JPWO2024069857A1 - - Google Patents

Info

Publication number
JPWO2024069857A1
JPWO2024069857A1 JP2024548965A JP2024548965A JPWO2024069857A1 JP WO2024069857 A1 JPWO2024069857 A1 JP WO2024069857A1 JP 2024548965 A JP2024548965 A JP 2024548965A JP 2024548965 A JP2024548965 A JP 2024548965A JP WO2024069857 A1 JPWO2024069857 A1 JP WO2024069857A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024548965A
Other languages
Japanese (ja)
Other versions
JPWO2024069857A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024069857A1 publication Critical patent/JPWO2024069857A1/ja
Publication of JPWO2024069857A5 publication Critical patent/JPWO2024069857A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, electron beams [EB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
JP2024548965A 2022-09-29 2022-09-29 Pending JPWO2024069857A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/036453 WO2024069857A1 (ja) 2022-09-29 2022-09-29 アンテナ装置およびアンテナ装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024069857A1 true JPWO2024069857A1 (https=) 2024-04-04
JPWO2024069857A5 JPWO2024069857A5 (https=) 2025-05-30

Family

ID=90476806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024548965A Pending JPWO2024069857A1 (https=) 2022-09-29 2022-09-29

Country Status (5)

Country Link
US (1) US20250353091A1 (https=)
JP (1) JPWO2024069857A1 (https=)
CN (1) CN119744481A (https=)
DE (1) DE112022007841T5 (https=)
WO (1) WO2024069857A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008211557A (ja) * 2007-02-27 2008-09-11 Casio Comput Co Ltd アンテナ装置、アンテナ装置の製造方法及び電子機器
JP2014505309A (ja) * 2011-01-27 2014-02-27 日本テキサス・インスツルメンツ株式会社 半導体ダイをアンテナに接続するためのｒｆｉｄトランスポンダ及び方法
JP2018176247A (ja) * 2017-04-18 2018-11-15 株式会社ジャパンユニックス レーザー式はんだ付け方法及びレーザー式はんだ付け装置
JP2022063081A (ja) * 2020-10-09 2022-04-21 株式会社ジャパンユニックス レーザーハンダ付け装置及び方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5467577B2 (ja) * 2010-04-08 2014-04-09 スターエンジニアリング株式会社 非接触型ｉｄ識別装置及びその製造方法
CN104842069A (zh) * 2014-02-13 2015-08-19 泰科电子(上海)有限公司 激光焊接系统
JP7255212B2 (ja) * 2019-02-01 2023-04-11 スミダコーポレーション株式会社 アンテナ装置、及び、アンテナ装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008211557A (ja) * 2007-02-27 2008-09-11 Casio Comput Co Ltd アンテナ装置、アンテナ装置の製造方法及び電子機器
JP2014505309A (ja) * 2011-01-27 2014-02-27 日本テキサス・インスツルメンツ株式会社 半導体ダイをアンテナに接続するためのｒｆｉｄトランスポンダ及び方法
JP2018176247A (ja) * 2017-04-18 2018-11-15 株式会社ジャパンユニックス レーザー式はんだ付け方法及びレーザー式はんだ付け装置
JP2022063081A (ja) * 2020-10-09 2022-04-21 株式会社ジャパンユニックス レーザーハンダ付け装置及び方法

Also Published As

Publication number Publication date
WO2024069857A1 (ja) 2024-04-04
DE112022007841T5 (de) 2025-08-14
US20250353091A1 (en) 2025-11-20
CN119744481A (zh) 2025-04-01

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