WO2024114266A1 - Csp滤波器的封装结构、制备方法、电路结构和电子设备 - Google Patents

Csp滤波器的封装结构、制备方法、电路结构和电子设备 Download PDF

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Publication number
WO2024114266A1
WO2024114266A1 PCT/CN2023/128672 CN2023128672W WO2024114266A1 WO 2024114266 A1 WO2024114266 A1 WO 2024114266A1 CN 2023128672 W CN2023128672 W CN 2023128672W WO 2024114266 A1 WO2024114266 A1 WO 2024114266A1
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WIPO (PCT)
Prior art keywords
substrate
chip body
annular protrusion
filter
packaging structure
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PCT/CN2023/128672
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English (en)
French (fr)
Inventor
洪胜平
林红宽
周斌
葛恒东
余财祥
Original Assignee
唯捷创芯(天津)电子技术股份有限公司
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Publication of WO2024114266A1 publication Critical patent/WO2024114266A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters

Definitions

  • the invention relates to a packaging structure of a CSP filter, and also relates to a preparation method of the packaging structure, and a circuit structure and electronic equipment comprising the packaging structure, belonging to the technical field of semiconductor packaging.
  • Filters can be divided into many types according to different implementation methods, such as LC filters, cavity filters, acoustic filters, dielectric filters, etc.
  • CSP Chip Scale Package
  • the primary technical problem to be solved by the present invention is to provide a packaging structure of a CSP filter.
  • Another technical problem to be solved by the present invention is to provide a method for preparing a packaging structure of a CSP filter.
  • Another technical problem to be solved by the present invention is to provide a circuit structure.
  • Another technical problem to be solved by the present invention is to provide an electronic device.
  • a packaging structure of a CSP filter comprising:
  • a filter chip body wherein an interdigital transducer is provided on the surface of the filter chip body, an annular protrusion is provided on the outer side of the interdigital transducer, a plurality of first protrusions are provided on the outer side of the annular protrusion, and the plurality of first protrusions are arranged at intervals;
  • the filter chip body is mounted on the surface of the substrate so that the end surface of the annular protrusion is in contact with the surface of the substrate, and the end surfaces of the plurality of first protrusions are respectively in contact with the The surface of the substrate is fitted together; wherein the annular protrusion, the surface of the substrate and the surface of the filter chip body are jointly arranged to form a closed accommodating cavity for accommodating the interdigital transducer; the end faces of the plurality of first protrusions are respectively welded and fixed to the surface of the substrate;
  • a plastic package body is plastic-packaged on the surface of the substrate to cover the filter chip body and fill the gap between two adjacent first convex pillars.
  • the packaging structure further includes a functional chip body
  • the functional chip body is mounted on the surface of the substrate, and a plurality of second convex pillars are extended toward the substrate from a side of the functional chip body close to the substrate surface, and the plurality of second convex pillars are arranged at intervals;
  • the plastic packaging body is plastic-sealed on the surface of the substrate to cover the filter chip body and the functional chip body, and fill the gap between two adjacent first convex pillars and the gap between two adjacent second convex pillars.
  • the annular protrusion includes a plurality of strip-shaped protrusions, and the plurality of strip-shaped protrusions are sequentially connected end to end to form a preset shape.
  • the preset shape is the same as the shape of the interdigital transducer.
  • a ring-shaped area is preset on the surface of the filter chip body, and the ring-shaped area extends toward the surface of the substrate by a preset length to form the ring-shaped protrusion; wherein the interdigital transducer is located in the ring-shaped area.
  • the width of the preset gap is smaller than the particle diameter of the molding material forming the molding body.
  • the molding material of the molding body at least satisfies: the particle diameter of the molding material is larger than a preset diameter; and/or the flow velocity of the molding material is smaller than a preset flow velocity; and/or the viscosity of the molding material is larger than a preset viscosity.
  • a method for preparing a packaging structure of a CSP filter comprising the following steps:
  • An interdigital transducer is arranged on the surface of the filter chip body
  • the plurality of first convex pillars and the plurality of second convex pillars are respectively welded and fixed on the surface of the substrate;
  • the molding material is molded on the surface of the substrate to completely cover the filter chip body and the functional chip body, and the molding material is filled in the gap between two adjacent first convex pillars and the gap between two adjacent second convex pillars, thereby forming a packaging structure of the CSP filter.
  • a circuit structure comprising the packaging structure of the above-mentioned CSP filter.
  • an electronic device comprising the packaging structure of the CSP filter described above.
  • the present invention has the following technical effects:
  • the plastic encapsulation material can be filled in the gap between two adjacent first convex pillars and the gap between two adjacent second convex pillars, so that the plastic encapsulation material can be used to form an underfill protection for the first convex pillars and the second convex pillars.
  • the first convex pillars and the second convex pillars will not have local cracks, which greatly improves the reliability of the packaging structure.
  • the size and shape of the annular protrusion is the same as that of the IDT, so that the IDT can be sealed with an optimal size, reducing the space occupied by the annular protrusion on the filter chip body.
  • the plastic sealing material of the plastic sealing body meets the preset conditions, thereby reducing the possibility of the plastic sealing material entering the accommodating cavity and ensuring the plastic sealing effect.
  • FIG1 is a schematic diagram of the overall structure of a packaging structure of a CSP filter provided by a first embodiment of the present invention
  • FIG2 is a schematic diagram of the structure of the packaging structure of the CSP filter omitting the plastic package body in the first embodiment of the present invention
  • FIG3 is a schematic structural diagram of the filter chip from another angle in the first embodiment of the present invention.
  • FIG4 is a schematic diagram of the overall structure of another packaging structure of a CSP filter provided by a second embodiment of the present invention.
  • FIG. 5 is a flow chart of a method for preparing a packaging structure of a CSP filter provided in accordance with a third embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a circuit structure provided by a fourth embodiment of the present invention.
  • FIG1 shows a packaging structure of a CSP filter provided by the first embodiment of the present invention, comprising a substrate 1, a filter chip 2, a functional chip 3 and a plastic package 4.
  • the filter chip 2 and the functional chip 3 are mounted on the substrate 1 together to cooperate with each other to achieve the transmission of sound waves; the plastic package 4 is used to plastic-package the filter chip 2 and the functional chip 3.
  • the filter chip 2 includes a filter chip body 21, an interdigital transducer 22, an annular protrusion 23 and a plurality of first protrusions 24.
  • the filter chip body 21 is mostly a wafer, and an interdigital transducer 22 is provided on the surface of the filter chip body 21, and an annular protrusion 23 is provided around the outer side of the interdigital transducer 22, and a plurality of first protrusions 24 are provided around the outer side of the annular protrusion 23, and a plurality of first protrusions 24 are arranged at intervals.
  • the height of the annular protrusion 23 in the Z direction in FIG1 is the same as the height of the first protrusion 24 in the Z direction.
  • the filter chip body 21 When specifically packaged, the filter chip body 21 is mounted on the surface of the substrate 1 so that the end face of the annular protrusion 23 fits with the surface of the substrate 1, and the end faces of the plurality of first protrusions 24 fit with the surface of the substrate 1 respectively.
  • the annular protrusion 23, the surface of the substrate 1 and the surface of the filter chip body 21 are jointly enclosed to form a closed accommodating cavity, and the interior of the accommodating cavity forms a closed accommodating cavity 201, so that the interdigital transducer 22 can be accommodated in the accommodating cavity 201.
  • the end faces of the plurality of first protrusions 24 are respectively welded and fixed to the surface of the substrate 1, thereby limiting the relative position of the filter chip body 21 and the substrate 1, and preventing the filter chip body 21 from changing position during the packaging process.
  • the first protrusions 24 can also play a supporting role to ensure the stability of the packaging of the filter chip body 21.
  • the function chip 3 includes a function chip body 31 and a plurality of second convex pillars 32 formed on the surface of the function chip body 31.
  • the plurality of second convex pillars 32 are arranged at intervals, and the function of the second convex pillars 32 is similar to that of the first convex pillars 24.
  • the shape, number, height and other features of the second convex pillars 32 can be the same as or different from those of the first convex pillars 24; and the spacing between two adjacent second convex pillars 32 can be the same as or different from the spacing between two adjacent first convex pillars 24, and can be adaptively selected according to needs.
  • the plastic encapsulation body 4 is plastic encapsulated on the surface of the substrate 1 to cover the filter chip 2 and the functional chip 3, and fill the gap between two adjacent first convex pillars 24 and the gap between two adjacent second convex pillars 32.
  • the plastic encapsulation material can be filled in the gap between two adjacent first convex pillars 24 and the gap between two adjacent second convex pillars 32, so that the plastic encapsulation material can be used to form an underfill protection for the first convex pillars 24 and the second convex pillars 32.
  • the first convex pillars 24 and the second convex pillars 32 will not have local cracks, which greatly improves the reliability of the packaging structure.
  • the annular protrusion 23 includes a plurality of strip protrusions 231, and the plurality of strip protrusions 231 are connected end to end in sequence to form a preset shape together.
  • the annular protrusion 23 is in a square ring shape. It can be understood that in order to save the space occupied by the annular protrusion 23, the size and shape of the annular protrusion 23 are the same as the shape of the interdigital transducer 22.
  • the annular protrusion 23 is also rectangular, and the four strip protrusions 231 forming the annular protrusion 23 correspond to the four sides of the interdigital transducer 22 respectively (that is, each strip protrusion 231 is slightly longer than one side of the corresponding interdigital transducer 22), so that the interdigital transducer 22 can be sealed with the optimal size.
  • the shape of the annular protrusion 23 also needs to be adaptively changed.
  • the IDT 22 is circular, and the plurality of strip protrusions 231 need to be replaced with arc-shaped protrusions, so that the plurality of arc-shaped protrusions are used to form a circular shape, thereby sealing the IDT 22 with an optimal size.
  • the annular protrusion 23 can be formed by surrounding a plurality of strip protrusions 231, or it can be formed in one piece.
  • the surface of the filter chip body 21 is preset with an annular area, and the annular area extends toward the surface of the substrate 1 by a preset length to form the annular protrusion 23; wherein the interdigital transducer 22 is located in the annular area.
  • the molding material of the molding body 4 cannot enter the accommodating cavity 201 accommodating the interdigital transducer 22 through the preset gap.
  • the encapsulation material of the encapsulation body 4 should meet at least one of the following conditions: first, the particle diameter of the encapsulation material is greater than the preset diameter; second, the flow rate of the encapsulation material is less than the preset flow rate; third, the viscosity of the encapsulation material is greater than the preset viscosity. It can be understood that when the particle diameter of the encapsulation material is larger, it is less likely to flow into the accommodating cavity 201 through the preset gap, and vice versa, it is easier to flow into the accommodating cavity 201.
  • the flow rate of the encapsulation material is slower, it is less likely to flow into the accommodating cavity 201 through the preset gap, and vice versa, it is easier to flow into the accommodating cavity 201.
  • the viscosity of the encapsulation material is greater, it is less likely to flow into the accommodating cavity 201 through the preset gap, and vice versa, it is easier to flow into the accommodating cavity 201. Therefore, when selecting the encapsulation material, materials with larger particle diameters, slower flow rates, and greater viscosity should be selected as much as possible, so as to reduce the possibility of the encapsulation material entering the accommodating cavity 201 during the encapsulation process to avoid contaminating the filter. It can be understood that the three conditions listed in this embodiment are only preferred selection conditions. In other embodiments, other selection conditions can be added. Moreover, the more conditions the plastic encapsulation material meets, the better the plastic encapsulation effect.
  • the plastic encapsulation material can be adaptively selected according to actual plastic encapsulation requirements.
  • a packaging structure of a CSP filter is provided in the second embodiment of the present invention.
  • the difference of this embodiment is that the functional chip 3 is omitted in this embodiment, and only the filter chip 2 is included.
  • the third embodiment of the present invention provides a method for preparing a packaging structure of a CSP filter, which specifically includes steps S1 to S4:
  • the functional chip 3 is formed by growing a plurality of second convex pillars 32 spaced apart from each other on the surface of the functional chip body 31. It is understandable that the step S2 and the step S1 have no sequence and can be performed simultaneously to improve production efficiency.
  • the filter chip 2 and the function chip 3 are mounted together on the surface of the substrate 1, so that the annular protrusion 23, the plurality of first protrusions 24 and the plurality of second protrusions 32 are all in contact with the surface of the substrate 1. Then, the plurality of first protrusions 24 and the plurality of second protrusions 32 are respectively welded and fixed on the surface of the substrate 1 to fix the relative positions of the filter chip 2 and the function chip 3.
  • the molding material is molded on the surface of the substrate 1 to completely cover the filter chip 2 and the functional chip 3, and the molding material fills the gap between two adjacent first convex pillars 24 and the gap between two adjacent second convex pillars 32, thereby forming a packaging structure of the CSP filter.
  • the fourth embodiment of the present invention further provides a circuit structure, which includes a circuit board 100, and a packaging structure 101 of a plurality of the above-mentioned CSP filters mounted on the circuit board 100, and/or other discrete components 102, 103.
  • the fifth embodiment of the present invention further provides an electronic device, which includes the packaging structure of the above-mentioned CSP filter and can be a smart phone, a tablet computer, a wearable electronic device, a smart connected car, etc.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

本发明公开了一种CSP滤波器的封装结构、制备方法、电路结构和电子设备。该封装结构包括基板；滤波器芯片体，表面上设有叉指换能器，叉指换能器的外侧围设有环形凸起部，环形凸起部的外侧围设有多个间隔设置的第一凸柱；滤波器芯片体贴装于基板的表面，以使环形凸起部与基板的表面相贴合，形成用于容纳叉指换能的容纳腔体；并使多个第一凸柱的端面分别与基板的表面相贴合，以与基板焊接固定；塑封体，塑封于基板的表面，以覆盖滤波器芯片体并填充于相邻两个第一凸柱之间的缝隙。该封装结构能够在塑封过程中，利用塑封材料对第一凸柱形成底填保护，在经过冷热冲击等可靠性测试后，第一凸柱不会出现局部裂纹的情况，提高了封装结构的可靠性。

Description

CSP滤波器的封装结构、制备方法、电路结构和电子设备 技术领域
本发明涉及一种CSP滤波器的封装结构，同时也涉及该封装结构的制备方法，以及包括该封装结构的电路结构和电子设备，属于半导体封装技术领域。
背景技术
滤波器根据实现方式的不同可以分为很多种，比如LC滤波器、腔体滤波器、声学滤波器、介质滤波器等，而在移动通信领域，由于便携式电子设备的尺寸普遍较小、功率较低，因此需要小体积、高性能的声学滤波器。目前，主流的封装工艺是CSP(Chip Scale Package，芯片级封装)，即将压电芯片、基板、金属球、树脂封装膜通过倒装和树脂封装工艺进行CSP封装，以实现电信号与机械信号的传输和器件的封装保护。
发明内容
本发明所要解决的首要技术问题在于提供一种CSP滤波器的封装结构。
本发明所要解决的另一技术问题在于提供一种CSP滤波器的封装结构的制备方法。
本发明所要解决的又一技术问题在于提供一种电路结构。
本发明所要解决的再一技术问题在于提供一种电子设备。
为实现上述技术目的，本发明采用以下的技术方案：
根据本发明实施例的第一方面，提供一种CSP滤波器的封装结构，包括：
基板；
滤波器芯片体，所述滤波器芯片体的表面上设有叉指换能器，所述叉指换能器的外侧围设有环形凸起部，所述环形凸起部的外侧围设有多个第一凸柱，且所述多个第一凸柱间隔设置；
所述滤波器芯片体贴装于所述基板的表面，以使所述环形凸起部的端面与所述基板的表面相贴合，并使所述多个第一凸柱的端面分别与所 述基板的表面相贴合；其中，所述环形凸起部、所述基板的表面和所述滤波器芯片体的表面共同围设成封闭的容纳腔体，以用于容纳所述叉指换能器；所述多个第一凸柱的端面分别与所述基板的表面焊接固定；
塑封体，塑封于所述基板的表面，以覆盖所述滤波器芯片体并填充于相邻两个所述第一凸柱之间的缝隙。
其中较优地，所述封装结构还包括功能芯片体；
所述功能芯片体贴装于所述基板的表面，且所述功能芯片体的靠近所述基板表面的一侧朝向所述基板延伸出多个第二凸柱，所述多个第二凸柱间隔设置；
所述塑封体塑封于所述基板的表面，以覆盖所述滤波器芯片体和所述功能芯片体，并填充于相邻两个所述第一凸柱之间的缝隙和相邻两个所述第二凸柱之间的缝隙。
其中较优地，所述环形凸起部包括多个条形凸起，所述多个条形凸起依次首尾相连，以共同围设成预设形状。
其中较优地，所述预设形状与所述叉指换能器的形状相同。
其中较优地，所述滤波器芯片体的表面预设有环形区域，所述环形区域朝向所述基板的表面延伸预设长度，以形成所述环形凸起部；其中，所述叉指换能器位于所述环形区域内。
其中较优地，所述环形凸起部的端面与所述基板的表面之间具有预设间隙，所述预设间隙的宽度小于形成所述塑封体的塑封材料的颗粒直径。
其中较优地，所述塑封体的塑封材料至少满足：所述塑封材料的颗粒直径大于预设直径；和/或，所述塑封材料的流动速度小于预设流速；和/或，所述塑封材料的粘性大于预设粘性。
根据本发明实施例的第二方面，提供一种CSP滤波器的封装结构的制备方法，包括以下步骤：
在滤波器芯片体的表面设置叉指换能器；
在所述叉指换能器的外侧生长环形凸起部，以使所述叉指换能器位于所述环形凸起部内；
在所述环形凸起部的外侧生长多个相互间隔的第一凸柱；
在功能芯片体的表面生长多个相互间隔的第二凸柱；
将所述滤波器芯片体和所述功能芯片体共同贴装于基板的表面，以使所述环形凸起部、多个第一凸柱和多个第二凸柱均与所述基板的表面相贴合；
将所述多个第一凸柱和所述多个第二凸柱分别焊接固定在所述基板的表面；
将塑封材料塑封于所述基板的表面，以完全覆盖所述滤波器芯片体和所述功能芯片体，并使得塑封材料填充于相邻两个所述第一凸柱之间的缝隙和相邻两个所述第二凸柱之间的缝隙，从而形成CSP滤波器的封装结构。
根据本发明实施例的第三方面，提供一种电路结构，包括上述CSP滤波器的封装结构。
根据本发明实施例的第四方面，提供一种电子设备，包括上述CSP滤波器的封装结构。
与现有技术相比较，本发明具有以下的技术效果：
1.塑封过程中，在保证滤波器芯片能够形成用于容纳叉指换能器的封闭式容纳腔体的前提下，使得塑封材料能够填充于相邻两个第一凸柱之间的缝隙和相邻两个第二凸柱之间的缝隙，从而可以利用塑封材料对第一凸柱和第二凸柱形成底填保护，在经过冷热冲击等可靠性测试后，第一凸柱和第二凸柱不会出现局部裂纹的情况，极大提高了封装结构的可靠性。
2.环形凸起部的尺寸形状与叉指换能器的形状相同，从而能够以最优尺寸对叉指换能器进行密封，减小环形凸起部在滤波器芯片体上的占用空间。
3.塑封体的塑封材料满足预设的条件，从而减少塑封材料进入容纳空腔的可能性，保证塑封效果。
附图说明
图1为本发明第一实施例提供的一种CSP滤波器的封装结构的整体结构示意图；
图2为本发明第一实施例中，CSP滤波器的封装结构省略塑封体的结构示意图；
图3为本发明第一实施例中，滤波器芯片另一个角度的结构示意图；
图4为本发明第二实施例提供的另一种CSP滤波器的封装结构的整体结构示意图；
图5为本发明第三实施例提供的又一种CSP滤波器的封装结构的制备方法的流程图；
图6为本发明第四实施例提供的一种电路结构的结构示意图。
具体实施方式
下面结合附图和具体实施例对本发明的技术内容进行详细具体的说明。
<第一实施例>
图1所示本发明第一实施例提供的一种CSP滤波器的封装结构，包括基板1、滤波器芯片2、功能芯片3和塑封体4。其中，滤波器芯片2和功能芯片3共同贴装于基板1上，以相互配合使用，从而实现声波的传输；塑封体4用于对滤波器芯片2、功能芯片3进行塑封。
如图2所示，滤波器芯片2包括滤波器芯片体21、叉指换能器22、环形凸起部23和多个第一凸柱24。具体的，滤波器芯片体21多为晶圆，在该滤波器芯片体21的表面上设有叉指换能器22，叉指换能器22的外侧围设有环形凸起部23，环形凸起部23的外侧围设有多个第一凸柱24，且多个第一凸柱24间隔设置。本实施例中，环形凸起部23在图1中Z方向的高度与第一凸柱24在Z方向的高度相同，具体封装时，将该滤波器芯片体21贴装于基板1的表面，以使得环形凸起部23的端面与基板1的表面相贴合，并使得多个第一凸柱24的端面分别与基板1的表面相贴合。由此，通过环形凸起部23、基板1的表面和滤波器芯片体21的表面共同围设成封闭的容纳腔体，该容纳腔体的内部形成封闭的容纳空腔201，以使得叉指换能器22能够容纳于该容纳空腔201内。并且，多个第一凸柱24的端面分别与基板1的表面焊接固定，从而限制滤波器芯片体21与基板1的相对位置，避免滤波器芯片体21在封装过程中改变位置。此外，该第一凸柱24还能够起到支撑作用，以保证滤波器芯片体21封装的稳定性。
如图2所示，功能芯片3包括功能芯片体31和形成于功能芯片体31表面的多个第二凸柱32。其中，多个第二凸柱32间隔设置，且第二凸柱32的作用与第一凸柱24的作用类似，通过将多个第二凸柱32分别焊接 固定在基板1的表面，一方面能够对功能芯片体31进行限位固定，另一方面能够对功能芯片体31进行稳定支撑。此外，可以理解的是，该第二凸柱32的形状、数量、高度等特征可以可以与第一凸柱24相同，也可以不同；并且，相邻两个第二凸柱32之间的间距可以与相邻两个第一凸柱24之间的间距相同，也可以不同，具体可根据需要进行适应性选择。
如图1所示，塑封体4塑封于基板1的表面，以覆盖滤波器芯片2和功能芯片3，并填充于相邻两个第一凸柱24之间的缝隙和相邻两个第二凸柱32之间的缝隙。由此，利用塑封材料进行塑封的过程中，在保证滤波器芯片2能够形成用于容纳叉指换能器22的封闭式容纳腔体的前提下，使得塑封材料能够填充于相邻两个第一凸柱24之间的缝隙和相邻两个第二凸柱32之间的缝隙，从而可以利用塑封材料对第一凸柱24和第二凸柱32形成底填保护，在经过冷热冲击等可靠性测试后，第一凸柱24和第二凸柱32不会出现局部裂纹的情况，极大提高了封装结构的可靠性。
如图3所示，在上述实施例中，优选地，环形凸起部23包括多个条形凸起231，多个条形凸起231依次首尾相连，以共同围设成预设形状。具体的，本实施例中，条形凸起231为四个，四个条形凸起231依次首尾相连以围设成矩形形状，即：该环形凸起部23呈方形环状。可以理解的是，为节省环形凸起部23的占用空间，该环形凸起部23的尺寸形状与叉指换能器22的形状相同，由于本实施例中的叉指换能器22为矩形形状，因此，该环形凸起部23也为矩形形状，并且，形成该环形凸起部23的四个条形凸起231分别与叉指换能器22的四条边相对应(即：每一个条形凸起231均比相对应的叉指换能器22的一条边略长)，从而能够以最优尺寸对叉指换能器22进行密封。
可以理解的是，当叉指换能器22的形状改变后，则环形凸起部23的形状也需要适应性改变。例如：在一实施例中，叉指换能器22呈圆形形状，则多个条形凸起231需要替换为弧形凸起，从而利用多个弧形凸起共同围设成圆形形状，进而以最优尺寸对叉指换能器22进行密封。
此外，在上述实施例中，环形凸起部23除了可以利用多个条形凸起231围设成形外，还可以一体成型。例如：在另一实施例中，滤波器芯片体21的表面预设有环形区域，该环形区域朝向基板1的表面延伸预设长度，以形成环形凸起部23；其中，叉指换能器22位于环形区域内。由此， 通过滤波器芯片体21的表面直接生长环形凸起部23，从而能够避免相邻两个条形凸起231之间的连接缝隙，提高了用于容纳叉指换能器22的容纳腔体的密封性，保证了叉指换能器22使用的安全性。
在上述实施例中，优选地，环形凸起部23的端面与基板1的表面之间具有预设间隙，该预设间隙的宽度小于形成塑封体4的塑封材料的颗粒直径。由此，塑封体4的塑封材料无法通过该预设间隙进入到容纳叉指换能器22的容纳空腔201内。
此外，优选地，该塑封体4的塑封材料应至少满足以下条件之一：第一.塑封材料的颗粒直径大于预设直径；第二.塑封材料的流动速度小于预设流速；第三.塑封材料的粘性大于预设粘性。可以理解的是，当塑封材料的颗粒直径越大时，则越不容易通过该预设间隙流入容纳空腔201内，反之，则越容易流入容纳空腔201内。类似的，当塑封材料的流动速度越慢时，则越不容易通过该预设间隙流入容纳空腔201内，反之，则越容易流入容纳空腔201内。当塑封材料的粘性越大时，则越不容易通过该预设间隙流入容纳空腔201内，反之，则越容易流入容纳空腔201内。因此，在选择塑封材料时，应尽可能选择颗粒直径较大、流动速度较慢、粘性较大的材料，从而能够在塑封过程中，减少塑封材料进入容纳空腔201的可能性，以避免污染滤波器。可以理解的是，本实施例中列举的三种条件仅为较优的选择条件，在其他实施例中，还可以新增其他的选择条件，并且，塑封材料满足的条件越多，则塑封效果越好，具体可根据实际塑封需求对塑封材料进行适应性选择即可。
<第二实施例>
如图4所示，为本发明第二实施例提供的一种CSP滤波器的封装结构，与第一实施例相比，本实施例的区别之处在于，本实施例中省略了功能芯片3，仅包含滤波器芯片2。
本实施例除上述区别之外，其余结构与第一实施例均相同，在此不再赘述。
<第三实施例>
如图5所示，在第一实施例的基础上，本发明第三实施例提供一种CSP滤波器的封装结构的制备方法，具体包括步骤S1～S4：
S1：预制滤波器芯片2。
具体包括步骤S11～S13：
S13：在滤波器芯片体21的表面设置叉指换能器22；
S13：在叉指换能器22的外侧生长环形凸起部23，以使叉指换能器22位于环形凸起部23内；
S13：在环形凸起部23的外侧生长多个相互间隔的第一凸柱24，以形成该滤波器芯片2。
S2：预制功能芯片3。
具体的，通过在功能芯片体31的表面生长多个相互间隔的第二凸柱32，从而形成该功能芯片3。可以理解的是，该步骤S2与步骤S1没有先后顺序，可同时进行以提高生产效率。
S3：贴装芯片。
具体的，将滤波器芯片2和功能芯片3共同贴装于基板1的表面，以使环形凸起部23、多个第一凸柱24和多个第二凸柱32均与基板1的表面相贴合。然后，将多个第一凸柱24和多个第二凸柱32分别焊接固定在基板1的表面，以固定滤波器芯片2和功能芯片3的相对位置。
S4：塑封。
具体的，将塑封材料塑封于基板1的表面，以完全覆盖滤波器芯片2和功能芯片3，并使得塑封材料填充于相邻两个第一凸柱24之间的缝隙和相邻两个第二凸柱32之间的缝隙，从而形成CSP滤波器的封装结构。
<第四实施例>
如图6所示，在第一实施例的基础上，本发明第四实施例还提供一种电路结构，该电路结构包括电路板100，以及安装在电路板100上的多个上述CSP滤波器的封装结构101，和/或其他分立元器件102、103。
<第五实施例>
在第一实施例的基础上，本发明第五实施例还提供一种电子设备，该电子设备包括上述CSP滤波器的封装结构，可以是智能手机、平板电脑、可穿戴电子设备、智能网联汽车等。
上面对本发明所提供的CSP滤波器的封装结构、制备方法、电路结构和电子设备进行了详细的说明。对本领域的一般技术人员而言，在不背离本发明实质内容的前提下对它所做的任何显而易见的改动，都将构成对本发明专利权的侵犯，将承担相应的法律责任。

Claims (10)

  1. 一种CSP滤波器的封装结构，其特征在于包括：
    基板；
    滤波器芯片体，所述滤波器芯片体的表面上设有叉指换能器，所述叉指换能器的外侧围设有环形凸起部，所述环形凸起部的外侧围设有多个第一凸柱，且所述多个第一凸柱间隔设置；
    所述滤波器芯片体贴装于所述基板的表面，以使所述环形凸起部的端面与所述基板的表面相贴合，并使所述多个第一凸柱的端面分别与所述基板的表面相贴合；其中，所述环形凸起部、所述基板的表面和所述滤波器芯片体的表面共同围设成封闭的容纳腔体，以用于容纳所述叉指换能器；所述多个第一凸柱的端面分别与所述基板的表面焊接固定；
    塑封体，塑封于所述基板的表面，以覆盖所述滤波器芯片体并填充于相邻两个所述第一凸柱之间的缝隙。
  2. 如权利要求1所述的封装结构，其特征在于还包括功能芯片体；
    所述功能芯片体贴装于所述基板的表面，且所述功能芯片体的靠近所述基板表面的一侧朝向所述基板延伸出多个第二凸柱，所述多个第二凸柱间隔设置；
    所述塑封体塑封于所述基板的表面，以覆盖所述滤波器芯片体和所述功能芯片体，并填充于相邻两个所述第一凸柱之间的缝隙和相邻两个所述第二凸柱之间的缝隙。
  3. 如权利要求1所述的封装结构，其特征在于：
    所述环形凸起部包括多个条形凸起，所述多个条形凸起依次首尾相连，以共同围设成预设形状。
  4. 如权利要求3所述的封装结构，其特征在于：
    所述预设形状与所述叉指换能器的形状相同。
  5. 如权利要求1所述的封装结构，其特征在于：
    所述滤波器芯片体的表面预设有环形区域，所述环形区域朝向所述基板的表面延伸预设长度，以形成所述环形凸起部；其中，所述叉指换能器位于所述环形区域内。
  6. 如权利要求1所述的封装结构，其特征在于：
    所述环形凸起部的端面与所述基板的表面之间具有预设间隙，所述预设间隙的宽度小于形成所述塑封体的塑封材料的颗粒直径。
  7. 如权利要求6所述的封装结构，其特征在于：
    所述塑封体的塑封材料至少满足：所述塑封材料的颗粒直径大于预设直径；和/或，所述塑封材料的流动速度小于预设流速；和/或，所述塑封材料的粘性大于预设粘性。
  8. 一种CSP滤波器的封装结构的制备方法，其特征在于包括以下步骤：
    在滤波器芯片体的表面设置叉指换能器；
    在所述叉指换能器的外侧生长环形凸起部，以使所述叉指换能器位于所述环形凸起部内；
    在所述环形凸起部的外侧生长多个相互间隔的第一凸柱；
    在功能芯片体的表面生长多个相互间隔的第二凸柱；
    将所述滤波器芯片体和所述功能芯片体共同贴装于基板的表面，以使所述环形凸起部、多个第一凸柱和多个第二凸柱均与所述基板的表面相贴合；
    将所述多个第一凸柱和所述多个第二凸柱分别焊接固定在所述基板的表面；
    将塑封材料塑封于所述基板的表面，以完全覆盖所述滤波器芯片体和所述功能芯片体，并使得塑封材料填充于相邻两个所述第一凸柱之间的缝隙和相邻两个所述第二凸柱之间的缝隙，从而形成CSP滤波器的封装结构。
  9. 一种电路结构，其特征在于包括权利要求1～7中任意一项所述的CSP滤波器的封装结构。
  10. 一种电子设备，其特征在于包括权利要求1～7中任意一项所述的CSP滤波器的封装结构。
PCT/CN2023/128672 2022-12-01 2023-10-31 Csp滤波器的封装结构、制备方法、电路结构和电子设备 WO2024114266A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0555303A (ja) * 1991-08-29 1993-03-05 Toshiba Corp 電子部品装置
JP2003032075A (ja) * 2001-07-12 2003-01-31 Toshiba Corp 弾性表面波デバイスとその製造方法
JP2004135192A (ja) * 2002-10-11 2004-04-30 Toyo Commun Equip Co Ltd 表面実装型ｓａｗデバイス
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CN217214708U (zh) * 2022-03-29 2022-08-16 江苏卓胜微电子股份有限公司 芯片封装结构

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