
  • FIG. FIG. 13 is a cross-sectional view showing a schematic configuration of an electronic device according to a second example of the fifth embodiment of the present disclosure.
  • FIG. 1 is a plan view showing a schematic configuration of an elastic wave device 101 according to a preferred embodiment of the present invention.
  • the elastic wave device 101 includes a series resonator 1, a first wiring portion 2, a second wiring portion 3, a ground terminal 4, a non-ground terminal 5, and a third wiring portion 6.
  • FIG. 2 is a circuit diagram of a ladder-type filter 51.
  • the elastic wave device 101 includes a ladder-type filter 51.
  • the ladder-type filter 51 includes a series resonator 7 and a parallel resonator 8.
  • the series resonator 1 corresponds to the series resonator 7.
  • the first wiring section 2 and the second wiring section 3 are connected to the series resonator 1.
  • the first wiring section 2 and the second wiring section 3 are signal wiring sections that transmit signals supplied to the series resonator 1 and signals supplied by the series resonator 1.
  • the first wiring section 2 may transmit signals supplied to the series resonator 1, and the second wiring section 3 may transmit signals supplied by the series resonator 1.
  • the second wiring section 3 may transmit signals supplied to the series resonator 1, and the first wiring section 2 may transmit signals supplied by the series resonator 1.
  • Ground terminal 4 is the ground terminal of elastic wave device 101.
  • Non-ground terminal 5 is a terminal that is electrically independent of ground terminal 4. In other words, ground terminal 4 and non-ground terminal 5 are not electrically connected to each other. The potential of non-ground terminal 5 may be different from the potential of ground terminal 4, or may ultimately be the same as the potential of ground terminal 4.
  • the non-ground terminal 5 may be made of a material with excellent heat dissipation properties.
  • a bump with excellent heat dissipation properties may be formed on the non-ground terminal 5.
  • the third wiring portion 6 is connected to the first wiring portion 2 and the non-ground terminal 5.
  • the third wiring portion 6 may be provided for the purpose of dissipating heat from the series resonator 1.
  • the third wiring portion 6 may contain a material with excellent heat dissipation properties. Examples of materials for the third wiring portion 6 include aluminum, copper, gold, and tungsten.
  • the third wiring portion 6 does not have to transmit signals, and it is not necessary for the third wiring portion 6 to be conductive.
  • the elastic wave device 101 there is no need to provide a member that contributes to heat dissipation of the series resonator 1 between the series resonator 1 and another series resonator adjacent to the series resonator 1, so the series resonator 1 and the other series resonator can be placed close to each other. Therefore, according to the elastic wave device 101, it is possible to achieve both effective heat dissipation of the series resonator 1 and space saving of the elastic wave device.
  • the series resonator 1 corresponds to the series resonator 7 of the ladder-type filter 51.
  • the non-ground terminal 5 may be disposed in a position that does not interfere with the planar shape of the first wiring portion 2.
  • a position that does not interfere with the planar shape of the first wiring portion 2 is a position that does not force changes to the routing of the first wiring portion 2 when viewed in a plane. Examples of such a position for the non-ground terminal 5 include a position that does not narrow or detour the first wiring portion 2, a position that does not cause the roughly band-shaped first wiring portion 2 to be missing, and a position where the non-ground terminal 5 and the first wiring portion 2 do not appear to overlap each other.
  • FIG. 1 is a plan view showing a schematic configuration of an elastic wave device 102 according to a preferred embodiment of the present invention.
  • the elastic wave device 102 includes a series resonator 1, a first wiring portion 2, a second wiring portion 3, a ground terminal 4, a non-ground terminal 5, a third wiring portion 6, and a fourth wiring portion 9.
  • the fourth wiring portion 9 is connected to the second wiring portion 3.
  • the fourth wiring portion 9 is not connected to the non-ground terminal 5 and is disposed in close proximity to the non-ground terminal 5.
  • the third wiring portion 6 and the fourth wiring portion 9 are disposed so as not to short-circuit the first wiring portion 2 and the second wiring portion 3 across the non-ground terminal 5.
  • the separation distance 10 between the fourth wiring portion 9 and the non-ground terminal 5 may be any distance that allows the heat of the fourth wiring portion 9 to be effectively transferred to the non-ground terminal 5, and may be, for example, 2 ⁇ m or more and 30 ⁇ m or less.
  • the fourth wiring portion 9, like the third wiring portion 6, may be provided for the purpose of dissipating heat from the series resonator 1.
  • the material options for the fourth wiring portion 9 may be the same as the material options for the third wiring portion 6.
  • the fourth wiring portion 9, like the third wiring portion 6, does not have to transmit signals and is not required to be conductive.
  • the elastic wave device 102 by adding a fourth wiring section 9 to the elastic wave device 101, more effective heat dissipation of the series resonator 1 can be achieved.
  • FIG. 4 is a plan view showing a schematic configuration of an elastic wave device 103 according to this preferred embodiment.
  • the elastic wave device 103 includes a series resonator 1, a first wiring section 2, a second wiring section 3, a ground terminal 4, a non-ground terminal 5, a third wiring section 6, a fourth wiring section 9, and a capacitive comb-tooth electrode 11.
  • the capacitive comb-tooth electrode 11 has a pair of first comb-tooth electrodes that are arranged opposite to each other. In other words, the pair of first comb-tooth electrodes are first comb-tooth electrodes 12 and 13.
  • the capacitive comb-tooth electrode 11 may be provided for the purpose of dissipating heat from the series resonator 1.
  • the series resonator 1 may be a SAW (Surface Acoustic Wave) filter.
  • FIG. 5 is a plan view showing a schematic configuration of the series resonator 1, which is a SAW filter.
  • the series resonator 1 has a pair of second comb-tooth electrodes, which are arranged opposite each other. In other words, the pair of second comb-tooth electrodes are second comb-tooth electrodes 14 and 15.
  • the third wiring portion 6 is electrically connected to the first wiring portion 2 and the first comb-tooth electrode 12.
  • the first comb-tooth electrode 12 corresponds to one of the pair of first comb-tooth electrodes.
  • the fourth wiring portion 9 is electrically connected to the second wiring portion 3 and the first comb-tooth electrode 13.
  • the first comb-tooth electrode 13 corresponds to the other of the pair of first comb-tooth electrodes.
  • the first comb-tooth electrode 12 is electrically connected to the first wiring portion 2 and the third wiring portion 6, and the first comb-tooth electrode 13 is electrically connected to the second wiring portion 3.
  • FIG. 6 is a plan view showing a schematic configuration of an elastic wave device 104 according to a first modified example of this embodiment.
  • FIG. 7 is a plan view showing a schematic configuration of an elastic wave device 105 according to a second modified example of this embodiment.
  • Acoustic wave device 104 differs from elastic wave device 103 in that first comb-tooth electrode 13 is in contact with second wiring portion 3, and therefore fourth wiring portion 9 is not present.
  • Elastic wave device 105 differs from elastic wave device 103 in that the arrangement of non-ground terminal 5 is shifted in the width direction of third wiring portion 6 relative to elastic wave device 103.
  • the elastic wave device 104 it is understood that it is not necessary for the first comb electrode 13 to be electrically connected to the fourth wiring portion 9.
  • elastic wave device 103 According to elastic wave device 103, elastic wave device 104, and elastic wave device 105, by adding capacitive comb electrode 11 to elastic wave device 101 and elastic wave device 102, respectively, more effective heat dissipation of series resonator 1 can be achieved.
  • the capacitive comb electrode 11 and the SAW filter can be manufactured within the same process. Therefore, when the series resonator 1 is a SAW filter, the capacitive comb electrode 11 can be manufactured easily.
  • the width 17 of the electrode fingers 16 provided on the first comb-tooth electrode 12 may be greater than the width 19 of the electrode fingers 18 provided on the second comb-tooth electrode 14. This allows the total area of the first comb-tooth electrode 12 to be increased, thereby realizing more effective heat dissipation of the series resonator 1.
  • the same can be said if the first comb-tooth electrode 12 is replaced with the first comb-tooth electrode 13, and the same can be said if the second comb-tooth electrode 14 is replaced with the second comb-tooth electrode 15.
  • the width 21 of the capacitive comb-tooth electrode 11 along the arrangement direction 20 of the multiple electrode fingers 16 provided on the first comb-tooth electrode 12 may be greater than at least one of the minimum width of the first wiring portion 2, the minimum width of the second wiring portion 3, and the minimum width of the third wiring portion 6.
  • An example of at least one of the minimum width of the first wiring portion 2, the minimum width of the second wiring portion 3, and the minimum width of the third wiring portion 6 is the minimum width 22 of the third wiring portion 6 excluding the connection portion with the non-ground terminal 5.
  • the width 21 may be greater than the minimum width of the fourth wiring portion 9.
  • FIG. 8 is a plan view showing a schematic configuration of an elastic wave device 106 according to a preferred embodiment of the present invention.
  • Elastic wave device 106 includes chip 23 and components constituting any one of elastic wave devices 101 to 105. For simplicity, only ground terminal 4 and non-ground terminal 5 are shown in FIG.
  • the chip 23 has an outer peripheral portion 24.
  • a non-ground terminal 5 may be arranged on the outer peripheral portion 24.
  • a ground terminal 4 may be arranged on the outer peripheral portion 24.
  • a signal terminal 25 that is electrically connected to the first wiring portion 2 and the second wiring portion 3 may be arranged on the outer peripheral portion 24.
  • Acoustic wave device 106 allows for a high degree of freedom in the layout of each of the components, making it possible to miniaturize the acoustic wave device.
  • the non-ground terminal 5 may be electrically independent of the signal terminal 25 that is electrically connected to the first wiring section 2 and the second wiring section 3.
  • FIG. 9 is a cross-sectional view showing a schematic configuration of an electronic device 201 according to a first example of the present embodiment.
  • the electronic device 201 includes an acoustic wave device 106 in which a non-ground terminal 5 is electrically independent from a signal terminal 25, a mounting board 26, a board 27 of the electronic device, and a sealing member 28.
  • the mounting substrate 26 is a substrate on which the elastic wave device 106 is mounted.
  • the mounting substrate 26 has a first wiring pattern 29, a second wiring pattern 30, and a third wiring pattern 31.
  • the first wiring pattern 29 is formed on the surface of the mounting substrate 26.
  • the second wiring pattern 30 and the third wiring pattern 31 are formed on the surface and inside of the mounting substrate 26, respectively.
  • the substrate 27 is a substrate on which the mounting substrate 26, on which the elastic wave device 106 is mounted, is mounted.
  • the substrate 27 has a fourth wiring pattern 32 and a fifth wiring pattern 33.
  • the sealing member 28 seals the elastic wave device 106 and may be, for example, a resin material.
  • the first wiring pattern 29 and the non-ground terminal 5 are connected.
  • a bump 34 may be used to connect the first wiring pattern 29 and the non-ground terminal 5.
  • the non-ground terminal 5 may be connected to the first wiring pattern 29 via the bump 34.
  • the fourth wiring pattern 32 belongs to the path of the input signal and output signal of the electronic device 201.
  • the fourth wiring pattern 32, the second wiring pattern 30, and the signal terminal 25 are connected.
  • a bump 35 may be used to connect the second wiring pattern 30 and the signal terminal 25.
  • the second wiring pattern 30 is electrically connected to the first wiring section 2 and the second wiring section 3.
  • the fifth wiring pattern 33 is grounded.
  • the fifth wiring pattern 33, the third wiring pattern 31, and the ground terminal 4 are connected.
  • a bump 36 may be used to connect the third wiring pattern 31 and the ground terminal 4.
  • FIG. 10 is a cross-sectional view showing a schematic configuration of an electronic device 202 according to a second example of this embodiment.
  • the electronic device 202 differs from the electronic device 201 in that the mounting board 26 has a heat dissipation member 37.
  • the heat dissipation member 37 is formed inside the mounting board 26 and is electrically independent from the second wiring pattern 30.
  • the non-ground terminal 5 is connected to the heat dissipation member 37 via the first wiring pattern 29.
  • the heat dissipation member 37 may be provided for the purpose of dissipating heat from the series resonator 1.
  • the heat dissipation member 37 may contain a material with excellent heat dissipation properties.
  • the heat dissipation member 37 may be a so-called via mounted on an electronic circuit.
  • the electronic device 202 can achieve more effective heat dissipation from the series resonator 1 by adding a heat dissipation member 37 to the electronic device 201.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
PCT/JP2023/041939 2022-11-28 2023-11-22 弾性波装置および電子機器 Ceased WO2024116986A1 (ja)

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JP2024561424A JP7847668B2 (ja) 2022-11-28 2023-11-22 電子機器

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JP2022189496 2022-11-28
JP2022-189496 2022-11-28

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014143675A (ja) * 2012-04-25 2014-08-07 Kyocera Corp 弾性波素子、分波器および通信モジュール
JP2020053876A (ja) * 2018-09-27 2020-04-02 京セラ株式会社 弾性波装置、分波器および通信装置
JP2022165332A (ja) * 2021-04-19 2022-10-31 三安ジャパンテクノロジー株式会社 弾性波デバイスおよびその弾性波デバイスを備えるモジュール

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005032058B4 (de) * 2005-07-08 2016-12-29 Epcos Ag HF-Filter mit verbesserter Gegenbandunterdrückung
JP6170349B2 (ja) * 2013-06-18 2017-07-26 太陽誘電株式会社 弾性波デバイス

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014143675A (ja) * 2012-04-25 2014-08-07 Kyocera Corp 弾性波素子、分波器および通信モジュール
JP2020053876A (ja) * 2018-09-27 2020-04-02 京セラ株式会社 弾性波装置、分波器および通信装置
JP2022165332A (ja) * 2021-04-19 2022-10-31 三安ジャパンテクノロジー株式会社 弾性波デバイスおよびその弾性波デバイスを備えるモジュール

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JPWO2024116986A1 (https=) 2024-06-06

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