TW202431461A - 探針及電性連接裝置 - Google Patents

探針及電性連接裝置 Download PDF

Info

Publication number
TW202431461A
TW202431461A TW112142902A TW112142902A TW202431461A TW 202431461 A TW202431461 A TW 202431461A TW 112142902 A TW112142902 A TW 112142902A TW 112142902 A TW112142902 A TW 112142902A TW 202431461 A TW202431461 A TW 202431461A
Authority
TW
Taiwan
Prior art keywords
probe
aforementioned
contact film
guide plate
contact
Prior art date
Application number
TW112142902A
Other languages
English (en)
Chinese (zh)
Inventor
那須美佳
豊田美岬
林孝幸
高瀬美菜子
Original Assignee
日商日本麥克隆尼股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日本麥克隆尼股份有限公司 filed Critical 日商日本麥克隆尼股份有限公司
Publication of TW202431461A publication Critical patent/TW202431461A/zh

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/06738Geometry aspects related to tip portion
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/0675Needle-like
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755Material aspects
    • G01R1/06761Material aspects related to layers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2853Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
TW112142902A 2022-11-11 2023-11-07 探針及電性連接裝置 TW202431461A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022-180871 2022-11-11
JP2022180871A JP2024070404A (ja) 2022-11-11 2022-11-11 プローブおよび電気的接続装置

Publications (1)

Publication Number Publication Date
TW202431461A true TW202431461A (zh) 2024-08-01

Family

ID=91032905

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112142902A TW202431461A (zh) 2022-11-11 2023-11-07 探針及電性連接裝置

Country Status (6)

Country Link
EP (1) EP4617675A1 (enExample)
JP (1) JP2024070404A (enExample)
KR (1) KR20250079202A (enExample)
CN (1) CN120153265A (enExample)
TW (1) TW202431461A (enExample)
WO (1) WO2024101224A1 (enExample)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7462800B2 (en) * 2004-12-03 2008-12-09 Sv Probe Pte Ltd. Method of shaping lithographically-produced probe elements
JP2009276145A (ja) * 2008-05-13 2009-11-26 Japan Electronic Materials Corp プローブ
KR102092430B1 (ko) * 2012-12-04 2020-03-23 일본전자재료(주) 전기적 접촉자
JP6305754B2 (ja) 2013-12-20 2018-04-04 東京特殊電線株式会社 コンタクトプローブユニット
WO2016107756A1 (en) * 2014-12-30 2016-07-07 Technoprobe S.P.A. Semi-finished product comprising a plurality of contact probes for a testing head and related manufacturing method
CN107257928B (zh) * 2014-12-30 2020-12-01 泰克诺探头公司 用于测试头的接触探针
KR102461856B1 (ko) * 2014-12-30 2022-11-02 테크노프로브 에스.피.에이. 검사 헤드용 접촉 프로브의 제조 방법
IT201700021400A1 (it) * 2017-02-24 2018-08-24 Technoprobe Spa Testa di misura a sonde verticali con migliorate proprietà in frequenza
JP7633766B2 (ja) * 2019-11-11 2025-02-20 株式会社日本マイクロニクス 電気的接続装置
JP7658768B2 (ja) * 2021-03-19 2025-04-08 株式会社日本マイクロニクス 電気的接続装置

Also Published As

Publication number Publication date
WO2024101224A1 (ja) 2024-05-16
KR20250079202A (ko) 2025-06-04
JP2024070404A (ja) 2024-05-23
CN120153265A (zh) 2025-06-13
EP4617675A1 (en) 2025-09-17

Similar Documents

Publication Publication Date Title
US7888953B2 (en) Probe card
TWI880493B (zh) 探針
TW202431461A (zh) 探針及電性連接裝置
TWI876428B (zh) 電性連接裝置
JP3099951B2 (ja) 分割型プローブカード
TWI885400B (zh) 探針裝置
US7477065B2 (en) Method for fabricating a plurality of elastic probes in a row
TW202511742A (zh) 探針
TWI911815B (zh) 探針
TWI884865B (zh) 探針
TWI884562B (zh) 接觸銷及電性連接裝置
TW202521996A (zh) 探針
TW202509483A (zh) 探針及電性連接裝置
JP2025185826A (ja) プローブ
TW202538283A (zh) 探針
KR20260002915A (ko) 프로브 및 전기적 접속 장치
TW202526332A (zh) 電性連接裝置
JPH10185955A (ja) 検査用ヘッド
WO2025164493A1 (ja) プローブおよび電気的接続装置