WO2024069857A1 - アンテナ装置およびアンテナ装置の製造方法 - Google Patents

アンテナ装置およびアンテナ装置の製造方法 Download PDF

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Publication number
WO2024069857A1
WO2024069857A1 PCT/JP2022/036453 JP2022036453W WO2024069857A1 WO 2024069857 A1 WO2024069857 A1 WO 2024069857A1 JP 2022036453 W JP2022036453 W JP 2022036453W WO 2024069857 A1 WO2024069857 A1 WO 2024069857A1
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WO
WIPO (PCT)
Prior art keywords
coil wire
wire
solder
antenna device
coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/036453
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
隆平 秦
信之 高橋
大地 玄馬
淳司 森田
智也 谷田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumida Corp
Original Assignee
Sumida Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumida Corp filed Critical Sumida Corp
Priority to PCT/JP2022/036453 priority Critical patent/WO2024069857A1/ja
Priority to US19/108,350 priority patent/US20250353091A1/en
Priority to JP2024548965A priority patent/JPWO2024069857A1/ja
Priority to CN202280099363.8A priority patent/CN119744481A/zh
Priority to DE112022007841.3T priority patent/DE112022007841T5/de
Publication of WO2024069857A1 publication Critical patent/WO2024069857A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, electron beams [EB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal

Definitions

  • the present invention relates to an antenna device and a method for manufacturing an antenna device.
  • Patent Document 1 discloses a method for manufacturing an RFID transponder having an antenna (4) made of a winding wire (2), the winding wire (2) being soldered to a solderable contact area (12).
  • a solderable contact area (12) is provided on the upper surface of a semiconductor die (6).
  • the contact area (12) is a metal plating made of a nickel-based alloy or the like.
  • the end of the winding wire (2) is soldered to the contact area (12).
  • a laser is irradiated to the area to be soldered, and the solder is melted by the laser to join the winding wire (2) and the contact area (12).
  • Patent Document 1 discloses that the same laser device used to solder the winding wire (2) to the contact area (12) is used to perform a process of stripping the insulating film before the soldering process. In other words, it is necessary to perform a process of stripping the insulating film before the soldering process. This causes a problem in the manufacture of the antenna device, in that the number of manufacturing steps increases. Such problems are not limited to solder, but occur in all brazing processes using other metallic brazing materials.
  • the present invention was made in consideration of the above-mentioned problems, and provides an antenna device and a method for manufacturing an antenna device that requires fewer manufacturing steps.
  • the method for manufacturing an antenna device of the present invention is a method for manufacturing an antenna device having an antenna section in which a coil wire whose coil core is coated with an insulating film is wound, and a base having a pad section to which a part of the coil wire is soldered with a solder material, and is characterized by including a melting process in which the solder material supplied onto the pad section is irradiated with a laser to melt the solder material, and a removal process in which the coil wire is immersed in the molten solder material to remove a part of the insulating film from the coil wire, and the coil wire and the pad section are joined with the solder material.
  • the antenna device of the present invention is an antenna device having an antenna section wound with a coil wire having a coil core and an insulating coating covering the coil core, and a base having a pad section, wherein the coil wire has an exposed section where the coil core is exposed from the insulating coating, the coil wire and the pad section are joined by a solder material, a part of the coil wire is embedded in the solder material, and a first boundary line, which is a boundary between an internal region of the circumferential surface of the coil wire that is embedded in the solder material and an external region that protrudes outside the solder material, and a second boundary line, which is a boundary between the exposed section and a coated portion of the coil wire that is coated with the insulating coating, are aligned with each other.
  • the heat of the molten solder removes the insulating coating immersed in the solder from the coil wire. This allows the brazing process and the process of removing the insulating coating from the coil wire to be carried out simultaneously, reducing the number of steps required to manufacture the antenna device.
  • FIG. 1 is a perspective view showing an example of an antenna device according to a first embodiment of the present invention.
  • FIG. 2 is a top view of a circuit portion of the antenna device according to the first embodiment.
  • 3 is a longitudinal cross-sectional view of the antenna device according to the first embodiment taken along the dashed dotted line shown in FIG. 2, viewed in the direction of the arrows III-III. 3 is an enlarged view of X shown in FIG. 2 of the antenna device according to the first embodiment.
  • 5 is a longitudinal cross-sectional view of the antenna device according to the first embodiment taken along the dashed dotted line shown in FIG. 4, viewed in the direction of the arrow VV.
  • FIG. 4A to 4C are perspective views of an antenna device illustrating an example of a manufacturing method for the antenna device according to the first embodiment.
  • 5A to 5C are top views of the antenna device for illustrating an example of a manufacturing method of the antenna device according to the first embodiment.
  • 8 is a longitudinal cross-sectional view of the antenna device according to the first embodiment taken along the dashed dotted line in FIG. 7, viewed in the direction of arrows VIII-VIII.
  • 9 is a longitudinal cross-sectional view of the antenna device according to the first embodiment taken along the dashed dotted line in FIG. 7, viewed in the direction of arrows IX-IX.
  • 2 is a perspective view showing an example of a pressing jig used in the manufacturing method of the antenna device according to the first embodiment.
  • FIG. 4 is a perspective view showing an example of installation of a pressing jig in the manufacturing method of the antenna device according to the first embodiment.
  • the various components of the antenna device of the present invention do not need to be independent entities, and it is permitted that multiple components are formed as a single member, that one component is formed from multiple members, that one component is part of another component, that part of one component overlaps with part of another component, etc.
  • the manufacturing method of the antenna device of the present invention may be described using a number of steps described in a sequential order, but the order of the steps does not limit the order or timing of performing the number of steps. Therefore, when implementing the manufacturing method of the antenna device of the present invention, the order of the number of steps may be changed to the extent that does not interfere with the content, and some or all of the timing of performing the number of steps may overlap with each other.
  • the front, rear, left, right, top and bottom directions are defined as shown in the drawings.
  • the front end of the base 30, the antenna unit 20 or the coil wire 40 may be referred to as the front end
  • the rear end of the base 30, the antenna unit 20 or the coil wire 40 may be referred to as the rear end.
  • the left and right direction may be referred to as the width direction
  • the up and down direction may be referred to as the height direction.
  • the direction from the center line of the base to the left or right in the left and right direction is referred to as the outward or outward direction, and the direction from the left or right toward the center line of the base is referred to as the inward or inward direction.
  • the direction perpendicular to the up and down direction that is, the left and right direction and the front and rear direction, may be collectively referred to as the lateral direction.
  • the term "flat surface” as used herein means a shape that is physically formed with a flat surface as a goal, and it is not necessarily required that the surface be a geometrically perfect flat surface.
  • FIG. 1 is a perspective view showing an example of an antenna device 100 according to a first embodiment of the present invention.
  • the antenna device 100 has an antenna section 20 and a base (circuit section 33) having a pad section 331.
  • the antenna section 20 is wound with a coil wire 40 having a coil core 47 and an insulating coating 46 that covers the coil core 47.
  • the coil wire 40 and the pad section 331 are joined with a brazing material 50.
  • the antenna device 100 can be used in a small portable communication system, such as a transceiver used in a keyless entry system, and can also be used as an RFID transponder used to identify an item such as a commodity.
  • the antenna unit 20 functions as an antenna for transmitting and receiving radio waves in the antenna device 100.
  • the antenna unit 20 has a winding core 21, and a coil wire 40 is wound around the winding core 21. As shown in FIG. 1, both ends of the coil wire 40 are disposed on the base 30 side (rear end side) of the winding core 21.
  • the coil wire 40 (coil unit 49) is wound around the axial middle part of the winding core 21. That is, the coil wire 40 is not wound around a part of the front end of the winding core 21.
  • each of the coil wires 40 wound around the winding core 21 is omitted from illustration. The same applies to Figs. 3, 6, 7, 9, and 11.
  • the shape of the antenna section 20 is not limited to that of the present embodiment, and may include various shapes that function as an antenna.
  • the antenna section 20 may be an air-core coil in which the inside of the coil section 49 is hollow without using the winding core 21.
  • the coil wire 40 may also be wound so as to be arranged in a ring shape on a plane. Both ends of the coil wire 40 are drawn out to the base 30 side.
  • the coil wire 40 is a conductive wire.
  • the coil wire 40 is formed by covering a coil core 47 (see FIG. 4) made of a conductive metal such as copper with an insulating coating 46 (see FIG. 4).
  • Examples of the material for the insulating coating 46 include resins such as polyurethane and polyimide.
  • the winding core 21 is inserted into a winding core insertion hole 316 (see FIG. 3) provided on the front end side of the base 30 described below, and is fixed to the base 30.
  • a chamfered portion 316a is provided at the opening of the winding core insertion hole 316.
  • the end face (the surface facing the rear end) of the winding core 21 contacts the bottom face (the surface facing the rear end) of the winding core insertion hole 316.
  • the base 30 (circuit section 33) is a member for arranging a circuit main body 333 to which the coil wires 40a, 40b drawn out from the coil section 49 are connected.
  • the base 30 can include a wire arrangement section 31 used in a manufacturing method of the antenna device 100 described below.
  • the circuit section 33 may be referred to as the base 30, and the circuit section 33 and the wire arrangement section 31 may be collectively referred to as the base 30.
  • the circuit unit 33 has a columnar shape with a substantially semicircular bottom surface, as shown in Fig. 1.
  • the semicircular surface that corresponds to the bottom surface of the column faces the front-rear direction
  • the flat portion (upper surface 33a) of the side surface of the column faces upward
  • the curved peripheral surface of the side surface of the column faces downward.
  • the shape of the circuit unit 33 is not limited to a columnar shape with a semicircular bottom surface, and may be a flat plate, a rectangular column, a cylinder, or the like.
  • a mounting hole 334 (see Figs. 3 and 8) recessed downward is provided on the upper surface 33a of the circuit portion 33.
  • the mounting hole 334 is open on the upper side and the rear end side as shown in Fig. 3.
  • the mounting hole 334 may be shaped so that only the upper side is open.
  • the bottom surface of the installation hole 334 has a size and shape sufficient for disposing the circuit body 333 described below.
  • the installation hole 334 in order to accommodate the rectangular circuit body 333 that is elongated in the front-rear direction, also has a rectangular shape that is elongated in the front-rear direction.
  • the width and front-rear lengths of the installation hole 334 are equal to or greater than the width and front-rear lengths of the circuit body 333, respectively. In this embodiment, the width and front-rear lengths of the installation hole 334 are greater than the width and front-rear lengths of the circuit body 333. As shown in Fig.
  • the circuit body 333 is housed inside the installation hole 334. Housed means that a part or the whole of the circuit body 333 is disposed in the installation hole 334.
  • the upper surface 333a of the circuit body 333 is lower than the upper surface 33a of the circuit section 33. That is, as shown in FIG. 3, the entire circuit body 333 is housed in the installation hole 334, but this is not limited thereto.
  • the upper part of the circuit body 333 may be located above the upper surface 33a of the circuit section 33.
  • the installation hole 334 may not be provided in the circuit section 33, and the circuit body 333 may be disposed on the upper surface 33a of the circuit section 33.
  • the circuit body 333 is a member having pad portions 331 (see FIGS. 2 and 3) described later and connected to the coil wire 40, and is a circuit board on which semiconductor components and the like are mounted.
  • the circuit board may be coated with resin or the like, and may be housed, for example, inside a hollow member.
  • the circuit body 333 and the circuit section 33 on which the circuit body 333 is installed are separate members, but this is not limited thereto.
  • the circuit body 333 and the circuit section 33 may be configured together as a single member.
  • a pad portion 331 is disposed on an upper surface 333a of the circuit body 333.
  • the pad portion 331 is a portion to which a brazing material 50 for brazing the coil wire 40 is supplied.
  • the pad portion 331 is a portion plated with a thin film of a conductive metal such as copper or nickel.
  • the pad portion 331 is connected to a component that constitutes a circuit, such as a semiconductor substrate, and the coil wire 40 and the component that constitutes the circuit are electrically connected via the pad portion 331. It is preferable that the thickness (length in the height direction) of the pad portion 331 is smaller than a base height h2 (height from the upper surface 333a of the circuit body 333 to the upper surface 33a of the circuit portion 33) described later.
  • two pad portions 331 are provided at two locations on the upper surface 333a of the circuit body 333. This is for joining both ends of the coil wire 40 to the respective pad portions 331. More specifically, in this embodiment, the pad portions 331 are disposed at one location each in the left and right regions on the rear end side of the upper surface 333a of the circuit body 333. The left and right pad portions 331 are disposed at positions that are line-symmetrical with respect to the center line in the left-right direction of the circuit body 333, and have line-symmetrical shapes. In this embodiment, both ends of the coil wire 40 are joined to a pair of pad portions 331 provided on the base 30 by the brazing material 50.
  • the pair of pad portions 331 are each formed into a substantially rectangular shape with the longitudinal direction being the longitudinal direction.
  • each of the rectangles has one of the corners on the inner side of the pair of pad portions 331 chamfered to form a hypotenuse 331a (see FIG. 4). Specifically, the corners located on the inner side and the front end side of the rectangle are chamfered. That is, the pad portion 331 has a pentagonal shape.
  • the hypotenuse 331a is aligned with the extension direction of the coil wire 40.
  • the extension direction of the coil wire 40 is the axial direction of the coil wire 40.
  • the extension direction of the coil wire 40 being aligned with the oblique side 331a means that the extension direction of the coil wire 40 and the oblique side 331a are preferably approximately parallel, and that the acute angle between the extension direction of the coil wire 40 and the oblique side 331a is at least 45 degrees or less.
  • the coil wire 40 drawn out from the antenna portion 20 is placed on the base 30 and joined to the pad portion 331 .
  • the corners at the boundary between the side surface and the top surface 33a at the front end of the base 30 are chamfered to provide an inclined surface 33c.
  • a pair of guide parts 335 protruding from the top surface 33a of the circuit part 33 are provided at the front end side of the base 30, spaced apart in the left-right direction. As shown in FIG. 2, the guide parts 335 are disposed outwardly of the pair of pad parts 331.
  • the guide parts 335 are substantially rectangular and elongated in the front-rear direction, and the corners at the boundary between the side surface at the rear end side and the side surface on the outer side are chamfered with R. That is, the outer side surface 335a (see FIG. 2) disposed on the outer side of the guide parts 335 is a partially curved peripheral surface. As shown in Fig. 1 and Fig. 2, the coil wire 40 drawn out toward the base 30 is disposed along the inclined surface 33c and the outer surface 335a of the guide portion 335. Furthermore, the coil wire 40 is disposed along the upper surface 33a of the circuit portion 33 and the outer surface 335a of the guide portion 335.
  • the coil wire 40 is bent while being disposed along the curved peripheral surface that is a part of the outer surface 335a.
  • One end of the coil wire 40 is soldered to the pad portion 331 disposed on the inner side of the guide portion 335.
  • one end of the coil wire 40 partially protrudes from the brazing material 50 toward the rear end side.
  • brazing material 50 used to braze the coil wire 40 and the pad portion 331 examples include metal brazing materials such as solder and gold brazing.
  • the brazing material 50 melts in a melting step described below, and the molten brazing material 50 comes into contact with the coil core 47 of the coil wire 40 and the pad portion 331 to form an alloy layer between the coil core 47 or the pad portion 331. In the following description, it is assumed that the brazing material 50 is solder 50 .
  • a portion of the coil wire 40 is embedded in the brazing material 50 (solder 50).
  • solder 50 covers the entire radial direction of the coil wire 40, and that the entire coil wire 40 is wrapped in the solder 50 in a portion of the length of the coil wire 40, as in the solder 50a in Figs. 4 and 5.
  • solder 50b illustrated in Figs. 4 and 5
  • the radial direction refers to a direction perpendicular to the axis of the coil wire 40, that is, a direction that radiates from the axis of the coil wire 40 toward the circumferential surface.
  • the antenna device 100 manufactured by this method has an antenna portion 20 in which a coil wire 40 is wound, the coil core 47 of which is covered with an insulating coating 46, as described above, and a base 30 having a pad portion 331 to which a portion of the coil wire 40 is soldered with a solder material 50.
  • This method includes a melting step and a removing step. In the melting step, a laser is irradiated onto the brazing material 50 supplied onto the pad portion 331, and the brazing material 50 is melted.
  • the coil wire 40 is immersed in the molten brazing material 50, and a part of the insulating coating 46 is removed from the coil wire 40, and the coil wire 40 and the pad portion 331 are joined by the brazing material 50.
  • a wire arrangement step is performed before the melting step and the removing step, and a cutting step is performed after the melting step and the removing step, as described below.
  • the base 30 in this method includes a circuit section 33 and a wire placement section 31, as shown in Fig. 6.
  • the wire placement section 31 is a portion of the base 30 for fixing an end of the coil wire 40.
  • the wire placement section 31 is a plate-like member that is long in the front-rear direction. In other words, the wire placement section 31 extends in the front-rear direction.
  • the main surface of the plate-like portion (flat section 315) of the wire placement section 31 faces in the up-down direction.
  • the shape of the wire placement section 31 is not limited to a flat plate, and may be another shape, such as a pillar.
  • the wire placement section 31 is disposed at a position on the circuit section 33 opposite to the antenna section 20, i.e., on the rear end side of the circuit section 33.
  • the wire placement section 31 is formed integrally with the circuit section 33.
  • the upper surface 315a of the flat plate section 315 is disposed lower than the upper surface 33a of the circuit section 33.
  • the base 30 (wire placement section 31) has a wire fixing section 312 that fixes the coil wire 40.
  • the wire fixing section 312 is a section to which an end of the coil wire 40 is fixed.
  • the wire fixing section 312 is a square prism that protrudes upward from an upper surface 315a of the flat plate section 315 at the rear end side.
  • the coil wire 40 can be fixed by winding the coil wire 40 around the protruding square prism.
  • the coil wire 40 is not limited to a shape that protrudes upward, and may have a shape or function for fixing one end of the coil wire 40, such as a protrusion in the left/right direction, toward the rear end, or toward the downward direction, or a hook shape.
  • a rectangular hole 314 (see FIG. 7) elongated in the front-rear direction is provided.
  • solder 50 is piled up on the surface of the pad portion 331 beforehand, prior to the wire placement process described below.
  • the solder 50 is formed in a mountain shape having a slope 51 that slopes downward from the center of the pad portion 331 toward the periphery of the pad portion 331.
  • the solder 50 is in contact with substantially the entire surface of the pad portion 331.
  • the slope 51 of the solder 50 is arched upward, and the entire solder 50 has a dome-like shape.
  • the solder 50 is cooled and solidified.
  • the distance from the surface of the pad portion 331 to the highest point (vertex 52) of the solder 50 is greater than the base height h2 (see Figure 9) described later, and is also greater than or equal to the wire diameter of the coil wire 40.
  • a wire placement step is performed in which the end of the coil wire 40 is placed on the base 30 .
  • one end (fixed portion 43) of the coil wire 40 is fixed to the wire fixing portion 312, and a portion of the coil wire 40 (pad portion placement portion 42) is placed on the solder material 50 provided on the surface of the pad portion 331. 6 and 7, one end of the coil wire 40 is pulled out from the antenna portion 20 around which the coil wire 40 is wound, and is pulled out toward the circuit portion 33.
  • the pulled out coil wire 40 is disposed along the inclined surface 33c, the upper surface 33a of the circuit portion 33, and the outer surface 335a of the guide portion 335.
  • a partial length region (on-pad portion disposition portion 42) of the coil wire 40 is disposed on the pad portion 331.
  • "a partial length region of the coil wire 40 is disposed on the pad portion 331” means that a part of the coil wire 40 overlaps a part of the pad portion 331 when viewed from the height direction. It is preferable that a part of the on-pad portion disposition portion 42 is disposed outward of the apex 52 (see FIG. 8).
  • a part of the on-pad portion disposition portion 42 is disposed above the pad portion 331 and is not in contact with the surface of the pad portion 331.
  • the solder 50 and the on-pad portion disposition portion 42 may or may not be in contact with each other. 6
  • the on-pad portion disposition portion 42 is disposed on the pad portion 331, the end of the coil wire 40 is wound and fixed to the wire fixing portion 312. At this time, sufficient tension is applied to the coil wire 40 disposed above the base 30 so that the coil wire 40 does not become loose.
  • the base 30 has a support portion 311 against which the coil wire 40 is pressed to change the drawing direction of the coil wire 40.
  • a bent portion 45 located between a part (the portion 42 arranged on the pad portion) and one end (the fixed portion 43) of the coil wire 40 is pressed against the support portion 311 of the base 30 and bent.
  • the bent portion 45 is a partial length region of the coil wire 40 between the portion 42 arranged on the pad portion and the fixed portion 43. More specifically, the bent portion 45 is a length region of the coil wire 40 that is curved in contact with the support portion 311 and a length region in the vicinity of the bent portion.
  • the support portion 311 is a member for holding the coil wire 40 to maintain the pull-out direction of the coil wire 40.
  • the support portion 311 is exemplified by a cylindrical protrusion protruding upward from an upper surface 315a of the flat plate portion 315 as shown in FIG. 6. As described later, the coil wire 40 is pressed inward against the support portion 311, so that the pull-out direction of the coil wire 40 pulled out from the guide portion 335 is maintained at a predetermined angle.
  • the support portion 311 may be a protrusion in the shape of a rectangular column or a column with a semicircular bottom surface.
  • the support portion 311 may also be a wall portion protruding from the base 30 and having a peripheral surface or a flat surface to which the coil wire 40 comes into contact.
  • the support portion 311 is not limited to the above-mentioned shape as long as it has a structure for maintaining the pull-out direction of the coil wire 40.
  • the support portion 311 is disposed between the pad portion 331 and the wire fixing portion 312.
  • the support portion 311 is disposed between the pad portion arrangement portion 42 and the fixing portion 43 when viewed in the height direction. With this arrangement, the bent portion 45 between the pad portion arrangement portion 42 and the fixing portion 43 is pressed against the side surface of the support portion 311 and bent.
  • a part of the bent portion 45 is disposed along the circumferential surface of the support portion 311 and curved.
  • the coil wire 40 is pressed against the side surface of the support portion 311. More specifically, the coil wire 40 is pressed against the side surface of the support portion 311 on the opposite side to the side where the coil wire 40 is pulled out from the coil portion 49 in the left-right direction.
  • the coil wire 40b (see FIG. 1) pulled out from the coil portion 49 to the base 30 on the right side is pressed against the left circumferential surface of the support portion 311.
  • One end (fixed portion 43) of the coil wire 40 bent at the bent portion 45 is wound around the wire fixing portion 312 of the base 30 as described above.
  • both ends of the coil wire 40 are disposed on the base 30 as described above.
  • both ends of the coil wire 40 cross above the base 30 when viewed from the height direction.
  • the pressure applying portions 44, 44 cross above the pressure jig installation hole 313 when viewed from the height direction.
  • the pressure applying portions 44 may or may not be in contact with each other. In other words, the pressure applying portions 44 may be in a twisted relationship with each other.
  • the pressure application portions 44 of the two coil wires 40a, 40b overlap in the height direction at the intersection.
  • the coil wire 40a may be located either above or below the coil wire 40b.
  • Figures 8 and 9 the overlapping state of the pressure application portion 44 of the coil wire 40a and the pressure application portion 44 of the coil wire 40b is omitted.
  • the coil wire 40 pulled out from the antenna portion 20 can be pulled in any direction and positioned on the pad portion 331.
  • the coil wire 40 can be adjusted so as to be positioned passing through any position. For example, by positioning the support portion 311 closer to the front end or by making the width of the support portion 311 larger, the coil wire 40 is pulled out at a larger angle with respect to the front-rear direction, and the coil wire 40 is positioned further inward above the circuit body 333.
  • the distance between the pad portion 331 and the support portion 311 is equal to or less than half the distance between the pad portion 331 and the wire fixing portion 312.
  • the width of the support portion 311 (the diameter of the bottom surface when the support portion 311 is cylindrical) is greater than the width of the wire fixing portion 312.
  • the pressure section 44 is a partial length region between one end (fixed section 43) and a portion (on-pad section placement section 42) of the coil wire 40. More specifically, the pressure section 44 is a partial length region between a length region of the coil wire 40 that contacts the support section 311 (a part or all of the bent section 45) and the on-pad section placement section 42, and is a partial length region that is placed above a pressure jig installation hole 313 described later.
  • the direction in which the pressure applying unit 44 faces the base 30 is the direction toward the pressure applying jig installation hole 313 when a hollow portion such as the pressure applying jig installation hole 313 is provided in the base 30.
  • the pressure applying unit 44 applies pressure downward.
  • the coil wire 40 comes into contact with the solder 50 while exerting a resistance force against the solder 50.
  • the coil wire 40 exerts a resistance force downward, inward, and toward the front end against the inclined surface 51 of the solder 50.
  • a pressure jig 200 is used in this embodiment.
  • the pressing jig 200 has an inverted U-shape as a whole.
  • the pressing jig 200 has a rod portion 230.
  • Arms 210 extend from both ends of the rod portion 230, and weight portions 211 are provided at the lower ends of the arms 210.
  • the rod portion 230 and the arms 210 are flat plate-like, and the weight portions 211 are substantially cubic in shape.
  • a wire straddling portion 220 is provided at the center of the rod portion 230 in the extending direction.
  • the wire straddling portion 220 is a portion that directly presses a part of the coil wire 40 (pressure portion 44), and has a pair of claws 221 spaced apart in the extending direction of the rod portion 230.
  • the claws 221 protrude on the opposite side (lower side) of the rod portion 230.
  • the shape of the pressing jig 200 is not limited to the above-mentioned shape, and may be any shape that can pressurize the coil wire 40 .
  • the pressing tool 200 is disposed so as to straddle the wire placement part 31.
  • the pressing part 44 is disposed between a pair of claws 221, and the wire straddling part 220 straddles and contacts the pressing part 44.
  • the wire straddling part 220 straddles the pressing part 44 at a part where both ends of the coil wire 40 are close to each other or intersect when viewed from the height direction.
  • the pressing tool 200 disposed on the pressing part 44 sinks downward due to its own weight.
  • the sunk wire straddling part 220 may be disposed in the pressing tool installation hole 313, and further, the lower surface of the rod part 230 and the upper surface of the flat part 315 may or may not be in contact with each other.
  • the weight of the pressing tool 200 is transmitted to the pressing part 44 in contact with the wire straddling part 220, so that the pressing part 44 is pressed downward. At this time, the pressing tool 200 is stably positioned on the coil wire 40 because the pressing part 44 is held between the pair of claws 221, 221.
  • the distance between a pair of inner end faces 212 (see FIG. 10 ) of the pressing tool 200 is equal to or greater than the width of the flat plate portion 315.
  • the distance between the inner end faces 212 of the pressing tool 200 is equal to the width of the flat plate portion 315, so that when the pressing tool 200 is placed across the coil wire 40, the outer end face 315b of the flat plate portion 315 comes into contact with the inner end face 212 of the pressing tool 200. This makes it easy to position the pressing tool 200 when it is placed across the wire placement portion 31, and also makes it possible to effectively prevent the pressing tool 200 from shifting when it is placed across the wire placement portion 31.
  • the coil wire 40 By applying pressure to the base 30 with the pressure unit 44, the coil wire 40 is bent toward the base 30, i.e., downward. As a result, the on-pad portion arrangement portion 42 approaches the pad portion 331 and is pressed against and comes into contact with the solder 50 previously piled on the pad portion 331. More specifically, as shown in FIG. 8, the coil wire 40 is pressed against the inclined surface 51 of the brazing material 50 (solder 50). Specifically, the coil wire 40 is pressed against the inclined surface 51 on the outer side of the apex 52 of the solder 50 piled in a mountain shape. More specifically, when viewed from above as in FIG.
  • the coil wire 40 including the on-pad portion arrangement portion 42 is slightly curved by being pushed outward at the portion that is in pressure contact with the solder 50. Also, a part of the coil wire 40 including the on-pad portion arrangement portion 42 is arranged obliquely with respect to the front end direction when viewed from above as in FIG. 7. Therefore, the coil wire 40 including the on-pad portion 42 is also expanded toward the rear end at the portion that is pressed against the solder 50. That is, when viewed from above as in Figure 7, the on-pad portion 42 is bent outward and toward the rear end along the slope of the solder 50. To summarize the above, the coil wire 40 applies not only a downward resistance force to the solder 50, but also an inward and forward resistance force to the solder 50.
  • the coil wire 40 applies a resistance force (resistance force T (see FIG. 8 )) toward the center of the pad portion 331 to the inclined surface 51 of the solder 50, while being pressed against the center of the pad portion 331.
  • a resistance force resistance force T (see FIG. 8 )
  • T resistance force
  • the upper surface 333a of the circuit body 333 is disposed lower than the upper surface 33a of the circuit portion 33. More specifically, the upper surface 333a of the circuit body 333 is disposed lower than the upper surface 33a of the circuit portion 33, which is disposed closer to the rear end than the circuit body 333.
  • the height to the upper surface 33a of the circuit section 33 based on the upper surface 333a of the circuit body 333 is greater than the thickness of the pad section 331, as described above.
  • the base height h2 is smaller than the height (solder height h1) of the highest point of the solder 50 based on the top surface 333a of the circuit body 333.
  • the base height h2 is equal to or less than half the solder height h1.
  • the height of the on-pad portion 42 relative to the solder 50 to be adjusted to any position. That is, by pressing the coil wire 40 against the middle part of the inclined surface 51 of the solder 50, the coil wire 40 can be sufficiently immersed in the solder 50 when the solder 50 melts, as described below.
  • the fusing step is performed.
  • a laser (not shown) is irradiated onto the solder 50 supplied onto the pad portion 331 from above.
  • a carbon dioxide laser is irradiated onto the solder 50.
  • "above the pad portion 331” includes the surface of the pad portion 331 and the space above the pad portion 331.
  • irradiating the brazing material 50 supplied onto the pad portion 331 with a laser is not limited to irradiating the solder 50 formed and solidified on the surface of the pad portion 331 with a laser.
  • this also includes irradiating the solder 50, such as a wire solder, arranged above the pad portion 331 with a laser.
  • the solder 50 melts due to the heat applied from the laser. It is sufficient that the laser is irradiated onto the solder 50, and it does not matter whether the laser is irradiated onto the coil wire 40 or not.
  • the solder 50 in the melting step, is supplied to the surface of the pad portion 331 with a thickness equal to or greater than the wire diameter of the coil wire 40.
  • the solder 50 is formed in advance with a thickness equal to or greater than the wire diameter of the coil wire 40, and even after being melted by the laser, the thickness of the solder 50 is maintained to be equal to or greater than the wire diameter of the coil wire 40.
  • the thickness of the melted solder 50 applied to the surface of the pad portion 331 is equal to or greater than the wire diameter of the coil wire 40 .
  • the temperature of at least one of the coil wire 40 or the brazing material 50 is measured, and the amount of laser irradiation is controlled so that the temperature is in a predetermined range higher than the melting point of the brazing material 50.
  • the amount of laser irradiation is controlled so that the temperature is in a predetermined range higher than the decomposition temperature of the insulating coating 46.
  • the temperature may be measured of only the coil wire 40, only the brazing material 50, or both the coil wire 40 and the brazing material 50. More specifically, the temperature is measured of the brazing material 50 irradiated with the laser, or a portion of the coil wire 40 immersed in the brazing material 50 and a length region in the vicinity thereof.
  • the temperature measurement is preferably performed without contacting the solder 50, and an example of a measuring device used for the temperature measurement is an infrared thermometer.
  • the lower limit of the predetermined range is the melting point of the solder 50, and is preferably higher than the melting point of the insulating coating 46, and more preferably higher than the decomposition temperature of the insulating coating 46.
  • the upper limit of the predetermined range can be the lower limit of the temperature at which the insulating coating 46 in the portion of the coil wire 40 that is not immersed in the solder 50 (the outer region described below) becomes scorched or decomposed and denatured.
  • controlling the amount of laser irradiation includes increasing the amount of laser irradiation when the temperature of the measurement site is lower than the predetermined range, and also includes decreasing the amount of laser irradiation or interrupting laser irradiation when the temperature of the measurement site is higher than the predetermined range.
  • the removing step is performed.
  • the solder 50 melts and becomes liquid
  • a portion of the coil wire 40 that has been pressed against the solder 50 becomes immersed in the molten solder 50 .
  • the coil wire 40 that has been in pressure contact toward the center of the pad portion 331 penetrates into the solder 50 toward the center of the pad portion 331. Specifically, when viewed in the front-to-back direction as shown in Fig.
  • the coil wire 40 (particularly the portion 42 disposed on the pad portion) that is in pressure contact with the inclined surface 51 of the solder 50 penetrates into the solder 50 while moving inward and downward (the coil wire 40a toward the lower right, and the coil wire 40b toward the lower left)
  • the coil wire 40 penetrates into the solder 50 while moving inward and toward the front end (the coil wire 40a toward the lower right on the paper, and the coil wire 40b toward the lower left on the paper). That is, the molten solder 50 envelops the coil wire 40 from the center side of the pad portion 331.
  • the solder 50a envelops the coil wire 40 from the lower right of the coil wire 40a
  • the solder 50b envelops the coil wire 40 from the lower left of the coil wire 40b.
  • a part (the part in the upper right corner of the page) of the side peripheral surface 40e (see Fig. 5) of the coil wire 40b is disposed outside the solder 50b.
  • a part of the coil wire 40 is completely immersed in the solder 50, like the coil wire 40a.
  • the liquid solder 50 on the surface of the pad portion 331 tends to spread laterally (left-right and front-back).
  • the solder 50 spreads only onto the surface of the pad portion 331, which has good wettability, and does not spread beyond the pad portion 331.
  • the coil wire 40 moves inward and toward the front end while penetrating into the solder 50. This causes the solder 50 to be spread out particularly inward and toward the front end.
  • the pad portion 331 has a rectangular shape with the corners on the inner side and the front end side missing when viewed from above.
  • solder 50 This prevents the solder 50, which tends to spread inward and toward the front end, from spreading out unnecessarily flat when the coil wire 40 is immersed in the solder 50. Furthermore, the solder 50 that is prevented from spreading tends to rise upward and cover the coil wire 40, so that the upper peripheral surface 40c of the coil wire 40 (see FIG. 5) is covered with the solder 50. As a result, the coil wire 40 can be sufficiently immersed in the solder 50. As described above, the solder 50 does not easily wet and spread on the upper surface 333a of the circuit body 333 that is not metal plated, and so it bulges upward on the pad portion 331. The bulging solder 50 is rounded due to surface tension, and it may appear that the solder 50 is disposed outside the pad portion 331 when viewed from above as shown in FIG.
  • the insulating coating 46 on the surface of the coil wire 40 immersed in the solder 50 is heated by the heat of the molten solder 50.
  • the insulating coating 46 in contact with the solder 50 is removed. Specifically, for example, the insulating coating 46 is decomposed and removed from the coil wire 40.
  • the temperature of the insulating coating 46 reaches the decomposition temperature of the insulating coating 46, the insulating coating 46 is decomposed.
  • the affinity between the coil core 47 made of a metal or the like and the solder 50 is greater than the affinity between the decomposition product of the insulating coating 46 made of a resin or the like and the coil core 47.
  • the solder 50 wets the surface of the coil core 47, and the decomposition product of the insulating coating 46 is removed from the surface of the coil core 47 to the outside of the solder 50.
  • the decomposition product of the insulating coating 46 precipitates on the surface of the solder 50.
  • the decomposition product of the insulating coating 46 is sublimated by the heat of the molten solder 50. In this way, the insulating coating 46 is decomposed and removed from the surface of the coil wire 40, exposing the coil core 47.
  • the insulating coating 46 may be melted and removed from the coil wire 40.
  • the insulating coating 46 melts and becomes liquid, increasing the fluidity of the insulating coating 46.
  • the liquefied insulating coating 46 is pushed out from the surface of the coil core 47 and removed by the solder 50 that wets the surface of the coil core 47.
  • the liquefied insulating coating 46 floats up to the surface of the solder 50. Also, a portion of the insulating coating 46 may melt, and another portion may be decomposed and removed from the coil wire 40 .
  • a coil wire 40 may be used in which the insulating coating 46 has a low heat resistance.
  • An example of such an insulating material is polyurethane or the like, which has a heat resistance of 120 degrees or less. It is also preferable to use a coil wire 40 in which the insulating coating 46 is thin enough to make it easy to remove.
  • the color of the insulating coating 46 is transparent or white and not colored, which keeps the laser absorption rate in the insulating coating 46 low and prevents the insulating coating 46 from being directly peeled off by laser irradiation or the insulating coating 46 not covered with solder 50 from being altered by laser irradiation.
  • substantially the entire insulating coating 46 covered with the solder 50 is removed from the coil wire 40, but this is not limited to the above.
  • a small amount of the insulating coating 46 may remain in a portion of the coil wire 40 immersed in the solder 50.
  • a portion of an inner region (the region inside the first boundary line 48) covered with the solder 50b is also a coated portion 473 (described later) in which the insulating coating 46 remains. This is because the heat of the solder 50b is not sufficiently transmitted to the peripheral portion of the inner region (the portion close to the first boundary line 48).
  • a very small amount of the insulating coating 46 may remain in the center of the inner region without being completely decomposed or melted.
  • a portion of the outside of the solder 50 in the coil wire 40 may not be covered with the insulating coating 46.
  • a portion of the insulating coating 46 adjacent to the solder 50a is removed to form an exposed portion 471, which will be described later. This is because the heat of the molten solder 50 is also conducted to the insulating coating 46 that is located outside the solder 50 and adjacent to the solder 50.
  • the coil core 47 comes into contact with the solder 50.
  • the metal constituting the coil core 47 and the metal constituting the solder 50 become an alloy, thereby joining the coil wire 40 and the pad portion 331.
  • the molten solder 50 cools and solidifies.
  • a part of the melting step and a part of the removing step are performed at overlapping times. Performing at overlapping times means that all of the steps may be performed at the same time, or some of the steps may be performed simultaneously.
  • the removing step is started and the coil wire 40 starts to be immersed in the solder 50. That is, the coil wire 40 is immersed in the solder 50 while the solder 50 is melted by the laser.
  • the melting step is completed by the time the removing step is completed.
  • the coil wire 40 is continuously pressed against the base before and during the laser irradiation. That is, the pressurization and the melting process in the wire placement process are performed at timings that overlap each other. This allows the coil wire 40 to be immersed in the solder 50 at the same time as it melts.
  • an inert gas (not shown) is supplied to the brazing material 50 (solder 50) along the direction in which pressure is applied to the coil wire 40. It is also preferable to supply an inert gas in the removal step following the melting step. It is preferable that the direction in which the inert gas is supplied is approximately parallel to the direction in which pressure is applied to the coil wire 40. That is, in the melting step, an inert gas is supplied to the solder 50 from above.
  • the inert gas a gas that is low in reactivity with the solder 50 is used, and examples of such a gas include noble gases such as nitrogen and argon.
  • Supplying an inert gas to the solder 50 makes it possible to remove the air containing oxygen around the solder 50. This makes it possible to prevent the solder 50 from oxidizing, and improves the wettability of the solder 50 on the circumferential surface of the coil wire 40 and the wettability of the solder 50 on the surface of the pad portion 331. Furthermore, by supplying the inert gas along the direction in which pressure is applied to the coil wire 40, it is possible to thoroughly remove oxygen over a wide area around the solder 50. That is, since the solder 50 is piled up in a mountain shape so as to protrude upward, supplying the inert gas from above supplies the inert gas to the entire slope 51 of the solder 50.
  • the inert gas may be supplied along the direction of each of the resistance forces that the coil wire 40 exerts on the solder 50. That is, the inert gas may be supplied from two directions, from the upper right toward the solder 50 and from the upper left toward the solder 50. This allows a sufficient supply of inert gas to be supplied especially around the coil wire 40 that is embedded in the solder 50. The wettability of the solder 50 on the peripheral surface of the coil wire 40 is well maintained, and the coil wire 40 is sufficiently immersed in the solder 50.
  • This method includes a cutting step that is performed after the pad portion 331 and the coil wire 40 are joined with the brazing material 50 (solder 50) in the removing step.
  • the cutting step the coil wire 40 and the base 30 are cut, and a part of the coil wire 40 including one end (fixing portion 43) and a part of the base 30 including the wire fixing portion 312 are removed.
  • the coil wire 40 and the base 30 are cut on a plane that is substantially perpendicular to the front-rear direction. It is preferable that the coil wire 40 and the base 30 are cut on the same plane.
  • the cut surface along which the coil wire 40 and the base 30 are cut is a surface that is located rearward of and parallel to the side end surface 333b on the rear end side of the circuit body 333. More specifically, the cut surface includes the installation hole 334. Alternatively, the cut surface may be flush with the side end surface 333b of the circuit main body 333. Also, in the removal step, the circuit portion 33 may not be cut, but the flat portion 315 of the wire placement portion 31 and the coil wire 40 may be cut. In this case, the cut surface may be flush with the rear end side surface 33d located on the rear end side of the circuit portion 33 (the boundary surface between the wire placement portion 31 and the circuit portion 33).
  • Both ends of the coil wire 40 located forward of the cut surface are removed. Specifically, the ends of the coil wire 40 including the pressure section 44, the bent section 45, and the fixed section 43 are removed. In addition, a portion of the base 30 located forward of the cut surface is also removed. Specifically, the ends of the base 30 including the wire placement section 31 are removed.
  • the antenna device 100 is manufactured.
  • the melting step of melting the solder 50 by laser irradiation and the step of immersing the coil wire 40 in the molten solder 50 to remove a portion of the insulating coating 46 from the coil wire 40 are essential steps. It is optional to include other steps or other components.
  • the insulating coating 46 is removed from the coil wire 40.
  • the insulating coating 46 can be peeled off during the brazing process, and there is no need to perform a process of peeling off the insulating coating 46 from the coil wire 40 before the brazing process. This allows the number of steps in manufacturing the antenna device 100 to be reduced.
  • the coil wire 40 has an exposed portion 471 where the coil core 47 is exposed from the insulating coating 46.
  • a first boundary line 48 which is a boundary between an internal region buried in the solder 50 and an external region protruding from the solder 50, on the peripheral surface of the coil wire 40, and a second boundary line 472, which is a boundary between the exposed portion 471 and a coated portion 473 of the coil wire 40 that is coated with the insulating coating 46, run along each other.
  • a portion of the circumferential surface of the coil wire 40 being embedded in the solder 50 means that a portion of the circumferential surface of the coil wire 40 is covered with the solder 50 .
  • the inner region is a portion of the circumferential surface of the coil wire 40 that is buried in the solder 50 and is a region inside the first boundary line 48 (see FIG. 4 ).
  • the outer region is a portion of the circumferential surface of the coil wire 40 that is not covered by the solder 50 and is a region outside the first boundary line 48.
  • two first boundary lines 48 are arranged on the circumferential surface of the coil wire 40a, spaced apart in the front-rear direction.
  • each of the first boundary lines 48 on the coil wire 40a goes around the coil wire 40a in the circumferential direction.
  • the internal region refers to a portion of the circumferential surface of the coil wire 40a that is sandwiched between a pair of first boundary lines 48. In other words, the internal region of the coil wire 40a extends over the entire radial direction of the coil wire 40a.
  • a substantially elliptical first boundary line 48 is disposed on the circumferential surface of the coil wire 40b shown in Fig. 4.
  • the inner region of the coil wire 40b is a substantially elliptical region inside the first boundary line 48. More specifically, the inner region of the coil wire 40b covers a portion of the lower circumferential surface of the coil wire 40b (lower circumferential surface 40d described below), and extends over only a portion of the radial direction of the coil wire 40b.
  • the exposed portion 471 is a partial region of the circumferential surface of the coil wire 40, which is not covered with the insulating coating 46 and in which the coil core 47 is exposed.
  • the insulating coating 46 may not be sufficiently removed in the removal process, and a small amount of the insulating coating 46 may remain in the center of the internal region. That is, the insulating coating 46 may be disposed in only a small portion of the center of the exposed portion 471.
  • the region in which the insulating coating 46 is disposed on the inside excluding the periphery of the internal region is also considered to be the exposed portion 471.
  • the insulating coating 46 is completely peeled off over the entire exposed portion 471.
  • a portion of the circumferential surface of the coil wire 40 excluding the exposed portion 471 is covered with an insulating coating 46.
  • the portion of the circumferential surface of the coil wire 40 that is covered with the insulating coating 46 is referred to as a covered portion 473.
  • the exposed portion 471 runs along the entire circumference of the coil wire 40a.
  • the exposed portion 471a is a region sandwiched between a pair of second boundary lines 472a, 472a spaced apart in the front-rear direction. Each of the second boundary lines 472a runs around the circumferential surface of the coil wire 40a in the circumferential direction.
  • the exposed portion 471b is generally elliptical, including a portion of the lower circumferential surface 40d (described later), and runs along only a portion of the radial direction of the coil wire 40b.
  • the exposed portion 471b is a region inside the generally elliptical second boundary line 472.
  • the exposed portion 471 and the internal region are generally coincident, but need not be perfectly coincident with each other.
  • the exposed portion 471 may include the external region, and the internal region may include the coated portion 473.
  • the coil wire 40a most of the exposed portion 471 is covered by the solder 50 and coincides with the internal region, but part of the exposed portion 471 is outside the solder 50 and is the external region.
  • the coil wire 40b most of the internal region is the exposed portion 471 that exposes the coil core 47, but the remaining part of the internal region is the coated portion 473 that is covered by the insulating coating 46.
  • first boundary line 48 and the second boundary line 472 are aligned means that the convex portions and concave portions of the first boundary line 48 and the second boundary line 472 correspond to each other.
  • shape of the first boundary line 48 and the shape of the second boundary line 472 are substantially identical to each other.
  • an acute angle between a tangent to a portion of the first boundary line 48 and a tangent to a portion of the second boundary line 472 adjacent to the portion of the first boundary line 48 is smaller than an acute angle between the first boundary line 48 and a plane perpendicular to the extension direction of the coil wire 40. It is also desirable that the first boundary line 48 and the second boundary line 472 are sufficiently close to each other.
  • the distance between a portion of the first boundary line 48 and a portion of the second boundary line 472 adjacent to said portion is equal to or less than the wire diameter of the coil. It is even more preferable that the distance between the portion of the first boundary line 48 and the portion of the second boundary line 472 adjacent to said portion is zero, and the first boundary line 48 and the second boundary line 472 approximately coincide with each other.
  • the first boundary line 48 may be disposed inside or outside the exposed portion 471.
  • the first boundary line 48a in the solder 50a is present on the exposed portion 471a, i.e., the first boundary line 48a is disposed closer to the inside of the exposed portion 471a than the second boundary line 472a.
  • a partial length region (first boundary line 48b) of the first boundary line 48 in the solder 50b is disposed outside the exposed portion 471b, i.e., the first boundary line 48b is disposed further outward from the exposed portion 471b than the second boundary line 472b.
  • first boundary line 48c Another partial length region (first boundary line 48c) of the first boundary line 48 in the solder 50b approximately coincides with a part of the second boundary line 472 (second boundary line 472c). Furthermore, the second boundary line 472 may intersect with the first boundary line 48. That is, a partial length region of the first boundary line 48 may be disposed outside the exposed portion 471, and another partial length region of the first boundary line 48 may be disposed inside the exposed portion 471, so that the second boundary line 472 and the first boundary line 48 intersect with each other.
  • the antenna device 100 of the present embodiment has a structure that can be manufactured with a small number of manufacturing steps. Furthermore, by arranging the first boundary line 48 and the second boundary line 472 along each other, substantially the entire area of the exposed portion 471 is covered with the solder 50, and the area of the exposed portion 471 that is not covered with the solder 50 (the area where the coil core is exposed) can be minimized. This prevents the coil core 47 from being exposed more than necessary, improving the insulation of the coil wire 40.
  • the antenna device 100 in which the coil wire 40 is enclosed in the solder 50 so that the first boundary line 48 and the second boundary line 472 are aligned in this manner without using the manufacturing method described above.
  • the insulating coating may be removed while the circumferential surface of the coil wire 40 other than the region to be covered with the solder 50 is masked in advance.
  • the thickness (length in the height direction) of the brazing material 50 is greater than the wire diameter of the coil wire 40.
  • the thickness of the solder 50 here refers to the maximum height of the solder 50 based on the surface of the pad portion 331 at a point where the coil wire 40 and the solder 50 do not overlap in the area where the solder 50 is arranged when viewed in the height direction.
  • the thickness of the solder 50 here means the thickness of the solder 50 only, not including the thickness of the coil wire 40.
  • the solder 50 is formed in a roughly mountain-shaped shape with the top above the coil wire 40.
  • the highest point of the solder 50 is above the coil wire 40, but the thickness of the solder 50 is smaller than the height of the solder 50 (the distance from the surface of the pad portion 331 to the highest point of the solder 50). In this case, the thickness of the solder 50 is the height of the solder 50 at a point close to the side of the coil wire 40.
  • the coil wire 40 can be sufficiently immersed in the solder 50 in the manufacturing method of the antenna device 100 described below. Furthermore, by piling up the solder 50 to a thickness equal to or greater than the wire diameter of the coil wire 40, the coil wire 40 can be substantially entirely embedded in the solder 50 in the radial direction. This makes the bond between the solder 50 and the coil wire 40 physically strong, and also improves the electrical connection between the solder 50 and the coil wire 40.
  • a radial portion is the exposed portion 471
  • another radial portion is the covered portion 473.
  • a radial portion being the exposed portion 471 and another radial portion being the covered portion 473 means that, in a cross section at a certain point in the buried portion 42a, a part of the circumference (arc) of the cross-sectional circle is not covered with the insulating coating 46 and the coil core 47 is exposed, and another part of the circumference is covered with the insulating coating 46.
  • the insulating coating 46 is not divided by the exposed portion 471. That is, the first insulating coating 46a and the second insulating coating 46b, which cover the entire radial direction of each of the first length region and the second length region that sandwich the buried portion 42a (a partial length region buried in the solder material 50) of the coil wire 40, are connected by a bridge portion 461 that has a width smaller than the wire diameter of the coil wire 40 and extends along the extension direction of the coil wire 40.
  • the first length region and the second length region are regions outside the brazing material 50, and are partial length regions of the coil wire 40 that are located forward or rearward of the pad portion 331 in the height direction.
  • the first insulating coating 46a covers the entire circumference of the coil wire 40 (first length region) that is located forward of the buried portion 42a.
  • the second insulating coating 46b covers the entire circumference of the coil wire 40 (second length region) that is located rearward of the buried portion 42a.
  • the bridge portion 461 connecting the first insulating coating 46a and the second insulating coating 46b is disposed on the circumferential surface of the buried portion 42a.
  • the bridge portion 461 is a part of the insulating coating 46, and is narrow and long in the axial direction of the coil wire 40.
  • the longitudinal direction of the bridge portion 461 and the extending direction of the coil wire 40 are aligned with each other.
  • the width of the bridge portion 461 refers to the minimum length of the bridge portion 461 in the circumferential direction.
  • the longitudinal direction of the bridge portion 461 and the extending direction of the coil wire 40 are aligned with each other means that the acute angle formed when a virtual center line connecting the centers of the bridge portion 461 in the width direction is projected onto the axis of the coil wire 40 is at least 30 degrees or less.
  • the center line of the bridge portion 461 and the axis of the coil wire 40 are substantially parallel to each other.
  • an upper portion (upper circumferential surface 40c) opposite the side where the pad portion 331 is disposed, and a lower portion (lower circumferential surface 40d) opposite the pad portion 331 are exposed portions 471 where the insulating coating 46 has been removed, and are in contact with the brazing material 50.
  • a lateral portion of the partial length region is a coated portion 473 covered with the insulating coating 46, and is not in contact with the brazing material 50.
  • the upper peripheral surface 40c is a region of a predetermined width including the upper end of the coil wire 40 on the peripheral surface of the buried portion 42a as shown in FIG. 5.
  • the upper peripheral surface 40c may be a substantially linear region including only the upper end of the coil wire 40, or may be an elongated region including the upper end of the coil wire 40 and its vicinity.
  • the lower peripheral surface 40d is a region of a predetermined width including the lower end of the coil wire 40 on the peripheral surface of the buried portion 42a.
  • the lower peripheral surface 40d may be a substantially linear region including only the lower end, or may be an elongated region having a width.
  • the width of the upper peripheral surface 40c or the lower peripheral surface 40d may be less than half the wire diameter of the coil wire 40, or may be more than half.
  • a portion of a side of the coil wire 40 is covered portion 473 means that at least a portion of the side circumferential surface is covered portion 473.
  • Side circumferential surface 40e is a region of the circumferential surface of the coil wire 40 excluding upper circumferential surface 40c and lower circumferential surface 40d.
  • a portion of the upper side of the partial length region (embedded portion 42a) of the coil wire 40 is a covered portion 473 covered with the insulating coating 46 and is not in contact with the brazing material 50, and the entire lower side of the partial length region (embedded portion 42a) is an exposed portion 471 from which the insulating coating 46 has been removed and is in contact with the brazing material 50.
  • the outer and upper region of the side circumferential surface 40e is the covered portion 473
  • the lower region of the side circumferential surface 40e is the exposed portion 471
  • the upper side of the side circumferential surface 40e refers to a region of the side circumferential surface 40e that is located above the center of the cross section of the coil wire 40
  • the lower side of the side circumferential surface 40e refers to a region that is located below the center of the cross section and faces the pad portion 331.
  • the upper peripheral surface 40c and the lower peripheral surface 40d in the entire length region of the buried portion 42a are not limited to being the exposed portion 471.
  • the upper peripheral surface 40c or the lower peripheral surface 40d in a partial length region of the buried portion 42a may be the exposed portion 471, and the upper peripheral surface 40c or the lower peripheral surface 40d in the remaining length region may be the covered portion 473.
  • the thermal fatigue resistance of the joint between the pad portion 331 and the coil wire 40 is improved.
  • air attached to the coil wire 40 may enter the inside of the solder 50.
  • any air that enters at any position in the solder 50 moves upward along the surface of the coil wire 40 and easily escapes from the solder 50.
  • the buried portion 42a of the coil wire 40a buried in the solder 50a has an exposed portion 471 in which the insulating coating 46 has been removed over substantially the entire length in the radial direction.
  • both ends of the buried portion 42a protrude from the solder 50a at an angle relative to the circumferential direction of the coil wire 40a.
  • the first insulating coating 46a covering a first length region of the coil wire 40a that is further forward than the buried portion 42a and the second insulating coating 46b covering a second length region of the coil wire 40a that is further rearward than the buried portion 42a are separated from each other by the exposed portion 471.
  • the region of the outer region of the circumferential surface of the coil wire 40a that is close to the solder 50a is an exposed portion 471a where the insulating coating 46 has been peeled off.
  • the region of the outer region of the circumferential surface of the coil wire 40a that is close to the solder 50a may be covered with the insulating coating 46 to form a covered portion 473.
  • the second boundary line 472 and the first boundary line 48 may be substantially coincident with each other, or the second boundary line 472 may be disposed inside the exposed portion 471.
  • a part of the radial direction is covered with the solder 50, and the other part of the radial direction is covered with the insulating coating 46. This prevents the coil core 47 from deteriorating and breaking due to oxidation, wear, or the like at both ends of the buried portion 42a as described above.
  • a radial portion of the entire length region of the buried portion 42a is the exposed portion 471 and the other portion is the covered portion 473, but this is not limited to the above.
  • a radial portion of the entire length region of the buried portion 42a may be the exposed portion 471 and the other portion may be the covered portion 473.
  • the entire radial portion of the partial length region may be the exposed portion 471.
  • the end faces 41 of the coil wire 40 at both ends and the side end face 33b of the base 30 (circuit portion 33) are arranged on the same plane.
  • the end faces 41 of the coil wire 40 are cross sections resulting from cutting the coil wire 40 in the cutting process described below.
  • the coil wire 40 is arranged at an angle to the cut surface, so that the end faces 41 of the coil wire 40 are elliptical.
  • the side end faces 33b of the circuit portion 33 are faces facing the rear end side of the circuit portion 33, and are cross sections resulting from cutting the base 30 in the cutting process described above.
  • the side end faces 33b of the circuit portion 33 are on the same plane as the face indicated by the dashed line Y in Fig. 9.
  • the coil wire 40 and the circuit portion 33 may be cut along a surface along the side end surface 333b of the circuit body 333.
  • the end surface 41 of the coil wire 40, the side end surface 33b of the circuit portion 33, and the side end surface 333b of the circuit body 333 are all disposed on the same plane.
  • the base 30 may be cut along the same plane as the boundary surface between the circuit portion 33 and the wire placement portion 31 (the same plane as the rear end side surface 33d in FIG. 9). In this manner, the coil wire 40 and the circuit body 333 do not protrude rearward beyond the side end surface 33b of the circuit portion 33, thereby preventing the coil wire 40 and the circuit body 333 from deteriorating due to wear.
  • the solder 50 is formed in a mountain shape on the surface of the pad portion 331 in advance and solidified, but this is not limited to this.
  • the solder 50 does not have to be formed on the surface of the pad portion 331 in advance.
  • the solder 50 supplied above the pad portion 331 may be melted by a laser, and the melted solder 50 may fall onto the surface of the pad portion 331. If the solder 50 is not formed on the surface of the pad portion 331 in advance and the melted solder 50 is applied to the surface of the pad portion 331 in the melting process, the wire placement process may be performed after the melting process.
  • the coil wire 40 may be placed above the pad portion 331, and the coil wire 40 may be pressed downward to immerse the coil wire 40 in the solder 50.
  • the melting process and the removal process may be performed at different times.
  • the solder 50 is formed in advance on the pad surface with the slope 51 in an arched mountain shape, but this is not limited to this.
  • the slope 51 of the solder 50 may be straight or concave downward.
  • the apex 52 of the solder 50 is not limited to being a point.
  • the highest points of the solder 50 may be connected on a line, or may be a surface.
  • the solder 50 may be formed in a trapezoidal shape when viewed from the front-to-rear direction.
  • one end of the coil wire 40 is fixed to the rear end side of the base 30, and a pressure tool 200 is placed on the coil wire 40 to press the coil wire 40 downward, but this is not limited to the above.
  • the coil wire 40 may be brought closer to the solder 50 and pressed against it by a mechanism that pulls or pushes the coil wire 40 downward.
  • the coil wire 40 may be pulled out downward and fixed so that the coil wire 40 is pressed against the solder 50.
  • the depth (length in the height direction) of the installation hole 334 is greater than the thickness (length in the height direction) of the circuit body 333, so that the entire upper surface 33a of the circuit part 33 is disposed at a higher position than the upper surface 333a of the circuit body 333.
  • the upper surface 33a of the circuit part 33 disposed on the rear end side of the circuit body 333 may be disposed at a higher position than the upper surface 333a of the circuit body 333.
  • a protrusion protruding upward from the upper surface 33a of the circuit part 33 may be provided on the rear end side of the circuit body 333, and the upper surface of the protrusion may be higher than the upper surface 333a of the circuit body 333. This prevents the coil wire 40, which is pressurized and approaches the pad part 331, from coming into contact with the pad part 331 and damaging the pad part 331.
  • substantially the entire upper surface 33a of the circuit part 33, excluding the protrusion may be disposed at a lower position than the upper surface 333a of the circuit body 333.
  • the pressure jig installation hole 313 is disposed between the circuit section 33 and the support section 311, but is not limited to this.
  • the pressure jig installation hole 313 may be provided between the support section 311 and the wire fixing section 312.
  • the pressure section 44 is a partial length region between the bent section 45 and the fixing section 43.
  • a method for manufacturing an antenna device having an antenna section in which a coil wire having a coil core covered with an insulating film is wound, and a base having a pad section to which a part of the coil wire is soldered with a solder material comprising the steps of: a melting step in which the brazing material supplied onto the pad portion is irradiated with a laser to melt the brazing material; a removal process in which the coil wire is immersed in the molten solder material to remove a portion of the insulating coating from the coil wire, and the coil wire and the pad portion are joined by the solder material.
  • the method further includes a wire placement step performed before the melting step, the base has a wire fixing portion for fixing the coil wire, In the wire placement step, one end of the coil wire is fixed to the wire fixing portion, and a portion of the coil wire is placed on the brazing material provided on the surface of the pad portion, A method for manufacturing an antenna device described in any one of (1) to (6), wherein, in the wire placement process, a pressure portion which is a partial length region between the one end and the portion of the coil wire is pressed toward the base, so that the coil wire is pressed against the solder material.
  • the base has a support portion against which the coil wire is pressed to change the drawing direction of the coil wire, In the wire placement step, a bent portion located between the portion and the one end of the coil wire is pressed against the support portion of the base and bent;
  • An antenna device including an antenna section wound with a coil wire having a coil core and an insulating coating covering the coil core, and a base having a pad section, the coil wire has an exposed portion where the coil core is exposed from the insulating coating, The coil wire and the pad portion are joined by a brazing material, A portion of the coil wire is embedded in the brazing material, An antenna device in which a first boundary line, which is a boundary between an internal region of the circumferential surface of the coil wire that is embedded in the solder material and an external region that protrudes outside the solder material, and a second boundary line, which is a boundary between the exposed portion and a coated portion of the coil wire that is coated with the insulating coating, are aligned with each other.
  • Antenna device 20 Antenna section 21 Winding core 30 Base 31 Wire arrangement section 311 Support section 312 Wire fixing section 313 Pressurizing jig installation hole 314 Hole 315 Flat section 315a Top surface 315b Outer end surface 316 Winding core insertion hole 316a Chamfered section 33 Circuit section 33a Top surface 33b Side end surface 33c Inclined surface 33d Rear end side surface 331 Pad section 331a Oblique side 333 Circuit body 333a Top surface 333b Side end surface 334 Installation hole 335 Guide section 335a Outer surface 40, 40a, 40b Coil wire 40c Upper peripheral surface 40d Lower peripheral surface 40e Side peripheral surface 41 End surface 42 Pad section upper arrangement section 42a Buried section 43 Fixed section 44 Pressurizing section 45 Bent section 46 Insulating coating 46a First insulating coating 46b Second insulating coating 461 Bridge portion 47 Coil core 471, 471a, 471b Exposed portion 472, 472a, 472b, 472c Second boundary line 473 Covering portion 48,

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
PCT/JP2022/036453 2022-09-29 2022-09-29 アンテナ装置およびアンテナ装置の製造方法 Ceased WO2024069857A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/JP2022/036453 WO2024069857A1 (ja) 2022-09-29 2022-09-29 アンテナ装置およびアンテナ装置の製造方法
US19/108,350 US20250353091A1 (en) 2022-09-29 2022-09-29 Antenna device and method for manufacturing the same
JP2024548965A JPWO2024069857A1 (https=) 2022-09-29 2022-09-29
CN202280099363.8A CN119744481A (zh) 2022-09-29 2022-09-29 天线装置和天线装置的制造方法
DE112022007841.3T DE112022007841T5 (de) 2022-09-29 2022-09-29 Antennenvorrichtung und verfahren zur herstellung derselben

Applications Claiming Priority (1)

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PCT/JP2022/036453 WO2024069857A1 (ja) 2022-09-29 2022-09-29 アンテナ装置およびアンテナ装置の製造方法

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011221771A (ja) * 2010-04-08 2011-11-04 Star Engineering Co Ltd 非接触型ｉｄ識別装置
JP2014505309A (ja) * 2011-01-27 2014-02-27 日本テキサス・インスツルメンツ株式会社 半導体ダイをアンテナに接続するためのｒｆｉｄトランスポンダ及び方法
JP2017506582A (ja) * 2014-02-13 2017-03-09 タイコ エレクトロニクス （シャンハイ） カンパニー リミテッド レーザ半田付けシステム
JP2018176247A (ja) * 2017-04-18 2018-11-15 株式会社ジャパンユニックス レーザー式はんだ付け方法及びレーザー式はんだ付け装置
JP2020127086A (ja) * 2019-02-01 2020-08-20 スミダコーポレーション株式会社 アンテナ装置、及び、アンテナ装置の製造方法
JP2022063081A (ja) * 2020-10-09 2022-04-21 株式会社ジャパンユニックス レーザーハンダ付け装置及び方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4940997B2 (ja) * 2007-02-27 2012-05-30 カシオ計算機株式会社 アンテナ装置、アンテナ装置の製造方法及び電子機器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011221771A (ja) * 2010-04-08 2011-11-04 Star Engineering Co Ltd 非接触型ｉｄ識別装置
JP2014505309A (ja) * 2011-01-27 2014-02-27 日本テキサス・インスツルメンツ株式会社 半導体ダイをアンテナに接続するためのｒｆｉｄトランスポンダ及び方法
JP2017506582A (ja) * 2014-02-13 2017-03-09 タイコ エレクトロニクス （シャンハイ） カンパニー リミテッド レーザ半田付けシステム
JP2018176247A (ja) * 2017-04-18 2018-11-15 株式会社ジャパンユニックス レーザー式はんだ付け方法及びレーザー式はんだ付け装置
JP2020127086A (ja) * 2019-02-01 2020-08-20 スミダコーポレーション株式会社 アンテナ装置、及び、アンテナ装置の製造方法
JP2022063081A (ja) * 2020-10-09 2022-04-21 株式会社ジャパンユニックス レーザーハンダ付け装置及び方法

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US20250353091A1 (en) 2025-11-20
JPWO2024069857A1 (https=) 2024-04-04
CN119744481A (zh) 2025-04-01

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