WO2024087916A1 - Procédé de fabrication de carte de circuit imprimé en aluminium métallique, et carte de circuit imprimé en aluminium métallique et module de carte de circuit imprimé - Google Patents

Procédé de fabrication de carte de circuit imprimé en aluminium métallique, et carte de circuit imprimé en aluminium métallique et module de carte de circuit imprimé Download PDF

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Publication number
WO2024087916A1
WO2024087916A1 PCT/CN2023/118177 CN2023118177W WO2024087916A1 WO 2024087916 A1 WO2024087916 A1 WO 2024087916A1 CN 2023118177 W CN2023118177 W CN 2023118177W WO 2024087916 A1 WO2024087916 A1 WO 2024087916A1
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WO
WIPO (PCT)
Prior art keywords
aluminum
layer
circuit board
metal
solder resist
Prior art date
Application number
PCT/CN2023/118177
Other languages
English (en)
Chinese (zh)
Inventor
王定锋
代宏信
徐磊
王晟齐
徐文红
Original Assignee
王定锋
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202211408899.1A external-priority patent/CN116017846A/zh
Priority claimed from CN202222948623.4U external-priority patent/CN218998386U/zh
Application filed by 王定锋 filed Critical 王定锋
Publication of WO2024087916A1 publication Critical patent/WO2024087916A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to the field of circuit boards, and in particular to a method for manufacturing a metal aluminum circuit board, a metal aluminum circuit board and a circuit board module.
  • Another method is to use copper-aluminum composite foil to make circuit boards.
  • the copper-aluminum composite foil is made into a copper-aluminum laminated substrate with the copper layer exposed, and then etched into circuits. Since etching removes both copper and aluminum, the etching reaction liquid contains both copper ions and aluminum ions. The etching liquid is difficult to control and has poor stability. In addition, the waste etching liquid recovery and treatment process is complicated. There is a layer of copper on the entire circuit surface, and the cost is higher than making copper, nickel, silver, and tin with good solderability only on the pad. Therefore, the overall cost of this method is still very high.
  • the present invention provides a method for manufacturing a metal aluminum circuit board, a metal aluminum circuit board and a circuit board module, which can ensure that the solder pad has good solderability while greatly Greatly reduces the production cost of circuit boards.
  • an embodiment of the present invention provides a method for manufacturing a metal aluminum circuit board, comprising:
  • the aluminum-clad substrate comprises an insulating substrate layer and a front aluminum layer located on one side of the insulating substrate layer;
  • a front solder resist layer is formed on the front aluminum circuit layer, and the front solder resist layer partially covers the front aluminum circuit layer to expose the aluminum pad;
  • the aluminum-clad substrate is a single-sided aluminum-clad substrate, a front aluminum layer is provided on one side of the insulating substrate layer, and there is no aluminum layer on the other side, and the circuit board is a single-sided circuit board; or, the aluminum-clad substrate is a double-sided aluminum-clad substrate, and also includes a back aluminum layer provided on the other side of the insulating substrate layer, and the circuit board is a double-sided circuit board.
  • the back aluminum layer is a back aluminum circuit layer
  • the aluminum-clad substrate also includes a back solder resist layer arranged on the back aluminum circuit layer; or the back aluminum layer is aluminum foil, and in the etching process, the back aluminum foil is simultaneously etched to form the back aluminum circuit layer, and in the solder resist layer manufacturing process, the back solder resist layer is simultaneously manufactured on the back aluminum circuit layer.
  • the aluminum-clad substrate is a single-sided aluminum-clad substrate, with a front aluminum layer on one side of the insulating substrate layer and no aluminum layer on the other side.
  • the back aluminum circuit layer is fixed to the insulating substrate layer of the aluminum-clad substrate by adhesive to form a double-sided circuit board.
  • it also includes a pad hole, which passes through the front solder mask layer, the front aluminum circuit layer and the insulating substrate layer, and the back aluminum circuit layer is exposed in the pad hole.
  • a pad hole which passes through the front solder mask layer, the front aluminum circuit layer and the insulating substrate layer, and the back aluminum circuit layer is exposed in the pad hole.
  • an extrusion die is used to extrude the front aluminum circuit layer and the back aluminum circuit layer to form contact and conduction.
  • the surface of the back aluminum circuit layer in the pad hole is plated with a tin-philic metal.
  • the electroplated circuit board is punched using a mold on a roll-to-roll punching machine.
  • the aluminum conductive wire is punched out to disconnect the aluminum conductive wire, wherein a punch hole is formed at the punched out portion of the aluminum conductive wire, and the punch hole runs through the entire circuit board.
  • the aluminum conductive wire is exposed and anti-plating ink is printed.
  • the anti-plating ink is removed using an alkaline solution, and the alkaline solution simultaneously corrodes and disconnects the aluminum conductive wire.
  • shielding ink is made at the disconnection position of the aluminum conductive wire to shield the fracture of the aluminum conductive wire, and a part of the shielding ink is stacked on the front solder resist layer.
  • the tin-philic metal is copper, tin, silver or nickel.
  • the front solder resist layer is solder resist ink or solder resist covering film.
  • the first aspect of the present invention has at least one of the following beneficial effects: by adding aluminum conductive wires during circuit design, all circuits of the front aluminum circuit layer are interconnected and connected by using the aluminum conductive wires, and when making the front solder mask layer, the front solder mask layer exposes the aluminum pad, and then uses the electroplating process to electroplate the tin-philic metal, so that only a layer of tin-philic metal is electroplated on the surface of the aluminum pad.
  • the anode metal loses electrons to form metal ions during electroplating, and then obtains electrons on the surface of the cathode aluminum pad to form metal atoms deposited on the pad surface.
  • the metal ion concentration in the solution is stable and consistent, the thickness of the electroplated layer is stable, and there is no external reducing agent like chemical plating.
  • the plating impurities brought by the electroplating are eliminated, and no impurities of the side reaction products are deposited in the plating, which ensures the good solderability of the metal pad after electroplating. Since there are no side reaction impurities in the waste etching liquid, the recovery process is relatively simple and low in cost.
  • the present invention only has tin-philic metals such as copper or silver at the pad position, which is obviously lower in cost than the solution with a layer of copper on the entire circuit surface, and also solves the difficulty of etching two metals.
  • the recovery and treatment of the waste electroplating liquid also becomes easier and lower in cost. While meeting the good solderability of the pad, the present invention greatly reduces the production cost of the circuit board, which is conducive to the circuit board and related products to obtain good market competitiveness.
  • an embodiment of the present invention provides a metal aluminum circuit board, comprising an insulating substrate layer, a front aluminum circuit layer bonded to the insulating substrate layer, and a front solder resist layer bonded to the front aluminum circuit layer, wherein a pad window is provided on the front solder resist layer, and the front aluminum circuit layer forms an aluminum pad at the pad window, and a tin-philic metal layer is bonded to the surface of the aluminum pad, and the tin-philic metal layer has a thickness of 1 micron-20 microns, and the front aluminum circuit layer comprises a plurality of circuits, and at least some of the circuits have fractures, and the fractures penetrate the front solder resist layer and the front aluminum circuit layer.
  • the fracture penetrates the insulating substrate layer, the aluminum section at the fracture and the section of the insulating substrate layer are located on the same knife-cut surface, and the side surface of the front aluminum circuit layer at the fracture is not blocked by the front solder resist layer; Alternatively, the fracture does not penetrate the insulating substrate layer, and the side surface of the front aluminum circuit layer at the fracture is not blocked by the front solder resist layer.
  • shielding ink is provided at the fracture, and the shielding ink shields the aluminum side surface at the fracture, and a part of the shielding ink is stacked on the front solder resist layer.
  • the circuit board is a single-sided circuit board, and the insulating substrate layer forms a back solder resist layer; or the circuit board is a double-sided circuit board, including a back aluminum circuit layer bonded to the insulating substrate layer, the back aluminum circuit layer is bonded to a back solder resist layer, and the front aluminum circuit layer and the back aluminum circuit layer are in contact and conductive.
  • it also includes a pad hole, which penetrates the front solder mask layer, the front aluminum circuit layer and the insulating substrate layer, and the back aluminum circuit layer is exposed in the pad hole to form a back aluminum pad, and the surface of the back aluminum pad is combined with a tin-philic metal layer.
  • the tin-philic metal is copper, tin, silver or nickel.
  • the second aspect of the present invention has at least one of the following beneficial effects: a tin-philic metal layer is combined with the surface of the aluminum pad, the thickness of the tin-philic metal layer is 1 micron-20 microns, the front aluminum circuit layer includes multiple circuits, at least some of the circuits have fractures, and the fractures penetrate the front solder mask layer and the front aluminum circuit layer.
  • the circuit board can use an electroplating process to electroplate the tin-philic metal, so that only a layer of tin-philic metal is electroplated on the surface of the aluminum pad.
  • the anode metal loses electrons to form metal ions during electroplating, and then obtains electrons on the cathode aluminum pad surface to form metal atoms deposited on the pad surface.
  • the metal ion concentration in the solution is stable and consistent, the thickness of the electroplated layer is stable, and there is no chemical plating.
  • the plating impurities brought by the external reducing agent in electroplating, and no impurities of side reaction products are deposited in the plating layer, which ensures the good solderability of the metal pad after electroplating. Since there are no side reaction impurities in the waste etching liquid, the recovery process is relatively simple and low in cost.
  • the present invention Compared with the copper-aluminum composite foil in the prior art, the present invention only has tin-philic metals such as copper or silver at the pad position, which is obviously lower in cost than the solution with a layer of copper on the entire circuit surface, and also solves the difficulty of etching two metals. The recovery and treatment of the waste electroplating solution also becomes easier and lower in cost. While meeting the good solderability of the pad, the present invention greatly reduces the production cost of the circuit board, which is conducive to the circuit board and related products to obtain good market competitiveness.
  • an embodiment of the present invention provides a circuit board module, comprising the metal aluminum circuit board described in any one of the embodiments of the second aspect, wherein electronic components are welded on the tin-philic metal layer.
  • the circuit board module is a lamp, a printer, a computer or a car.
  • FIG1 is a schematic diagram of the planar structure of a front aluminum circuit layer obtained after etching the front aluminum layer in an embodiment of the present invention
  • Figure 1-1 is a partial enlarged view of A in Figure 1;
  • Figure 1-1-1 is a partial enlarged view of B in Figure 1-1;
  • FIG1-2 is a cross-sectional view along the A'-A' direction in FIG1-1-1 (single-sided circuit board);
  • Figure 1-3 is a cross-sectional view in the B'-B' direction in Figure 1-1-1 (for single-sided circuit board, in order to facilitate the placement of drawings and reading, the cross-sectional view is rotated 90° in the opposite direction to be placed horizontally, the same below);
  • FIG1-4 is a cross-sectional view along the A'-A' direction in FIG1-1-1 (double-sided circuit board);
  • Figure 1-5 is a cross-sectional view of the B'-B' direction in Figure 1-1-1 (double-sided circuit board).
  • the cross-sectional view is rotated 90° in the opposite direction to be placed horizontally, the same below);
  • FIG2 is a schematic diagram of the planar structure of FIG1 after a front solder resist layer is produced
  • Figure 2-1 is a partial enlarged view of C in Figure 2;
  • FIG2-2 is a cross-sectional view of FIG1-2 after a front solder mask layer is made
  • FIG2-3 is a cross-sectional view of FIG1-3 after a front solder mask layer is made
  • FIG2-4 is a cross-sectional view of FIG1-4 after a front solder mask layer is made
  • FIG2-5 is a cross-sectional view of FIG1-5 after a front solder mask layer is made
  • FIG3 is a schematic diagram of a planar structure of FIG2 after anti-plating ink is produced at the position of the aluminum conductive line;
  • FIG3-1 is a partial enlarged view of D in FIG3;
  • FIG3-2 is a cross-sectional view of FIG2-2 after anti-plating ink is produced
  • FIG3-3 is a cross-sectional view of FIG2-3 after anti-plating ink is produced
  • FIG3-4 is a cross-sectional view of FIG2-4 after anti-plating ink is produced
  • FIG3-5 is a cross-sectional view of FIG2-5 after anti-plating ink is produced
  • Figure 4-1 is a cross-sectional view of Figure 3 at the pad position (single-sided circuit board, direction is B'-B' direction, the interception position is at the pad, in order to facilitate the placement of drawings and reading, the cross-sectional view is rotated 90° in the opposite direction to be placed horizontally, the same below);
  • FIG4-2 is a cross-sectional view of FIG4-1 after electroplating with a tin-philic metal
  • FIG4-3 is a cross-sectional view of FIG3 at the pad position (double-sided circuit board, direction is B'-B' direction, the interception position is at the pad, for the convenience of placing drawings and reading, the cross-sectional view is rotated 90° in the opposite direction to be placed horizontally, the same below);
  • FIG4-4 is a cross-sectional view of FIG4-3 after electroplating with a tin-philic metal
  • FIG5 is a schematic diagram of the planar structure of FIG3 after the aluminum conductive wire is disconnected;
  • Figure 5-1 is a partial enlarged view of E in Figure 5;
  • Figure 5-2 is a partial enlarged view of F in Figure 2;
  • FIG5-3 is a schematic diagram of the structure of FIG5-2 after the aluminum conductive wire is disconnected;
  • Figure 5-4 is a schematic diagram of the structure of Figure 5-2 after the front solder mask layer is hidden (in order to clearly express the structure, the scale of the figure is reduced relative to Figure 5-2);
  • Figure 5-5 is a schematic diagram of the structure of Figure 5-3 after the solder mask layer is hidden (in order to clearly express the structure, the scale of the figure is reduced relative to Figure 5-2);
  • FIG5-6 is a cross-sectional view of FIG3-2 after being treated with an alkaline solution (the aluminum conductive wire and the anti-plating ink are corroded);
  • FIG5-7 is a cross-sectional view of FIG3-3 after being treated with an alkaline solution (the aluminum conductive wire and the anti-plating ink are corroded);
  • FIG5-8 is a cross-sectional view of FIG3-4 after being treated with an alkaline solution (the aluminum conductive wire and the anti-plating ink are corroded);
  • FIG5-9 is a cross-sectional view of FIG3-5 after being treated with an alkaline solution (the aluminum conductive wire and the anti-plating ink are corroded);
  • FIG5-10 is a cross-sectional view of the aluminum conductive wire and the insulating substrate layer in FIG2-2 after being cut;
  • FIG5-11 is a cross-sectional view of the aluminum conductive wire and the insulating substrate layer in FIG2-3 after being cut;
  • FIG5-12 is a cross-sectional view of the aluminum conductive wire, the insulating substrate layer, the back aluminum circuit layer and the back solder resist layer in FIG2-4 after being cut;
  • FIG5-13 is a cross-sectional view of the aluminum conductive wire, the insulating substrate layer, the back aluminum circuit layer and the back solder resist layer in FIG2-5 after being cut;
  • FIG. 6 is a schematic diagram of a punching die for punching aluminum conductive wires in an embodiment of the present invention
  • FIG7 is a schematic diagram of the planar structure of FIG5 after the shielding ink is produced
  • FIG7-1 is a partial enlarged view of G in FIG7;
  • FIG7-2 is a cross-sectional view of FIG5-6 after masking ink is produced
  • FIG7-3 is a cross-sectional view of FIG5-7 after masking ink is produced
  • FIG7-4 is a cross-sectional view of FIG5-8 after masking ink is produced
  • FIG7-5 is a cross-sectional view of FIG5-9 after masking ink is produced
  • FIG. 8 is a cross-sectional view of a double-sided circuit board with pad holes in an embodiment of the present invention.
  • the front side refers to the upper surface shown in the figure
  • the back side corresponds to the lower surface shown in the figure.
  • An embodiment of a first aspect of the present invention provides a method for manufacturing a metal aluminum circuit board.
  • Example 1-1 Production of single-sided circuit board
  • the aluminum-clad substrate is a single-sided aluminum-clad substrate, including an insulating substrate layer and a front aluminum layer located on one side of the insulating substrate layer, and the other side of the insulating substrate layer has no aluminum layer, the insulating substrate layer forms a back solder resist layer 3 of the single-sided circuit board, the insulating substrate layer can use a PET film or a PI film, or other substrates known in the art, the insulating substrate layer and the front aluminum layer are combined by a well-known technology in the art, such as by bonding and pressing, which will not be repeated here;
  • the aluminum-clad substrate is etched by etching to form a front aluminum circuit layer 1 and aluminum conductive wires 2, wherein the aluminum conductive wires 2 interconnect all the circuits of the front aluminum circuit layer 1.
  • Etching to form circuits by etching is a well-known technique in the art, and the etching solution and specific processes are not described in detail here.
  • the purpose of interconnecting all the circuits of the front aluminum circuit layer 1 by the aluminum conductive wires 2 is to enable the front aluminum circuit layer 1 to be energized during the electroplating stage, so that the tin-philic metal in the electrolyte can be deposited on the aluminum layer.
  • a 2% NAOH solution is used to remove the anti-etching ink to expose the covered aluminum layer, thereby obtaining a front aluminum circuit layer 1 and an aluminum conductive wire 1.
  • the anti-etching ink can be removed by using a 10% ammonia solution.
  • FIG. 1 to FIG. 1-3 a front aluminum circuit layer 1 formed after etching is obtained.
  • the front aluminum circuit layer 1 includes a plurality of circuits 11. There are gaps between adjacent circuits 11 in the up and down directions shown in FIG. 1 to FIG. 1-1-1.
  • the aluminum conductive wires 2 interconnect the adjacent circuits, and interconnection and conduction of all circuits are achieved through the plurality of aluminum conductive wires 2.
  • a front solder resist layer 4 is made on the front aluminum circuit layer 1.
  • the front solder resist layer 4 uses solder resist ink.
  • the front solder resist layer 4 can be bonded by an adhesive and pressed on the front aluminum circuit layer 1.
  • the front solder resist layer 4 has a pad window to partially cover the front aluminum circuit layer 1 to expose the aluminum pad 12.
  • the aluminum pad 12 is used for soldering electronic components after being electroplated with a tin-philic metal; the front solder resist layer 4 also has a conductive wire window 41 to expose the aluminum conductive wire 2, as shown in Figures 2 to 2-3;
  • Anti-plating ink 5 (LB-1600D ink produced by Dongguan Lanbang Electronic Hardware Materials Co., Ltd.) is printed at the conductive wire window, as shown in FIG. 3 to FIG. 3-3.
  • the anti-plating ink is used to prevent the aluminum conductive wire 2 from being electroplated with tin-philic metal during the electroplating process, so as to prevent the tin-philic metal from being difficult to corrode and dissolve and remove in a low-cost manner. If the tin-philic metal cannot be removed, the aluminum conductive wire 2 will interconnect the adjacent circuits 11, and the front aluminum circuit layer 1 will be short-circuited;
  • the tin-philic metal is plated on the aluminum pad by electroplating to obtain the tin-philic metal layer 6.
  • a copper rod is selected as the anode for electroplating.
  • Metal copper is plated on the aluminum pad 12. Since the surface of the aluminum conductive wire 2 is printed with anti-electroplating ink, copper ions will not be deposited on the aluminum conductive wire 2 and the anti-electroplating ink. Referring to FIG4-1, a cross-sectional view of the position of the aluminum pad 12 is shown.
  • a group of aluminum pads 12 includes two left and right aluminum pads for adapting the positive and negative soldering feet of the component.
  • solder paste is applied on the copper pad.
  • the solidified tin has a good bonding force with the copper pad, and the electronic components are electrically connected reliably and are not easy to fall off.
  • the single-sided circuit board after the electroplating process is treated with a 10% concentration of NAOH solution.
  • NAOH corrodes the anti-plating ink 5 and the aluminum conductive wire 2 covered by it, thereby disconnecting the aluminum conductive wire 2.
  • Figures 5 to 5-7 where a fracture 14 is formed at the disconnection position.
  • Example 1-2 Production of single-sided circuit board
  • Example 1 The difference from Example 1 is that: when making the front solder resist layer 4, there is no need to make the conductive wire window 41 on the front solder resist layer 4, and the aluminum conductive wire 2 is covered by the front solder resist layer 4, so there is no printing anti-plating ink process; in the electroplating process, a silver rod is selected as the electroplating anode, and metallic silver is electroplated on the aluminum pad 12. After the electroplating process is completed, on the roll-to-roll punching machine, a punching die 7 with a ejector as shown in Figure 6 is used to punch the position of the aluminum conductive wire 2. Specifically, the punching die 7 includes an upper die 71 and a lower die 72.
  • the upper die 71 is formed by a punching die 72, and the lower die 72 is formed by a punching die 71.
  • 71 is provided with an ejector pin 73, and a clearance hole is provided on the lower mold 72 at a position corresponding to the ejector pin.
  • the mold is closed, and the ejector pin 73 punches off the aluminum conductive wire 2 and the front solder resist layer 4 and the back solder resist layer 3 at the position corresponding to the aluminum conductive wire 2, so as to disconnect the aluminum conductive wire 2, wherein a punching hole 8 is formed at the position where the aluminum conductive wire is punched off, and the punching hole 8 runs through the entire circuit board, as shown in Figures 5-4, 5-5, 5-10, and 5-11, and the fracture 14 is formed at the position where the punching hole 8 is located.
  • the difference from Embodiments 1-2 lies in that a conductive wire window 41 is made on the front solder resist layer 4, but anti-plating ink is not printed, and during electroplating, a tin-philic metal layer 6 is plated on the aluminum conductive wire 2, and during the punching process, the aluminum conductive wire 2, the tin-philic metal layer 6, and the back solder resist layer 3 are punched out together to disconnect the aluminum conductive wire 2 and avoid a short circuit between adjacent wires 11 of the front aluminum circuit layer 1.
  • an aluminum-clad substrate which is a double-sided aluminum-clad substrate, including an insulating substrate layer and a front aluminum layer located on one side of the insulating substrate layer, and the other side of the insulating substrate layer is a back aluminum circuit layer 9.
  • the insulating substrate layer forms an intermediate insulating layer 10 of the double-sided circuit board to insulate the front aluminum layer and the back aluminum layer.
  • the insulating substrate layer can be made of PET film or PI film, or other substrates known in the art.
  • the back of the back aluminum circuit layer 9 has been prefabricated with a back solder resist layer 3;
  • the anti-etching ink is selected from the market directly purchased PE10/S10B2 anti-corrosion ink
  • the positions where the circuit and conductive line need to be formed are completed in the circuit design stage, and then the designed circuit is printed on the front aluminum layer;
  • the aluminum-clad substrate is etched by an etching method to form a front aluminum circuit layer 1 and aluminum conductive wires 2 by etching the front aluminum layer, wherein the aluminum conductive wires 2 interconnect all the circuits of the front aluminum circuit layer 1;
  • a 2% NAOH solution is used to remove the anti-etching ink to expose the covered aluminum layer, thereby obtaining a front aluminum circuit layer 1 and aluminum conductive wires 2; as shown in FIGS. 1 to 1-1-1, 1-4, and 1-5, a front aluminum circuit layer 1 formed after etching is obtained, wherein the front aluminum circuit layer 1 comprises a plurality of circuits 11, and adjacent circuits 11 are spaced apart in the up and down directions shown in FIGS. 1 to 1-1-1, and aluminum conductive wires 2 are provided between adjacent circuits, and the aluminum conductive wires 2 interconnect adjacent circuits, and interconnection and conduction of all circuits are achieved through the plurality of aluminum conductive wires 2;
  • a front solder resist layer 4 is made on the front aluminum circuit layer 1.
  • the front solder resist layer 4 uses a solder resist cover film (PI cover film or PET cover film).
  • the front solder resist layer 4 can be bonded and pressed on the front aluminum circuit layer 1 by an adhesive.
  • the front solder resist layer 4 has a pad window, which partially covers the front aluminum circuit layer 1 to expose the aluminum pad 12.
  • the aluminum pad 12 is used for soldering electronic components after being electroplated with a tin-philic metal; the front solder resist layer 4 also has a conductive wire window 41 to expose the aluminum conductive wire 2, as shown in Figures 2 to 2-1, and Figures 2-4 to 2-5;
  • Anti-plating ink 5 (LB-1600D ink produced by Dongguan Lanbang Electronic Hardware Materials Co., Ltd.) is printed at the conductive wire window 41, as shown in Figures 3 to 3-1, 3-4, and 3-5.
  • the anti-plating ink is used to prevent the aluminum conductive wire 2 from being electroplated with tin-philic metal during the electroplating process, so as to prevent the tin-philic metal from being difficult to dissolve and remove in a low-cost manner. If the tin-philic metal cannot be removed, the aluminum conductive wire will interconnect adjacent circuits, and a short circuit will occur in the front aluminum circuit layer 1;
  • the tin-philic metal is electroplated on the aluminum pad by electroplating to obtain the tin-philic metal layer 6.
  • the copper rod is used as the anode for electroplating, and the aluminum pad 12 is electroplated with metal copper. Since the surface of the aluminum conductive wire 2 is printed with anti-electroplating ink, copper ions will not be deposited on the aluminum conductive wire 2 and the anti-electroplating ink.
  • the single-sided circuit board after the electroplating process is treated with a 10% concentration of NAOH solution.
  • NAOH corrodes the anti-plating ink 5 and the aluminum conductive wire 2 covered by it, thereby disconnecting the aluminum conductive wire 2.
  • Example 2-2 Production of double-sided circuit board
  • Example 2-1 The difference from Example 2-1 is that the back side of the insulating substrate layer of the aluminum-clad substrate is aluminum foil.
  • the front aluminum layer and the back aluminum layer are etched together to form a front aluminum circuit layer 1 and a back aluminum circuit layer 9 respectively.
  • a front solder resist layer 4 is made on the front aluminum circuit layer 1
  • a back solder resist layer 3 is made on the back aluminum circuit layer 9.
  • the aluminum conductive wire 2 is covered by the front solder resist layer 4, so there is no printing anti-electroplating ink process.
  • a silver rod is selected as the anode for electroplating.
  • the aluminum solder resist layer 4 is used as the anode for electroplating. Metallic silver is electroplated on the disk 12.
  • a mold with a ejector as shown in Figure 6 is used to punch out the aluminum conductive wire 2 and the corresponding front solder resist layer 4, the middle insulating layer 10, the back aluminum circuit layer 9 and the back solder resist layer 3 on the electroplated circuit board using the ejector to disconnect the aluminum conductive wire, wherein a punching hole 8 is formed at the location where the aluminum conductive wire is broken, and the punching hole 8 runs through the entire circuit board, as shown in Figures 5-4, 5-5, 5-12, and 5-13, and the fracture 14 is formed at the location of the punching hole 8.
  • the aluminum-clad substrate is a single-sided aluminum-clad substrate
  • a front aluminum layer is provided on one side of the insulating substrate layer
  • no aluminum layer is provided on the other side.
  • the back aluminum circuit layer prefabricated, specifically, in this embodiment, a single-sided aluminum-clad substrate is used for etching
  • the electroplating process is performed.
  • the back aluminum circuit layer 9 can be bonded to the insulating substrate layer before removing the anti-etching ink, or can be bonded to the back aluminum circuit layer after removing the anti-etching ink and before making the front solder resist layer, or can be bonded to the back circuit layer after making the front solder resist layer.
  • an adhesive is applied to the insulating substrate layer of the front aluminum circuit layer and/or the back aluminum circuit layer, and the adhesive is bonded and pressed together to combine the front aluminum circuit layer and the back aluminum circuit layer together, and the front solder resist layer and the back solder resist layer are manufactured at the same time to improve work efficiency.
  • the back aluminum circuit layer 9 is generally used for the positive and negative electrodes of an external power supply.
  • a pad can also be provided on the back aluminum circuit layer to solder electronic components.
  • a pad hole 15 can be pre-fabricated by a puncher before being assembled into a double-sided circuit board (the pre-fabricated pad hole is a prior art and will not be described in detail here).
  • the pad hole 15 penetrates the front solder resist layer 4 and the front solder resist layer 4.
  • the aluminum circuit layer 1 and the intermediate insulating layer 10 make the back aluminum circuit layer 9 exposed in the pad hole 15.
  • an extrusion die is used to extrude the front aluminum circuit layer 1 and the back aluminum circuit layer 9 to form contact conduction (existing technology).
  • the surface of the back aluminum circuit layer 9 in the pad hole is electroplated with a tin-philic metal.
  • the contact conduction between the front aluminum circuit layer and the back aluminum circuit layer is achieved by an extrusion die, so that during the electroplating stage, the back aluminum circuit layer can form an interconnection conduction with the front aluminum circuit layer, so that the tin-philic metal ions in the electroplating solution can be deposited on the back aluminum circuit layer in the pad hole, so that when soldering electronic components, the soldering can be firm, as shown in Figure 8.
  • a masking ink 13 (a permanent plugging resin produced by Quanying Technology Co., Ltd.) is made at the disconnection point of the aluminum conductive wire 2 to cover the fracture 14 of the aluminum conductive wire 2.
  • a portion of the masking ink 13 is stacked on the front solder resist layer 4, as shown in Figures 7 to 7-5. The masking ink 13 masks the disconnection position to improve the overall appearance of the entire circuit board.
  • the anode may be replaced with a tin rod or a nickel rod.
  • the tin-affinity metal for electroplating is tin or nickel, which also has good tin affinity and is low in cost.
  • the metal ion concentration in the solution is stable and consistent, the thickness of the electroplated layer is stable, and there is no external electroplating like chemical plating.
  • the plating impurities brought by the reducing agent and the impurities of the side reaction products are not deposited in the plating layer, which ensures the good solderability of the metal pad after electroplating. Since there are no side reaction impurities in the waste etching liquid, the recovery process is relatively simple and low in cost.
  • the present invention only has tin-philic metals such as copper or silver at the pad position, which is obviously lower in cost than the solution with a layer of copper on the entire circuit surface, and also solves the difficulty of etching two metals.
  • the recovery and treatment of the waste electroplating liquid also becomes easier and lower in cost. While meeting the good solderability of the pad, the present invention greatly reduces the production cost of the circuit board, which is conducive to the circuit board and related products to obtain good market competitiveness.
  • the embodiment of the second aspect of the present invention provides a metal aluminum circuit board, comprising an insulating substrate layer, a front aluminum circuit layer 1 bonded to the insulating substrate layer, and a front solder resist layer 4 bonded to the front aluminum circuit layer 1.
  • a pad window is provided on the front solder resist layer 4, and an aluminum pad 12 is formed at the pad window on the front aluminum circuit layer 1.
  • a tin-philic metal layer 6 is bonded to the surface of the aluminum pad 12.
  • the thickness of the tin-philic metal layer 6 is 1 micron-20 microns. The thickness of the tin-philic metal layer 6 can be achieved by controlling the electroplating time.
  • the front aluminum circuit layer 1 includes a plurality of circuits 11, and at least some of the circuits 11 have fractures 14, and the fractures 14 penetrate the front solder resist layer 4 and the front aluminum circuit layer 1.
  • the aluminum conductive wire 2 is broken by a breaking mold 7, the fracture 14 penetrates the insulating substrate layer, the aluminum section at the fracture 14 and the section of the insulating substrate layer are located on the same knife-cut surface, and the side of the front aluminum circuit layer at the fracture is not blocked by the front solder resist layer 4; or the fracture 14 does not penetrate the insulating substrate layer, and the side of the front aluminum circuit layer at the fracture is not blocked by the front solder resist layer, as shown in Figures 5-6 to 5-9, the fracture is formed by corroding the front solder resist layer 4 and the aluminum wire 12 with an alkaline solution.
  • a shielding ink 13 is provided at the fracture 14, and the shielding ink 13 shields the aluminum side at the fracture.
  • a part of the shielding ink is stacked on the front solder resist layer 4, as shown in Figures 7 to 7-5 for details.
  • the circuit board is a single-sided circuit board, and the insulating substrate layer forms a back solder resist layer 3, as shown in Figures 2-2, 2-3, 3-2, 3-3, 4-1, 4-2, 5-6, 5-7, 5-10, 5-11, 7-2, and 7-3; in other embodiments, the circuit board is a double-sided circuit board, including a back aluminum circuit layer 9 bonded to the insulating substrate layer, and the back aluminum circuit layer 9 is bonded to A back solder resist layer 3 is provided, and the front aluminum circuit layer 1 and the back aluminum circuit layer 9 are in contact and conductive.
  • the contact and conductive method is to push the front aluminum circuit layer 1 and the back aluminum circuit layer 9 to contact and achieve conduction through a mold.
  • the insulating substrate layer forms the middle insulating layer 10 of the double-sided circuit board, as shown in Figures 2-4, 2-5, 3-4, 3-5, 4-3, 4-4, 5-8, 5-9, 5-12, 5-13, 7-4, and 7-5.
  • a pad hole is also included, wherein the pad hole penetrates the front solder resist layer, the front aluminum circuit layer and the insulating substrate layer, and the back aluminum circuit layer is exposed in the pad hole to form a back aluminum pad, and the surface of the back aluminum pad is combined with a tin-philic metal layer, so that the aluminum pad on the back aluminum circuit layer is electroplated with the tin-philic metal layer, so that the solder It is firm and reliable when connecting electronic components.
  • the tin-philic metal is copper, tin, silver or nickel.
  • the third aspect of the present invention provides a circuit board module, including the metal aluminum circuit board described in any one of the embodiments of the second aspect, and electronic components are welded on the tin-philic metal layer, and the electronic components can be resistors, LEDs or others; it can be understood that the circuit board module is a lamp, a printer, a computer or a car, and can also be other products that require the use of a circuit board and are not mentioned in this article.
  • a tin-philic metal layer is combined on the surface of the aluminum pad, the thickness of the tin-philic metal layer is 1 micron-20 microns, the front aluminum circuit layer includes multiple circuits, at least some of the circuits have fractures, and the fractures penetrate the front solder mask layer and the front aluminum circuit layer.
  • the circuit board can be electroplated with tin-philic metal using an electroplating process, so that only a layer of tin-philic metal is electroplated on the surface of the aluminum pad.
  • the anode metal loses electrons to form metal ions, and then obtains electrons on the surface of the cathode aluminum pad to form metal atoms deposited on the pad surface.
  • the metal ion concentration in the solution is stable and consistent, the thickness of the electroplated layer is stable, and there is no external reduction like chemical plating.
  • the waste etching liquid does not contain impurities from side reactions, which ensures good solderability of the metal pad after electroplating.
  • the waste etching liquid does not contain impurities from side reactions, so the recycling process is relatively simple and low-cost.
  • the present invention Compared with the copper-aluminum composite foil in the prior art, the present invention only has tin-philic metals such as copper or silver at the pad position, which is obviously lower in cost than a solution in which the entire circuit surface has a layer of copper. It also solves the difficulty of etching two metals, and the recycling of waste electroplating liquid becomes easier and lower in cost. While meeting the requirement of good solderability of the pad, the present invention greatly reduces the production cost of the circuit board, which is conducive to the circuit board and related products to obtain good market competitiveness.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention concerne un procédé de fabrication d'une carte de circuit imprimé en aluminium métallique, ainsi qu'une carte de circuit imprimé en aluminium métallique et un module de carte de circuit imprimé. Le procédé de fabrication consiste à : préparer un substrat revêtu d'aluminium, le substrat revêtu d'aluminium comprenant une couche de substrat isolante et une couche d'aluminium frontale située sur une face de la couche de substrat isolante ; fabriquer une encre anti-gravure sur la couche d'aluminium frontale, et recouvrir la couche d'aluminium à l'endroit où un circuit et un fil conducteur doivent être formés ; graver le substrat revêtu d'aluminium à l'aide d'un procédé de gravure, et graver la couche d'aluminium frontale pour former une couche de circuit d'aluminium frontale et un fil conducteur d'aluminium, tous les circuits de la couche de circuit d'aluminium frontale étant interconnectés et conducteurs grâce au fil conducteur d'aluminium ; retirer l'encre anti-gravure ; fabriquer un masque de soudure frontal sur la couche de circuit d'aluminium frontal, le masque de soudure frontal recouvrant partiellement la couche de circuit d'aluminium frontal, de manière à révéler une pastille d'aluminium ; électrodéposer la pastille d'aluminium avec un métal étainphile à l'aide d'un procédé d'électrodéposition ; et déconnecter le fil conducteur d'aluminium. Par conséquent, la soudabilité d'une pastille est garantie et le coût de fabrication d'une carte de circuit imprimé est également considérablement réduit.
PCT/CN2023/118177 2022-10-29 2023-09-12 Procédé de fabrication de carte de circuit imprimé en aluminium métallique, et carte de circuit imprimé en aluminium métallique et module de carte de circuit imprimé WO2024087916A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN202222948623.4 2022-10-29
CN202211408899.1 2022-10-29
CN202211408899.1A CN116017846A (zh) 2022-10-29 2022-10-29 一种金属铝线路板的制作方法、金属铝线路板及线路板模组
CN202222948623.4U CN218998386U (zh) 2022-10-29 2022-10-29 一种金属铝线路板及线路板模组

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102711375A (zh) * 2012-06-13 2012-10-03 田茂福 具有改良的可焊性的柔性线路板和方法
CN104684277A (zh) * 2015-02-14 2015-06-03 深圳市五株科技股份有限公司 印刷电路板的金手指制作方法
CN107708297A (zh) * 2017-08-31 2018-02-16 深圳崇达多层线路板有限公司 一种基于焊盘的电镀引线设计
CN112087877A (zh) * 2019-06-12 2020-12-15 铜陵国展电子有限公司 一种用铝箔蚀刻制成电路的电路板及其制作方法
CN115151053A (zh) * 2021-03-28 2022-10-04 中山国展光电科技有限公司 一种铜合铝箔材料制作的led线路板模组及其制作方法
CN116017846A (zh) * 2022-10-29 2023-04-25 铜陵国展电子有限公司 一种金属铝线路板的制作方法、金属铝线路板及线路板模组

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102711375A (zh) * 2012-06-13 2012-10-03 田茂福 具有改良的可焊性的柔性线路板和方法
CN104684277A (zh) * 2015-02-14 2015-06-03 深圳市五株科技股份有限公司 印刷电路板的金手指制作方法
CN107708297A (zh) * 2017-08-31 2018-02-16 深圳崇达多层线路板有限公司 一种基于焊盘的电镀引线设计
CN112087877A (zh) * 2019-06-12 2020-12-15 铜陵国展电子有限公司 一种用铝箔蚀刻制成电路的电路板及其制作方法
CN115151053A (zh) * 2021-03-28 2022-10-04 中山国展光电科技有限公司 一种铜合铝箔材料制作的led线路板模组及其制作方法
CN116017846A (zh) * 2022-10-29 2023-04-25 铜陵国展电子有限公司 一种金属铝线路板的制作方法、金属铝线路板及线路板模组

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