WO2024101224A1 - プローブおよび電気的接続装置 - Google Patents

プローブおよび電気的接続装置 Download PDF

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Publication number
WO2024101224A1
WO2024101224A1 PCT/JP2023/039278 JP2023039278W WO2024101224A1 WO 2024101224 A1 WO2024101224 A1 WO 2024101224A1 JP 2023039278 W JP2023039278 W JP 2023039278W WO 2024101224 A1 WO2024101224 A1 WO 2024101224A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe
contact
guide plate
contact film
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/039278
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
美佳 那須
美岬 豊田
孝幸 林▲崎▼
美菜子 高瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Priority to EP23888572.7A priority Critical patent/EP4617675A1/en
Priority to KR1020257014537A priority patent/KR20250079202A/ko
Priority to CN202380077062.XA priority patent/CN120153265A/zh
Publication of WO2024101224A1 publication Critical patent/WO2024101224A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections

Definitions

  • the present invention relates to a probe and an electrical connection device used to test the electrical characteristics of an object to be tested.
  • An electrical connection device including a probe is used to test the electrical characteristics of test objects such as semiconductor integrated circuits while they are in the wafer state.
  • one end of the probe is brought into contact with an electrode of the test object, and the other end of the probe is brought into contact with a terminal (hereinafter referred to as a "land") arranged on a printed circuit board or the like.
  • the land is electrically connected to a tester or other test device.
  • the object of the present invention is to provide a probe and electrical connection device that can achieve stable contact with the land.
  • the probe according to one aspect of the present invention comprises a columnar base material having a first end and a second end, with a polygonal cross section perpendicular to the axial direction, and a contact film covering the tip surface of the second end and the remaining side surfaces of the second end excluding the side surfaces facing the first direction among a plurality of side surfaces connected to the tip surface of the second end.
  • the end surface of the contact film covering the tip surface of the second end is a plane perpendicular to the axial direction.
  • the present invention provides a probe and electrical connection device that can make stable contact with the land.
  • FIG. 1 is a schematic diagram showing the configuration of a probe according to an embodiment of the present invention.
  • FIG. 2 is a schematic cross-sectional view taken along the line II-II of FIG.
  • FIG. 3 is a schematic perspective view showing a configuration of a second end portion of the probe according to the embodiment of the present invention.
  • FIG. 4 is a schematic perspective view showing a configuration of a second end portion of a probe according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram showing the configuration of an electrical connecting device according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram showing a state in which the probe and the land of the first comparative example are in contact with each other.
  • FIG. 7 is a schematic diagram showing a state in which the probe and the land are in contact with each other according to the embodiment of the present invention.
  • FIG. 8 is a schematic diagram showing a state in which probes without a tapered shape are arranged adjacent to each other.
  • FIG. 9 is a schematic diagram showing a state in which tapered probes are arranged adjacent to each other.
  • FIG. 10 is a schematic perspective view showing the configuration of the second end portion of the probe of the second comparative example.
  • the probe 1 is used to inspect the electrical characteristics of an object to be inspected.
  • the probe 1 comprises a base material 10 having a first end 11, which is one end that contacts an object to be inspected (not shown) during inspection, and a second end 12, which is the other end, and a contact film 13 that covers a part of the second end 12 of the base material 10.
  • the base material 10 has a columnar shape extending along the axial direction D3. When inspecting the object to be inspected, the second end 12 comes into contact with a land.
  • the base material 10 has a polygonal cross section perpendicular to the axial direction D3 (hereinafter, simply referred to as the "cross section").
  • the second end 12 has four side faces that connect to the tip surface 121. That is, the second end 12 has a first side face S1 facing the first direction D1, a second side face S2 facing the opposite side to the first direction D1, a third side face S3 facing the second direction D2 perpendicular to the first direction D1, and a fourth side face S4 facing the opposite side to the second direction D2.
  • a side face S when each of the first side face S1 to the fourth side face S4 is not limited, it will be referred to as a side face S.
  • the contact film 13 covers the remaining side surfaces of the second end 12, excluding the side surfaces facing the first direction D1, and the tip surface 121 of the second end 12, among the multiple side surfaces connected to the tip surface 121 of the second end 12.
  • the contact film 13 covers the remaining side surfaces S of the region of the second end 12 that connects to the tip surface 121 (hereinafter referred to as the "tip region 122"), excluding the first side surface S1 facing the first direction D1. That is, in the probe 1 having a rectangular cross section, the contact film 13 covers the second side surface S2, the third side surface S3, and the fourth side surface S4 of the tip region 122.
  • the contact film 13 covers the tip surface 121 of the second end 12.
  • the end surface 131 of the contact film 13 that covers the tip surface 121 of the second end 12 is a plane perpendicular to the axial direction D3.
  • the corners of the end face 131 of the contact film 13 are chamfered.
  • the contact film 13 shown in Figures 3 and 4 has a rounded chamfer at the connection point between the outer side and the end face 131 when viewed from the first direction D1.
  • the tip surface 121 of the second end 12 is a plane perpendicular to the axial direction D3. Furthermore, the tip region 122 covered by the contact film 13 is rectangular in side view from the first direction D1 and the second direction D2. Therefore, the end surface 131 of the contact film 13 covering the tip surface 121 of the second end 12 is a plane, and the portion of the contact film 13 covering the side surface S of the second end 12 is perpendicular to the end surface 131.
  • connection region the region of the second end 12 that is exposed to the outside of the contact film 13 and that connects to the tip region 122 (hereinafter referred to as the "connection region") has a tapered shape in which the cross section of the base material 10 gradually narrows toward the tip surface 121.
  • the side surface S of the connection region 123 whose extensions intersect with the tip surface 121 at an obtuse angle is also referred to as the "tapered side surface".
  • conductive materials such as metal materials are used for the base material 10 and the contact film 13.
  • the contact film 13 may be formed on the surface of the base material 10 by plating.
  • the materials of the base material 10 and the contact film 13 are selected so that the conductivity of the base material 10 and the contact film 13 is equal or higher than that of the base material 10.
  • the materials of the base material 10 and the contact film 13 are preferably used for the base material 10.
  • Gold (Au), silver (Ag), copper (Cu), other precious metals, etc. are preferably used for the contact film 13.
  • the probe 1 is used, for example, in an electrical connection device 100 shown in FIG. 5.
  • the probe 1 is held by a probe head 20.
  • a plurality of probes 1 are held in the probe head 20 by being inserted into guide holes in a first guide plate 21, a second guide plate 22, and a third guide plate 23 included in the probe head 20.
  • the first guide plate 21, the second guide plate 22, and the third guide plate 23 will be referred to as guide plates unless otherwise specified.
  • the probe head 20 has a configuration in which the first guide plate 21, the second guide plate 22, and the third guide plate 23 are arranged at a distance from each other in the surface normal direction (Z direction) of the main surfaces of the guide plates.
  • the first end 11 of the probe 1 comes into contact with an electrode pad (not shown) of the test object 2 when the test object 2 is being tested.
  • the contact film 13 covering the tip region 122 of the second end 12 of the probe 1 comes into contact with a land 31 of the substrate 30.
  • the land 31 is electrically connected to a test device such as an IC tester (not shown).
  • FIG. 5 is a side view seen from the Y direction perpendicular to both the X direction and the Z direction.
  • the shifted position of the guide holes is referred to as the "offset position”.
  • the direction in which the guide holes are shifted is also referred to as the "offset direction”.
  • the offset direction is the -X direction. Due to the offset position, the base material 10 of the probe 1 is curved inside the probe head 20. That is, in the hollow area 200 between the first guide plate 21 and the second guide plate 22, the base material 10 is curved due to elastic deformation.
  • the positions of the guide holes in the second guide plate 22 and the third guide plate 23 are aligned when viewed from the Z direction.
  • the guide holes of the first guide plate 21 and the second guide plate 22 are offset from each other, so that when the first end 11 of the probe 1 comes into contact with the test object 2, the probe 1 buckles in the hollow region 200. That is, when the probe 1 is in contact with the test object 2, the probe 1 is further curved by flexural deformation from the curved shape in the non-contact state in which the probe 1 is not in contact with the test object 2. As the probe 1 is further curved, it comes into contact with the test object 2 with a predetermined pressure. Therefore, the offset arrangement allows the electrical characteristics of the test object 2 to be stably measured using the probe 1. When the probe 1 is in a non-contact state, it has the elasticity to return to the shape it had before coming into contact with the test object 2.
  • the probe 1 is attached to the probe head 20 so that the first direction D1 is oriented in the same direction as the offset direction.
  • the first side S1 of the second end 12 that is not covered by the contact film 13 is oriented in the same direction as the offset direction. Therefore, as described below, it is possible to prevent the probe 1 from contacting a land other than the land that is the specified contact target (hereinafter referred to as the "target land").
  • the probe 1 is easily tilted in the offset direction due to the offset arrangement.
  • the probe 1 since a gap (clearance) is provided between the probe 1 and the guide hole in each of the X and Y directions, the probe 1 may tilt in a direction perpendicular to the offset direction, that is, in the Y direction.
  • the connection region 123 of the second end 12 tapered by making the third side surface S3 and the fourth side surface S4 facing the Y direction tapered side surfaces.
  • connection region 123 tapered, the contact area of the end surface 131 can be made smaller than the cross-sectional area of the base material 10, so that the pressing force of the probe 1 pressing the land 31 can be increased and the contact stability between the probe 1 and the land 31 can be improved.
  • the third side surface S3 and the fourth side surface S4 are tapered side surfaces.
  • side surface S of the connection region 123 is made into a tapered side surface.
  • all side surfaces S of the connection region 123 may be made into tapered side surfaces. This makes it possible to prevent contact between the probes 1 regardless of the direction in which the probes 1 are tilted.
  • only one side surface S facing the direction in which the probe 1 is likely to tilt may be made into a tapered side surface. This makes it possible to shorten the manufacturing process of the probe 1. Regardless of which side surface S is made into a tapered side surface, by reducing the area of the tip surface 121 of the second end portion 12, it is possible to prevent contact between adjacent probes 1 even if the probes 1 are misaligned.
  • the tip region 122 of the second end 12 is covered with the contact film 13, and the end surface 131 of the contact film 13 is flat. Therefore, with the probe 1, the contact between the second end 12 and the land can be stabilized compared to the probe of the second comparative example shown in FIG. 10 in which the contact member 15 that contacts the land is embedded in the second end 12. That is, in the probe of the second comparative example, the contact with the land is point contact.
  • the contact with the land is surface contact. Therefore, the contact between the probe 1 and the land is stable. As a result, good electrical conduction between the test object and the land can be achieved.
  • the plated contact film 13 is less likely to peel off from the base material 10 than a tapered shape in which the cross section of the base material becomes wider as the side surface S moves away from the end surface 131, and the durability of the probe 1 can be improved.
  • the probe 1 requires that the contact film 13 be durable because it repeatedly comes into contact with the land, but because all side surfaces S are perpendicular to the end surface 131, the contact film 13 is less likely to peel off, which increases the durability of the probe 1.
  • the tip region 122 of the second end 12 is covered by the contact film 13 whose end surface 131 is flat. Therefore, the probe 1 can stably contact the second end 12 with the land. Furthermore, in the electrical connection device 100 including the probe 1, the contact film 13 is not disposed on the first side surface S1 of the tip region 122 that is parallel to the offset direction of the probe 1. Therefore, the electrical connection device 100 can prevent the probe 1 from contacting an adjacent land. Furthermore, the electrical connection device 100 including the probe 1 whose connection region 123 is tapered can prevent contact between adjacent probes 1.
  • the cross-sectional shape of the probe 1 is rectangular, but the cross-sectional shape of the probe 1 may be other shapes.
  • the cross-sectional shape of the probe 1 may be polygonal other than rectangular. Regardless of the polygonal shape of the cross-sectional shape of the probe 1, as long as the side surface of the probe 1 facing opposite the offset direction is not covered with the contact film 13, the probe 1 can be prevented from coming into contact with the adjacent land.
  • connection region 123 is connected to the tip region 122 of the probe 1 covered with the contact film 13
  • the contact film 13 does not need to cover the entire tip region 122.
  • a surface on which the contact film 13 is not formed may be provided on the tip region 122 opposite the surface on which the contact film 13 is formed and connected to the end face 131, and a tapered connection region 123 may be connected to the surface on which the contact film 13 is not formed.
  • REFERENCE SIGNS LIST 1 ... probe 10... base material 11... first end 12... second end 13... contact film 20... probe head 21... first guide plate 22... second guide plate 23... third guide plate 30... substrate 31... land 100... electrical connection device 121... tip surface 122... tip region 123... connection region 131... end surface S1... first side S2... second side S3... third side S4... fourth side

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
PCT/JP2023/039278 2022-11-11 2023-10-31 プローブおよび電気的接続装置 Ceased WO2024101224A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP23888572.7A EP4617675A1 (en) 2022-11-11 2023-10-31 Probe and electrical connecting device
KR1020257014537A KR20250079202A (ko) 2022-11-11 2023-10-31 프로브 및 전기적 접속 장치
CN202380077062.XA CN120153265A (zh) 2022-11-11 2023-10-31 探针和电连接装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-180871 2022-11-11
JP2022180871A JP2024070404A (ja) 2022-11-11 2022-11-11 プローブおよび電気的接続装置

Publications (1)

Publication Number Publication Date
WO2024101224A1 true WO2024101224A1 (ja) 2024-05-16

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PCT/JP2023/039278 Ceased WO2024101224A1 (ja) 2022-11-11 2023-10-31 プローブおよび電気的接続装置

Country Status (6)

Country Link
EP (1) EP4617675A1 (enExample)
JP (1) JP2024070404A (enExample)
KR (1) KR20250079202A (enExample)
CN (1) CN120153265A (enExample)
TW (1) TW202431461A (enExample)
WO (1) WO2024101224A1 (enExample)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008522190A (ja) * 2004-12-03 2008-06-26 エス ヴィ プルーブ ピーティーイー リミテッド リソグラフィーによって作製されたプローブ素子を成形する方法
JP2009276145A (ja) * 2008-05-13 2009-11-26 Japan Electronic Materials Corp プローブ
WO2014087906A1 (ja) * 2012-12-04 2014-06-12 日本電子材料株式会社 電気的接触子
JP2015118064A (ja) 2013-12-20 2015-06-25 東京特殊電線株式会社 コンタクトプローブユニット
JP2018501490A (ja) * 2014-12-30 2018-01-18 テクノプローベ エス．ピー．エー． テストヘッド用コンタクトプローブ
JP2018506030A (ja) * 2014-12-30 2018-03-01 テクノプローベ エス．ピー．エー． テストヘッドのための接触プローブの製造方法
JP2018508753A (ja) * 2014-12-30 2018-03-29 テクノプローベ エス．ピー．エー． テストヘッド用の複数のコンタクトプローブを含む半製品および関連する製造方法
JP2020509371A (ja) * 2017-02-24 2020-03-26 テクノプローべ ソシエタ ペル アチオニ 改善された周波数特性を有する垂直プローブ試験ヘッド
JP2021076486A (ja) * 2019-11-11 2021-05-20 株式会社日本マイクロニクス 電気的接続装置
JP2022144851A (ja) * 2021-03-19 2022-10-03 株式会社日本マイクロニクス プローブおよびプローブカード

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008522190A (ja) * 2004-12-03 2008-06-26 エス ヴィ プルーブ ピーティーイー リミテッド リソグラフィーによって作製されたプローブ素子を成形する方法
JP2009276145A (ja) * 2008-05-13 2009-11-26 Japan Electronic Materials Corp プローブ
WO2014087906A1 (ja) * 2012-12-04 2014-06-12 日本電子材料株式会社 電気的接触子
JP2015118064A (ja) 2013-12-20 2015-06-25 東京特殊電線株式会社 コンタクトプローブユニット
JP2018501490A (ja) * 2014-12-30 2018-01-18 テクノプローベ エス．ピー．エー． テストヘッド用コンタクトプローブ
JP2018506030A (ja) * 2014-12-30 2018-03-01 テクノプローベ エス．ピー．エー． テストヘッドのための接触プローブの製造方法
JP2018508753A (ja) * 2014-12-30 2018-03-29 テクノプローベ エス．ピー．エー． テストヘッド用の複数のコンタクトプローブを含む半製品および関連する製造方法
JP2020509371A (ja) * 2017-02-24 2020-03-26 テクノプローべ ソシエタ ペル アチオニ 改善された周波数特性を有する垂直プローブ試験ヘッド
JP2021076486A (ja) * 2019-11-11 2021-05-20 株式会社日本マイクロニクス 電気的接続装置
JP2022144851A (ja) * 2021-03-19 2022-10-03 株式会社日本マイクロニクス プローブおよびプローブカード

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4617675A1

Also Published As

Publication number Publication date
TW202431461A (zh) 2024-08-01
KR20250079202A (ko) 2025-06-04
JP2024070404A (ja) 2024-05-23
CN120153265A (zh) 2025-06-13
EP4617675A1 (en) 2025-09-17

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