KR20250079202A - 프로브 및 전기적 접속 장치 - Google Patents

프로브 및 전기적 접속 장치 Download PDF

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Publication number
KR20250079202A
KR20250079202A KR1020257014537A KR20257014537A KR20250079202A KR 20250079202 A KR20250079202 A KR 20250079202A KR 1020257014537 A KR1020257014537 A KR 1020257014537A KR 20257014537 A KR20257014537 A KR 20257014537A KR 20250079202 A KR20250079202 A KR 20250079202A
Authority
KR
South Korea
Prior art keywords
probe
contact film
guide plate
contact
cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257014537A
Other languages
English (en)
Korean (ko)
Inventor
미카 나스
미사키 토요다
타카유키 하야시자키
미나코 타카세
Original Assignee
가부시키가이샤 니혼 마이크로닉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 니혼 마이크로닉스 filed Critical 가부시키가이샤 니혼 마이크로닉스
Publication of KR20250079202A publication Critical patent/KR20250079202A/ko
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G01R1/06761—Material aspects related to layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
KR1020257014537A 2022-11-11 2023-10-31 프로브 및 전기적 접속 장치 Pending KR20250079202A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022180871A JP2024070404A (ja) 2022-11-11 2022-11-11 プローブおよび電気的接続装置
JPJP-P-2022-180871 2022-11-11
PCT/JP2023/039278 WO2024101224A1 (ja) 2022-11-11 2023-10-31 プローブおよび電気的接続装置

Publications (1)

Publication Number Publication Date
KR20250079202A true KR20250079202A (ko) 2025-06-04

Family

ID=91032905

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257014537A Pending KR20250079202A (ko) 2022-11-11 2023-10-31 프로브 및 전기적 접속 장치

Country Status (6)

Country Link
EP (1) EP4617675A1 (enExample)
JP (1) JP2024070404A (enExample)
KR (1) KR20250079202A (enExample)
CN (1) CN120153265A (enExample)
TW (1) TW202431461A (enExample)
WO (1) WO2024101224A1 (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015118064A (ja) 2013-12-20 2015-06-25 東京特殊電線株式会社 コンタクトプローブユニット

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7462800B2 (en) * 2004-12-03 2008-12-09 Sv Probe Pte Ltd. Method of shaping lithographically-produced probe elements
JP2009276145A (ja) * 2008-05-13 2009-11-26 Japan Electronic Materials Corp プローブ
KR102092430B1 (ko) * 2012-12-04 2020-03-23 일본전자재료(주) 전기적 접촉자
WO2016107756A1 (en) * 2014-12-30 2016-07-07 Technoprobe S.P.A. Semi-finished product comprising a plurality of contact probes for a testing head and related manufacturing method
CN107257928B (zh) * 2014-12-30 2020-12-01 泰克诺探头公司 用于测试头的接触探针
KR102461856B1 (ko) * 2014-12-30 2022-11-02 테크노프로브 에스.피.에이. 검사 헤드용 접촉 프로브의 제조 방법
IT201700021400A1 (it) * 2017-02-24 2018-08-24 Technoprobe Spa Testa di misura a sonde verticali con migliorate proprietà in frequenza
JP7633766B2 (ja) * 2019-11-11 2025-02-20 株式会社日本マイクロニクス 電気的接続装置
JP7658768B2 (ja) * 2021-03-19 2025-04-08 株式会社日本マイクロニクス 電気的接続装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015118064A (ja) 2013-12-20 2015-06-25 東京特殊電線株式会社 コンタクトプローブユニット

Also Published As

Publication number Publication date
WO2024101224A1 (ja) 2024-05-16
TW202431461A (zh) 2024-08-01
JP2024070404A (ja) 2024-05-23
CN120153265A (zh) 2025-06-13
EP4617675A1 (en) 2025-09-17

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P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902