JP2024070404A - プローブおよび電気的接続装置 - Google Patents
プローブおよび電気的接続装置 Download PDFInfo
- Publication number
- JP2024070404A JP2024070404A JP2022180871A JP2022180871A JP2024070404A JP 2024070404 A JP2024070404 A JP 2024070404A JP 2022180871 A JP2022180871 A JP 2022180871A JP 2022180871 A JP2022180871 A JP 2022180871A JP 2024070404 A JP2024070404 A JP 2024070404A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- contact film
- contact
- guide plate
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022180871A JP2024070404A (ja) | 2022-11-11 | 2022-11-11 | プローブおよび電気的接続装置 |
| PCT/JP2023/039278 WO2024101224A1 (ja) | 2022-11-11 | 2023-10-31 | プローブおよび電気的接続装置 |
| EP23888572.7A EP4617675A1 (en) | 2022-11-11 | 2023-10-31 | Probe and electrical connecting device |
| KR1020257014537A KR20250079202A (ko) | 2022-11-11 | 2023-10-31 | 프로브 및 전기적 접속 장치 |
| CN202380077062.XA CN120153265A (zh) | 2022-11-11 | 2023-10-31 | 探针和电连接装置 |
| TW112142902A TW202431461A (zh) | 2022-11-11 | 2023-11-07 | 探針及電性連接裝置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022180871A JP2024070404A (ja) | 2022-11-11 | 2022-11-11 | プローブおよび電気的接続装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2024070404A true JP2024070404A (ja) | 2024-05-23 |
| JP2024070404A5 JP2024070404A5 (enExample) | 2025-04-25 |
Family
ID=91032905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022180871A Pending JP2024070404A (ja) | 2022-11-11 | 2022-11-11 | プローブおよび電気的接続装置 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4617675A1 (enExample) |
| JP (1) | JP2024070404A (enExample) |
| KR (1) | KR20250079202A (enExample) |
| CN (1) | CN120153265A (enExample) |
| TW (1) | TW202431461A (enExample) |
| WO (1) | WO2024101224A1 (enExample) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7462800B2 (en) * | 2004-12-03 | 2008-12-09 | Sv Probe Pte Ltd. | Method of shaping lithographically-produced probe elements |
| JP2009276145A (ja) * | 2008-05-13 | 2009-11-26 | Japan Electronic Materials Corp | プローブ |
| KR102092430B1 (ko) * | 2012-12-04 | 2020-03-23 | 일본전자재료(주) | 전기적 접촉자 |
| JP6305754B2 (ja) | 2013-12-20 | 2018-04-04 | 東京特殊電線株式会社 | コンタクトプローブユニット |
| WO2016107756A1 (en) * | 2014-12-30 | 2016-07-07 | Technoprobe S.P.A. | Semi-finished product comprising a plurality of contact probes for a testing head and related manufacturing method |
| CN107257928B (zh) * | 2014-12-30 | 2020-12-01 | 泰克诺探头公司 | 用于测试头的接触探针 |
| KR102461856B1 (ko) * | 2014-12-30 | 2022-11-02 | 테크노프로브 에스.피.에이. | 검사 헤드용 접촉 프로브의 제조 방법 |
| IT201700021400A1 (it) * | 2017-02-24 | 2018-08-24 | Technoprobe Spa | Testa di misura a sonde verticali con migliorate proprietà in frequenza |
| JP7633766B2 (ja) * | 2019-11-11 | 2025-02-20 | 株式会社日本マイクロニクス | 電気的接続装置 |
| JP7658768B2 (ja) * | 2021-03-19 | 2025-04-08 | 株式会社日本マイクロニクス | 電気的接続装置 |
-
2022
- 2022-11-11 JP JP2022180871A patent/JP2024070404A/ja active Pending
-
2023
- 2023-10-31 KR KR1020257014537A patent/KR20250079202A/ko active Pending
- 2023-10-31 CN CN202380077062.XA patent/CN120153265A/zh active Pending
- 2023-10-31 WO PCT/JP2023/039278 patent/WO2024101224A1/ja not_active Ceased
- 2023-10-31 EP EP23888572.7A patent/EP4617675A1/en active Pending
- 2023-11-07 TW TW112142902A patent/TW202431461A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024101224A1 (ja) | 2024-05-16 |
| TW202431461A (zh) | 2024-08-01 |
| KR20250079202A (ko) | 2025-06-04 |
| CN120153265A (zh) | 2025-06-13 |
| EP4617675A1 (en) | 2025-09-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250417 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250829 |