WO2024116558A1 - 積層セラミック電子部品 - Google Patents

積層セラミック電子部品 Download PDF

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Publication number
WO2024116558A1
WO2024116558A1 PCT/JP2023/034071 JP2023034071W WO2024116558A1 WO 2024116558 A1 WO2024116558 A1 WO 2024116558A1 JP 2023034071 W JP2023034071 W JP 2023034071W WO 2024116558 A1 WO2024116558 A1 WO 2024116558A1
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Prior art keywords
electrode layer
end surface
layer
exposed
internal electrode
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Ceased
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PCT/JP2023/034071
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English (en)
French (fr)
Japanese (ja)
Inventor
辰徳 安田
和樹 黒川
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to JP2024561195A priority Critical patent/JP7831637B2/ja
Priority to CN202380076863.4A priority patent/CN120129947A/zh
Priority to KR1020257010145A priority patent/KR20250054103A/ko
Priority to US18/616,240 priority patent/US20240234033A1/en
Publication of WO2024116558A1 publication Critical patent/WO2024116558A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/35—Feed-through capacitors or anti-noise capacitors

Definitions

  • the present invention relates to multilayer ceramic electronic components, in particular multilayer ceramic capacitors.
  • Multilayer ceramic capacitors are known as conventional multilayer ceramic electronic components.
  • multilayer ceramic capacitors have a structure including a laminate, which is a fired body in which dielectric layers and internal electrode layers made of ceramic are alternately laminated, and external electrodes provided on both end faces of the laminate, and have a desired capacitance according to the number of laminates and the thickness of the dielectric layers.
  • Japanese Patent Application Laid-Open No. 2003-233699 and other publications disclose providing a step absorption layer to eliminate steps caused by internal electrode layers.
  • step absorption layers are placed on the same plane as each internal electrode layer as described in Patent Document 1, the step absorption layers will also be placed on parts that are only curved to an extent that does not affect structural defects. This creates the possibility of new structural defects occurring and the problem of increased costs for the step absorption layers. Therefore, the present invention aims to suppress structural defects by reducing costs and placing appropriate amounts of step absorption layers in appropriate locations.
  • the multilayer ceramic electronic component of the present invention includes a plurality of laminated ceramic layers, and has a first main surface and a second main surface that face each other in a height direction, a first side surface and a second side surface that face each other in a width direction perpendicular to the height direction, a first end surface and a second end surface that face each other in a length direction perpendicular to the height direction and the width direction, a first internal electrode layer that is laminated alternately with the plurality of ceramic layers and exposed at the first end surface, a second internal electrode layer that is laminated alternately with the plurality of ceramic layers and exposed at the second end surface, a first step layer that is disposed on the same plane as the second internal electrode layer and exposed at the first end surface, and a front
  • the laminate includes a second step layer disposed on the same plane as the first internal electrode layer and exposed to the second end surface, a first external electrode provided on the first end surface, and a second external electrode provided on the second end surface, and the longitudinal distance between the first step
  • the multilayer ceramic electronic component of the present invention includes a plurality of laminated ceramic layers, and includes a first main surface and a second main surface that face each other in a height direction, a first side surface and a second side surface that face each other in a width direction perpendicular to the height direction, a first end surface and a second end surface that face each other in a length direction perpendicular to the height direction and the width direction, end surface-exposed electrode layers that are internal electrode layers that are laminated alternately with the plurality of ceramic layers and exposed to the first end surface and the second end surface, side surface-exposed electrode layers that are internal electrode layers that are laminated alternately with the plurality of ceramic layers and exposed to the first side surface and the second side surface, and a first end surface-exposed electrode layer that is disposed on the same plane as the end surface-exposed electrode layer and that is exposed to the first side surface and the second side surface.
  • the laminate includes a side surface step layer exposed to the first end surface, an end surface step layer disposed on the same plane as the side surface exposed electrode layer and exposed to the first end surface and the second end surface, a first external electrode provided on the first end surface and the second end surface, and a second external electrode provided on the first side surface and the second side surface, and the widthwise distance between the side surface step layer and the end surface exposed electrode layer is greater when the side surface step layer is located closer to the first main surface, and the lengthwise distance between the end surface step layer and the side surface exposed electrode layer is greater when the side surface step layer is located closer to the first main surface.
  • the present invention provides a multilayer ceramic electronic component that makes it easier to make the surface of the laminate flatter.
  • FIG. 1 is a perspective view of a multilayer ceramic electronic component according to a first embodiment of the present invention
  • 2 is a cross-sectional view taken along line II in FIG. 1.
  • 2 is a cross-sectional view taken along line II-II of FIG. 1.
  • 1 is an LT cross-sectional view of a laminate according to a first embodiment.
  • FIG. FIG. 11 is an LT cross-sectional view of a laminate according to a second embodiment.
  • FIG. 11 is an LT cross-sectional view of a multilayer ceramic electronic component according to a second preferred embodiment of the present invention.
  • FIG. 11 is a perspective view of a multilayer ceramic electronic component according to a third preferred embodiment of the present invention.
  • 8 is a cross-sectional view taken along line III-III in FIG. 7.
  • 8 is a cross-sectional view taken along line IV-IV in FIG. 7.
  • 8 is a cross-sectional view taken along line VV in FIG. 7, showing the planar structure of an end surface exposed electrode layer.
  • 8 is a cross-sectional view taken along line VV in FIG. 7, showing the planar structure of the side surface exposed electrode layer.
  • the multilayer ceramic electronic component 1 is a multilayer ceramic capacitor.
  • FIG. 1 is a perspective view showing the multilayer ceramic electronic component 1 of the present embodiment.
  • the multilayer ceramic electronic component 1 includes a laminate 2 and external electrodes 20.
  • the L direction is the length direction of the multilayer ceramic electronic component 1.
  • the W direction is the width direction of the multilayer ceramic electronic component 1.
  • the T direction is the height direction of the multilayer ceramic electronic component 1.
  • the cross section shown in FIG. 2 is called an LT cross section, and the cross section shown in FIG. 3 is called a WT cross section.
  • the length direction L, the width direction W, and the height direction T do not necessarily have to be perpendicular to each other.
  • the length direction L, the width direction W, and the height direction T may intersect each other.
  • the laminate 2 has a substantially rectangular parallelepiped shape.
  • the laminate 2 has two main surfaces 61, two end surfaces 62, and two side surfaces 63.
  • the main surface 61 is a surface facing the height direction T.
  • the end surface 62 is a surface facing the length direction L.
  • the side surface 63 is a surface facing the width direction W.
  • One of the two main surfaces 61 is a first main surface 61a, and the other is a second main surface 61b.
  • One of the two end surfaces 62 is a first end surface 62a, and the other is a second end surface 62b.
  • One of the two side surfaces 63 is a first side surface 63a, and the other is a second side surface 63b.
  • the first main surface 61a and the first side surface 63a are shown in FIG. 1.
  • the ridges and corners of the laminate 2 are preferably rounded.
  • a ridge is a portion where two surfaces of the laminate 2 intersect.
  • a corner is a portion where three surfaces of the laminate 2 intersect.
  • the size of the laminate 2 is not particularly limited.
  • the laminate 2 includes a plurality of ceramic layers 4 and a plurality of internal electrode layers 10. The structure of the laminate 2 will be described below with reference to a cross-sectional view of the laminate 2.
  • Fig. 2 is a cross-sectional view of the multilayer ceramic electronic component 1 shown in Fig. 1 taken along line II.
  • Fig. 2 shows an LT cross-section of the multilayer ceramic electronic component 1.
  • the laminate 2 includes a plurality of ceramic layers 4 and a plurality of internal electrode layers 10. The plurality of ceramic layers 4 and the plurality of internal electrode layers 10 are stacked on top of each other in the height direction T.
  • the laminate 2 is divided into an inner layer portion 53 and two outer layer portions 54 in the height direction T.
  • the outer layer portion 54 includes a first outer layer portion 54a and a second outer layer portion 54b.
  • the first outer layer portion 54a and the second outer layer portion 54b are located at positions sandwiching the inner layer portion 53 in the height direction T.
  • the inner layer portion 53 In the inner layer portion 53, some of the ceramic layers 4 and the internal electrode layers 10 are arranged. In the inner layer portion 53, the internal electrode layers 10 face each other via the ceramic layers 4. Therefore, a capacitance is formed in the inner layer portion 53. Therefore, the inner layer portion 53 is the portion of the laminate 2 that essentially functions as a capacitor.
  • the first outer layer portion 54a is a portion of the outer layer portion 54 located on the side of the first main surface 61a of the laminate 2.
  • the second outer layer portion 54b is a portion of the outer layer portion 54 located on the side of the second main surface 61b of the laminate 2.
  • the first outer layer portion 54a is a portion between the internal electrode layer 10 closest to the first main surface 61a among the multiple internal electrode layers 10 and the first main surface 61a.
  • the second outer layer portion 54b is a portion between the internal electrode layer 10 closest to the second main surface 61b among the multiple internal electrode layers 10 and the second main surface 61b.
  • No internal electrode layer 10 is arranged in the first outer layer portion 54a and the second outer layer portion 54b.
  • the first outer layer 54a and the second outer layer 54b function as protective layers for the inner layer 53.
  • the ceramic layers 4 can be classified into ceramic layers 4 arranged in the inner layer portion 53 and ceramic layers 4 arranged in the outer layer portion 54.
  • the ceramic layers 4 arranged in the inner layer portion 53 are referred to as inner ceramic layers 4a.
  • the ceramic layers 4 arranged in the outer layer portion 54 are referred to as outer ceramic layers 4b.
  • the number of ceramic layers 4 stacked in the laminate 2 may be, for example, 5 to 2000.
  • the material of the ceramic layer 4 may be, for example, a dielectric ceramic composed of a main component such as BaTiO3 , CaTiO3 , SrTiO3 , or CaZrO3 .
  • a material in which a subcomponent such as a Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound is added to these main components may also be used.
  • the laminated ceramic electronic component 1 functions as a ceramic piezoelectric element.
  • piezoelectric ceramic materials include PZT (lead zirconate titanate) ceramic materials.
  • the laminated ceramic electronic component 1 functions as a thermistor element.
  • semiconductor ceramic materials include spinel ceramic materials.
  • the multilayer ceramic electronic component 1 When magnetic ceramics are used in the laminate, the multilayer ceramic electronic component 1 functions as an inductor element. When the multilayer ceramic electronic component 1 functions as an inductor element, the internal electrode layer becomes a coil-shaped conductor.
  • a specific example of a magnetic ceramic material is a ferrite ceramic material.
  • the ceramic layer 4 may have a thickness of, for example, 10 ⁇ m or less.
  • the internal electrode layers 10 can be classified into a first internal electrode layer 10a and a second internal electrode layer 10b.
  • the first internal electrode layer 10a is an internal electrode layer 10 connected to a first external electrode 20a.
  • the second internal electrode layer 10b is an internal electrode layer 10 connected to a second external electrode 20b.
  • the first internal electrode layer 10a extends from a first end face 62a toward a second end face 62b.
  • the second internal electrode layer 10b extends from the second end face 62b toward the first end face 62a.
  • the first internal electrode layer 10 a and the second internal electrode layer 10 b each have an opposing portion 11 and an extension portion 12 .
  • the facing portion 11 is a portion of the internal electrode layer 10 where the first internal electrode layer 10a and the second internal electrode layer 10b face each other in the height direction T.
  • the extension portion 12 is a portion of the internal electrode layer 10 that extends from the facing portion 11 to the first end face 62a or the second end face 62b of the laminate 2.
  • the opposing portion 11 of the first internal electrode layer 10a is referred to as the first opposing portion 11a.
  • the extension portion 12 of the first internal electrode layer 10a is referred to as the first extension portion 12a.
  • the first extension portion 12a is a portion that extends from the first opposing portion 11a to the first end surface 62a of the laminate 2.
  • the opposing portion 11 of the second internal electrode layer 10b is referred to as the second opposing portion 11b.
  • the extension portion 12 of the second internal electrode layer 10b is referred to as the second extension portion 12b.
  • the second extension portion 12b is a portion that extends from the second opposing portion 11b to the second end surface 62b of the laminate 2.
  • the number of the internal electrode layers 10 may be, for example, from 10 to 2000.
  • the number of the internal electrode layers 10 includes the number of the first internal electrode layers 10a and the number of the second internal electrode layers 10b.
  • the thickness of the internal electrode layer 10 can be, for example, 0.1 ⁇ m to 5.0 ⁇ m, preferably 0.2 ⁇ m to 2.0 ⁇ m. When the thickness of the internal electrode layer 10 is 0.5 ⁇ m or more, a plating film is likely to grow when the metal layer of the external electrode 20 is formed by plating.
  • the material of the internal electrode layer 10 can be, for example, a metal such as Ni, Cu, Ag, Pd, or Au, an alloy of Ni and Cu, an alloy of Ag and Pd, etc.
  • the material of the internal electrode layer 10 may contain dielectric particles having the same composition as the ceramic contained in the ceramic layer 4.
  • the division of the laminate 2 in the longitudinal direction L will be described.
  • the laminate 2 can be divided into an electrode opposing portion 50 and an L gap 51 in the longitudinal direction L.
  • the electrode opposing portion 50 in the division in the longitudinal direction L is referred to as an L opposing portion 50a.
  • the L gap 51 includes a first L gap 51a and a second L gap 51b.
  • the L-opposing portion 50a corresponds to the portion where the first internal electrode layer 10a and the second internal electrode layer 10b oppose each other in the height direction T. A capacitance is formed in the L-opposing portion 50a.
  • the L gap 51 is a portion in the length direction L of the laminate 2 where the first internal electrode layer 10a and the second internal electrode layer 10b do not face each other in the height direction T.
  • the first L gap 51a is between the L opposing portion 50a and the first end face 62a.
  • the second L gap 51b is between the L opposing portion 50a and the second end face 62b.
  • the first internal electrode layer 10a is arranged in the height direction T, but the second internal electrode layer 10b is not arranged.
  • the second internal electrode layer 10b is arranged in the height direction T, but the first internal electrode layer 10a is not arranged.
  • the first L gap 51a functions as an extension to the first end surface 62a of the first opposing portion 11a.
  • the second L gap 51b functions as an extension to the second end surface 62b of the second opposing portion 11b.
  • the length of the L gap 51 in the longitudinal direction L can be, for example, 10% or more and 30% or less of the length of the laminate 2 in the longitudinal direction L.
  • the external electrodes 20 include a first external electrode 20a and a second external electrode 20b.
  • the first external electrode 20a is an external electrode 20 disposed on the first end surface 62a of the laminate 2.
  • the first external electrode 20a is electrically connected to the first internal electrode layer 10a.
  • the second external electrode 20b is an external electrode 20 disposed on the second end surface 62b of the laminate 2.
  • the second external electrode 20b is electrically connected to the second internal electrode layer 10b.
  • the external electrode 20 extends from one end face 62 to parts of the two main faces 61 and to parts of the two side faces 63 .
  • the layer structure of the external electrode 20 will be described with reference to Fig. 2.
  • the external electrode 20 includes an undercoat layer 21 and a plating layer 23.
  • the plating layer 23 includes an inner plating layer 23a and a surface plating layer 23b. These layers are arranged in the following order from the end surface 62 of the laminate 2: undercoat layer 21, inner plating layer 23a, surface plating layer 23b.
  • the underlayer 21 is disposed on an end face 62 of the laminate 2 and covers the end face 62.
  • the underlayer 21 extends from the end face 62 to a part of the main face 61 and a part of the side face 63.
  • the underlayer 21 is configured as a baking layer.
  • the baking layer contains a glass component and a metal.
  • the glass component contains at least one selected from B, Si, Ba, Mg, Al, Li, etc.
  • the metal contains at least one selected from Cu, Ni, Ag, Pd, Ag-Pd alloy, Au, etc.
  • the baking layer may be a multi-layered layer.
  • the plating layer 23 includes the inner plating layer 23a and the surface plating layer 23b.
  • the plating layers are, from the bottom, a Ni plating layer and a Sn plating layer. That is, the inner plating layer 23a is a Ni plating layer, and the surface plating layer 23b is a Sn plating layer.
  • the plating layer 23 is a three-layer structure, it is preferable that the plating layers are, from the bottom, a Sn plating layer, a Ni plating layer, and a Sn plating layer.
  • the Ni plating layer can prevent the underlayer 21 from being eroded by solder when mounting the multilayer ceramic electronic component 1.
  • the Sn plating layer can improve the wettability of the solder when mounting the multilayer ceramic electronic component 1, making mounting easier. Therefore, by making the surface plating layer 23b a Sn plating layer, the wettability of the solder to the external electrode 20 can be improved.
  • the thickness of each plating layer is preferably 3 ⁇ m or more and 9 ⁇ m or less.
  • Fig. 3 is a cross-sectional view of the laminated ceramic electronic component 1 shown in Fig. 1 taken along line II-II.
  • the laminate 2 is divided in the width direction W into an electrode opposing portion 50 and a W gap 52.
  • the electrode opposing portion 50 in the section in the width direction W is referred to as a W opposing portion 50b.
  • the W gap 52 includes a first W gap 52a and a second W gap 52b.
  • the W opposing portion 50b is a portion where the internal electrode layers 10 oppose each other in the height direction T.
  • the W gap 52 is a portion in the width direction W where neither the first internal electrode layer 10a nor the second internal electrode layer 10b is disposed in the height direction T.
  • the first W gap 52a is between the W opposing portion 50b and the first side surface 63a in the width direction W of the laminate 2.
  • the second W gap 52b is between the W opposing portion 50b and the second side surface 63b.
  • the first W gap 52a and the second W gap 52b are arranged to sandwich the W opposing portion 50b.
  • the first W gap 52a and the second W gap 52b function as protective layers for the internal electrode layer 10.
  • the length of the width direction W of the W gap 52 can be, for example, 20% to 30% of the length of the width direction W of the laminate 2. In addition, the length of the width direction W of the W gap 52 can be, for example, 5 ⁇ m to 50 ⁇ m.
  • the size of the multilayer ceramic electronic component 1 is not particularly limited.
  • the size of the multilayer ceramic electronic component 1 can be, for example, as follows.
  • the dimension in the length direction L of the multilayer ceramic electronic component 1 including the laminate 2 and the external electrodes 20 is defined as the L dimension.
  • the L dimension is preferably 0.25 mm or more and 1.0 mm or less.
  • the dimension in the height direction T of the multilayer ceramic electronic component 1 including the laminate 2 and the external electrodes 20 is defined as the T dimension.
  • the T dimension is preferably 0.125 mm or more and 0.5 mm or less.
  • the dimension in the width direction W of the multilayer ceramic electronic component 1 including the laminate 2 and the external electrodes 20 is defined as the W dimension.
  • the W dimension is preferably 0.125 mm or more and 0.5 mm or less.
  • the multilayer ceramic electronic component 1 of this embodiment is provided with a step layer 5 . It is preferable that the difference in length in the height direction T of the laminate 2 be small between the electrode opposing portion 50 and the L gap 51. However, in the inner layer portion 53, the length in the height direction T tends to differ between the electrode opposing portion 50 and the L gap 51.
  • the ceramic layers 4 and the internal electrode layers 10 are laminated in the electrode opposing portion 50. In contrast, only the ceramic layers 4 are laminated in the L gap 51. No internal electrode layers 10 are laminated in the L gap 51. Therefore, the length in the height direction T tends to differ between the electrode opposing portion 50 and the L gap 51.
  • an additional ceramic layer 4 is placed in the L gap 51.
  • This additional ceramic layer 4 is referred to as the step layer 5. It is preferable that the step layer 5 has the same components as the ceramic layer 4. However, the components of the ceramic layer 4 are not limited to this.
  • Fig. 4 is an LT cross-sectional view of the laminate 2 provided in the multilayer ceramic electronic component 1 of this embodiment.
  • Fig. 4 shows a cross-section of the laminate 2 at a position corresponding to line II in Fig. 1.
  • the step layer 5 is arranged between the tip E of the internal electrode layer 10 in the longitudinal direction L and an end face 62.
  • the step layer 5 includes a first step layer 5a and a second step layer 5b.
  • the first step layer 5a is a step layer 5 arranged on the same plane as the second internal electrode layer 10b.
  • the tip E on the first end face 62a side in the longitudinal direction L of the second internal electrode layer 10b is defined as a tip E1.
  • the first step layer 5a is arranged between the tip E1 and the first end face 62a in the longitudinal direction L.
  • the first step layer 5a is exposed from the first end face 62a.
  • the second step layer 5b is a step layer 5 arranged on the same plane as the first internal electrode layer 10a.
  • the tip E on the second end face 62b side in the longitudinal direction L of the first internal electrode layer 10a is defined as a tip E2.
  • the second step layer 5b is arranged between the tip E2 and the second end face 62b in the longitudinal direction L.
  • the second step layer 5b is exposed from the second end face 62b.
  • FIG. 4 shows two layers each of the first step layers 5a and the second step layers 5b. This is because FIG. 4 is a schematic diagram for explanation purposes. Therefore, FIG. 4 does not mean that the number of layers in a laminated ceramic capacitor is limited to the number of layers shown in FIG. 4.
  • the length of the step layer 5 in the height direction T is defined as the thickness of the step layer 5 .
  • the thickness of the first step layer 5a located closer to the first main surface 61a is thicker than the thickness of the first step layer 5a located closer to the second main surface 61b.
  • the second step layer 5b is thicker than the second step layer 5b located closer to the second main surface 61b.
  • the second step layer 5b located closer to the first main surface 61a has a greater thickness than the second step layer 5b located closer to the second main surface 61b.
  • the thickness of the step layer 5 is shown as H.
  • Two first step layers 5a and two second step layers 5b are shown in Figure 4.
  • the thickness of the first step layer 5a closer to the first main surface 61a is shown as H2
  • the thickness of the first step layer 5a closer to the second main surface 61b is shown as H4.
  • Thickness H2 is thicker than thickness H4.
  • the thickness of the second step layer 5b closer to the first main surface 61a is H1
  • the thickness of the second step layer 5b closer to the second main surface 61b is H3.
  • Thickness H1 is thicker than thickness H3.
  • the thickness in the height direction T of the ceramic layers 4 between the internal electrode layers 10 connected to the same external electrode 20 increases toward the first main surface 61a.
  • curvature of each layer due to the presence or absence of the internal electrode layer 10 is more likely to occur at the end of the lamination than at the beginning of the lamination. In other words, the influence of steps due to the presence or absence of the internal electrode layer 10 is greater at the end of the lamination.
  • the start of the lamination corresponds to the second main surface 61b side.
  • the end of the lamination corresponds to the first main surface 61a side.
  • a thicker step layer 5 is provided toward the end of lamination. This allows the multilayer ceramic electronic component 1 to reduce the degree of curvature of the laminate 2.
  • the step layer 5 can be formed partially on a part of the stack 2 in the height direction T. This makes it possible to more effectively prevent steps from occurring in the stack 2.
  • the thickness of the internal electrode layer 10 is shown as H in Fig. 4.
  • the thickness H of the step layer 5 is 20% to 120% of the thickness K of the internal electrode layer 10.
  • the thickness of the first step layer 5a is 20% to 120% of the thickness of the second internal electrode layer 10b.
  • the thickness of the second step layer 5b is 20% to 120% of the thickness of the first internal electrode layer 10a.
  • the thicknesses of the two first step layers 5a are thickness H2 and thickness H4.
  • the thickness of the second internal electrode layer 10b is also indicated as K2 in Fig. 4.
  • the thicknesses H2 and H4 are 20% or more and 120% or less of the thickness K2.
  • the thicknesses of the two second step layers 5b shown in Fig. 4 are thickness H1 and thickness H3.
  • the thickness of the first internal electrode layer 10a is indicated as K1 in Fig. 4.
  • the thicknesses H1 and H3 are 20% or more and 120% or less of the thickness K1.
  • the step layer 5 is exposed from the end face 62. Specifically, the first step layer 5a is exposed at the first end face 62a, and the second step layer 5b is exposed at the second end face 62b.
  • the end of the step layer 5 opposite to the end exposed from the end face 62 in the longitudinal direction L is in contact with the internal electrode layer 10 in the same layer as the step layer 5 at a tip E of the internal electrode layer 10.
  • the tip E of the internal electrode layer 10 means the end of the internal electrode layer 10 opposite to the end exposed from the end face 62 in the longitudinal direction L.
  • the tip E of the second internal electrode layer 10b on the first end face 62a side is referred to as tip E1.
  • the first step layer 5a contacts the second internal electrode layer 10b at the tip E1 of the second internal electrode layer 10b.
  • the tip E of the first internal electrode layer 10a on the second end face 62b side is referred to as tip E2.
  • the second step layer 5b contacts the first internal electrode layer 10a at the tip E2 of the first internal electrode layer 10a.
  • the L-direction end portion 47 means a region extending from the L-direction end portion of the internal electrode layer 10 toward the end face 62 to which the internal electrode layer 10 is connected, the region being 0 ⁇ m or more and 60 ⁇ m or less. That is, D1 shown in FIG. 4 is 0 ⁇ m or more and 60 ⁇ m or less.
  • the thickness of the ceramic layer 4 and step layer 5 between the first internal electrode layer 10a and the first internal electrode layer 10a on the adjacent first main surface 61a side is defined as D2.
  • the thickness of the ceramic layer 4 and step layer 5 between the first internal electrode layer 10a and the first internal electrode layer 10a on the adjacent second main surface 61b side is defined as D3.
  • D2 is larger than D3.
  • D2 becomes larger as it approaches the first main surface side.
  • the coverage of the internal electrode layer 10 will be described.
  • the coverage at the L-direction end 47 of the internal electrode layer 10 is lower than the coverage at the opposing portion 11 of the internal electrode layer 10.
  • the coverage at the L-direction end 47 of the first internal electrode layer 10a is lower than the coverage at the first opposing portion 11a of the first internal electrode layer 10a.
  • the coverage at the L-direction end 47 of the second internal electrode layer 10b is lower than the coverage at the second opposing portion 11b of the second internal electrode layer 10b.
  • Fig. 5 is an LT cross-sectional view of a laminate 2 in the second embodiment.
  • Fig. 5 is a view corresponding to Fig. 4 in the first embodiment.
  • Fig. 6 is an LT cross-sectional view of a portion of the multilayer ceramic electronic component 1 of the second embodiment.
  • the following description will focus on the differences from the first embodiment.
  • the length of the step layer 5 in the height direction T differs depending on the internal electrode layer 10.
  • the length of the step layer 5 in the length direction L differs depending on the internal electrode layer 10.
  • the distance in the length direction L between the step layer 5 and the internal electrode layer 10 will be described. Of the two ends of the step layer 5 in the length direction L, the end that is not exposed to the end face 62 is defined as the inner end Q of the step layer 5.
  • the distance in the length direction L between the tip E of the internal electrode layer 10 and the inner end Q of the step layer 5 arranged in the same layer as the internal electrode layer 10 is defined as J. This distance J is the distance in the length direction L between the step layer 5 and the internal electrode layer 10.
  • the distance J in the longitudinal direction L between the step layer 5 and the internal electrode layer 10 becomes greater when the internal electrode layer 10 is located closer to the first main surface 61a.
  • the distance J in the longitudinal direction L between the first step layer 5a and the second internal electrode layer 10b is greater when the first step layer 5a located closer to the first main surface 61a is located and the second internal electrode layer 10b.
  • the distance J in the longitudinal direction L between the second step layer 5b and the first internal electrode layer 10a is greater when the second step layer 5b is located closer to the first main surface 61a than the first internal electrode layer 10a.
  • FIG. 5 shows two first step layers 5a and two second step layers 5b.
  • the distance J in the longitudinal direction L between the first step layer 5a and the second internal electrode layer 10b is set to a distance J2 for the first step layer 5a closer to the first main surface 61a, and a distance J4 for the first step layer 5a closer to the second main surface 61b.
  • the distance J2 is greater than the distance J4.
  • the distance J in the longitudinal direction L between the second step layer 5b and the first internal electrode layer 10a is set to distance J1 for the second step layer 5b closer to the first main surface 61a, and distance J3 for the second step layer 5b closer to the second main surface 61b.
  • Distance J1 is greater than distance J3.
  • the length of the step layer 5 becomes shorter as it approaches the first main surface 61a.
  • curvature of each layer due to the presence or absence of the internal electrode layer 10 is more likely to occur at the end of the lamination than at the beginning of the lamination. In other words, the influence of steps due to the presence or absence of the internal electrode layer 10 is greater at the end of the lamination.
  • the bending of each layer begins toward the end face side.
  • the length of the step layer 5 from the end face 62 becomes shorter towards the end of lamination. This allows the multilayer ceramic electronic component 1 to reduce the degree of curvature of the laminate 2 .
  • overlapping of the internal electrode layers 10 and the step layers 5 in the height direction T can be suppressed, thereby improving the reliability of the multilayer ceramic electronic component 1 .
  • the ratio of the length of the step layer 5 to the length of the L gap 51 in the longitudinal direction L will be described.
  • the length of the step layer 5 in the longitudinal direction L is indicated by S.
  • the length of the L gap 51 in the longitudinal direction L is indicated by D5.
  • the length S of the step layer 5 is 20% or more of the length D5 of the L gap 51.
  • the length S in the longitudinal direction L of the first step layer 5a is 20% or more of the distance in the longitudinal direction L between the tip E1 of the second internal electrode layer 10b and the first end face 62a, i.e., the length D5 in the longitudinal direction L of the first L gap 51a.
  • the length S in the longitudinal direction L of the second step layer 5b is 20% or more of the distance in the longitudinal direction L between the tip E2 of the first internal electrode layer 10a and the second end face 62b, i.e., the length D5 in the longitudinal direction L of the second L gap 51b.
  • FIG. 5 shows two first step layers 5a and two second step layers 5b.
  • the length S in the longitudinal direction L of the two first step layers 5a is set to be length S2 for the first step layer 5a closer to the first main surface 61a, and length S4 for the first step layer 5a closer to the second main surface 61b. Both lengths S2 and S4 are 20% or more of the length D5 in the longitudinal direction L of the first L gap 51a.
  • the length S in the longitudinal direction L is set to S1 for the second step layer 5b closer to the first main surface 61a, and to S3 for the second step layer 5b closer to the second main surface 61b. Both lengths S1 and S3 are 20% or more of the length D5 in the longitudinal direction L of the second L gap 51b.
  • Fig. 6 is an LT cross-sectional view of a portion of the multilayer ceramic electronic component 1 according to the second preferred embodiment.
  • Fig. 6 shows a first L gap 51a of the multilayer ceramic electronic component 1 and the like.
  • the internal electrode layer 10 in the second embodiment has a bent portion 40.
  • the bent portion 40 refers to a portion of the extension portion 12 of the internal electrode layer 10 where the internal electrode layer 10 is bent in the direction of the second main surface 61b.
  • FIG. 6 shows the bent portions 40 of the first internal electrode layer 10a. Five bent portions 40 are shown in FIG. 6. The five bent portions 40 are numbered 41 to 45 in order from the first main surface 61a to the second main surface 61b.
  • the start point of bending of the bent portion 40 is defined as point F, and the end point of bending is defined as point G.
  • the start point of bending is a point where the internal electrode layer 10a starts to bend in the direction of the second main surface 61b in the extension portion 12.
  • the start points of bending, or points F, of each bent portion 40 are shown as points F1 to F5.
  • End point of bending The end points of the bends are points where the bent portions 40 of the internal electrode layers 10 contact the end faces 62. In the configuration shown in Fig. 6, the end points of the bends are points where the first internal electrode layers 10a contact the first end faces 62a. In Fig. 6, points G, which are end points of the bends, for each of the bent portions 40 are shown as points G1 to G5.
  • the length M of the bent portion 40 is the distance in the longitudinal direction L between the start point G of the bend and the end point G of the bend. 6, the length M of each bent portion 40 is shown as length M1 to length M5.
  • the length M of the bent portion 40 becomes shorter as the internal electrode layer 10 is located closer to the second main surface 61b. That is, the length M becomes shorter in the order from length M1 to length M5.
  • the height N of the bent portion 40 is the distance in the height direction T between the start point G of the bend and the end point G of the bend. 6, the height N of each bent portion 40 is shown as a length N5 from a height N1.
  • the height N of the bent portion 40 becomes lower as the internal electrode layer 10 is located closer to the second main surface 61b. That is, the height N becomes lower in the order from height N1 to height N5.
  • a laminated ceramic electronic component 1 according to a third embodiment of the present invention will be described with reference to Figures 7 to 11.
  • differences from the first and second embodiments will be mainly described.
  • the case where the multilayer ceramic electronic component 1 is a two-terminal multilayer ceramic capacitor has been described.
  • the multilayer ceramic electronic component 1 is not limited to a two-terminal multilayer ceramic capacitor.
  • the multilayer ceramic electronic component 1 can also be a multi-terminal multilayer ceramic capacitor with three or more terminals.
  • the case where the multilayer ceramic electronic component 1 is a three-terminal multilayer ceramic capacitor will be described.
  • FIG. Fig. 7 is a perspective view showing the multilayer ceramic electronic component 1 of this embodiment.
  • the multilayer ceramic electronic component 1 of the third embodiment has external electrodes 20 formed on two side surfaces 63 in addition to two end surfaces 62.
  • the external electrodes 20 formed on the side surfaces 63 are referred to as side surface external electrodes 30.
  • the side surface external electrodes 30 include a first side surface external electrode 30a and a second side surface external electrode 30b.
  • the first side surface external electrode 30a is formed on the first side surface 63a.
  • the second side surface external electrode 30b is formed on the second side surface 63b.
  • the internal electrode layers 10 and the external electrodes 20 can be connected to each other on two side faces 63 in addition to the two end faces 62 .
  • Fig. 8 is a cross section taken along line III-III in Fig. 7. 8, a plurality of end-surface exposed electrode layers 10c and a plurality of side-surface exposed electrode layers 10d are laminated with an inner ceramic layer 4a interposed therebetween in the laminate 2.
  • the end-surface exposed electrode layer 10c is connected to the first external electrode 20a at a first end surface 62a.
  • the end-surface exposed electrode layer 10c is connected to the second external electrode 20b at a second end surface 62b.
  • the side surface exposed electrode layer 10 d is not connected to the external electrode 20 at any of the end faces 62 .
  • the end surface exposed electrode layer 10c functions as a through electrode
  • the side surface exposed electrode layer 10d functions as a ground electrode.
  • Fig. 9 is a cross section taken along line IV-IV in Fig. 7.
  • the side surface exposed electrode layer 10d is connected to the first side surface external electrode 30a at the first side surface 63a, and is connected to the second side surface external electrode 30b at the second side surface 63b.
  • the end surface exposed electrode layer 10 c is not connected to the external electrode 20 at any of the side surfaces 63 .
  • planar structure of internal electrode layer The planar structure of the end surface exposed electrode layer 10c and the side surface exposed electrode layer 10d will be described with reference to Fig. 10 and Fig. 11.
  • the planar structure refers to the structure of the internal electrode layer 10 when viewed from the height direction T of the multilayer ceramic electronic component 1.
  • End surface exposed electrode layer The end surface exposed electrode layer 10c will be described with reference to Fig. 10.
  • Fig. 10 is a cross-sectional view taken along line VV in Fig. 7.
  • Fig. 10 shows the planar structure of the end surface exposed electrode layer 10c.
  • a first end face extension 12c is provided on a portion of the end face exposed electrode layer 10c that is exposed on the first end face 62a, and a second end face extension 12d is provided on a portion of the end face exposed electrode layer 10c that is exposed on the second end face 62b.
  • the facing portion 11 of the end surface exposed electrode layer 10c is connected to the first end surface 62a via the first end surface extension portion 12c, and the facing portion 11 of the end surface exposed electrode layer 10c is connected to the second end surface 62b via the second end surface extension portion 12d.
  • the end surface exposed electrode layer 10c is illustrated as being rectangular, but the width in the width direction W of the opposing portion 11 and the end surface vertical portion, i.e., the first end surface extension portion 12c and the second end surface extension portion 12d, may be the same.
  • Fig. 11 is a cross-sectional view taken along line VV in Fig. 7.
  • Fig. 11 shows the planar structure of the side surface exposed electrode layer 10d.
  • a first side extension 12e is provided on a portion of the side surface exposed electrode layer 10d exposed to the first side surface 63a.
  • a second side extension 12f is provided on a portion of the side surface exposed electrode layer 10d exposed to the second side surface 63b.
  • the facing portion 11 of the side surface exposed electrode layer 10d is connected to the first side surface 63a via the first side extension 12e.
  • the facing portion 11 of the side surface exposed electrode layer 10d is connected to the second side surface 63b via the second side extension 12f.
  • a region corresponding to a region where the first side surface extension 12e is provided in the side surface exposed electrode layer 10d is defined as a third W gap 52c.
  • a region corresponding to a region where the second side surface extension 12f is provided in the side surface exposed electrode layer 10d is defined as a fourth W gap 52d.
  • the region of the side surface exposed electrode layer 10d corresponding to the region where the first end surface extension 12c is provided on the end surface exposed electrode layer 10c is defined as a third L gap 51c.
  • the region of the side surface exposed electrode layer 10d corresponding to the region where the second end surface extension 12d is provided on the end surface exposed electrode layer 10c is defined as a fourth L gap 51d.
  • the extension region 55 in which the first side extension portion 12e is provided is referred to as the first L extension region 55c.
  • the extension region 55 in which the second side extension portion 12f is provided is referred to as the second L extension region 55d.
  • the extension region 55 in which the first end face extension portion 12c is provided is referred to as the first W extension region 55a.
  • the extension region 55 in which the second end face extension portion 12d is provided is referred to as the second W extension region 55b.
  • Step layer 5 Even when the multilayer ceramic electronic component 1 is a three-terminal multilayer ceramic capacitor, the step layer 5 is disposed in the same manner as in the case of a two-terminal multilayer ceramic capacitor. By appropriately arranging the step layer 5, it is possible to suppress unevenness in the thickness of the laminate 2 in the height direction T caused by the first end face extension 12c, the second end face extension 12d, the first side face extension 12e, and the second side face extension 12f.
  • the step layer 5 includes an end surface step layer 5c and a side surface step layer 5d.
  • the end surface step layer 5c can be used to eliminate the step caused by the first end surface extension portion 12c and the second end surface extension portion 12d of the end surface exposed electrode layer 10c.
  • the side surface exposed electrode layer 10d does not have electrodes at the positions corresponding to the first end surface extension 12c and the second end surface extension 12d. Therefore, in the same layer as the side surface exposed electrode layer 10d, an end surface step layer 5c is disposed at the positions corresponding to the first end surface extension 12c and the second end surface extension 12d. This makes it possible to suppress unevenness in the height direction T of the laminate 2.
  • the end surface step layer 5c In the same layer as the side surface exposed electrode layer 10d, there are two regions where it is preferable to dispose the end surface step layer 5c.
  • One is the portion where the third L gap 51c and the first W extension region 55a overlap in Fig. 11.
  • the end surface step layer 5c disposed in this portion reduces unevenness in height caused by the side surface exposed electrode layer 10d not having the first end surface extension portion 12c.
  • the other is a portion where the fourth L gap 51d and the second W extension region 55b overlap in Fig. 11.
  • the end surface step layer 5c disposed in this portion reduces unevenness in height caused by the side surface exposed electrode layer 10d not having the second end surface extension portion 12d.
  • the side surface step layer 5d can be used to eliminate a step caused by the first side surface extension portion 12e and the second side surface extension portion 12f of the side surface exposed electrode layer 10d.
  • the end surface exposed electrode layer 10c does not have an electrode at a position corresponding to the first side surface extension portion 12e and at a position corresponding to the second side surface extension portion 12f. Therefore, in the same layer as the end surface exposed electrode layer 10c, a side surface step layer 5d is disposed at a position corresponding to the first side surface extension 12e and a position corresponding to the second side surface extension 12f. This makes it possible to suppress unevenness in the height direction T of the laminate 2.
  • the side surface step layer 5d In the same layer as the end surface exposed electrode layer 10c, there are two regions where it is preferable to dispose the side surface step layer 5d.
  • One is the portion where the third W gap 52c and the first L extension region 55c overlap in Fig. 10.
  • the side surface step layer 5d disposed in this portion reduces unevenness in height caused by the end surface exposed electrode layer 10c not having the first side surface extension portion 12e.
  • the other is a portion where the fourth W gap 52d and the second L extension region 55d overlap in Fig. 10.
  • the side surface step layer 5d disposed in this portion reduces unevenness in height caused by the end surface exposed electrode layer 10c not having the second side surface extension portion 12f.
  • the end surface step layer 5c and the side surface step layer 5d can be disposed in the same manner as the first step layer 5a and the second step layer 5b described in the first and second embodiments.
  • the shape of the step layer 5 has been described by taking the vicinity of the end face 62 as an example.
  • the shape of the step layer 5 described based on the end face 62 applies not only to the end face step layer 5c of the third embodiment, but also to the side face step layer 5d.
  • the distance between the electrode layer 10 and the step layer 5 can be the distance in the length direction L between the adjacent side extensions 12e, 12f and the side step layer 5d. Furthermore, the distance between the electrode layer 10 and the step layer 5 can be the distance in the width direction W between the adjacent opposing portion 11 with the side exposed electrode layer 10d and the side step layer 5d.
  • the end surface step layer 5c can be provided on the same layer as the end surface exposed electrode layer 10c.
  • the distance between the electrode layer 10 and the step layer 5 can be the distance in the length direction L between the adjacent opposing portions 11 of the end surface exposed electrode layer 10c and the end surface step layer 5c.
  • the distance between the electrode layer 10 and the step layer 5 can be the distance in the width direction W between the adjacent end surface extensions 12c, 12d and the end surface step layer 5c.
  • the thickness of the step layer 5 in the height direction T has been mainly described.
  • the length of the step layer 5 in the length direction T has been mainly described.
  • the thickness of the step layer 5 in the height direction T may be the same as in the first embodiment, and the length of the step layer 5 in the length direction T may be the same as in the second embodiment.
  • the step layer 5 of the first or second embodiment may be applied to at least one of the end surface exposed electrode layer 10c and the side surface exposed electrode layer 10d.
  • the step layer 5 of the first embodiment may be applied to one of the end surface exposed electrode layer 10c and the side surface exposed electrode layer 10d
  • the step layer 5 of the second embodiment may be applied to the remaining other.
  • the step layer 5 combining the first and second embodiments may be applied to at least one of the end surface exposed electrode layer 10c and the side surface exposed electrode layer 10d. In this manner, the above-described embodiments can be combined in various ways.
  • the electrode paste and the step paste are applied to the ceramic green sheet in a desired pattern.
  • the application of each paste to the ceramic green sheet can be performed by, for example, screen printing, gravure printing, or the like.
  • the electrode paste and the step paste are printed in a predetermined pattern on the ceramic green sheet by any printing method. In this way, a ceramic green sheet for the inner layer portion 53 on which the paste is printed is obtained.
  • the distance in the length direction between the step layer and the internal electrode layer can be controlled by changing the position where the step paste is applied.
  • a predetermined number of ceramic green sheets on which the pattern of the internal electrode layer 10 is not printed are laminated. This creates a portion corresponding to the outer layer portion 54.
  • ceramic green sheets for the inner layer portion 53 coated with paste are laminated in sequence. This creates a portion corresponding to the inner layer portion 53.
  • a predetermined number of ceramic green sheets for the other outer layer portion 54 are laminated. This creates a laminated sheet. The laminated sheet is pressed in the height direction by means of a hydrostatic press or the like to create a laminated block.
  • the laminated block is cut to a predetermined size to cut out laminated chips. At this time, corners and edges of the laminated chips may be rounded by barrel polishing or the like.
  • the laminated chip is fired to produce the laminate 2.
  • the firing temperature depends on the materials of the ceramic layers 4 and the internal electrode layers 10, but is preferably 900° C. or higher and 1400° C. or lower.
  • the external electrodes 20 are formed.
  • (Base layer) A conductive paste that will become the underlayer 21 is applied to the two end faces 62 of the laminate 2 to form the underlayer 21 .
  • a conductive paste containing a glass component and a metal is applied by a method such as dipping.
  • a baking process is performed to form the underlayer 21.
  • the baking temperature is preferably 500° C. or higher and 900° C. or lower.
  • the baking time is preferably 30 minutes or higher and 2 hours or lower.
  • the baking atmosphere is preferably a reducing atmosphere containing, for example, H 2 O or H 2 .
  • a plating layer 23 is formed on the surface of the base layer 21.
  • a Ni plating layer is formed on the baked layer. This Ni plating layer becomes the inner plating layer 23a.
  • a Sn plating layer is formed on the Ni plating layer. This Sn plating layer becomes the surface plating layer 23b.
  • the Ni plating layer and the Sn plating layer are formed in sequence, for example, by barrel plating. In this manner, the multilayer ceramic electronic component 1 is obtained.
  • external electrodes 20 are formed on the two side faces 63 in addition to the two end faces 62 of the laminate 2.
  • the length and thickness of the ceramic layers 4 and the internal electrode layers 10 can be measured, for example, by observing the cross section of the laminate 2 exposed by polishing with a scanning electron microscope. Each value can be an average value of the measured values at a plurality of points corresponding to the portion to be measured.
  • the length of each part of the laminate 2 can be measured with a micrometer or an optical microscope.
  • the step layer becomes thicker as it approaches the first main surface. At this time, the distance between the first internal electrode layer and the first internal electrode layer closest to the first main surface becomes thicker as it approaches the first main surface.
  • the coverage can be measured, for example, as follows.
  • the internal electrode layer 10 includes hollow portions where no metal is present.
  • the ratio of the metal to the internal electrode layer 10 is defined as the coverage.
  • the coverage is defined as metal/(metal+(cavity or ceramic material)). That is, the entire internal electrode layer 10 is the sum of (i) the metal, (ii) the part that is not filled with ceramic material and exists as a cavity, and (iii) the part in which the cavity is filled with ceramic material.
  • the ratio of (i) the metal to the entire internal electrode layer 10 is defined as the coverage.
  • coverage can be performed in the following manner. First, the laminate 2 is polished to expose the cross section at the location where coverage is to be measured. The exposed surface is then observed with an optical microscope or the like to determine the area of the metal within a specified range. The coverage is calculated based on the determined area. Note that the coverage can also be calculated by averaging values determined at multiple locations.

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